© 2009 Microchip Technology Inc. DS22190B-page 1
MCP73213
Features
Complete Linear Charge Management Controller:
- Integrated Input Overvoltage Protection
- Integrated Pass Transistor
- Integrated Current Sense
- Integrated Reverse Discharge Protection
Constant Current / Constant Voltage Operation
with Thermal Regulation
4.15V Undervoltage Lockout (UVLO)
13V Input Overvoltage Protection
High Accuracy Preset Voltage Regulation
Through Full Temperature Range (-5°C to +55°C):
-+
0.6%
Battery Charge Voltage Options:
- 8.20V, 8.40V, 8.7V or 8.8V
Resistor Programmable Fast Charge Current:
- 130 mA - 1100 mA
Preconditioning of Deeply Depleted Cells:
- Available Options: 10% or Disable
Integrated Precondition Timer:
- 32 Minutes or Disable
Automatic End-of-Charge Control:
- Selectable Minimum Current Ratio:
5%, 7.5%, 10% or 20%
- Elapse Safety Timer: 4 HR, 6 HR, 8 HR or
Disable
Automatic Recharge:
- Available Options: 95% or Disable
Factory Preset Charge Status Output:
- On/Off or Flashing
Soft Start
Temperature Range: -40°C to +85°C
Packaging: DFN-10 (3 mm x 3 mm)
Applications
Digital Camcorders
Portable Media Players
Ultra Mobile Personal Computers
Netbook Computers
Handheld Devices
Walkie-Talkie
Low-Cost 2-Cell Li-Ion/Li-Poly Chargers / Cradles
Description
The MCP73213 is a highly integrated Li-Ion battery
charge management controller for use in space-limited
and cost-sensitive applications. The MCP73213
provides specific charge algorithms for dual-cell Li-Ion
/ Li-Polymer batteries to achieve optimal capacity and
safety in the shortest charging time possible. Along
with its small physical size, the low nu mb er of extern al
components makes the MCP73 213 ideally suitable for
portable applications. The absolu te maximum voltage,
up to 18V, allows the use of MCP73213 in harsh
environments, such as low cost wall wart or voltage
spikes from plug/unplug.
The MCP73213 employs a constant current / constant
voltage charge algorithm. The various charging voltage
regulations provide design engineers flexibility to use in
different applications. The fast charge, constant current
value is set with one external resistor from 130 mA to
1100 mA. The MCP73213 limits the charge current
based on die temperature during high power or high
ambient conditions. This thermal regulation optimizes
the charge cycle time while maintaining device
reliability.
The PROG pin of the MCP73213 also serves as enable
pin. When high impedance is applied, the MCP73213
will be in standby mode.
The MCP73213 is fully specified over the ambient
temperature range of -40°C to +85°C. T he MCP73213
is available in a 10 lead, DFN package.
Package Types (Top View)
MCP73213
3x3 DFN *
VBAT
VDD
VBAT
VSS
VSS
1
2
3
4
10
9
8
7STAT
PROGVDD
* Includes Exposed Thermal Pad (EP); see Table 3-1.
EP
11
NC 56NC
Dual-Cell Li-Ion / Li-Polymer Battery Charge Management
Controller with Input Overvoltage Protection
MCP73213
DS22190B-page 2 © 2009 Microchip Technology Inc.
Typical Application
TABLE 1: AVAILABLE FACTORY PRESET OPTIONS
TABLE 2: STANDARD SAMPLE OPTIONS
Charge
Voltage OVP
Pre-
conditioning
Charge Current
Pre-
conditioning
Threshold
Precondition
Timer
Elapse
Timer
End-of-
Charge
Control
Automatic
Recharge
Output
Status
8.2V 13V Disable / 10% 66.5% / 71.5% Disable /
32 Minimum Disable / 4 HR /
6 HR / 8 HR 5% / 7.5% /
10% / 20% No /
Yes Type 1 /
Type 2
8.4V 13V Disable / 10% 66.5% / 71.5% Disable /
32 Minimum Disable / 4 HR /
6 HR / 8 HR 5% / 7.5% /
10% / 20% No /
Yes Type 1 /
Type 2
8.7V 13V Disable / 10% 66.5% / 71.5% Disable /
32 Minimum Disable / 4 HR /
6 HR / 8 HR 5% / 7.5% /
10% / 20% No /
Yes Type 1 /
Type 2
8.8V 13V Disable / 10% 66.5% / 71.5% Disable /
32 Minimum Disable / 4 HR /
6 HR / 8 HR 5% / 7.5% /
10% / 20% No /
Yes Type 1 /
Type 2
Note 1: IREG: Regulated fast charge current.
2: VREG: Regulated charge voltage.
3: IPREG/IREG: Preconditioning charge current; ratio of regulated fast charge current.
4: ITERM/IREG: End-of-Charge control; ratio of regulated fast charge current.
5: VRTH/VREG: Recharge threshold; ratio of regulated battery voltage.
