TJA1054T/VM,518 - NXP Semiconductors

DATA SH EET

Preliminary speciﬁcation

File under Integrated Circuits, IC18 1999 Feb 11

INTEGRATED CIRCUITS

TJA1054

Fault-tolerant CAN transceiver

1999 Feb 11 2

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

FEATURES

Optimized for in-car low-speed communication

•Baud rate up to 125 kBaud

•Up to 32 nodes can be connected

•Supports unshielded bus wires

•Very low Radio Frequency Interference (RFI) due to

built-in slope control function and a very good matching

of the CANL and CANH bus outputs

•Fully integrated receiver filters

•Permanent dominant monitoring of transmit data input

•Good immunity performance of ElectroMagnetic

Compatibility (EMC) in normal operating mode and in

low power modes.

Bus failure management

•Supports single-wire transmission modes with ground

offset voltages up to 1.5 V

•Automatic switching to single-wire mode in the event of

bus failures, even when the CANH bus wire is

short-circuited to VCC

•Automatic reset to differential mode if bus failure is

removed

•Fully wake-up capability during failure modes.

Protection

•Short-circuit proof to battery and ground in

12 V powered systems

•Thermally protected

•Bus lines protected against transients in an automotive

environment

•An unpowered node does not disturb the bus lines.

Support for low power modes

•Low current sleep and standby mode with wake-up via

the bus lines

•Power-on reset flag on the output.

GENERAL DESCRIPTION

The TJA1054 is the interface between the protocol

controller and the physical wires of the bus lines in a

Control Area Network (CAN). It is primarily intended for

low-speed applications, up to 125 kBaud, in passenger

cars. The device provides differential transmit capability

but will switch in error conditions to single-wire transmitter

and/or receiver.

The TJA1054T is pin and upwards compatible with the

PCA82C252T and the TJA1053T. This means that these

two devices can be replaced by the TJA1054T with

retention of all functions.

The most important improvements are:

•Very low RFI due to a very good matching of the CANL

and CANH bus lines outputs

•Good immunity performance of EMC, especially in low

power modes

•Fully wake-up capability during failure modes

•Extended bus failure management including

short-circuit of the CANH bus line to VCC

•Supports easy fault localization

•Two-edge sensitive wake-up input signal via pin WAKE.

ORDERING INFORMATION

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TJA1054T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

1999 Feb 11 3

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCC supply voltage on pin VCC 4.75 −5.25 V

VBAT battery voltage on pin BAT no time limit −0.3 −+40 V

operating mode 5.0 −27 V

load dump −−40 V

IBAT battery current on pin BAT Sleep mode; VCC =0V;

BAT =12V −30 50 µA

VCANH CANH bus line voltage VCC = 0 to 5.5 V;

VBAT ≥0V;

no time limit

−40 −+40 V

VCANL CANL bus line voltage VCC = 0 to 5.5 V;

VBAT ≥0V;

no time limit

−40 −+40 V

∆VCANH CANH bus line transmitter voltage drop ICANH =−40 mA −−1.4 V

∆VCANL CANH bus line transmitter voltage drop ICANL =40mA −−1.4 V

tPD propagation delay TXD to RXD −1−µs

rbus line output rise time 10 to 90%; C1 = 10 nF −0.6 −µs

fbus line output fall time 90 to 10%; C1 = 1 nF −0.3 −µs

amb operating ambient temperature −40 −+125 °C

1999 Feb 11 4

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGL421

FAILURE DETECTOR

PLUS WAKE-UP

PLUS TIME-OUT

WAKE-UP

STANDBY

CONTROL

INH 1

WAKE 7

STB 5

EN 6

TXD

VCC

ERR 4

RXD 3

TEMPERATURE

PROTECTION

DRIVER

RECEIVER

BAT

VCC

GND

FILTER

TIMER

FILTER

TJA1054

RTL

CANH

CANL

RTH

1999 Feb 11 5

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

PINNING

SYMBOL PIN DESCRIPTION

INH 1 inhibit output for switching an external voltage regulator if a wake-up signal occurs

TXD 2 transmit data input for activating the driver to the bus lines

RXD 3 receive data output for reading out the data from the bus lines

ERR 4 error, wake-up and power-on indication output; active LOW in normal operating mode when the

bus has a failure and in low power modes (wake-up signal or in power-on standby)

