USB5744 4-Port SS/HS USB Controller Hub Highlights Key Benefits * USB Hub Feature Controller IC with 4 USB 3.1 Gen 1 / USB 2.0 downstream ports * USB-IF Battery Charger revision 1.2 support on up & downstream ports (DCP, CDP, SDP) * USB Link Power Management (LPM) support * Enhanced OEM configuration options available through either OTP or SPI ROM * Available in 56-pin (7 x 7 mm) VQFN lead-free, RoHS compliant package * Commercial and industrial grade temperature support * Configuration Straps: Predefined configuration of system level functions * USB 3.1 Gen 1 compliant 5 Gbps, 480 Mbps, 12 Mbps and 1.5 Mbps operation Target Applications * * * * * Standalone USB Hubs Laptop Docks PC Motherboards PC Monitor Docks Multi-function USB 3.1 Gen 1 Peripherals - 5 V tolerant USB 2.0 pins - 1.32 V tolerant USB 3.1 Gen 1 pins - Integrated termination & pull-up/pull-down resistors * Supports per port battery charging of most popular battery powered devices - USB-IF Battery Charging rev. 1.2 support (DCP, CDP, SDP) - Apple portable product charger emulation - Chinese YD/T 1591-2006 charger emulation - Chinese YD/T 1591-2009 charger emulation - European Union universal mobile charger support - Support for Microchip USC100x family of battery charging controllers - Supports additional portable devices * Smart port controller operation - Firmware handling of companion port controllers * On-chip microcontroller - Manages I/Os, VBUS, and other signals * 8 KB RAM, 64 KB ROM * 8 KB One Time Programmable (OTP) ROM - Includes on-chip charge pump * Configuration programming via OTP ROM, SPI ROM, or SMBus * PortSwap - Configurable differential intro-pair signal swapping * PHYBoostTM - Programmable USB transceiver drive strength for recovering signal integrity * VariSenseTM - Programmable USB receiver sensitivity * Compatible with Microsoft Windows 8, 7, XP, Apple OS X 10.4+, and Linux hub drivers * Optimized for low-power operation and low thermal dissipation * Package - 56-pin VQFN (7 x 7 mm) * Environmental - 3 kV HBM JESD22-A114F ESD protection - Commercial temperature range (0C to +70C) - Industrial temperature range (-40C to +85C) 2015-2017 Microchip Technology Inc. DS00001855E-page 1 USB5744 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Documentation To obtain the most up-to-date version of this documentation, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS00001855E-page 2 2015-2017 Microchip Technology Inc. USB5744 1.0 Preface ............................................................................................................................................................................................ 4 2.0 Introduction ..................................................................................................................................................................................... 6 3.0 Pin Description and Configuration .................................................................................................................................................. 8 4.0 Device Connections ...................................................................................................................................................................... 17 5.0 Modes of Operation ...................................................................................................................................................................... 19 6.0 Device Configuration ..................................................................................................................................................................... 22 7.0 Device Interfaces .......................................................................................................................................................................... 23 8.0 Functional Descriptions ................................................................................................................................................................. 24 9.0 Operational Characteristics ........................................................................................................................................................... 30 10.0 Package Information ................................................................................................................................................................... 39 2015-2017 Microchip Technology Inc. DS00001855E-page 3 USB5744 1.0 PREFACE 1.1 General Terms TABLE 1-1: GENERAL TERMS Term Description ADC Analog-to-Digital Converter Byte 8 bits CDC Communication Device Class CSR Control and Status Registers DWORD 32 bits EOP End of Packet EP Endpoint FIFO First In First Out buffer FS Full-Speed FSM Finite State Machine GPIO General Purpose I/O HS Hi-Speed HSOS High Speed Over Sampling Hub Feature Controller The Hub Feature Controller, sometimes called a Hub Controller for short is the internal processor used to enable the unique features of the USB Controller Hub. This is not to be confused with the USB Hub Controller that is used to communicate the hub status back to the Host during a USB session. I2C Inter-Integrated Circuit LS Low-Speed lsb Least Significant Bit LSB Least Significant Byte msb Most Significant Bit MSB Most Significant Byte N/A Not Applicable NC No Connect OTP One Time Programmable PCB Printed Circuit Board PCS Physical Coding Sublayer PHY Physical Layer PLL Phase Lock Loop RESERVED Refers to a reserved bit field or address. Unless otherwise noted, reserved bits must always be zero for write operations. Unless otherwise noted, values are not guaranteed when reading reserved bits. Unless otherwise noted, do not read or write to reserved addresses. SDK Software Development Kit SMBus System Management Bus UUID Universally Unique IDentifier WORD 16 bits DS00001855E-page 4 2015-2017 Microchip Technology Inc. USB5744 1.2 1. 2. 3. 4. 5. Reference Documents UNICODE UTF-16LE For String Descriptors USB Engineering Change Notice, December 29th, 2004, http:// www.usb.org Universal Serial Bus Revision 3.1 Specification, http://www.usb.org Battery Charging Specification, Revision 1.2, Dec. 07, 2010, http://www.usb.org I2C-Bus Specification, Version 1.1, http://www.nxp.com System Management Bus Specification, Version 1.0, http://smbus.org/specs 2015-2017 Microchip Technology Inc. DS00001855E-page 5 USB5744 2.0 INTRODUCTION 2.1 General Description The Microchip USB5744 hub is low-power, OEM configurable, USB 3.1 Gen 1 hub feature controller with 4 downstream ports and advanced features for embedded USB applications. The USB5744 is fully compliant with the Universal Serial Bus Revision 3.1 Specification and USB 2.0 Link Power Management Addendum. The USB5744 supports 5 Gbps SuperSpeed (SS), 480 Mbps Hi-Speed (HS), 12 Mbps Full-Speed (FS), and 1.5 Mbps Low-Speed (LS) USB downstream devices on all enabled downstream ports. The USB5744 supports the legacy USB speeds (HS/FS/LS) through a dedicated USB 2.0 hub feature controller that is the culmination of five generations of Microchip hub feature controller design and experience with proven reliability, interoperability, and device compatibility. The SuperSpeed hub feature controller operates in parallel with the USB 2.0 controller, decoupling the 5 Gbps SS data transfers from bottlenecks due to the slower USB 2.0 traffic. The USB5744 supports downstream battery charging. The USB5744 integrated battery charger detection circuitry supports the USB-IF Battery Charging (BC1.2) detection method and most Apple devices. The USB5744 provides the battery charging handshake and supports the following USB-IF BC1.2 charging profiles: * * * * DCP: Dedicated Charging Port (Power brick with no data) CDP: Charging Downstream Port (1.5A with data) SDP: Standard Downstream Port (0.5A with data) Custom profiles loaded via SMBus or OTP Additionally, the USB5744 includes many powerful and unique features such as: PortSwap, which adds per-port programmability to USB differential-pair pin