6: VPTH/VREG: Preconditioning threshold voltage.
Part
Number
VREG OVP IPREG/IREG Pre-charge
Timer
Elapse
Timer
ITERM/IREG VRTH/VREG VPTH/VREG Output
Status
MCP73213-B6S/MF 8.20V 13V 10% 32 Min. 6 HR 10% 95% 71.5% Type 1
MCP73213-A6S/MF 8.40V 13V 10% 32 Min. 6 HR 10% 95% 71.5% Type 1
Note 1: Customers should contact their distributor, representatives or field application engineer (FAE) for support and sample.
Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of
this document. Technical support is available through the web site at: http//support.microchip.com
VDD
5
3
1
2
8
7
RPROG
9
10
CIN COUT
RLED
+
-
2-Cell
Li-Ion
Battery
6
4
MCP73213 Typical Application
VDD
STAT
NC
NC
VBAT
VBAT
PROG
VSS
VSS
Ac-dc-Adapter
© 2009 Microchip Technology Inc. DS22190B-page 3
MCP73213
Functional Block Diagram
VREF (1.21V)
STAT
PROG
VBAT
VSS
DIRECTION
CONTROL
PRECONDITION
+
-
TERM
+
-
+
-
CA
CHARGE
+
-
+
-
VA
+
-
CURRENT
LIMIT
VOREG
VOREG UVLO
VDD
Input OverVP
VDD
+
-
13V
Thermal RegulationTSD
+
-
110°C
*Recharge VBAT
+
-
95% VREG
*Only available on selected options
VREF
CHARGE
CONTROL,
TIMER
AND
STATUS
LOGIC
REFERENCE,
BIAS, UVLO
AND SHDN
MCP73213
DS22190B-page 4 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 5
MCP73213
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
VDD................................................................................18.0V
VPROG ..............................................................................6.0V
All Inputs and Outputs w.r.t. VSS ............... -0.3 to (VDD+0.3)V
Maximum Junction Temperature, TJ............Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins
Human Body Model (1.5 kΩ in Series with 100 pF).......4kV
Machine Model (200 pF, No Series Resistance).............300V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended per iods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 12V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
Supply Input
Input Voltage Range VDD 4—16V
Operating Supply Voltage VDD 4.2 13 V
Supply Current ISS 4 5.5 µA Shutdown (VDD < VBAT - 150 mV)
700 1500 µA Charging
50 125 µA Standby (PROG Floating)
50 150 µA Charge Complete; No Battery;
VDD < VSTOP
Battery Discharge Current
Output Reverse Leakage
Current IDISCHARGE 0.5 2 µA Standby (PROG Floating)
0.5 2 µA Shutdown (VDD < VBAT,
or VDD < VSTOP)
10 17 µA Charge Complete; VDD is present
Undervoltage Lockout
UVLO Start Threshold VSTART 4.10 4.15 4.25 V
UVLO Stop Threshold VSTOP 4.00 4.05 4.10 V
UVLO Hysteresis VHYS 100 mV
Overvoltage Protection
OVP Start Threshold VOVP 12.8 13 13.2 V
OVP Hysteresis VOVPHYS 150 mV
Voltage Regulation (Constant Voltage Mode)
Regulated Output Voltage
Options VREG 8.15 8.20 8.25 V TA= -5°C to +55°C
8.35 8.40 8.45 V VDD = [VREG(Typical)+1V]
8.65 8.70 8.75 V IOUT = 50 mA
8.75 8.80 8.85 V
Output Voltage Tolerance VRTOL -0.6 0.6 %
Line Regulation |(ΔVBAT/VBAT)/
ΔVDD| 0.05 0.20 %/V VDD = [VREG(Typical)+1V] to 12V
IOUT = 50 mA
Load Regulation VBAT/VBAT| 0.05 0.20 % IOUT = 50 mA - 150 mA
VDD = [VREG(Typical)+1V]
Supply Ripple Attenuation PSRR -46 dB IOUT = 20 mA, 10 Hz to 1 kHz
—-30—dBI
OUT = 20 mA, 10 Hz to 10 kHz
Note 1: Not production tested. Ensured by design.
MCP73213
DS22190B-page 6 © 2009 Microchip Technology Inc.