STB 5 standby digital control signal input (active LOW); deﬁnes together with input signal on pin EN the

state of the transceiver (in normal and low power modes); see Table 2 and Fig.3

EN 6 enable digital control signal input; deﬁnes together with input signal on pin STB the state of the

transceiver (in normal and low power modes); see Table 2 and Fig.3

WAKE 7 local wake-up signal input; falling and rising edges are both detected

RTH 8 termination resistor connection; in case of a CANH bus wire error the line is terminated with a

selectable impedance

RTL 9 termination resistor connection; in case of a CANL bus wire the line is terminated with a

selectable impedance

VCC 10 supply voltage

CANH 11 HIGH-level voltage bus line

CANL 12 LOW-level voltage bus line

GND 13 ground

BAT 14 battery supply

Fig.2 Pin configuration.

handbook, halfpage

MGL422

1INH

14 BAT

TXD GND

RXD CANL

ERR CANH

STB VCC

EN RTL

WAKE RTH

TJA1054T

1999 Feb 11 6

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

FUNCTIONAL DESCRIPTION

The TJA1054 is the interface between the CAN protocol

controller and the physical wires of the CAN bus

(see Fig.7). It is primarily intended for low speed

applications, up to 125 kBaud, in passenger cars.

The device provides differential transmit capability to the

CAN bus and differential receive capability to the CAN

controller.

To reduce RFI, the rise and fall slope are limited. This

allows the use of an unshielded twisted pair or a parallel

pair of wires for the bus lines. Moreover, it supports

transmission capability on either bus line if one of the wires

is corrupted. The failure detection logic automatically

selects a suitable transmission mode.

In normal operating mode (no wiring failures) the

differential receiver is output on pin RXD (see Fig.1).

The differential receiver inputs are connected to

pins CANH and CANL through integrated filters.

The filtered input signals are also used for the single-wire

receivers. The receivers connected to pins CANH

and CANL have threshold voltages that ensure a

maximum noise margin in single-wire mode.

A timer has been integrated at pin TXD. This timer

prevents the TJA1054 from driving the bus lines to a

permanent dominant state.

Failure detector

The failure detector is fully active in the normal operating

mode. After the detection of a single bus failure the

detector switches to the appropriate mode (see Table 1).

Table 1 Bus failures

FAILURE DESCRIPTION

1 CANH wire interrupted

2 CANL wire interrupted

3 CANH short-circuited to battery

3a CANH short-circuited to VCC

4 CANL short-circuited to ground

5 CANH short-circuited to ground

6 CANL short-circuited to battery

6a CANL short-circuited to VCC

7 CANL mutually short-circuited to CANH

The differential receiver threshold voltage is set at

−3.2 V typically (VCC = 5 V). This ensures correct

reception with a noise margin as high as possible in the

normal operating mode and in the event of failures 1, 2,

4 and 6a. These failures, or recovery from them, do not

destroy ongoing transmissions.

Failures 3 and 6 are detected by comparators connected

to the CANH and CANL bus lines, respectively. If the

comparator threshold is exceeded for a certain period of

time, the reception is switched to the single-wire mode.

This time is needed to avoid false triggering by external RF

fields. Recovery from these failures is detected

automatically after a certain time-out (filtering) and no

transmission is lost. In the event of failure 3 the CANH

driver and pin RTH are switched off. In the event of

failure 6 the CANL driver and pin RTL are switched off.

The pull-up current on pin RTL and the pull-down current

on pin RTH will not be switched off.

Failures 3a, 4 and 7 initially result in a permanent

dominant level on pin RXD. After a time-out, the CANL

driver and pin RTL are switched off (failures 4 and 7) or

the CANH driver and pin RTH are switched off (failure 3a).

Only a weak pull-up on pin RTL or a weak pull-down on

pin RTH remains. Reception continues by switching to the

single-wire mode via pins CANH or CANL. When

failures 3a, 4 or 7 are removed, the recessive bus levels

are restored. If the differential voltage remains below the

recessive threshold level for a certain period of time,

reception and transmission switch back to the differential

mode.

If any of the wiring failure occurs, the output signal on

pin ERR will become LOW. On error recovery, the output

signal on pin ERR will become HIGH again.

During all single-wire transmissions, the EMC

performance (both immunity and emission) is worse than

in the differential mode. The integrated receiver filters

suppress any HF noise induced into the bus wires.

The cut-off frequency of these filters is a compromise

between propagation delay and HF suppression. In the

single-wire mode, LF noise cannot be distinguished from

the required signal.