locations. PortSwap allows direct alignment of USB signals (D+/D-) to connectors to avoid uneven trace length or crossing of the USB differential signals on the PCB. PHYBoost, which provides programmable levels of Hi-Speed USB signal drive strength in the downstream port transceivers. PHYBoost attempts to restore USB signal integrity in a compromised system environment. The graphic on the right shows an example of Hi-Speed USB eye diagrams before and after PHYBoost signal integrity restoration. in a compromised system environment VariSense, which controls the USB receiver sensitivity enabling programmable levels of USB signal receive sensitivity. This capability allows operation in a sub-optimal system environment, such as when a captive USB cable is used. The USB5744 can be configured for operation through internal default settings. Custom OEM configurations are supported through external SPI ROM or OTP ROM. All port control signal pins are under firmware control in order to allow for maximum operational flexibility, and are available as GPIOs for customer specific use. The USB5744 is available in commercial (0C to +70C) and industrial (-40C to +85C) temperature ranges. An internal block diagram of the USB5744 is shown in Figure 2-1. DS00001855E-page 6 2015-2017 Microchip Technology Inc. USB5744 FIGURE 2-1: INTERNAL BLOCK DIAGRAM 2015-2017 Microchip Technology Inc. DS00001855E-page 7 USB5744 3.0 PIN DESCRIPTION AND CONFIGURATION 3.1 Pin Assignments USB3UP_TXDM USB3UP_TXDP USB2UP_DM USB2UP_DP VDD33 VDD12 47 46 45 44 43 USB3UP_RXDM 51 48 ATEST 52 USB3UP_RXDP XTALO 53 VDD12 XTALI/CLK_IN 54 49 VDD33 55 50 RBIAS 56-VQFN PIN ASSIGNMENTS 56 FIGURE 3-1: USB2DN_DP1/PRT_DIS_P1 1 42 RESET_N USB2DN_DM1/PRT_DIS_M1 2 41 SPI_CE_N/CFG_NON_REM USB3DN_TXDP1 3 40 SPI_DI/CFG_BC_EN USB3DN_TXDM1 4 39 SPI_DO/SMDAT VDD12 5 38 SPI_CLK/SMCLK USB3DN_RXDP1 6 37 VBUS_DET USB3DN_RXDM1 7 36 PRT_CTL1 35 PRT_CTL2 USB2DN_DP2/PRT_DIS_P2 USB2DN_DM2/PRT_DIS_M2 USB5744 5 6 -V QF N 8 ( To p V i e w ) 9 34 PRT_CTL3 USB3DN_TXDP2 10 33 VDD12 USB3DN_TXDM2 11 32 PRT_CTL4/GANG_PWR VSS (Connect exposed pad to ground with a via field ) 21 22 23 24 25 26 27 VDD12 USB3DN_RXDP3 USB3DN_RXDM3 USB2DN_DP4/PRT_DIS_P4 USB2DN_DM4/PRT_DIS_M4 USB3DN_TXDP4 USB3DN_TXDM4 28 20 USB3DN_TXDM3 VDD12 19 USB3DN_TXDP3 USB3DN_RXDP4 18 29 17 14 USB2DN_DP3/PRT_DIS_P3 USB3DN_RXDM2 USB2DN_DM3/PRT_DIS_M3 USB3DN_RXDM4 16 VDD33 30 VDD33 31 13 15 12 VDD12 VDD12 USB3DN_RXDP2 Note: Exposed pad (VSS) on bottom of package must be connected to ground with a via field . Note 1: Configuration straps are identified by an underlined symbol name. Signals that function as configurations traps must be augmented with an external resistor when connected to a load. Refer to Section 3.4, "Configuration Straps and Programmable Functions" for additional information. DS00001855E-page 8 2015-2017 Microchip Technology Inc. USB5744 Table 3-1 details the package pin assignments in table format. TABLE 3-1: 56-VQFN PIN ASSIGNMENTS Pin Number Pin Name Pin Number Pin Name 1 USB2DN_DP1/PRT_DIS_P1 29 USB3DN_RXDP4 2 USB2DN_DM1/PRT_DIS_M1 30 USB3DN_RXDM4 3 USB3DN_TXDP1 31 VDD33 4 USB3DN_TXDM1 32 PRT_CTL4/GANG_PWR 5 VDD12 33 VDD12 6 USB3DN_RXDP1 34 PRT_CTL3 7 USB3DN_RXDM1 35 PRT_CTL2 8 USB2DN_DP2/PRT_DIS_P2 36 PRT_CTL1 9 USB2DN_DM2/PRT_DIS_M2 37 VBUS_DET 10 USB3DN_TXDP2 38 SPI_CLK/SMCLK 11 USB3DN_TXDM2 39 SPI_DO/SMDAT 12 VDD12 40 SPI_DI/CFG_BC_EN 13 USB3DN_RXDP2 41 SPI_CE_N/CFG_NON_REM 14 USB3DN_RXDM2 42 RESET_N 15 VDD12 43 VDD12 16 VDD33 44 VDD33 17 USB2DN_DP3/PRT_DIS_P3 45 USB2UP_DP 18 USB2DN_DM3/PRT_DIS_M3 46 USB2UP_DM 19 USB3DN_TXDP3 47 USB3UP_TXDP 20 USB3DN_TXDM3 48 USB3UP_TXDM 21 VDD12 49 VDD12 22 USB3DN_RXDP3 50 USB3UP_RXDP 23 USB3DN_RXDM3 51 USB3UP_RXDM 24 USB2DN_DP4/PRT_DIS_P4 52 ATEST 25 USB2DN_DM4/PRT_DIS_M4 53 XTALO 26 USB3DN_TXDP4 54 XTALI/CLK_IN 27 USB3DN_TXDM4 55 VDD33 28 VDD12 56 RBIAS 2015-2017 Microchip Technology Inc. DS00001855E-page 9 USB5744 3.2 Pin Descriptions This section contains descriptions of the various USB5744 pins. This pin descriptions have been broken into functional groups as follows: * * * * * * USB 3.1 Gen 1 Pin Descriptions USB 2.0 Pin Descriptions USB Port Control Pin Descriptions SPI/SMBus Pin Descriptions Miscellaneous Pin Descriptions Power and Ground Pin Descriptions The "_N" symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage level. For example, RESET_N indicates that the reset signal is active low. When "_N" is not present after the signal name, the signal is asserted when at the high voltage level. The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of "active low" and "Active high" signals. The term assert, or assertion, indicates that a signal is active, independent of whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inactive. Note: The buffer type for each signal is indicated in the "Buffer Type" column of the pin description tables. A description of the buffer types is provided in Section 3.3, "Buffer Types," on page 14. For additional information on configuration straps and configurable pins, refer to Section 3.4, "Configuration Straps and Programmable Functions". TABLE 3-2: USB 3.1 GEN 1 PIN DESCRIPTIONS Num Pins Symbol Buffer Type 1 USB3UP_TXDP IO-U USB 3.1 Gen 1 upstream SuperSpeed transmit data plus. 1 USB3UP_TXDM IO-U USB 3.1 Gen 1 upstream SuperSpeed transmit data minus. 1 USB3UP_RXDP IO-U USB 3.1 Gen 1 upstream SuperSpeed receive data plus. 1 USB3UP_RXDM IO-U USB 3.1 Gen 1 upstream SuperSpeed receive data minus. 4 USBDN_TXDP[4:1] IO-U USB 3.1 Gen 1 downstream ports 4-1 SuperSpeed transmit data plus. 4 USBDN_TXDM[4:1] IO-U USB 3.1 Gen 1 downstream ports 4-1 SuperSpeed transmit data minus. 4 USBDN_RXDP[4:1] IO-U USB 3.1 Gen 1 downstream ports 4-1 SuperSpeed receive data plus. 4 USBDN_RXDM[4:1] IO-U USB 3.1 Gen 1 downstream ports 4-1 SuperSpeed receive data minus. TABLE 3-3: Description USB 2.0 PIN DESCRIPTIONS Num Pins Symbol Buffer Type 1 USB2UP_DP IO-U USB 2.0 upstream data plus (D+). 1 USB2UP_DM IO-U USB 2.0 upstream data minus (D-). DS00001855E-page 10 Description 2015-2017 Microchip Technology Inc. USB5744 TABLE 3-3: Num Pins USB 2.0 PIN DESCRIPTIONS (CONTINUED) Symbol Buffer Type USB2DN_DP[4:1] IO-U Description USB 2.0 downstream ports 4-1 data plus (D+). Port 4-1 D+ Disable Configuration Strap. 4 PRT_DIS_P[4:1] I USB2DN_DM[4:1] IO-U These configuration straps are used in conjunction with the corresponding PRT_DIS_M[4:1] straps to disable the related port (4-1). Refer to Section 3.4.2, "Port Disable Configuration (PRT_DIS_P[4:1] / PRT_DIS_M[4:1])" for more information. See Note 2. USB 2.0 downstream ports 4-1 data minus (D-). Port 4-1 D- Disable Configuration Strap. 4 PRT_DIS_M[4:1] I These configuration straps are used in conjunction with the corresponding PRT_DIS_P[4:1] straps to disable the related port (4-1). Refer to Section 3.4.2, "Port Disable Configuration (PRT_DIS_P[4:1] / PRT_DIS_M[4:1])" for more information. See Note 2. This signal detects the state of the upstream bus power. When designing a detachable hub, this pin must be connected to the VBUS power pin of the upstream USB port through a resistor divider (50 k by 100 k) to provide 3.3 V. 1 VBUS_DET IS For self-powered applications with a permanently attached host, this pin must be connected to either 3.3 V or 5.0 V through a resistor divider to provide 3.3 V. In embedded applications, VBUS_DET may be controlled (toggled) when the host desires to renegotiate a connection without requiring a full reset of the device. GPIO16 I/O6 General purpose input/output 16. Note 2: Configuration strap values are latched on Power-On Reset (POR) and the rising edge of RESET_N (external chip reset). Configuration straps are identified by an underlined symbol name. Signals that function as configurations traps must be augmented with an external resistor when connected to a load. Refer to Section 3.4, "Configuration Straps and Programmable Functions" for additional information. TABLE 3-4: Num Pins USB PORT CONTROL PIN DESCRIPTIONS Symbol Buffer Type Description Port 1 Power Enable / Overcurrent Sense. 