Battery Short Protection
BSP Start Threshold VSHORT —3.4—V
BSP Hysteresis VBSPHYS 150 mV
BSP Regulation Current ISHORT —25—mA
Current Regulation (Fast Charge, Constant-Current Mode)
Fast Charge Current
Regulation IREG 130 1100 mA TA = -5°C to +55°C
117 130 143 mA PROG = 10 kΩ
900 1000 1100 mA PROG = 1.1 kΩ
Preconditioning Current Regulation (Trickle Charge Constant Current Mode)
Precondition Current Ratio IPREG / IREG 10 % PROG = 1 kΩ to 10 kΩ
TA=-5°C to +55°C
100 % No Preconditioning
Precondition Voltage
Threshold Ratio VPTH / VREG 64 66.5 69 % VBAT Low-to-High
69 71.5 74 %
Precondition Hysteresis VPHYS 100 mV VBAT High-to-Low (Note 1)
Charge Termination
Charge Termination
Current Ratio ITERM / IREG 3.7 5 6.3 % PROG = 1 kΩ to 10 kΩ
TA=-5°C to +55°C
5.6 7.5 9.4
7.5 10 12.5
15 20 25
Automatic Recharge
Recharge Voltage
Threshold Ratio VRTH / VREG 93 95.0 97 % VBAT High-to-Low
No Automatic Recharge
—0—%
Pass Transistor ON-Resistance
ON-Resistance RDSON 350 mΩVDD = 4.5V, TJ = 105°C (Note 1)
Status Indicator - STAT
Sink Current ISINK —2035mA
Low Output Voltage VOL —0.20.5VI
SINK = 4 mA
Input Leakage Current ILK 0.001 1 µA High Impedance, VDD on pin
PROG Input
Charge Impedance Range RPROG 1—22kΩ
Shutdown Impedance RPROG 200 kΩImpedance for Shutdown
Automatic Power Down
Automatic Power Down
Entry Threshold VPDENTRY VBAT +
10 mV VBAT +
50 mV —VV
DD Falling
Automatic Power Down
Exit Threshold VPDEXIT —V
BAT +
150 mV VBAT +
250 mV VV
DD Rising
Thermal Shutdown
Die Temperature TSD 150 °C
Die Temperature
Hysteresis TSDHYS —10—°C
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 12V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
Note 1: Not production tested. Ensured by design.
© 2009 Microchip Technology Inc. DS22190B-page 7
MCP73213
AC CHARACTERISTICS
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 12V, TA=- 40°C to +85°C.
Typical values are at +25°C, VDD= [VREG(Typical)+1.0V]
Parameters Sym Min Typ Max Units Conditions
Elapsed Timer
Elapsed Timer Period tELAPSED 0 Hours Timer Disabled
3.6 4.0 4.4 Hours
5.4 6.0 6.6 Hours
7.2 8.0 8.8 Hours
Preconditioning Timer
Preconditioning Timer Period tPRECHG 0 Hours Disabled Timer
0.4 0.5 0.6 Hours
Status Indicator
Status Output turn-off tOFF ——500µsI
SINK = 1 mA to 0 mA
(Note 1)
Status Output turn-on, tON ——500 I
SINK = 0 mA to 1 mA
(Note 1)
Note 1: Not production tested. Ensured by design.
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V.
Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 +85 °C
Operating Temperature Range T J-40 +125 °C
Storage Temperature Range TA-65 +150 °C
Thermal Package Resistances
Thermal Resistance, DFN-10 (3x3) θJA 43 °C/W 4-Layer JC51-7 S tandard Board,
Natural Convection
MCP73213
DS22190B-page 8 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 9
MCP73213
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 50 mA and TA= +25°C, Constant-voltage mode.
FIGURE 2-1: Battery Regulation Voltage
(VBAT) vs. Supply Voltage (V DD).
FIGURE 2-2: Battery Regulation Voltage
(VBAT) vs. Supply Voltage (V DD).
FIGURE 2-3: Battery Regulation Voltage
(VBAT) vs. Ambient Temperatur e (TA).
FIGURE 2-4: Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
FIGURE 2-5: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-6: Charge Current (IOUT) vs.
Supply Voltage (VDD).
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provide d for informational purposes only. The performance characteristics listed here in
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified pow er supply range) and therefore outside the warranted range.
8.16
8.17
8.18
8.19
8.20
8.21
8.22
8.23
8.24
8.4 9.0 9.6 10.2 10.8 11.4 12.0
Supply Voltage (V)
Battery Regulation Voltage (V)
VBAT = 8.2V
ILOAD = 150 mA
TA = +25°C
8.16
8.17
8.18
8.19
8.20
8.21
8.22
8.23
8.24
8.4 9.0 9.6 10.2 10.8 11.4 12.0
Supply Voltage (V)
Battery Regulation Voltage (V)
VBAT = 8.2V
ILOAD = 50 mA
TA = +25°C
8.16
8.17
8.18
8.19
8.20
8.21
8.22
8.23
8.24
-5 5 1525354555
Ambient Temperature (°C)
Battery Regulation Voltage (V)
VBAT = 8.2V
VDD = 9.2V
ILOAD = 50 mA
8.16
8.17
8.18
8.19
8.20
8.21
8.22
8.23
8.24
-5.0 5.0 15.0 25.0 35.0 45.0 55.0
Ambient Temperature (°C)
Battery Regulation Voltage (V)
VBAT = 8.2V
VDD = 9.2V
ILOAD = 150 mA
0
200
400
600
800
1000
1200
1 3 5 7 9 11 13 15 17 19
Programming Resistor (k)
Charge Current (mA)
VBAT = 8.2V
VDD = 9.2V
TA = +25°C
700
720
740
760
780
800
820
840
860
880
900
8.4 9.0 9.6 10.2 10.8 11.4 12.0
Supply Voltage (V)
Charge Current (mA)
RPROG = 1.3 k
TA = +25°C
MCP73213
DS22190B-page 10 © 2009 Microchip Technology Inc.