1999 Feb 11 7

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

Low power modes

The transceiver provides 3 low power modes which can be

entered and exited via pins STB and EN (see Table 2 and

Fig.3).

The Sleep mode is the mode with the lowest power

consumption. Pin INH is switched to high-impedance for

deactivation of the external voltage regulator. Pin CANL is

biased to the battery voltage via pin RTL. If the supply

voltage is provided pins RXD and ERR will signal the

wake-up interrupt signal.

The standby mode will react the same as the Sleep mode

but with a HIGH-level on pin INH.

The power-on standby mode is the same as the standby

mode with the battery power-on flag instead of the

wake-up interrupt signal on pin ERR. The output on

pin RXD will show the wake-up interrupt. This mode is only

for reading out the power-on flag.

Wake-up requests are recognized by the transceiver when

a dominant signal is detected on either bus line or if

pin WAKE detects an edge (rising or falling) which stays

longer HIGH or LOW respectively during a certain period

of time. On a wake-up request the transceiver will set the

output on pin INH which can be used to activate the

external supply voltage regulator.

If VCC is provided the wake-up request can be read on the

ERR or RXD outputs, so the external microcontroller can

wake-up the transceiver (switch to normal operating

mode) via pins STB and EN.

To prevent false wake-up due to transients or RF fields,

the wake-up voltage levels have to be maintained for a

certain period of time. In the low power modes the failure

detection circuit remains partly active to prevent an

increased power consumption in the event of

failures 3, 3a, 4 and 7.

Pin INH is set to floating only during the goto-sleep

command and stays floating during the Sleep mode. If

pin INH is set to floating, pin INH will not be set to

HIGH-level again just by a mode change to normal

operating mode. Pin INH will be set to HIGH-level by the

following events only:

•power-on (VBAT switching-on at cold start)

•rising or falling edge on pin WAKE

•a message with 5 consecutive dominant bits during

pin EN or pin STB is at LOW-level.

The signals on pins STB and EN will internally be set to

LOW-level when VCC is below a certain threshold voltage

so providing fail safe functionality.

Table 2 Normal operating and low power modes

Notes

1. In case the goto-sleep command was used before. When VCC drops pin EN will become LOW, but this does not effect

the internal functions due to the fail safe functionality.

2. If the supply voltage VCC is present.

3. Wake-up interrupts are released when entering the normal operating mode.

4. VBAT power-on flag will be reset when entering the normal operating mode.

MODE STB EN ERR RXD RTL

SWITCHED

LOW HIGH LOW HIGH

Goto-sleep

command 01

wake-up interrupt

signal;

notes 2 and 3

wake-up interrupt

signal;

notes 2 and 3

VBAT

Sleep 0 0(1) VBAT

Standby 0 0 VBAT

Power-on

standby 10V

BAT power-on ﬂag;

notes 2 and 4 wake-up interrupt

signal;

notes 2 and 3 VBAT

Normal

operating 1 1 error ﬂag no error

ﬂag dominant

received data recessive

received data VCC

1999 Feb 11 8

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

Power-on

After power-on (VBAT switched on) the signal on pin INH will become HIGH and an internal power-on flag will be set. This

flag can be read in the power-on standby mode via pin ERR (STB = 1; EN = 0) and will be reset by entering the normal

operating mode.

Protections

A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery

voltage.

If the junction temperature exceeds a maximum value, the transmitter output stages are disabled. Because the

transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and

hence a lower chip temperature. All other parts of the IC will remain operating.

The pins CANH and CANL are protected against electrical transients which may occur in an automotive environment.

Fig.3 Mode control.

handbook, full pagewidth

MBK949

POWER-ON

STANDBY

NORMAL (4)

GOTO (5)

SLEEP

STANDBY

00 SLEEP

(1)

(2)

(3)

(1) Mode change via input ports STB and EN.

(2) Mode change via input ports STB and EN, but in the sleep mode INH is inactive and possibly there is no VCC.

Mode control is only possible if VCC of the transceiver is active.

(3) INH is activated after wake-up via bus or input port WAKE.

(4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared.

(5) Transitions to sleep mode: INH is deactivated.

1999 Feb 11 9

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); note 1.

Notes

1. All voltages are defined with respect to pin GND. Positive current flows into the IC.

2. Junction temperature in accordance with

“IEC 747-1”

. An alternative definition is: Tvj =T

amb +P×R

th(vj-a) where

Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of

power dissipation (P) and operating ambient temperature (Tamb).

3. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

4. Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil.

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

Quality specification in accordance with

“SNW-FQ-611-Part-E”

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage on pin VCC −0.3 +6 V

VBAT battery voltage on pin BAT −0.3 +40 V

VnDC voltage on pins 2 to 6 −0.3 VCC + 0.3 V

VCANH DC voltage on pin CANH −40 +40 V

VCANL DC voltage on pin CANL −40 +40 V

Vtrt(n) transient voltage on

pins CANH and CANL see Fig.6 −150 +100 V

VWAKE DC input voltage on pin WAKE −VBAT + 0.3 V

IWAKE DC input current on pin WAKE −15 −mA

VINH DC output voltage on pin INH −0.3 VBAT + 0.3 V

VRTH DC voltage on pin RTH −0.3 VBAT + 1.2 V

VRTL DC voltage on pin RTL −0.3 VBAT + 1.2 V

RRTH termination resistance on pin RTH 500 16000 Ω

RRTL termination resistance on pin RTL 500 16000 Ω

Tvj virtual junction temperature note 2 −40 +150 °C

Tstg storage temperature −55 +150 °C

Vesd electrostatic discharge voltage human body model; note 3 −2.0 +2.0 kV

machine model; note 4 −200 +200 V

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(vj-a) thermal resistance from junction to ambient in free air 120 K/W

1999 Feb 11 10

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

DC CHARACTERISTICS

VCC = 4.75 to 5.25 V ; VBAT = 5 to 27 V ; VSTB =V

CC; Tamb =−40 to +125 °C; unless otherwise speciﬁed. All voltages are

deﬁned with respect to ground. Positive currents ﬂow into the IC. All parameters are guaranteed over the temperature

range by design, but only 100% tested at 25 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

ICC supply current normal operating mode;

VTXD =V

CC (recessive) 4711mA

normal operating mode;

VTXD = 0 V (dominant); no load 11 17 27 mA

low power modes; VTXD =V

CC 0010µA

BAT battery current on pin BAT all modes; in low power modes at

VRTL =V

BAT or

VRTL < 2.5 V (>1.5 ms)

VBAT =V

WAKE =V

INH = 12 V 10 30 50 µA

VBAT =V

WAKE =V

INH = 5 to 27 V 5 30 125 µA

VBAT =VWAKE =V

INH = 3.5 V 5 20 30 µA

VBAT =V

WAKE =V

INH =1V 0 0 10 µA

CC +I

BAT supply current plus battery

current low power modes; VCC =5V;

BAT =V

WAKE =V

INH =12V −35 60 µA

VBAT battery voltage on pin BAT low power modes

for setting power-on ﬂag −−1V

for not setting power-on ﬂag 3.5 −−V

Pins STB, EN and TXD

VIH HIGH-level input voltage 0.7VCC −VCC + 0.3 V

VIL LOW-level input voltage −0.3 −0.3VCC V

IIH HIGH-level input current VI=4V

pins STB and EN −920µA

pin TXD −25 −80 −200 µA

IIL LOW-level input current VI=1V

pins STB and EN 4 8 −µA

pin TXD −100 −320 −800 µA

VCC supply voltage for forced power-on standby mode

(fail safe) 2.75 −4.5 V

Pins RXD and ERR

VOH HIGH-level output voltage

on pin ERR lO=−100 µAV

CC −0.9 −VCC V

on pin RXD IO=−1mA V

CC −0.9 −VCC V

VOL LOW-level output voltage

on pins ERR and RXD IO= 1.6 mA 0 −0.4 V

IO= 7.5 mA 0 −1.5 V

1999 Feb 11 11

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

Pin WAKE

IIL LOW-level input current VWAKE =0V; V

BAT =27V −1−4−10 µA

Vth(WAKE) wake-up threshold voltage VSTB = 0 V 2.5 3.2 3.9 V

Pin INH

∆VHHIGH-level voltage drop IINH =−0.18 mA −−0.8 V

ILleakage current Sleep mode; VINH =0V −−5µA

Pins CANH and CANL

Vdiff differential receiver

threshold voltage no failures and

bus failures 1, 2, 5, 6a; see Fig.4

VCC =5V −3.5 −3.2 −2.9 V

VCC = 4.75 to 5.25 V −0.70VCC −0.64VCC −0.58VCC V

VO(reces) recessive output voltage VTXD =V

on pin CANH RRTH <4kΩ −−0.2 V

on pin CANL RRTL <4kΩV

CC −0.2 −−V

O(dom) dominant output voltage VTXD =0V; V

EN =V

on pin CANH ICANH =−40 mA VCC −1.4 −−V

on pin CANL ICANL =40mA −−1.4 V

IO(CANH) output current on

pin CANH normal operating mode;