1 PRT_CTL1 I (PU) As an output, this signal is an active high control signal used to enable power to the downstream port 1. As an input, this signal indicates an overcurrent condition from an external current monitor on USB port 1. Port 2 Power Enable / Overcurrent Sense. 1 PRT_CTL2 2015-2017 Microchip Technology Inc. I (PU) As an output, this signal is an active high control signal used to enable power to the downstream port 2. As an input, this signal indicates an overcurrent condition from an external current monitor on USB port 2. DS00001855E-page 11 USB5744 TABLE 3-4: Num Pins USB PORT CONTROL PIN DESCRIPTIONS (CONTINUED) Symbol Buffer Type Description Port 3 Power Enable / Overcurrent Sense. 1 PRT_CTL3 I (PU) As an output, this signal is an active high control signal used to enable power to the downstream port 3. As an input, this signal indicates an overcurrent condition from an external current monitor on USB port 3. Port 4 Power Enable / Overcurrent Sense. PRT_CTL4 I (PU) GANG_PWR I (PU) 1 TABLE 3-5: Num Pins As an output, this signal is an active high control signal used to enable power to the downstream port 4. As an input, this signal indicates an overcurrent condition from an external current monitor on USB port 4. When pulled high enables gang mode. Gang power pin when used in gang mode. SPI/SMBUS PIN DESCRIPTIONS Symbol Buffer Type SPI_CE_N O12 GPIO7 I/O12 Description Active low SPI chip enable output. General purpose input/output 7. Non-Removable Port Configuration Strap. 1 CFG_NON_REM I This configuration strap is used to configure the number of nonremovable ports. Refer to Section 3.4.3, "Non-Removable Port Configuration (CFG_NON_REM)" for more information. See Note 3. 1 1 SPI_CLK O6 SMCLK OD12 GPIO4 I/O6 SPI_DO O6 SMDAT I/O12 GPIO5 I/O6 SPI_DI IS GPIO9 I/O12 SPI clock output to the serial ROM, when configured for SPI operation. SMBus clock pin, when configured for SMBus slave operation. General purpose input/output 4. SPI data output, when configured for SPI operation. SMBus data pin, when configured for SMBus slave operation. General purpose input/output 5. SPI data input, when configured for SPI operation. General purpose input/output 9. Battery Charging Configuration Strap. 1 CFG_BC_EN I This configuration strap is used to enable battery charging. Refer to Section 3.4.4, "Battery Charging Configuration (CFG_BC_EN)" for more information. See Note 3. Note 3: Configuration strap values are latched on Power-On Reset (POR) and the rising edge of RESET_N (external chip reset). Configuration straps are identified by an underlined symbol name. Signals that function as configurations traps must be augmented with an external resistor when connected to a load. Refer to Section 3.4, "Configuration Straps and Programmable Functions" for additional information. DS00001855E-page 12 2015-2017 Microchip Technology Inc. USB5744 TABLE 3-6: MISCELLANEOUS PIN DESCRIPTIONS Num Pins Symbol Buffer Type 1 RESET_N IS XTALI ICLK 1 1 1 Description The RESET_N pin puts the device into Reset Mode, as the name of the pin and function then align. External 25 MHz crystal input External reference clock input. CLK_IN ICLK XTALO OCLK RBIAS AI The device may alternatively be driven by a single-ended clock oscillator. When this method is used, XTALO should be left unconnected. External 25 MHz crystal output A 12.0 k (+/- 1%) resistor is attached from ground to this pin to set the transceiver's internal bias settings. Analog test pin. 1 TABLE 3-7: Num Pins ATEST AI This signal is used for test purposes and must always be connected to ground. POWER AND GROUND PIN DESCRIPTIONS Symbol Buffer Type Description +3.3 V power and internal regulator input 4 VDD33 P Refer to Section 4.1, "Power Connections" for power connection information. +1.2 V core power 8 VDD12 P Refer to Section 4.1, "Power Connections" for power connection information. Common ground. Pad VSS 2015-2017 Microchip Technology Inc. P This exposed pad must be connected to the ground plane with a via array. DS00001855E-page 13 USB5744 3.3 Buffer Types TABLE 3-8: BUFFER TYPES Buffer Type I Input IS Schmitt-triggered input O6 Output with 6 mA sink and 6 mA source O12 Output with 12 mA sink and 12 mA source OD12 Open-drain output with 12 mA sink PU 50 A (typical) internal pull-up. Unless otherwise noted in the pin description, internal pullups are always enabled. Internal pull-up resistors prevent unconnected inputs from floating. Do not rely on internal resistors to drive signals external to the device. When connected to a load that must be pulled high, an external resistor must be added. PD 50 A (typical) internal pull-down. Unless otherwise noted in the pin description, internal pull-downs are always enabled. Internal pull-down resistors prevent unconnected inputs from floating. Do not rely on internal resistors to drive signals external to the device. When connected to a load that must be pulled low, an external resistor must be added. IO-U AI Analog input/output as defined in USB specification Analog input ICLK Crystal oscillator input pin OCLK Crystal oscillator output pin P Note: Description Power pin Refer to Section 9.5, "DC Specifications" for individual buffer DC electrical characteristics. DS00001855E-page 14 2015-2017 Microchip Technology Inc. USB5744 3.4 Configuration Straps and Programmable Functions Configuration straps are multi-function pins that are used during Power-On Reset (POR) or external chip reset (RESET_N) to determine the default configuration of a particular feature. The state of the signal is latched following deassertion of the reset. Configuration straps are identified by an underlined symbol name. This section details the various device configuration straps and associated programmable pin functions. Note: 3.4.1 The system designer must guarantee that configuration straps meet the timing requirements specified in Section 9.6.2, "Power-On and Configuration Strap Timing," on page 34 and Section 9.6.3, "Reset and Configuration Strap Timing," on page 35. If configuration straps are not at the correct voltage level prior to being latched, the device may capture incorrect strap values. SPI/SMBUS CONFIGURATION The SPI/SMBus pins can be configured into one of two functional modes: * SPI Mode * SMBus Slave Mode If 10 k pull-up resistors are detected on SPI_DO and SPI_CLK, the SPI/SMBus pins are configured into SMBus Slave Mode. If no pull-ups or pull-downs are detected on SPI_DO and SPI_CLK, the SPI/SMBus pins are first configured into SPI Mode. The strap settings for these supported modes are detailed in Table 3-9. The individual pin function assignments for each mode are detailed in Table 3-10. For additional device connection information, refer to Section 4.0, "Device Connections". TABLE 3-9: SPI/SMBUS MODE CONFIGURATION SETTINGS Pin SPI Mode (Note 4) SMBus Slave Mode 39 (SPI_DO) No pull-up/down 10 k pull-up 38 (SPI_CLK) No pull-up/down 10 k pull-up Note 4: In order to use the SPI interface, an SPI ROM containing a valid signature of 2DFU (device firmware upgrade) beginning at address 0xFFFA must be present. Refer to Section 7.1, "SPI Master Interface" for additional information. TABLE 3-10: SPI/SMBUS MODE PIN ASSIGNMENTS Pin SPI Mode SMBus Slave Mode 41 SPI_CE_N CFG_NON_REM 40 SPI_DI CFG_BC_EN 39 SPI_DO SMDAT 38 SPI_CLK SMCLK 2015-2017 Microchip Technology Inc. DS00001855E-page 15 USB5744 3.4.2 PORT DISABLE CONFIGURATION (PRT_DIS_P[4:1] / PRT_DIS_M[4:1]) The PRT_DIS_P[4:1] and PRT_DIS_M[4:1] configuration straps are used in conjunction to disable the related port (4-1). For PRT_DIS_Px (where x is the corresponding port 4-1): 0 = Port x D+ Enabled 1 = Port x D+ Disabled For PRT_DIS_Mx (where x is the corresponding port 4-1): 0 = Port x D- Enabled 1 = Port x D- Disabled Note: 3.4.3 Both PRT_DIS_Px and PRT_DIS_Mx (where x is the corresponding port) must be tied to 3.3 V to disable the associated downstream port. Disabling the USB 2.0 port will also disable the