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
FIGURE 2-7: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-8: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-9: Charge Current (IOUT) vs.
Ambient Temperature (TA).
FIGURE 2-10: Charge Current (IOUT) vs.
Ambient Temperature (TA).
FIGURE 2-11: Battery Short Protection
Regulation Current (ISHORT) vs. Ambient
Temperature (TA).
FIGURE 2-12: Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
100
106
112
118
124
130
136
142
148
154
160
8.4 9.0 9.6 10.2 10.8 11.4 12.0
Supply Voltage (V)
Charge Current (mA)
RPROG = 10 k
TA = +25°C
200
210
220
230
240
250
260
270
280
290
300
8.4 9.0 9.6 10.210.811.412.0
Supply Voltage (V)
Charge Current (mA)
RPROG = 5 k
TA = +25°C
60
63
66
69
72
75
78
81
84
87
90
-5 0 5 10 15 20 25 30 35 40 45 50 55
Ambient Temperature (°C)
Charge Current (mA)
VBAT = 8.2V
RPROG = 20 k
VDD = 12V
VDD = 11V
VDD = 8.5V
VDD = 9.2V
550
560
570
580
590
600
-5 0 5 10 15 20 25 30 35 40 45 50 55
Ambient Temperature (°C)
Charge Current (mA)
VDD = 8.5V
VDD = 9.2V
VDD = 11V
VDD = 12V
VBAT = 8.2V
RPROG = 2 k
10
14
18
22
26
30
-45-35-25-15-5 5 1525354555657585
Ambient Temperature (C)
BSP Regulation Current (mA)
VDD = 9.2V
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
-5.0 5.0 15.025.035.045.055.0
Ambient Temperature (°C)
Discharge Current (uA)
VDD < VBAT
VDD < VSTOP
End of Charge
© 2009 Microchip Technology Inc. DS22190B-page 11
MCP73213
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
FIGURE 2-13: Battery Voltage Accuracy
(VRTOL) vs. Supply Voltage (VDD).
FIGURE 2-14: Load Transient Response
(ILOAD = 50 mA/Div, Output: 100 mV/Div, Time:
100 µs/Div).
FIGURE 2-15: Input Overvoltage
Protection.
FIGURE 2-16: Complete Charge Cycle
(875 mAh Li-Ion Battery).
FIGURE 2-17: Line Transient Response
(ILOAD = 10 mA) (1 00 µs/Div).
FIGURE 2-18: Line Transient Response
(ILOAD = 100 mA) (100 µs/Div).
-0.5
-0.3
-0.1
0.1
0.3
0.5
8.4 9.0 9.6 10.2 10.8 11.4 12.0
Supply Voltage (V)
Battery Voltage Accuracy (%)
VBAT = 8.2V
ILOAD = 150 mA
TA = +25°C
Output Ripple (V)
Output Current (mA)
0
1
2
3
4
5
6
7
8
9
10
0 102030405060708090
Time (Minutes)
Battery Voltage (V)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
Supply Current (A)
VDD = 9V
RPROG = 1.5 k
875 mAh Li-Ion Battery
Thermal Foldback
Input Voltage
Battery Voltage
Output Current
Output Ripple (V)
Source Voltage (V)
Output Ripple (V)
Source Voltage (V)
MCP73213
DS22190B-page 12 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 13
MCP73213
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLES
3.1 Battery Management Input Supply
(VDD)
A supply voltage of [VREG (Typical) + 0.3V] to 13.0V is
recommended. Bypass to VSS with a minimum of 1 µF.
The VDD pin is rated 18V absolute maximum to prevent
suddenly rise of input voltage from spikes or low cost
ac-dc wall adapter.
3.2 Battery Charge Control Output
(VBAT)
Connect to the positive termin al of the battery. Bypass
to VSS with a minimum o f 1 µF to ensure loop stability
when the battery is disconnected.
3.3 No Connect (NC)
No connect.
3.4 Status Output (STAT)
STA T is an open-drain logic output for connection to an
LED for charge status indication in standalone
applications. Alternatively, a pull-up resistor can be
applied for interfacing to a host microcontroller. Refer to
Table 5-1 for a summary of the status output during a
charge cycle.
3.5 Battery Management 0V Reference
(VSS)
Connect to the negative terminal of the battery and
input supply.
3.6 Current Regulation Set (PROG)
The fast charge current is set by placing a resistor from
PROG to VSS during constant current (CC) mode.
