For questions, contact foil@vishaypg.com
Vishay Foil Resistors
Document No.: 63106
Revision: 04-Nov-2013
www.vishayfoilresistors.com
1
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Ultra High-Precision Z-Foil Flip Chip Resistor with TCR of ±0.05 ppm/°C, 35% Space Saving vs. Wraparound Design
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Ultra High-Precision Z-Foil Flip Chip Resistor with TCR of
±0.05 ppm/°C, 35% Space Saving vs. Wraparound Design
and PCR of 5 ppm at Rated Power
Document No.: 63106
Revision: 04-Nov-2013
FEATURES
• Temperature coefficient of resistance (TCR):
± 0.05 ppm/°C nominal (0°C to + 60°C)
± 0.2 ppm/°C nominal (–55°C to +125°C, +25°C ref.)
(see Table 1 and Figure 2)
• Tolerance: to ±0.01% (100 ppm)
• Power coefficient “∆R due to self heating” 5 ppm at
rated power
• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)
• Power rating to: 600 mW at +70°C
• Electrostatic discharge (ESD): at least to 25 kV
• Resistance range: 5 Ω to 125 kΩ (for lower and higher
values, please contact us)
• Foil resistors are not restricted to standard values;
specific “as required” values can be supplied at no
extra cost or delivery (e.g., 1K2345 vs. 1K)
• Non-inductive, non-capacitive design
• Thermal stabilization time: <1 s (within 10 ppm of
steady state value)
• Short time overload: ≤0.005% (50 ppm)
• Non hot spot design
• Rise time: 1 ns effectively no ringing
• Current noise: <0.010 μVrms / V of applied voltage
(<–40 dB)
• Voltage coefficient: <0.1 ppm/V
• Non-inductive: <0.08 μH
• Terminal finishes available: lead (Pb)-free, tin/lead alloy
• Compliant to RoHS directive 2002/95/EC*
• Matched sets are available per request
• Prototype quantities available in just 5 working days or
sooner. For more information, please contact us.
INTRODUCTION
Based on VFR’s next-generation Bulk Metal® Z-Foil
technology, the VFCP Series (foil resistor flip-chip)
excels over all previous stability standards for precision
resistors with an order of magnitude improvement in
high-temperature stability, load-life stability, and moisture
resistance. These new benchmark levels of performance
provide design engineers with the tools to build circuits
not previously achievable while reducing costs and space
in the most critical applications by eliminating the need for
corrective circuitry and reducing the large land patterns
needed for a wrap-around configuration. The device’s flip-
chip configuration saves up to 35% PCB space compared
with a surface-mount chip with wraparound terminations
while also providing better strain relief to eliminate
cracked substrates and board delamination.
In addition to its remarkably improved load-life stability,
the VFCP Series is noise-free and provides ESD
protection of 25 kV or more for increased reliability. The
device’s solid element alloy is matched to the substrate,
forming a single entity with balanced resistance versus
temperature characteristics for an unusually low and
predictable TCR over a wide temperature range from
–55°C to more than +125°C. The adhesive that holds the
foil to the flat substrate withstands high temperatures,
pulsing power, moisture incursions, shock and vibration,
and low-temperature exposure while still holding securely
to the foil element. Resistance patterns are photo-etched
into the element to permit the trimming of resistance
values to very tight tolerances as low as 0.01%.
The Flip Chips devices are qualified as anti-sulfurated
resistors for use in environments with high levels of
contamination. Such environments include alternative
energy applications, industrial control systems,
sensors, RTDs, electric instrumentation, weather and
communication base stations, and any electronic
appliance used in high concentrations of sulfur. The
combination of flip-chip terminations and Z-Foil
construction and materials results in the most stable
resistors available, requiring the lowest error allowance.
This means that more error allowance can be transferred
to active devices—resulting in lower costs—or applied
to the foil resistors themselves, allowing for looser initial
tolerances than would be required for other resistor
technologies.
RELATED VIDEO
Refer to Bulk Metal® Foil Resistor TCR Performance
(Product Demo).
* Pb containing terminations are not RoHS compliant, exemptions may apply
For questions, contact foil@vishaypg.com
Vishay Foil Resistors
www.vishayfoilresistors.com
2
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Document No.: 63106
Revision: 04-Nov-2013
TABLE 1—TOLERANCE AND TCR VS.
RESISTANCE VALUE
Resistance
Value
(Ω)
Tolerance
(%)
Nominal TCR and Max. Spread
(–55°C to +125°C, +25°C Ref.)