corresponding USB 3.1 Gen 1 port. NON-REMOVABLE PORT CONFIGURATION (CFG_NON_REM) The CFG_NON_REM configuration strap is used to configure the non-removable port settings of the device to one of five settings. These modes are selected by the configuration of an external resistor on the CFG_NON_REM pin. The resistor options are a 200 k pull-down, 200 k pull-up, 10 k pull-down, 10 k pull-up, and 10 pull-down, as shown in Table 3-11. TABLE 3-11: CFG_NON_REM RESISTOR ENCODING CFG_NON_REM Resistor Value Setting 200 k Pull-Down All ports removable 200 k Pull-Up Port 1 non-removable 10 k Pull-Down Port 1, 2 non-removable 10 k Pull-Up Port 1, 2, 3, non-removable 10 Pull-Down Port 1, 2, 3, 4 non-removable 3.4.4 BATTERY CHARGING CONFIGURATION (CFG_BC_EN) The CFG_BC_EN configuration strap is used to configure the battery charging port settings of the device to one of five settings. These modes are selected by the configuration of an external resistor on the CFG_BC_EN pin. The resistor options are a 200 k pull-down, 200 k pull-up, 10 k pull-down, 10 k pull-up, and 10 pull-down, as shown in Table 3-12. TABLE 3-12: CFG_BC_EN RESISTOR ENCODING CFG_BC_EN Resistor Value Setting 200 k Pull-Down No battery charging 200 k Pull-Up Port 1 battery charging 10 k Pull-Down Port 1, 2 battery charging 10 k Pull-Up Port 1, 2, 3, battery charging 10 Pull-Down Port 1, 2, 3, 4 battery charging DS00001855E-page 16 2015-2017 Microchip Technology Inc. USB5744 4.0 DEVICE CONNECTIONS 4.1 Power Connections Figure 4-1 illustrates the device power connections. FIGURE 4-1: POWER CONNECTIONS +3.3V Supply +1.2V Supply VDD33 (4x) 3.3V Internal Logic USB5744 4.2 1.2V Internal Logic VDD12 (8x) VSS SPI ROM Connections Figure 4-2 illustrates the device SPI ROM connections. Refer to Section 7.1, "SPI Master Interface," on page 23 for additional information on this device interface. FIGURE 4-2: SPI ROM CONNECTIONS SPI_CE_N CE# SPI_CLK CLK USB5744 2015-2017 Microchip Technology Inc. SPI ROM SPI_DO DO SPI_DI DI DS00001855E-page 17 USB5744 4.3 SMBus Slave Connections Figure 4-3 illustrates the device SMBus slave connections. Refer to Section 7.2, "SMBus Slave Interface," on page 23 for additional information on this device interface. FIGURE 4-3: SMBUS SLAVE CONNECTIONS +3.3V 10K Clock SMCLK USB5744 SMBus Master +3.3V 10K SMDAT DS00001855E-page 18 Data 2015-2017 Microchip Technology Inc. USB5744 5.0 MODES OF OPERATION The device provides two main modes of operation: Standby Mode and Hub Mode. These modes are controlled via the RESET_N pin, as shown in Table 5-1. TABLE 5-1: MODES OF OPERATION RESET_N Input Summary 0 Standby Mode: This is the lowest power mode of the device. No functions are active other than monitoring the RESET_N input. All port interfaces are high impedance and the PLL is halted. Refer to Section 8.2.2, "External Chip Reset (RESET_N)" for additional information on RESET_N. 1 Hub (Normal) Mode: The device operates as a configurable USB hub with battery charger detection. This mode has various sub-modes of operation, as detailed in Figure 5-1. Power consumption is based on the number of active ports, their speed, and amount of data received. The flowchart in Figure 5-1 details the modes of operation and details how the device traverses through the Hub Mode stages (shown in bold). The remaining sub-sections provide more detail on each stage of operation. FIGURE 5-1: HUB MODE FLOWCHART RESET_N deasserted (SPI_INIT) (CFG_RD) In SPI Mode & Ext. SPI ROM present? NO Load Config from Internal ROM YES Modify Config Based on Config Straps Run From External SPI ROM Perform SMBus/I2C Initialization YES SMBus Host Present? NO (STRAP) NO SOC Done? (SOC_CFG) YES Combine OTP Config Data (OTP_CFG) Hub Connect (Hub.Connect) Normal operation 2015-2017 Microchip Technology Inc. DS00001855E-page 19 USB5744 5.1 5.1.1 Boot Sequence STANDBY MODE If the RESET_N pin is asserted, the hub will be in Standby Mode. This mode provides a very low power state for maximum power efficiency when no signaling is required. This is the lowest power state. In Standby Mode all downstream ports are disabled, the USB data pins are held in a high-impedance state, all transactions immediately terminate (no states saved), all internal registers return to their default state, the PLL is halted, and core logic is powered down in order to minimize power consumption. Because core logic is powered off, no configuration settings are retained in this mode and must be re-initialized after RESET_N is negated high. 5.1.2 SPI INITIALIZATION STAGE (SPI_INIT) The first stage, the initialization stage, occurs on the deassertion of RESET_N. In this stage, the internal logic is reset, the PLL locks if a valid clock is supplied, and the configuration registers are initialized to their default state. The internal firmware then checks for an external SPI ROM. The firmware looks for an external SPI flash device that contains a valid signature of "2DFU" (device firmware upgrade) beginning at address 0xFFFA. If a valid signature is found, then the external ROM is enabled and the code execution begins at address 0x0000 in the external SPI device. If a valid signature is not found, then execution continues from internal ROM (CFG_RD stage). When using an external SPI ROM, a 1 Mbit, 60 MHz or faster ROM must be used. Both 1- and 2-bit SPI operation are supported. For optimum throughput, a 2-bit SPI ROM is recommended. Both mode 0 and mode 3 SPI ROMs are also supported. If the system is not strapped for SPI Mode, code execution will continue from internal ROM (CFG_RD stage). 5.1.3 CONFIGURATION READ STAGE (CFG_RD) In this stage, the internal firmware loads the default values from the internal ROM and then uses the configuration strapping options to override the default values. Refer to Section 3.4, "Configuration Straps and Programmable Functions" for information on usage of the various device configuration straps. 5.1.4 STRAP READ STAGE (STRAP) In this stage, the firmware registers the configuration strap settings on the SPI_DO and SPI_CLK pins. Refer to Section 3.4.1, "SPI/SMBus Configuration" for information on configuring these straps. If configured for SMBus Slave Mode, the next state will be SOC_CFG. Otherwise, the next state is OTP_CFG. 5.1.5 SOC CONFIGURATION STAGE (SOC_CFG) In this stage, the SOC can modify any of the default configuration settings specified in the integrated ROM, such as USB device descriptors and port electrical settings. There is no time limit on this mode. In this stage the firmware will wait indefinitely for the SMBus/I2C configuration. When the SOC has completed configuring the device, it must write to register 0xFF to end the configuration. 5.1.6 OTP CONFIGURATION STAGE (OTP_CFG) Once the SOC has indicated that it is done with configuration, all configuration data is combined in this stage. The default data, the SOC configuration data, and the OTP data are all combined in the firmware and the device is programmed. After the device is fully configured, it will go idle and then into suspend if there is no VBUS or Hub.Connect present. Once VBUS is present, and battery charging is enabled, the device will transition to the Battery Charger Detection Stage. If VBUS is present, and battery charging is not enabled, the device will transition to the Connect stage. 5.1.7 HUB CONNECT STAGE (HUB.CONNECT) Once the CHGDET stage is completed, the device enters the Hub Connect stage. USB connect can be initiated by asserting the VBUS pin function high. The device will remain in the Hub Connect stage indefinitely until the VBUS pin function is deasserted. DS00001855E-page 20 2015-2017 Microchip Technology Inc. USB5744 5.1.8 NORMAL MODE Lastly, the hub enters Normal Mode of operation. In this stage full USB operation is supported under control of the USB Host on the upstream port. The device will remain in the normal mode until the operating mode is changed by the system. If RESET_N is asserted low, then Standby Mode is entered. The device may then be placed into any of the designated hub stages. Asserting a soft disconnect on the upstream port will cause the hub to return to the Hub.Connect stage until the soft disconnect is negated. 