PROG pin also serves as charge control enable. When
a typical 200 kΩ impedance is applied to PROG pin,
the MCP73213 is disabled until th e high-impedance is
removed. Refer to Section 5.5 “Constant Current
Mode - Fast Charge” for details.
3.7 Exposed Pad (EP)
The Exposed Thermal Pad (EP) shall be connected to
the exposed copper area o n the Printed Circuit Board
(PCB) for the thermal enhancement. Additional vias on
the copper area under the MCP73213 device can
improve the performance of heat dissipation and
simplify the assembly process.
MCP73213
Symbol I/O Description
DFN-10
1, 2 VDD I Battery Management Input Supply
3, 4 VBAT I/O Battery Charge Control Output
5, 6 NC No Connection
7 STAT O Battery Charge Status Output
8, 9 VSS Battery Management 0V Reference
10 PROG I/O Battery Charge Current Regulation Program and Charge Control Enable
11 EP Exposed Pad
MCP73213
DS22190B-page 14 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 15
MCP73213
4.0 DEVICE OVERVIEW
The MCP73213 are simple, but fully integrated linear
charge management controllers. Figure 4-1 depicts
the operational flow algorithm.
FIGURE 4-1: The MCP73213 Flow Chart.
VBAT < VPTH
Timer Expired
SHUTDOWN MODE
VDD < VUVLO
VDD < VPD
or
PROG > 200 kΩ
STAT = HI-Z
TEMPERATURE FAULT
No Charge Current
STAT = Flashing (Op.1)
STAT = Hi-Z (Op.2)
Timer Suspended
TIMER FAULT
No Charge Current
STAT = Flashing (Op.1)
STAT = Hi-Z (Op.2)
Timer Suspended
PRECONDITIONING MODE
Charge Current = IPREG
STAT = LOW
T imer Reset
Timer Enable
FAST CHARGE MODE
Charge Current = IREG
STAT = LOW
T imer Reset
T i mer Enabled
CONSTANT VOLTAGE MODE
Charge Voltage = VREG
STAT = LOW
CHARGE COMPLETE MODE
No Charge Current
STAT = HI-Z
T imer Reset
VBAT > VPTH
VBAT = VREG
VBAT < ITERM
VBAT > VPTH
VBAT < VRTH
VDD < VOVP
VDD > VOVP
OVERVOLTAGE PROTECTION
No Charge Current
STAT = Hi-Z
Timer Suspended
VDD > VOVP
VDD < VOVP
VDD > VOVP
VDD < VOVP
Timer Expired
TIMER FAULT
No Charge Current
STAT = Flashing (Op.1)
STAT = Hi-Z (Op.2)
Timer Suspended
Die Temperature > TSD
Die Temperature < TSDHYS
Charge Mode Resume
BATTERY SHORT PROTECTION
Charge Current = ISHORT
STAT = Flashing (Op.1)
STAT = Hi-Z (Op.2)
Timer Suspended
VBAT > VSHORT
VBAT < VSHORT
Charge Mode Resume
MCP73213
DS22190B-page 16 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 17
MCP73213
5.0 DETAILED DESCRIPTION
5.1 Undervoltage Lockout (UVLO)
An internal undervoltage lockout (UVLO) circuit
monitors the input voltage and keeps the charger in
shutdown mode until the input supply rises above the
UVLO threshold. In the event a battery is present when
the input power is applied, the input supply must rise
approximately 150 mV above the battery voltage
before the MCP73213 device becomes operational.
The UVLO circuit places the device in shutdown mode
if the input supply falls to approximately 150 mV above
the battery voltage.The UVLO circuit is always active.
At any time, the input supply is below the UVLO
threshold or approximately 150 mV of the voltage at the
VBAT pin, the MCP73213 device is placed in a
shutdown mode.
5.2 Overvoltage Protection (OVP)
An internal overvoltage protection (OVP) circuit
monitors the input voltage and keeps the charger in
shutdown mode when the input supply rises above the
typical 13V, OVP threshold. The hysteresis of OVP is
approximately 150 mV for the MCP73213 device.
The MCP73213 device is operational between UVLO
and OVP threshold. The OVP circuit is also recognized
as overvoltage lock out (OVLO).
5.3 Charge Qualification
When the input power is applied, the input supply must
rise 150 mV above the battery voltage before the
MCP73213 becomes operational.
The automati c power down circuit places the d evice i n
a shutdown mode if the input supply falls to within
+50 mV of the battery voltage.
The automatic circuit is always active. At any time the
input supply is within +50 mV of the voltage at the
VBAT pin, the MCP73213 is placed in a shutdown
mode.
For a charge cycle to begin, the automatic power
down conditions must be met and the charge enable
input must be above the input high threshold.
5.3.1 BATTERY MANAGEMENT INPUT
SUPPLY (VDD)
The VDD input is the input supply to the MCP73213.