VCANH =0V; V

TXD =0V −45 −80 −110 mA

low power modes;

VCANH =0V;V

CC =5V −−0.25 −µA

O(CANL) output current on

pin CANL normal operating mode;

VCANL = 14 V; VTXD =0V 45 70 100 mA

low power modes;

VCANL =12V;V

BAT =12V −0−µA

det(CANH) detection threshold

voltage for short-circuit to

battery voltage on

pin CANH

normal operating mode 1.5 1.7 1.85 V

low power modes 1.1 1.8 2.5 V

Vdet(CANL) detection threshold

voltage for short-circuit to

battery voltage on

pin CANL

normal operating mode 6.5 7.3 8 V

Vth(wake) wake-up threshold voltage

on pin CANL low power modes 2.5 3.2 3.9 V

on pin CANH low power modes 1.1 1.8 2.5 V

∆Vth(wake) difference of wake-up

threshold voltages low power modes 0.8 1.4 −V

Vse(CANH) single-ended receiver

threshold voltage on

pin CANH

normal operating mode and

failures 4, 6 and 7

VCC = 5 V 1.5 1.7 1.85 V

VCC = 4.75 to 5.25 V 0.30VCC 0.34VCC 0.37VCC V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Feb 11 12

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

Vse(CANL) single-ended receiver

threshold voltage on

pin CANL

normal operating mode and

failures 3 and 3a

VCC = 5 V 3.15 3.3 3.45 V

VCC = 4.75 to 5.25 V 0.63VCC 0.66VCC 0.69VCC V

Pins RTH and RTL

Rsw(RTL) switch-on resistance

between pin RTL and VCC

normal operating mode;

IO<10mA −50 100 Ω

Rsw(RTH) switch-on resistance

between pin RTH and

ground

normal operating mode;

IO<10mA −50 100 Ω

VO(RTH) output voltage on pin RTH low power modes; IO=1mA −0.7 1.0 V

IO(RTL) output current on pin RTL low power modes; VRTL =0V −1.25 −0.65 −0.3 mA

Ipu(RTL) pull-up current on pin RTL normal operating mode and

failures 4, 6 and 7 −75 −µA

pd(RTH) pull-down current on

pin RTH normal operating mode and

failures 3 and 3a −75 −µA

Thermal shutdown

Tjjunction temperature for shutdown 155 165 180 °C

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Feb 11 13

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

TIMING CHARACTERISTICS

VCC = 4.75 to 5.25 V ; VBAT = 5 to 27 V ; VSTB =V

CC; Tamb =−40 to +125 °C; unless otherwise speciﬁed. All voltages are

deﬁned with respect to ground. Positive currents ﬂow into the IC. All parameters are guaranteed over the temperature

range by design, but only 100% tested at 25 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

tt(r-d) CANL and CANH output

transition time for

recessive-to-dominant

10 to 90%;

C1 = 10 nF; C2 = 0; R1 = 100 Ω;

see Fig.5

0.35 0.60 −µs

t(d-r) CANL and CANH output

transition time for

dominant-to-recessive

10 to 90%;

C1 = 1 nF; C2 = 0; R1 = 100 Ω;

see Fig.5

0.2 0.3 −µs

PD(L) propagation delay TXD to

RXD (LOW) no failures and failures 1, 2, 5, 6a;

see Figs 4 and 5

C1 = 1 nF; C2 = 0; R1 = 100 Ω− 0.75 1.35 µs

C1 = C2 = 3.3 nF; R1 = 100 Ω− 1 1.75 µs

failures 3, 3a, 4, 6 and 7;

see Figs 4 and 5

C1 = 1 nF; C2 = 0; R1 = 100 Ω− 0.85 1.4 µs

C1 = C2 = 3.3 nF; R1 = 100 Ω− 1.1 1.7 µs

tPD(H) propagation delay TXD to

RXD (HIGH) no failures and failures 1, 2, 5, 6a;

see Figs 4 and 5

C1 = 1 nF; C2 = 0; R1 = 100 Ω− 1.2 1.9 µs

C1 = C2 = 3.3 nF; R1 = 100 Ω− 2.5 3.3 µs

failures 3, 3a, 4, 6 and 7;