2015-2017 Microchip Technology Inc. DS00001855E-page 21 USB5744 6.0 DEVICE CONFIGURATION The device supports a large number of features (some mutually exclusive), and must be configured in order to correctly function when attached to a USB host controller. The hub can be configured either internally or externally depending on the implemented interface. Microchip provides a comprehensive software programming tool, Pro-Touch, for configuring the USB5744 functions, registers and OTP memory. All configuration is to be performed via the Pro-Touch programming tool. For additional information on the Pro-Touch programming tool, refer to the Software Libraries within the Microchip USB5744 product page at www.microchip.com/USB5744. Note: 6.1 Device configuration straps and programmable pins are detailed in Section 3.4, "Configuration Straps and Programmable Functions," on page 15. Refer to Section 7.0, "Device Interfaces" for detailed information on each device interface. Customer Accessible Functions The following USB or SMBus accessible functions are available to the customer via the Pro-Touch Programming Tool. Note: 6.1.1 6.1.1.1 For additional programming details, refer to the Pro-Touch programming tool. USB ACCESSIBLE FUNCTIONS OTP Access over USB The OTP ROM in the device is accessible via the USB bus. All OTP parameters can be modified to the USB Host. The OTP operates in Single Ended mode. For more information, refer to the Microchip USB5744 product page and SDK at www.microchip.com/USB5744 6.1.1.2 Battery Charging Access over USB The Battery charging behavior of the device can be dynamically changed by the USB Host when something other than the preprogrammed or OTP programmed behavior is desired. For more information, refer to the Microchip USB5744 product page and SDK at www.microchip.com/USB5744 6.1.2 SMBUS ACCESSIBLE FUNCTIONS OTP access and configuration of specific device functions are possible via the USB5744 SMBus. All OTP parameters can be modified via the SMBus Host. The OTP can be programmed to operate in Single-Ended, Differential, Redundant, or Differential Redundant mode, depending on the level of reliability required. For more information, refer to AN1903 "Configuration Options for the USB5734 and USB5744" application note at www.microchip.com/AN1903. DS00001855E-page 22 2015-2017 Microchip Technology Inc. USB5744 7.0 DEVICE INTERFACES The USB5744 provides multiple interfaces for configuration and external memory access. This section details the various device interfaces and their usage: * SPI Master Interface * SMBus Slave Interface Note: For details on how to enable each interface, refer to Section 3.4.1, "SPI/SMBus Configuration". For information on device connections, refer to Section 4.0, "Device Connections". For information on device configuration, refer to Section 6.0, "Device Configuration". Microchip provides a comprehensive software programming tool, Pro-Touch, for configuring the USB5744 functions, registers and OTP memory. All configuration is to be performed via the Pro-Touch programming tool. For additional information on the Pro-Touch programming tool, refer to Software Libraries within Microchip USB5744 product page at www.microchip.com/USB5744. 7.1 SPI Master Interface The device is capable of code execution from an external SPI ROM. When configured for SPI Mode, on power up the firmware looks for an external SPI flash device that contains a valid signature of 2DFU (device firmware upgrade) beginning at address 0xFFFA. If a valid signature is found, then the external ROM is enabled and the code execution begins at address 0x0000 in the external SPI device. If a valid signature is not found, then execution continues from internal ROM. Note: 7.2 For SPI timing information, refer to Section 9.6.7, "SPI Timing". SMBus Slave Interface The device includes an integrated SMBus slave interface, which can be used to access internal device run time registers or program the internal OTP memory. SMBus slave detection is accomplished by detection of pull-up resistors on both the SMDAT and SMCLK signals. Refer to Section 3.4.1, "SPI/SMBus Configuration" for additional information. Note: All device configuration must be performed via the Pro-Touch Programming Tool. For additional information on the Pro-Touch programming tool, refer to Software Libraries within Microchip USB5744 product page at www.microchip.com/USB5744. 2015-2017 Microchip Technology Inc. DS00001855E-page 23 USB5744 8.0 FUNCTIONAL DESCRIPTIONS This section details various USB5744 functions, including: * * * * Downstream Battery Charging Resets Link Power Management (LPM) Port Control Interface 8.1 Downstream Battery Charging The device can be configured by an OEM to have any of the downstream ports support battery charging. The hub's role in battery charging is to provide acknowledgment to a device's query as to whether the hub system supports USB battery charging. The hub silicon does not provide any current or power FETs or any additional circuitry to actually charge the device. Those components must be provided externally by the OEM. FIGURE 8-1: BATTERY CHARGING EXTERNAL POWER SUPPLY DC Power INT SCL Microchip SOC Hub SDA PRT_CTL[n] VBUS[n] If the OEM provides an external supply capable of supplying current per the battery charging specification, the hub can be configured to indicate the presence of such a supply from the device. This indication, via the PRT_CTL[4:1] pins, is on a per port basis. For example, the OEM can configure two ports to support battery charging through high current power FETs and leave the other two ports as standard USB ports. For additional information, refer to the Microchip USB5744 Battery Charging application note on the Microchip.com USB5744 product page at www.microchip.com/USB5744. DS00001855E-page 24 2015-2017 Microchip Technology Inc. USB5744 8.2 Resets The device includes the following chip-level reset sources: * Power-On Reset (POR) * External Chip Reset (RESET_N) * USB Bus Reset 8.2.1 POWER-ON RESET (POR) A power-on reset occurs whenever power is initially supplied to the device, or if power is removed and reapplied to the device. A timer within the device will assert the internal reset per the specifications listed in Section 9.6.2, "Power-On and Configuration Strap Timing," on page 34. 8.2.2 EXTERNAL CHIP RESET (RESET_N) A valid hardware reset is defined as assertion of RESET_N, after all power supplies are within operating range, per the specifications in Section 9.6.3, "Reset and Configuration Strap Timing," on page 35. While reset is asserted, the device (and its associated external circuitry) enters Standby Mode and consumes minimal current. Assertion of RESET_N causes the following: 1. 2. 3. 4. 5. The PHY is disabled and the differential pairs will be in a high-impedance state. All transactions immediately terminate; no states are saved. All internal registers return to the default state. The external crystal oscillator is halted. The PLL is halted. All power supplies must have reached the operating levels mandated in Section 9.2, "Operating Conditions**," on page 30, prior to (or coincident with) the assertion of RESET_N. Note: 8.2.3 USB BUS RESET In response to the upstream port signaling a reset to the device, the device performs the following: The device does not propagate the upstream USB reset to downstream devices. Note: 1. 2. 3. 4. Sets default address to 0. Sets configuration to Unconfigured. Moves device from suspended to active (if suspended). Complies with the USB Specification for behavior after completion of a reset sequence. The host then configures the device in accordance with the USB Specification. 