The MCP73213 automatically enters a Power-down
mode if the voltage on the VDD input falls to within
+50 mV of the battery voltage. This feature prevents
draining the battery pack when the VDD supply is not
present.
5.3.2 BATTERY CHARGE CONTROL
OUTPUT (VBAT)
The battery charge control output is th e drain terminal
of an internal P-channel MOSFET. The MCP73213
provides constant current and voltage regulation to the
battery pack by controlling this MOSFET in the linear
region. The battery charge control output should be
connected to the positive terminal of the battery pack.
5.3.3 BATTERY DETECTION
The MCP73213 detects the battery presence with
charging of the output capacitor. The charge flow will
initiate when the voltage on VBAT is pulled below the
VRECHARGE threshold. Refer to Section 1.0
“Electrical Characteristics” for VRECHARGE values.
The value will be the same for non-rechargeable
device.
When VBAT >V
REG + Hysteresis, the charge will be
suspended or not start, depen ding on the condition to
prevent over charge that may occur.
5.4 Preconditioning
If the voltage at the VBAT pin is less than the
preconditioning threshold, the MCP73213 device
enters a preconditioning mode. The preconditioning
threshold is factory set. Refer to Section 1.0
“Electrical Characteristics” for preconditioning
threshold options.
In this mode, the MCP73213 device supplies 10% of
the fast charge current (established with the value of
the resistor connected to the PROG pin) to the battery.
When the voltage at the VBAT pin rises above the
preconditioning threshold, the MCP73213 device
enters the constant current (fast charge) mode.
5.4.1 TIMER EXPIRED DURING
PRECONDITIONING MODE
If the internal timer expires before the voltage threshold
is reached for fast charge mode, a timer fault is
indicated and the charge cycle terminates. The
MCP73213 device remains in this condition until the
battery is removed or input power is cycled. If the
battery is removed, the MCP73213 device enters the
Stand-by mode where it remains until a battery is
reinserted.
Note: The MCP73213 device also offers options
with no preconditionin g.
Note: The typical preconditioning timer for
MCP73213 is 32 minutes. The MCP73213
also offers options with no preconditioning
timer.
MCP73213
DS22190B-page 18 © 2009 Microchip Technology Inc.
5.5 Constant Current Mode - Fast
Charge
During the constant current mode, the programmed
charge current is supplied to the battery or load.
The charge current is established using a single
resistor from PROG to VSS. The program resistor and
the charge current are calculated using the following
equation:
EQUATION 5-1:
EQUATION 5-2:
Table 5-1 provides commonly seen E96 (1% ) and E2 4
(5%) resistors for various charge current to reduce
design time.
TABLE 5-1: RESISTOR LOOKUP TABLE
Constant current mode is maintained until the voltage
at the VBAT pin reaches the regulation voltage, VREG.
When constant current mode is invoked, the internal
timer is reset.
5.5.1 TIMER EXPIRED DURING
CONSTANT CURRENT - FAST
CHARGE MODE
If the internal timer expires before the recharge voltage
threshold is reached, a timer faul t is indicated and the
charge cycle terminates. The MCP73213 device
remains in this condition until the battery is removed. If
the battery is removed or input power is cycled, the
MCP73213 device enters the Stand-by mode where it
remains until a battery is reinserted.
5.6 Constant Voltage Mode
When the voltage at the VBAT pin reaches the
regulation voltage, VREG, constant voltage regulation
begins. The regulation voltage is factory set to 8.2V,
8.4V, 8.7V or 8.8V with a tolerance of ± 0.5%.
5.7 Charge Termination
The charge cycle is terminated when, during constant
voltage mode, the average charge current diminishes
below a threshold established with the value of 5%,
7.5%, 10% or 20% of fast charge current or internal
timer has expired. A 1 ms filter time on the termination
comparator ensures that transient load conditions do
not result in premature charge cycle termination. The
timer period is factory set and can be disabled. Refer to
Section 1.0 “Electrical Characteristics” for timer
period options.
5.8 Automatic Recharge
The MCP73213 device continuously monitors the
voltage at the VBAT pin in the charge complete mode. If
the voltage drops below the recharge threshold,
another charge cycle begins and cu rrent is once again
supplied to the battery or load. The recharge threshold
is factory set. Refer to Section 1.0 “Electrical
Characteristics” for recharge threshold option s .