see Figs 4 and 5

C1 = 1 nF; C2 = 0; R1 = 100 Ω− 1.1 1.7 µs

C1 = C2 = 3.3 nF; R1 = 100 Ω− 1.5 2.2 µs

tCANH(min) minimum dominant time for

wake-up on pin CANH low power modes; VBAT =12V 7 −38 µs

tCANL(min) minimum dominant time for

wake-up on pin CANL low power modes; VBAT =12V 7 −38 µs

tWAKE(min) minimum time on pin WAKE low power modes; VBAT =12V;

for wake-up after receiving a falling

or rising edge

7−38 µs

tdet failure detection time normal mode

failure 3 and 3a 1.6 −8.0 ms

failure 4, 6 and 7 0.3 −1.6 ms

low power modes; VBAT =12V

failure 3 and 3a 1.6 −8.0 ms

failure 4 and 7 0.1 −1.6 ms

1999 Feb 11 14

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

trec failure recovery time normal mode

failure 3 and 3a 0.3 −1.6 ms

failure 4 and 7 7 −38 µs

failure 6 125 −750 µs

low power modes; VBAT =12V

failures 3, 3a, 4 and 7 0.3 −1.6 ms

th(min) minimum hold time of goto-sleep

command 5−50 µs

tdis(TXD) disable time of TXD permanent

dominant timer normal mode; VTXD = 0 V 0.75 −4ms

∆pc pulse-count difference between

CANH and CANL normal mode and

failures 1, 2, 5 and 6a

failure detection

(pin ERR becomes LOW) −4−

failure recovery −4−

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

handbook, full pagewidth

MGL424

−5 V

−3.2 V

2.2 V

0.7VCC

0.3VCC

0 V

5 V

1.4 V

3.6 V

0 V

VCC

VTXD

VCANL

VCANH

Vdiff

VRXD

tPD(L) tPD(H)

Fig.4 Timing diagram for dynamic characteristics.

Vdiff =V

CANH −VCANL.

1999 Feb 11 15

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

TEST AND APPLICATION INFORMATION

Fig.5 Test circuit for dynamic characteristics.

For testing, the 100 Ω termination resistors are not connected to RTH or RTL because minimum 500 Ω per transceiver is allowed.

handbook, full pagewidth

MGL423

20 pF

RXD

STB

TXD

WAKE 7

INH BAT VCC

11410

GND ERR

13 4

RTL

RTH

CANL

CANH

+5 V

R1 C1

TJA1054

Fig.6 Test circuit for automotive transients.

The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a and 3b.

handbook, full pagewidth

MGL426

20 pF

RXD

STB

TXD

WAKE 7

INH BAT VCC

11410

GND ERR

13 4

RTL

RTH

CANL

CANH

+5 V

+12 V

1 nF

10 µF

GENERATOR

1 nF

125 Ω

511 Ω

TJA1054

1999 Feb 11 16

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

Fig.7 Application diagram.

handbook, full pagewidth

MGL425

100 nF

TXD RXD STB ERR EN INH

735461

TJA1054

CAN TRANSCEIVER

BAT

VCC

VDD

GND

WAKE

P8xC592/P8xCE598

CAN CONTROLLER

CTX0 CRXO Px.x Px.x Px.x

811129

RTLCANLCANHRTH

CAN BUS LINE

+5 V

BATTERY

VBAT

1999 Feb 11 17

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 8.75

8.55 4.0

3.8 1.27 6.2

5.8 0.7

0.6 0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT108-1

detail X

vMA

(A )

076E06S MS-012AB

pin 1 index

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.35

0.34 0.16

0.15 0.050

1.05

0.041

0.244

0.228 0.028

0.024 0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

95-01-23

97-05-22

0 2.5 5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

1999 Feb 11 18

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

1999 Feb 11 19

Philips Semiconductors Preliminary speciﬁcation

Fault-tolerant CAN transceiver TJA1054

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, SQFP not suitable suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

Internet: http://www.semiconductors.philips.com

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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

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Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 62 5344, Fax.+381 11 63 5777

For all other countries apply to: Philips Semiconductors,

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Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

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Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

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Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

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Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

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Tel. +91 22 493 8541, Fax. +91 22 493 0966

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Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

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Printed in The Netherlands 285002/00/01/pp20 Date of release: 1999 Feb 11 Document order number: 9397 750 03636