8.3 Link Power Management (LPM) The device supports the L0 (On), L1 (Sleep), and L2 (Suspend) link power management states. These supported LPM states offer low transitional latencies in the tens of microseconds versus the much longer latencies of the traditional USB suspend/resume in the tens of milliseconds. The supported LPM states are detailed in Table 8-1. TABLE 8-1: LPM STATE DEFINITIONS State Description Entry/Exit Time to L0 L2 Suspend Entry: ~3 ms Exit: ~2 ms (from start of RESUME) L1 Sleep Entry: <10 us Exit: <50 us L0 Fully Enabled (On) - 2015-2017 Microchip Technology Inc. DS00001855E-page 25 USB5744 8.4 Port Control Interface Port power and over-current sense share the same pin (PRT_CTLx) for each port. These functions can be controlled directly from the USB hub, or via the processor. The device can be configured into the following port control modes: * Ganged Mode * Combined Mode Port connection in various modes are detailed in the following subsections. 8.4.1 PORT CONNECTION IN GANGED MODE In this mode, one pin (GANG_PWR) is used to control port power and over-current sensing. 8.4.2 8.4.2.1 PORT CONNECTION IN COMBINED MODE Port Power Control using USB Power Switch When operating in combined mode, the device will have one port power control and over-current sense pin for each downstream port. When disabling port power, the driver will actively drive a '0'. To avoid unnecessary power dissipation, the pull-up resistor will be disabled at that time. When port power is enabled, it will disable the output driver and enable the pull-up resistor, making it an open drain output. If there is an over-current situation, the USB Power Switch will assert the open drain OCS signal. The Schmidt trigger input will recognize that as a low. The open drain output does not interfere. The over-current sense filter handles the transient conditions such as low voltage while the device is powering up. FIGURE 8-2: PORT POWER CONTROL WITH USB POWER SWITCH Pull-Up Enable 5V 50k PRT_CTLx OCS USB Power Switch EN PRTPWR USB Device FILTER OCS When the port is enabled, the PRT_CTLx pin input is constantly sampled. Overcurrent events can be detected in one of two ways: * Single, continuous low pulse (consecutive low samples over tocs_single), as shown in Figure 8-3. * Two short low pulses within a rolling window (two groupings of 1 or more low samples over tocs_double), as shown in Figure 8-4. FIGURE 8-3: SINGLE LOW PULSE OVERCURRENT DETECTION PRT_CTLx IS VIL tocs_single DS00001855E-page 26 2015-2017 Microchip Technology Inc. USB5744 FIGURE 8-4: DOUBLE LOW PULSE OVERCURRENT DETECTION PRT_CTLx IS VIL tocs_double TABLE 8-2: OVERCURRENT PULSE TIMING Symbol Description Min Max Units tocs_single single low pulse assertion time 5 - ms tocs_double double low pulse window - 20 ms 8.4.2.2 Port Power Control using Poly Fuse When using the device with a poly fuse, there is no need for an output power control. To maintain consistency, the same circuit will be used. A single port power control and over-current sense for each downstream port is still used from the Hub's perspective. When disabling port power, the driver will actively drive a '0'. This will have no effect as the external diode will isolate pin from the load. When port power is enabled, it will disable the output driver and enable the pull-up resistor. This means that the pull-up resistor is providing 3.3 volts to the anode of the diode. If there is an over-current situation, the poly fuse will open. This will cause the cathode of the diode to go to 0 volts. The anode of the diode will be at 0.7 volts, and the Schmidt trigger input will register this as a low resulting in an over-current detection. The open drain output does not interfere. Note: The USB 2.0 and USB 3.1 Gen 1 bPwrOn2PwrGood descriptors must be set to 0 when using poly-fuse mode. Refer to Microchip application note AN1903 "Configuration Options for the USB5734 and USB5744" for details on how to change these values. FIGURE 8-5: PORT POWER CONTROL USING A POLY FUSE 5V Pull-Up Enable Poly Fuse 50k PRT_CTLx USB Device PRTPWR OCS 2015-2017 Microchip Technology Inc. FILTER DS00001855E-page 27 USB5744 8.4.2.3 Port Power Control with Single Poly Fuse and Multiple Loads Many customers use a single poly fuse to power all their devices. For the ganged situation, all power control pins must be tied together. FIGURE 8-6: PORT POWER CONTROL WITH GANGED CONTROL WITH POLY FUSE 5V Pull-Up Enable 50k Poly Fuse PRT_CTLz Pull-Up Enable 50k PRT_CTLy Pull-Up Enable 50k PRT_CTLx USB Device PRTPWR USB Device USB Device OCS 8.4.3 PORT CONTROLLER CONNECTION EXAMPLE FIGURE 8-7: USB5744 WITH 4 GENERIC PORT POWER CONTROLLERS (2 BC ENABLED) (High Current) PRT_CTL1 POWER OCS Generic Port Power Controller (High Current) POWER OCS Generic Port Power Controller D+ D- (BC Enabled) Port 2 Connector VBUS (BC Enabled) D+ D- USB5744 PRT_CTL3 VBUS D+ D- D+ D- PRT_CTL2 Port 1 Connector POWER OCS Port 3 Connector VBUS Generic Port Power Controller D+ D- D+ D- PRT_CTL4 POWER OCS Port 4 Connector VBUS Generic Port Power Controller D+ D- DS00001855E-page 28 D+ D- 2015-2017 Microchip Technology Inc. USB5744 Note: The CFG_BC_EN configuration strap must be properly configured to enable battery charging on the appropriate ports. For example, in the application shown in Figure 8-7, CFG_BC_EN must be connected to an external 10 k pull-down resistor to enable battery charging on Ports 1 and 2. For more information on the CFG_BC_EN configuration strap, refer to Section 3.4.4, "Battery Charging Configuration (CFG_BC_EN)". 2015-2017 Microchip Technology Inc. DS00001855E-page 29 USB5744 9.0 OPERATIONAL CHARACTERISTICS 9.1 Absolute Maximum Ratings* +1.2 V Supply Voltage (VDD12) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to +1.32 V +3.3 V Supply Voltage (VDD33) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to +4.6 V Positive voltage on input signal pins, with respect to ground (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.6 V Negative voltage on input signal pins, with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V Positive voltage on XTALI/CLK_IN, with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.63 V Positive voltage on USB DP/DM signal pins, with respect to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6.0 V Positive voltage on USB 3.1 Gen 1 USB3UP_xxxx and USB3DN_xxxx signal pins, with respect to ground . . . . . 1.32 V Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to +150oC Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +125oC Lead Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to JEDEC Spec. J-STD-020 HBM ESD Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 kV Note 1: When powering this device from laboratory or system power supplies, it is important that the absolute maximum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. If this possibility exists, it is suggested to use a clamp circuit. Note 2: This rating does not apply to the following pins: All USB DM/DP pins, XTAL1/CLK_IN, and XTALO *Stresses exceeding those listed in this section could cause permanent damage to the device. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at any condition exceeding those indicated in Section 9.2, "Operating Conditions**", Section 9.5, "DC Specifications", or any other applicable section of this specification is not implied. 9.2 Operating Conditions** +1.2 V Supply Voltage (VDD12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +1.08 V to +1.32 V +3.3 V Supply Voltage (VDD33) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.0 V to +3.6 V Input Signal Pins Voltage (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +3.6 V XTALI/CLK_IN Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +3.6 V USB 2.0 DP/DM Signal Pins Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +5.5 V USB 3.1 Gen 1 USB3UP_xxxx and USB3DN_xxxx Signal Pins Voltage . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +1.32 V Ambient Operating Temperature in Still Air (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Note 3 +1.2 V Supply Voltage Rise Time (TRT in Figure 9-1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 s +3.3 V Supply Voltage Rise Time (TRT in Figure 9-1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 s Note 3: 0oC to +70oC for commercial version, -40oC to +85oC for industrial version. **Proper operation of the device is guaranteed only within the ranges specified in this section. Note: Do not drive input signals without power supplied to the device. DS00001855E-page 30 2015-2017 Microchip Technology Inc. USB5744 FIGURE 9-1: SUPPLY RISE TIME MODEL Voltage TRT 3.3 V VDD33 100% 90% 1.2 V VDD12 100% 90% 10% VSS t90% t10% 9.3 Package Thermal Specifications TABLE 9-1: PACKAGE THERMAL PARAMETERS Symbol JA JT JC Note: Time C/W Velocity (Meters/s) 30 0 26 1 0.2 0 0.3 1 2.6 0 2.6 1 Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51. TABLE 9-2: MAXIMUM POWER DISSIPATION Parameter Value Units PD(max) 1400 mW 2015-2017 Microchip Technology Inc. DS00001855E-page 31 USB5744 9.4 Power Consumption This section details the power consumption of the device as measured during various modes of operation. Power dissipation is determined by temperature, supply voltage, and external source/sink requirements. TABLE 9-3: DEVICE POWER CONSUMPTION Typical (mA) Typical Power VDD33 VDD12 (mW) Reset 0.8 1.8 4.8 No VBUS 2.0 5.0 12.6 Global Suspend 2.0 5.2 12.9 4 FS Ports 39 35 170 4 HS Ports 53 42 222 4 SS Ports 55 683 1001 4 SS/HS Ports 93 688 1132 DS00001855E-page 32 2015-2017 Microchip Technology Inc. USB5744 9.5 DC Specifications TABLE 9-4: I/O DC ELECTRICAL CHARACTERISTICS Parameter Symbol Min Typical Max Units 0.9 V Notes I Type Input Buffer Low Input Level VIL High Input Level VIH 2.1 V IS Type Input Buffer Low Input Level VIL High Input Level VIH 1.9 VHYS 9 Schmitt Trigger Hysteresis (VIHT - VILT) 0.9 V V 20 40 mV 0.4 V IOL = 6 mA V IOH = -6 mA V IOL = 12 mA V IOH = -12 mA V IOL = 12 mA O6 Type Output Buffer Low Output Level VOL High Output Level VOH VDD33-0.4 O12 Type Output Buffer Low Output Level VOL High Output Level VOH 0.4 VDD33-0.4 OD12 Type Output Buffer Low Output Level VOL 0.4 Note 4 ICLK Type Input Buffer (XTALI Input) Low Input Level VIL High Input Level VIH 0.85 0.50 V VDD33 V IO-U Type Buffer (See Note 5) Note 5 Note 4: XTALI can optionally be driven from a 25 MHz singled-ended clock oscillator. Note 5: Refer to the USB 3.1 Gen 1 Specification for USB DC electrical characteristics. 2015-2017 Microchip Technology Inc. DS00001855E-page 33 USB5744 9.6 AC Specifications This section details the various AC timing specifications of the device. 9.6.1 POWER SUPPLY AND RESET_N SEQUENCE TIMING Figure 9-2 illustrates the recommended power supply sequencing and timing for the device. VDD33 should rise after or at the same rate as VDD12. Similarly, RESET_N and/or VBUS_DET should rise after or at the same rate as VDD33. VBUS_DET and RESET_N do not have any other timing dependencies. FIGURE 9-2: POWER SUPPLY AND RESET_N SEQUENCE TIMING VDD12 VDD33 RESET_N/ VBUS_DET TABLE 9-5: POWER SUPPLY AND RESET_N SEQUENCE TIMING Symbol Description tVDD33 treset 9.6.2 Min Typ Max Units VDD12 to VDD33 rise time 0 ms VDD33 to RESET_N/VBUS_DET rise time 0 ms POWER-ON AND CONFIGURATION STRAP TIMING Figure 9-3 illustrates the configuration strap valid timing requirements in relation to power-on, for applications where RESET_N is not used at power-on. In order for valid configuration strap values to be read at power-on, the following timing requirements must be met. The operational levels (Vopp) for the external power supplies are detailed in Section 9.2, "Operating Conditions**," on page 30. FIGURE 9-3: POWER-ON CONFIGURATION STRAP VALID TIMING All External Power Supplies Vopp tcsh Configuration Straps TABLE 9-6: POWER-ON CONFIGURATION STRAP LATCHING TIMING Symbol Description Min tcsh Configuration strap hold after external power supplies at operational levels 1 Typ Max Units ms Device configuration straps are also latched as a result of RESET_N assertion. Refer to Section 9.6.3, "Reset and Configuration Strap Timing" for additional details. DS00001855E-page 34 2015-2017 Microchip Technology Inc. USB5744 9.6.3 RESET AND CONFIGURATION STRAP TIMING Figure 9-4 illustrates the RESET_N pin timing requirements and its relation to the configuration strap pins. Assertion of RESET_N is not a requirement. However, if used, it must be asserted for the minimum period specified. Refer to Section 8.2, "Resets" for additional information on resets. Refer to Section 3.4, "Configuration Straps and Programmable Functions" for additional information on configuration straps. FIGURE 9-4: RESET_N CONFIGURATION STRAP TIMING trstia RESET_N tcsh Configuration Straps TABLE 9-7: RESET_N CONFIGURATION STRAP TIMING Symbol Description Min Typ Max Units trstia RESET_N input assertion time 5 s tcsh Configuration strap pins hold after RESET_N deassertion 1 ms Note: The clock input must be stable prior to RESET_N deassertion. Configuration strap latching and output drive timings shown assume that the Power-On reset has finished first otherwise the timings in Section 9.6.2, "Power-On and Configuration Strap Timing" apply. 9.6.4 USB TIMING All device USB signals conform to the voltage, power, and timing characteristics/specifications as set forth in the Universal Serial Bus Specification. Please refer to the Universal Serial Bus Revision 3.1 Specification, available at http:// www.usb.org/developers/docs. 9.6.5 I2C TIMING All device I2C signals conform to the 400KHz Fast Mode (Fm) voltage, power, and timing characteristics/specifications as set forth in the I2C-Bus Specification. Please refer to the I2C-Bus Specification, available at http://www.nxp.com/documents/user_manual/UM10204.pdf. 9.6.6 SMBUS TIMING All device SMBus signals conform to the voltage, power, and timing characteristics/specifications as set forth in the System Management Bus Specification. Please refer to the System Management Bus Specification, Version 1.0, available at http://smbus.org/specs. 2015-2017 Microchip Technology Inc. DS00001855E-page 35 USB5744 9.6.7 SPI TIMING This section specifies the SPI timing requirements for the device. FIGURE 9-5: SPI TIMING tceh SPI_CE_N tfc tcel SPI_CLK tclq tdh SPI_DI tos toh tov toh SPI_DO TABLE 9-8: SPI TIMING (30 MHZ OPERATION) Symbol tfc Description Min Typ Clock frequency Max Units 30 MHz tceh Chip enable (SPI_CE_EN) high time tclq Clock to input data tdh Input data hold time 0 ns 100 ns 13 ns tos Output setup time 5 ns toh Output hold time 5 ns tov Clock to output valid 4 ns tcel Chip enable (SPI_CE_EN) low to first clock 12 ns tceh Last clock to chip enable (SPI_CE_EN) high 12 ns TABLE 9-9: SPI TIMING (60 MHZ OPERATION) Symbol tfc Description Min Clock frequency Typ Max Units 60 MHz 9 ns tceh Chip enable (SPI_CE_EN) high time tclq Clock to input data tdh Input data hold time 0 ns tos Output setup time 5 ns toh Output hold time 5 ns tov Clock to output valid 4 ns tcel Chip enable (SPI_CE_EN) low to first clock 12 ns tceh Last clock to chip enable (SPI_CE_EN) high 12 ns DS00001855E-page 36 50 ns 2015-2017 Microchip Technology Inc. USB5744 9.7 Clock Specifications The device can accept either a 25MHz crystal or a 25MHz single-ended clock oscillator (50ppm) input. If the singleended clock oscillator method is implemented, XTALO should be left unconnected and XTALI/CLK_IN should be driven with a nominal 0-3.3V clock signal. The input clock duty cycle is 40% minimum, 50% typical and 60% maximum. It is recommended that a crystal utilizing matching parallel load capacitors be used for the crystal input/output signals (XTALI/XTALO). The following circuit design (Figure 9-6) and specifications (Table 9-10) are required to ensure proper operation. FIGURE 9-6: 25MHZ CRYSTAL CIRCUIT USB5744 XTALO Y1 XTALI C1 9.7.1 C2 CRYSTAL SPECIFICATIONS It is recommended that a crystal utilizing matching parallel load capacitors be used for the crystal input/output signals (XTALI/XTALO). Refer to Table 9-10 for the recommended crystal specifications. TABLE 9-10: CRYSTAL SPECIFICATIONS Parameter Symbol Min Nom Crystal Cut Max Units Notes AT, typ Crystal Oscillation Mode Fundamental Mode Crystal Calibration Mode Parallel Resonant Mode Ffund - 25.000 - MHz Ftol - - 50 PPM Note 6 Frequency Stability Over Temp Ftemp - - 50 PPM Note 6 Frequency Deviation Over Time Fage - 3 to 5 - PPM - - 100 PPM Frequency oC Frequency Tolerance @ 25 Total Allowable PPM Budget Shunt Capacitance CO - 7 typ - pF Load Capacitance CL - 20 typ - pF Drive Level PW 100 - - uW Equivalent Series Resistance R1 - - 50 Note 7 Note 7 - Note 8 oC XTALI/CLK_IN Pin Capacitance - 3 typ - pF Note 9 XTALO Pin Capacitance - 3 typ - pF Note 9 Operating Temperature Range Note 6: Frequency Deviation Over Time is also referred to as Aging. 