For the MCP73213 device with no recharge option, the
MCP73213 will go into standby mode when termination
condition is met. The charge will not restart until
following conditions have been met:
Battery is removed from the system and inserted
again
•V
DD is removed and plugged in again
RPROG is disconnected (or high impedance) and
reconnected
Charge
Current (mA)
Recommended
E96 Resistor (Ω)
Recommended
E24 Resistor (Ω)
130 10k 10k
150 8.45k 8.20k
200 6.20k 6.20k
250 4.99k 5.10k
300 4.02k 3.90k
350 3.40k 3.30k
400 3.00k 3.00k
450 2.61k 2.70k
500 2.32k 2.37k
550 2.10k 2.20k
600 1.91k 2.00k
650 1.78k 1.80k
700 1.62k 1.60k
750 1.50k 1.50k
800 1.40k 1.50k
850 1.33k 1.30k
900 1.24k 1.20k
950 1.18k 1.20k
1000 1.10k 1.10k
1100 1.00k 1.00k
IREG 1104 RPROG 0.93
×
=
Where:
RPROG = kilo-ohms (kΩ)
IREG = milliampere (mA)
RPROG 10
IREG
1104
------------
⎝⎠
⎛⎞
log
⎝⎠
⎛⎞
0.93()
=
Where:
RPROG = kilo-ohms (kΩ)
IREG = milliampere (mA)
Note: The MCP73213 also offers options with no
automatic recharge.
© 2009 Microchip Technology Inc. DS22190B-page 19
MCP73213
5.9 Thermal Regulation
The MCP73213 shall limit the charge current based on
the die temperature. The thermal regulation optimizes
the charge cycle time while maintaining device
reliability. Figure 5-1 depicts the thermal regulation for
the MCP73213 device. Refer to Section 1.0
“Electrical Characteristics” for thermal package
resistances and Section 6.1.1.2 “Thermal
Considerations” for calculating power dissipation.
.
FIGURE 5-1: Thermal Regulation.
5.10 Thermal Shutdown
The MCP73213 suspends charge if the die
temperature exceeds +150°C. Charging will resume
when the die temperature has cooled by approximately
10°C. The thermal shutdown is a secondary safety
feature in the event that there is a failure within the
thermal regulation circuitry.
5.11 Status Indicator
The charge status outputs are open-drain ou tputs with
two different states: Low (L), and High Impedance
(Hi-Z). The charge status outputs can be used to
illuminate LEDs. Optionally, the charge status outputs
can be used as an interface to a host microcontroller.
Table 5-2 summarize the state of the status outputs
during a charge cycle.
5.12 Battery Short Protection
Once a single-cell Li-Ion battery is detected, an internal
battery short protection (BSP) circuit starts monitoring
the battery voltage. When VBAT falls below a typical
1.7V battery short protection threshold voltage, the
charging behavior is postponed. 25 mA (typical)
detection current is supplied for recovering from battery
short condition.
Preconditioning mode resumes when VBAT raises
above battery short protection threshold. The battery
voltage must rise approximately 150 mV above the
battery short protection voltage before the MCP73213
device become operational.
0
30
60
90
120
150
25 40 55 70 85 100 115 130 145 160
Junction Temperature (°C)
Fast Charge Current (mA)
VDD = 9.1V
RPROG = 10 k
TABLE 5-2: STATUS OUTPUTS
CHARGE CYCLE
STATE STAT
Shutdown Hi-Z
Standby Hi-Z
Preconditioning L
Constant Current Fast
Charge L
Constant Voltage L
Charge Complete - Standby Hi-Z
Temperature Fault 1.6 second 50% D.C.
Flashing (Type 2)
Hi-Z (Type 1)
Timer Fault 1.6 second 50% D.C.
Flashing (Type 2)
Hi-Z (Type 1)
Preconditioning Timer Fault 1.6 second 50% D.C.
Flashing (Type 2)
Hi-Z (Type 1)
MCP73213
DS22190B-page 20 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 21
MCP73213
6.0 APPLICATIONS
The MCP73213 is de si gned to operate in conjunction
with a host microcontroller or in stand-alone
applications. The MCP73213 provides the preferred
charge algorithm for dual Lithium-Ion or
Lithium-Polymer cells Constant-current followed by
Constant-voltage. Figure 6-1 depicts a typical
stand-alone application circuit, while Figure 6-2
depicts the accompanying charge profile.
FIGURE 6-1: Typical Application Circuit.
FIGURE 6-2: Typical Charge Profile
(875 mAh Li-Ion Battery).
VDD
5
3
1
2
8
7
RPROG
9
10
CIN COUT
RLED
+
-
2-Cell
Li-Ion
Battery
6
4
MCP73213 Typical Application
VDD
STAT
NC
NC
VBAT
VBAT
PROG
VSS
VSS
Ac-dc-Adapter
0
1
2
3
4
5
6
7
8
9
10
0 102030405060708090
Time (Minutes)
Battery Voltage (V)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
Supply Current (A)
VDD = 9V
RPROG = 1.5 k
875 mAh Li-Ion Battery
Thermal Foldback
MCP73213
DS22190B-page 22 © 2009 Microchip Technology Inc.
6.1 Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air . The worst-case situation is
when the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
6.1.1 COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
6.1.1.1 Charge Current
The preferred fast charge current for Li-Ion / Li-Poly
cells is below the 1C ra te, with an absolute maximum
current at the 2C rate. The recommended fast charge
current should be obtained from battery
manufacturer. For example, a 500 mAh battery pack
with 0.7C preferred fast charge current has a charge
current of 350 mA. Charging at this rate provides the
shortest charge cycle times without degradation to the
battery pack performance or life.