(ppm/°C)
250 to 125k ±0.01% ±0.2 ±1.6
100 to <250 ±0.02% ±0.2 ±1.6
50 to <100 ±0.05% ±0.2 ±1.8
25 to <50 ±0.1% ±0.2 ±2.8
10 to <25 ±0.25% ±0.2 ±2.8
5 to <10 ±0.5% ±0.2 ±7.8
FIGURE 1—POWER DERATING CURVE
100
75
50
25
0
–75 –50 –25 0 +25 +50 +75 +100 +125 +150 +175
Ambient Temperature (°C)
Percent of Rated Power
+70°C
–55°C
FIGURE 2—NOMINAL
RESISTANCE/TEMPERATURE CURVE
+500
+200
+100
0
–100
–200
–300
–500
Ambient Temperature (°C) and TCR Chord Slopes
for Different Temperature Ranges
∆
R
R(ppm)
0.05 ppm/°C
- 0.1 ppm/°C 0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C- 0.16 ppm/°C
–400
+300
+400
–55 –25 0 +25 +60 +75 +100 +125
Note
The TCR values for <100 Ω are influenced by the termination
composition and result in deviation from this curve.
FIGURE 3—TRIMMING TO VALUES
(conceptual illustration)
Mutual
Inductance
Reduction
due to Change
in Current
Direction
Current Path
Before Trimming
Foil shown in black, etched spaces in white
Interloop
Capacitance
Reduction
in Series
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Current Path After Trimming
Note
To acquire a precision resistance value, the Bulk Metal
®
Foil
chip is trimmed by selectively removing built-in “shorting bars.”
To increase the resistance in known increments, marked areas
are cut, producing progressively smaller increases in resistance.
This method reduces the effect of “hot spots” and improves the
long-term stability of the Vishay Foil resistors.
TABLE 2—MODEL SELECTION
Chip
Size
Rated Power
at +70°C
(mW)
Maximum
Voltage Rating
(≤√P × R)
Resistance
Range
(Ω)
Max.
Weight
(mg)
0805 100 mW 28 V 5 to 8k 5.2
1206 250 mW 79 V 5 to 25k 10.3
1506 300 mW 95 V 5 to 30k 12
2010 400 mW 167 V 5 to 70k 25
2512 600 mW 220 V 5 to 125k 35
TABLE 3—LOAD-LIFE STABILITY
(+70°C for 2000 h)
Chip Size MAXIMUM ∆R LIMITS
0805 ±0.005% at 50 mW
±0.01% at 100 mW
1206 ±0.005% at 150 mW
±0.01% at 250 mW
1506 ±0.005% at 150 mW
±0.01% at 300 mW
2010 ±0.005% at 200 mW
±0.01% at 400 mW
2512 ±0.005% at 500 mW
±0.01% at 600 mW
For questions, contact foil@vishaypg.com
Vishay Foil Resistors
Document No.: 63106
Revision: 04-Nov-2013
www.vishayfoilresistors.com
3
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
TABLE 4—PERFORMANCE SPECIFICATIONS
Test or Condition MIL-PRF-55342
Characteristic E ∆R Limits Typical ∆R Limits Maximum ∆R Limits(1)
Thermal Shock ±0.1% ±0.005% (50 ppm) ± 0.01% (100 ppm)
Low Temperature Operation ±0.1% ±0.005% (50 ppm) ± 0.01% (100 ppm)
Short Time Overload ±0.1% ±0.005% (50 ppm) ± 0.01% (100 ppm)
High Temperature Exposure ±0.1% ±0.01% (100 ppm) ±0.02% (200 ppm)
Resistance to Soldering Heat ±0.2% ±0.005% (50 ppm) ±0.015% (150 ppm)
Moisture Resistance ±0.2% ±0.005% (50 ppm) ±0.02% (200 ppm)
Load Life Stability +70°C for
2000 hours at Rated Power ±0.5% ±0.005% (50 ppm) ±0.01% (100 ppm)
Note
(1) As shown +0.01 ohms (Ω) to allow for measurement errors at low values.
TABLE 5—DIMENSIONS AND LAND PATTERN in inches (millimeters)
D
W
L
L1 (L - 0.005")
W1 (W - 0.003")
Solder Terminals
BOTTOM VIEW (showing terminals for mounting) LAND PATTERN
G
Z
X
Chip
Size
L
±0.005 (0.13)
W
±0.005 (0.13)
Thickness
Maximum
D
±0.005 (0.13) Z G X
0805 0.079 (2.01) 0.049 (1.24) 0.025 (0.64) 0.010 (0.25) 0.078 (1.98) 0.053 (1.35) 0.049 (1.24)
1206 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.015 (0.38) 0.125 (3.18) 0.090 (2.29) 0.062 (1.57)
1506 0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.012 (0.30) 0.150 (3.81) 0.120 (3.05) 0.062 (1.57)
2010 0.200 (5.08) 0.100 (2.54) 0.025 (0.64) 0.020 (0.51) 0.199 (5.05) 0.153 (3.89) 0.100 (2.54)
2512 0.250 (6.35) 0.126 (3.20) 0.025 (0.64) 0.024 (0.61) 0.250 (6.35) 0.196 (4.98) 0.126 (3.20)
Notes
Avoid the use of those cleaning agents that could attack epoxy resins, which form part of the resistor construction.
Vacuum pick-up is recommended for handling.