2015-2017 Microchip Technology Inc. DS00001855E-page 37 USB5744 Note 7: 0 C for commercial version, -40 C for industrial version. Note 8: +70 C for commercial version, +85 C for industrial version. Note 9: This number includes the pad, the bond wire and the lead frame. PCB capacitance is not included in this value. The XTALI/CLK_IN pin, XTALO pin and PCB capacitance values are required to accurately calculate the value of the two external load capacitors. These two external load capacitors determine the accuracy of the 25.000 MHz frequency. 9.7.2 EXTERNAL REFERENCE CLOCK (CLK_IN) When using an external reference clock, the following input clock specifications are suggested: * 25 MHz * 50% duty cycle 10%, 100 ppm * Jitter < 100 ps RMS DS00001855E-page 38 2015-2017 Microchip Technology Inc. USB5744 10.0 PACKAGE INFORMATION 10.1 Package Marking Information 56-VQFN (7x7 mm) PIN 1 Legend: Note: i R nnn e3 V COO YY WW NNN USB5744i e3 Rnnn e3 VCOO YYWWNNN Temperature range designator (Blank = commercial, i = industrial) Product revision Internal code Pb-free JEDEC(R) designator for Matte Tin (Sn) Plant of assembly Country of origin Year code (last two digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. * Standard device marking consists of Microchip part number, year code, week code and traceability code. For device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2015-2017 Microchip Technology Inc. DS00001855E-page 39 USB5744 10.2 Note: Package Drawings For the most current package drawings, see the Microchip Packaging Specification at: http://www.microchip.com/packaging. FIGURE 10-1: DS00001855E-page 40 56-VQFN PACKAGE (DRAWING) 2015-2017 Microchip Technology Inc. USB5744 FIGURE 10-2: 56-VQFN PACKAGE (DIMENSIONS) 2015-2017 Microchip Technology Inc. DS00001855E-page 41 USB5744 FIGURE 10-3: DS00001855E-page 42 56-VQFN LAND PATTERN 2015-2017 Microchip Technology Inc. USB5744 APPENDIX A: TABLE A-1: DATA SHEET REVISION HISTORY REVISION HISTORY Revision Level & Date DS00001855E (02-10-17) Section/Figure/Entry Table 3-1 Correction Removed errant duplicate pin assignment table. Product Identification System on page Added package with hub feature controller 46 disabled DS00001855D (06-06-16) Section 10.0, Package Information Added top marking information and land pattern drawing. All Updated "SQFN" references to "VQFN". Name change only. Section 8.4.2.1, Port Power Control using USB Power Switch Added additional information on overcurrent detection methods. Section 9.6.1, Power Supply and RESET_N Sequence Timing Added Power Supply and RESET_N Sequence Timing section. Section 9.6.5, I2C Timing "100kHz Standard Mode (Sm)" updated to "400kHz Fast Mode (Fm)", since the device supports up to 400kHz I2C operation. DS00001855C (06-22-15) All Updated "USB 3.0" references to "USB 3.1 Gen 1" throughout the document Updated USB specification references Misc. typos DS00001855B (04-16-15) Features Changed Environmental feature bullet from "4kV HBM JESD22-A114F ESD protection" to "3kV HBM JESD22-A114F ESD protection" Section 9.2, Operating Conditions** Changed XTALI/CLK_IN Voltage to -0.3V to +3.6V Table 9-10, "Crystal Specifications" Total Allowable PPM budget changed to 100pm, removed notes under table regarding "Frequency Tolerance" and "Frequency and Transmitter Clock Frequency" Section 9.7.2, External Reference Clock (CLK_IN) Changed +-350ppm t +-100 ppm Figure 3-1, "56-VQFN Pin Assignments"Table 3-1, "56-VQFN Pin Assignments" Modified pin 32 from "PRT_CTL4/ GANG_PWR" to "PRT_CTL4/GANG_PWR" Table 3-4, "USB Port Control Pin Descriptions" Revised description of Pin 1, GANG_PWR Table 1-1, "General Terms" and throughout document Replaced the term Hub Controller with Hub Feature Controller, added definition in Table 11, "General Terms". Section 6.1.2, SMBus Accessible Functions Added web link to AN1903 Removed PortMap feature throughout document. Table 3-6, "Miscellaneous Pin Descriptions" 2015-2017 Microchip Technology Inc. Modified RESET_N pin description DS00001855E-page 43 USB5744 TABLE A-1: REVISION HISTORY (CONTINUED) Revision Level & Date Section/Figure/Entry Correction Section 8.3, Link Power Management Removed "per the USB 3.0 Specification" from (LPM) the first sentence. Removed last sentence "For additional information, refer to the USB 3.0 Specification." Table 9-2, "MAXIMUM Power Dissipa- Added Table 9-2. tion" Section 9.7, "Clock Updated these sections. Specifications",Figure 9-6, Table 9-10, "Crystal Specifications" Section 9.7.2, External Reference Clock (CLK_IN) Oscillator changed from "35MHz" to "25 MHz" Section 9.6.7, SPI Timing Removed SPI interface configure note Section 9.1, Absolute Maximum Ratings* Added "Positive voltage on USB 3.0 USB3UP_xxxx and USB3DN_xxxx signal pins, with respect to ground...1.32 V Changed XTALI positive voltage from 2.1V to 3.63V. Changed "USB 3.0 DP/DM Signal Pins Voltage" to "USB 3.0 USB3UP_xxxx and USB3DN_xxxx Signal Pins Voltage" Section 8.4.2, "Port Connection in Combined Mode," on page 26 Added note under Section 8.4.2 Product Identification System on page Updated ordering information 46 Section 9.1, "Absolute Maximum Rat- Updated +1.2V supply voltage absolute max ings*," on page 30 value. Added HBM ESD performance specification. Table 9-1, "Package Thermal Parame- Added package thermal parameters. ters," on page 31 DS00001855A (12-15-14) DS00001855E-page 44 Worldwide Sales and Service Updated Worldwide Sales Listing Table 9-4, "I/O DC Electrical Characteristics," on page 33 Updated I buffer type high input level max. Added IS buffer type Schmitt trigger hysteresis values. Cover, All Updated document title to "4-Port SS/HS Controller Hub" Removed PortMap references. Removed sentence: "These circuits are used to detect the attachment and type of a USB charger and provide an interrupt output to indicate charger information is available to be read from the device's status registers via the serial interface." FIGURE 3-1: 56-VQFN Pin Assignments on page 8 Added configuration strap note under figure. All Initial Release 2015-2017 Microchip Technology Inc. USB5744 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support 2015-2017 Microchip Technology Inc. DS00001855E-page 45 USB5744 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X] [-X] Device Tape & Reel Option Temperature Range / XX XXX Package Config. Option Device: USB5744 Tape and Reel Option: Blank T = Standard packaging (tray) = Tape and Reel (Note 1) Temperature Range: Blank I = 0C to = -40C to Package: 2G Configuration Option: Blank X01 DS00001855E-page 46 = +70C +85C (Commercial) (Industrial) Examples: a) USB5744/2G Tray, Commercial temp., 56-pin VQFN b) USB5744-I/2G Tray, Industrial temp., 56-pin VQFN c) USB5744T-I/2G Tape & reel, Industrial temp., 56-pin VQFN d) USB5744T/2G Tape & reel, Commercial temp., 56-pin VQFN e) USB5744/2GX01 Tray, Commercial temp., 56-pin VQFN Hub Feature Controller disabled 56-pin VQFN = Standard Configuration = Hub Feature Controller disabled Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2015-2017 Microchip Technology Inc. USB5744 Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2015-2017, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 9781522413714 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015-2017 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 DS00001855E-page 48 11/07/16