6.1.1.2 Thermal Consid erations
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this case, the power dissipation is:
EQUATION 6-1:
Power dissipation with a 9V, ±10% input voltage
source, 500 mA ±10% and preconditioning threshold
voltage at 6V is:
EQUATION 6-2:
This power dissipation with the battery charger in the
DFN-10 package will result approximately 92°C ab ove
room temperature.
6.1.1.3 External Capacitors
The MCP73213 is stable with or without a battery load.
In order to maintain good AC stability in the Con stant-
voltage mode, a minimum capacitance of 1 µF is
recommended to bypass the VBAT pin to VSS. This
capacitance provides compensation when there is no
battery load. In addition, the battery and
interconnections appea r inductive at high frequencies.
These elements are in the control feedback loop during
Constant-voltage mode. Therefore, the bypass
capacitance may be necessary to compensate for the
inductive nature of the battery pack.
A minimum of 16V rated 1 µF , is recommended to apply
for output capacitor and a minimum of 25V rated 1 µF,
is recommended to apply for in put ca pacitor for typical
applications.
TABLE 6-1: MLCC CAPACITOR EXAMPLE
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 1 µF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability.
6.1.1.4 Reverse-Blocking Protection
The MCP73213 provides protection from a faulted or
shorted input. Without the protection, a faulted or
shorted inpu t would discharge th e battery pack th rough
the body diode of the internal pass transistor.
Note: Please consult with your battery supplier
or refer to battery data sheet for preferred
charge rate.
PowerDissipation VDDMAX VPTHMIN
()IREGMAX
×
=
Where:
VDDMAX = the maximum input voltage
IREGMAX = the maximum fast charge current
VPTHMIN = the minimum transition threshold
voltage
MLCC
Capacitors
Temperature
Range Tolerance
X7R -55°C to +125°C ±15%
X5R -55°C to +85°C ±15%
PowerDissipation 9.9V6.0V()550mA
×
2.15W==
© 2009 Microchip Technology Inc. DS22190B-page 23
MCP73213
6.2 PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins,
recommended to minimize voltage drops along the
high current-carrying PCB traces.
If the PCB layout is used as a heatsink, adding many
vias in the heatsink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature. Figure 6-4 and Figure 6-5 depict
a typical layout with PCB heatsinking.
FIGURE 6-3: Typical Layout (Top).
FIGURE 6-4: Typical Layout (Top Metal).
FIGURE 6-5: Ty pical Layout (Bott om ) .
102-00261
MCP73213EV
MCP73213
DS22190B-page 24 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 25
MCP73213
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
XXXX
10-Lead DFN (3x3)
YYWW
NNN
Example:
Standard *
Part Number Code
MCP73213-A6SI/MF Z3HI
MCP73213-B6SI/MF Y3HI
Z3HI
0923
256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb -free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
MCP73213
DS22190B-page 26 © 2009 Microchip Technology Inc.
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D
N
NOTE 1 12
E
b
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L
E2
NOTE 1
1
2
D2
K
EXPOSED
PAD
BOTTOM VIEW
TOP VIEW
A3 A1
A
NOTE 2
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© 2009 Microchip Technology Inc. DS22190B-page 27
MCP73213
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MCP73213
DS22190B-page 28 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 29
MCP73213
APPENDIX A: REVISION HISTORY
Revision B (December 2009)
The following is the list of modificatio ns:
1. Updated the Battery Short Protection values in
the DC Characteristics table.
Revision A (July 2009)
Original Release of this Document.
MCP73213
DS22190B-page 30 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 31
MCP73213
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP73213: Dual Cell Li-Ion/Li-Polymer Battery Device
MCP73213T: Dual Cell Li-Ion/Li-Polymer Battery Device,
Tape and Reel
Temperature
Range: I= -40°C to +85°C (Industrial)
Package: MF = Plastic Dual Flat No Lead, 3x3 mm Body (DFN),
10-Lead
PART NO. XXX
PackageTemperature
Range
Device
Examples:
a) MCP73213-A6SI/MF: Dual Cell Li- Ion/
Li-Polymer Battery Device
b) MCP73213-B6SI/MF: Dual Cell Li- Ion/
Li-Polymer Battery Device
c) MCP73213T-A6SI-MF:Tape and Reel,
Dual Cell Li-Ion/
Li-Polymer Battery Device
d) MCP73213T-B6SI/MF: Tape and Reel,
Dual Cell Li-Ion/
Li-Polymer Battery Device
MCP73213
DS22190B-page 32 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS22190B-page 33
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defen d, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of product s is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Dat a
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts
allow unauthorized access to you r software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:200 2 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and
analog product s. In addition, Microchip s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS22190B-page 34 © 2009 Microchip Technology Inc.
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