Supplier : Samsung electro-mechanics Samsung P/N : CL10B223KA85PNC
Product : Multi-layer Ceramic Capacitor Description : CAP, 22㎋, 25V, ±10%, X7R, 0603
AEC-Q 200 Specified
CL 10 B 223 K A 8 5 P N C
① ②③ ④ ⑤⑥⑦⑧⑨⑩⑪
①Series Samsung Multi-layer Ceramic Capacitor
②Size 0603 (inch code) L: 1.6 ± 0.1 mm W: ± 0.1 mm
③Dielectric X7R ⑧Inner electrode Ni , Open mode
④Capacitance 22 ㎋Termination Cu , Ag-epoxy
⑤Capacitance ±10 % Plating Sn 100% (Pb Free)
tolerance ⑨Product Automotive
⑥Rated Voltage 25 V ⑩Grade code Standard
⑦Thickness 0.8 ± 0.1 mm ⑪Packaging Cardboard Type, 7" reel
B. Reliablility Test and Judgement condition
High Temperature Unpowered, 1000hrs@T=150℃
Exposure Capacitance Change : Within ±10% Measurement at 24±2hrs after test conclusion
Tan δ : 0.03 max
IR : More than 10,000㏁ or 500㏁×㎌
Whichever is Smaller
Temperature Cycling 1000Cycles
Capacitance Change : Within ±10% Measurement at 24±2hrs after test conclusion
Tan δ : 0.03 max 1 cycle condition :
IR : More than 10,000㏁ or 500㏁×㎌ -55+0/-3℃(15±3min) -> Room Temp(1min.)
Whichever is Smaller -> 125+3/-0℃(15±3min) -> Room Temp(1min.)
Destructive Physical No Defects or abnormalities Per EIA 469
Analysis
Moisture Resistance 10Cycles, t=24hrs/cycle
Capacitance Change : Within ±12.5% Heat (25~65℃) and humidity (80~98%), Unpowered
Tan δ : 0.03 max measurement at 24±2hrs after test conclusion
IR : More than 10,000㏁ or 500㏁×㎌
Whichever is Smaller
Humidity Bias 1000hrs 85℃/85%RH, Rated Voltate and 1.3~1.5V,
Capacitance Change : Within ±12.5% Add 100kohm resistor
Tan δ : 0.035 max Measurement at 24±2hrs after test conclusion
IR : More than 500㏁ or 25㏁×㎌The charge/discharge current is less than 50mA.
Whichever is Smaller
High Temperature 1000hrs @ TA=125℃, 200% Rated Voltage,
Operating Life Capacitance Change : Within ±12.5% Measurement at 24±2hrs after test conclusion
Tan δ : 0.035 max The charge/discharge current is less than 50mA.
IR : More than 1000㏁ or 50㏁×㎌
Whichever is Smaller
0.8
Specification of Automotive MLCC
A. Samsung Part Number
Appearance : No abnormal exterior appearance
Performance Test condition
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
External Visual No abnormal exterior appearance Microscope (´10)
Physical Dimensions Within the specified dimensions Using The calipers
Mechanical Shock Three shocks in each direction should be applied along
Capacitance Change : Within ±10% 3 mutually perpendicular axes of the test specimen (18 shocks)
Tan δ, IR : initial spec.
Vibration 5g's for 20min., 12cycles each of 3 orientations,
Capacitance Change : Within ±10% Use 8"×5" PCB 0.031" Thick 7 secure points on one long side
Tan δ, IR : initial spec. and 2 secure points at corners of opposite sides. Parts mounted
within 2" from any secure point. Test from 10~2000㎐.
Resistance to Solder pot : 260±5℃, 10±1sec.
Solder Heat Capacitance Change : Within ±10%
Tan δ, IR : initial spec.
Thermal Shock -55℃/+125℃.
Capacitance Change : Within ±10% Note: Number of cycles required-300,
Tan δ, IR : initial spec. Maximum transfer time-20 sec, Dwell time-15min. Air-Air
ESD AEC-Q200-002
Capacitance Change : Within ±10%
Tan δ, IR : initial spec.
Solderability 95% of the terminations is to be soldered a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃
evenly and continuously b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5℃
c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃
solder : a solution ethanol and rosin
Electrical Capacitance : Within specified tolerance The Capacitance /D.F. should be measured at 25℃,
Characterization Tan δ (DF) : 0.025 max. 1㎑±10%, 1.0±0.2Vrms
IR(25℃) : More than 10,000㏁ or 500㏁×㎌I.R. should be measured with a DC voltage not exceeding
IR(125℃) : More than1,000㏁ or 10㏁×㎌Rated Voltage @25℃, @125℃ for 60~120 sec.
Whichever is Smaller
Dielectric Strength Dielectric Strength : 250% of the rated voltage for 1~5 seconds
Board Flex Bending to the limit (2㎜) for 5 seconds
Capacitance Change : Within ±10%
Terminal 10N, for 60±1 sec.
Strength(SMD) Capacitance Change : Within ±10%
Beam Load Destruction value should not be exceed Beam speed
Chip Length < 2.5㎜0.5±0.05㎜/sec
a) Chip Thickness > 0.5㎜ : 20N
b) Chip Thickness ≤ 0.5㎜ : 8N
Temperature X7R
Characterisitcs (From -55℃ to 125℃, Capacitance change shoud be within ±15%)
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
Meet IPC/JEDEC J-STD-020 D Standard
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
Peakvalue
Appearance : No abnormal exterior appearance
0.5ms Half sine 4.7m/sec.
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Duration Wave
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
Appearance : No abnormal exterior appearance
1,500G
Velocity
Performance Test condition