Soldering iron not recommended.
RELATED PRODUCT TRAINING MODULE
Refer to Precision Resistors—There is more to resistor
precision than meets the eye.
RELATED VIDEO
Refer to Bulk Metal® Foil Resistor Accelerated Life Test
(Product Demo).
HARMONIC DISTORTION
Harmonic distortion is an important consideration in the
choice of precision resistors for sensitive applications. A
significant signal voltage across the resistor may change
the resistance value depending on the construction,
material, and size. Under these conditions Bulk Metal Foil
resistors behave more linearly than other resistor types.
FLOWER OF SULFUR
ASTM B 809, also known as flower of sulfur, is a test to
determine the porosity of metallic coating using humid
sulfur vapor. This vapor can penetrate conformal coatings
and cause damage to the device when it reacts with
lower layers of silver. Surface-mount Bulk Metal Foil chip
resistors avoid this problem with a special coating that
is proven to be reliable in extreme environments and
even against sulfur. The flower of sulfur test is especially
For questions, contact foil@vishaypg.com
Vishay Foil Resistors
www.vishayfoilresistors.com
4
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Document No.: 63106
Revision: 04-Nov-2013
relevant to designers of circuits used in alternative
energy and industrial applications, where environmental
pollution is a constant concern. Analog circuitry in
these applications almost always operates under severe
environmental, thermal, and mechanical conditions,
and must withstand frequent and extended service by
professionals and novices alike. The picture is further
complicated by tough regulatory restrictions and high
consumer expectations. VFR received a steady stream
of customer inquiries, which led to more focus on anti-
sulfurated resistor research and development. As a result
we have qualified our surface-mount foil chip resistors
as “antisulfurated resistors.” These resistors are capable
of exposure to sulfurous environments without damage.
Beyond alternative energy, applications include industrial
control systems, sensors, RTDs, electric instrumentation,
weather and communication base stations. These
resistors are also suited for electronic appliances used in
high concentrations of sulfur.
POWER COEFFICIENT OF RESISTANCE
(PCR)
The TCR of a resistor for a given temperature range is
established by measuring the resistance at two different
ambient temperatures: at room temperature and in a
cooling chamber or oven. The ratio of relative resistance
change and temperature difference gives the slope of
DR/R = f (T) curve. This slope is usually expressed in
parts per million per degree Centigrade (ppm/°C). In
these conditions, a uniform temperature is achieved
in the measured resistance. In practice, however, the
temperature rise of the resistor is also partially due to
self-heating as a result of the power it is dissipating. As
stipulated by the Joule effect, when current flows through
a resistance, there will be an associated generation of
of a heat flow and of a temperature gradient. Therefore,
the TCR alone does not provide the actual resistance
change for precision resistor. Hence, another metric is
introduced to incorporate this inherent characteristic—the
Power Coefficient of Resistance (PCR). PCR is expressed
in parts per million per Watt or in ppm at rated power. In
the case of Z-based Bulk Metal® Foil, the PCR is 5 ppm
typical at rated power or 4 ppm per Watt typical for power
resistors.
TABLE 6—GLOBAL PART NUMBER INFORMATION(1)
NEW GLOBAL PA RT NUMBER: Y163010K0000T9W (preferred part number format)
SCITSIRETCARAHCEULAVNOISICERP SETONED
RY = Ω
K = kΩ
0 = tin/lead
9 = lead (Pb)-free
1 to 999 = custom
GNIGAKCAPECNARELOT ECNATSISEREDOC TCUDORP
1629 = VFCP0805
1630 = VFCP1206
1631 = VFCP1506
1632 = VFCP2010
1633 = VFCP2512
T= ±0.01%
Q= ±0.02%
A= ±0.05%
B= ±0.10%
C= ±0.25%
D= ±0.50%
F= ±1.00%
R= tape and reel
W= waffle pack
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1630 10K0000 T 9 W:
TYPE: VFCP1206
VALUE: 10.0 kΩ
ABSOLUTE TOLERANCE: ±0.01%
TERMINATION: lead (Pb)-free
PACKAGING: waffle pack
HISTORICAL PART NUMBER:VFCP1206 10K000 TCR0.2TSW(will continue to be used)
VFCP120610K000TCR0.2T
SW
MODELOHMIC VALUETCR RESISTANCE
TOLERANCETERMINAT IONPACKAGING
VFCP0805
VFCP1206
VFCP1506
VFCP2010
VFCP2512
10.0 kΩCharacteristicT= ±0.01%
Q= ±0.02%
A= ±0.05%
B= ±0.10%
C= ±0.25%
D= ±0.50%
F= ±1.00%
S= lead (Pb)-free
B= tin/lead
T= tape and reel
W= waffle pack
6301 K000Y1 T90 W0
Note
(1) For non-standard requests, please contact Application Engineering
Vishay Precision Group, Inc.
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Legal Disclaimer Notice
Document No.: 63999
Revision: 15-Jul-2014
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