OM7816/BGU8007/MMIC,598 - NXP Semiconductors

1. Product profile

1.1 General description

The BGU8007 is a Low Noise Amplifier (LNA) for GNSS receiver applications in a plastic

leadless 6-pin, extremely small SOT886 package. The BGU8007 requires only one

external matching inductor and one external decoupling capacitor.

The BGU8007 adapts itself to the changing environment resulting from co-habitation of

different radio systems in moder n ce llula r ha nd se ts. It has been de sig ne d fo r low po we r

consumption and optimal performance when jamming signals from co-existing cellular

transmitters are present. At low jamming power levels it delivers 19 dB ga in at a no ise

figure of 0.75 dB. During high jamming power levels, resulting for example from a cellular

transmit burst, it temporarily increases its bias current to improve sensitivity.

1.2 Features and benefits

Covers full GNSS L1 band, from 1559 MHz to 1610 MHz

Noise figure (NF) = 0.75 dB

Excellent low NF < 1 dB in the presence of strong jamming signals

Gain 19 dB

High input 1 dB compression point Pi(1dB) of 11 dBm

High out of band IP3i of 4 dB m

Supply voltage 1.5 V to 2.5 V

Power-down mode current consumption < 1 A

Optimized performance at low supply current of 4.6 mA

Integrated temperature stabilized bias for easy design

Requires only one input matching inductor and one supply decoupling capacitor

Input and output DC decoupled

ESD protection on all pins (HBM > 2 kV)

Integrated matching for the output

Small 6-pin leadless package 1 mm  1.45 mm  0.5 mm

110 GHz transit frequency - SiGe:C technology

BGU8007

SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo

and Compass

Rev. 2 — 30 March 2012 Product data sheet

CAUTION

This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken

during transport and handling.

Product data sheet Rev. 2 — 30 March 2012 2 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

1.3 Applications

LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in smart phones, feature

phones, tablet PCs, Personal Navigation Devices, Digital Still Cameras, Digital Video

Cameras, RF Front End m odules, comple te GPS chip set modules and thef t protection

(laptop, ATM)

1.4 Quick reference data

[1] PCB losses are subtracted.

[2] Including PCB losses.

[3] f1 = 1713 MHz; f2 = 1851 MHz; P1=P

2=30 dBm.

2. Pinning information

Table 1. Quick reference data

f = 1559 MHz to 1610 MHz; VCC = 1.8 V; Pi <



40 dBm; Tamb =25



C; input matched to 50



using

a 5.6 nH inductor; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage RF input AC coupled 1.5 - 2.5 V

ICC supply current VENABLE  0.8 V

Pi < 40 dBm 3.3 4.6 5.9 mA

Pi = 20 dBm 8.4 11.9 14.7 mA

Gppower gain Pi < 40 dBm, no jammer 17.0 19.0 20.5 dB

Pi = 20 dBm, no jammer 18.5 20.5 21.5 dB

NF noise figure Pi < 40 dBm, no jammer [1] - 0.75 1.1 dB

Pi < 40 dBm, no jammer [2] - 0.80 1.2 dB

Pi = 20 dBm, no jammer [2] -1.01.4dB

Pi(1dB) input power at 1 dB

gain compression f = 1559 MHz to 1610 MHz

VCC =1.5V 15 12 - dBm

VCC =1.8V 14 11 - dBm

VCC =2.2V 13 10 - dBm

IP3iinput third-order intercept point f = 1.575 GHz

VCC =1.5V [3] 14- dBm

VCC =1.8V [3] 14- dBm

VCC =2.2V [3] 25- dBm

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1GND

2GND

3RF_IN

5 ENABLE

6RF_OUT Transparent

top view

456

321

sym129

4 5

Product data sheet Rev. 2 — 30 March 2012 3 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

3. Ordering information

4. Marking

5. Limiting values

[1] Tsp is the temperature at the soldering point of the emitter lead.

[2] Warning: due to internal ESD diode proctection, the applied DC voltage should not exceed VCC + 0.6 and

shall not exceed 5.0 V in order to avoid excess current.

[3] The RF input and RF output are AC coupled through internal DC blocking capacitors.

6. Thermal characteristics

Table 3. Ordering information

Type number Package

Name Description Version

BGU8007 XSON6 plastic extremely thin small outline package; no leads;

6 terminals; body 1 1.45  0.5 mm SOT886

Table 4. Marking codes

Type number Marking code

BGU8007 UZ

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage RF input AC coupled 0.5 +4.0 V

VENABLE voltage on pin ENABLE VENABLE <V

CC +0.6 [2] 0.5 +4.0 V

VRF_IN voltage on pin RF_IN DC; VRF_IN <V

CC +0.6 [2][3] 0.5 +4.0 V

VRF_OUT voltage on pin RF_OUT DC; VRF_OUT <V

CC +0.6 [2][3] 0.5 +4.0 V

Piinput power - 0 dBm

Ptot total power dissipation Tsp  130 C[1] 55 mW

Tstg storage temperature 65 +150 C

Tjjunction temperature - 150 C

VESD electrostatic discharge

voltage Human Body Model (HBM);

According JEDEC standard

22-A114E

-2 kV

Charged

Device Model (CDM);

According JEDEC standard

22-C101B

-1 kV

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction to solder point 225 K/W

BGU8007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 30 March 2012  4 of 19
NXP Semiconductors BGU8007
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
7. Characteristics
 
Table 7. Characteristics
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < 

40 dBm; Tamb =25

C; input matched to 50

 using a 
5.6 nH inductor; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage RF input AC coupled 1.5 - 2.5 V
ICC supply current VENABLE  0.8 V
Pi < 40 dBm 3.3 4.6 5.9 mA
Pi = 20 dBm 8.4 11.9 14.7 mA
VENABLE  0.3 V --1 A
Tamb ambient temperature 40 +25 +85 C
Gppower gain Tamb =25C
Pi < 40 d Bm, no jammer 17.0 19.0 20.5 dB
Pi = 20 d Bm, no jammer 18.5 20.5 21.5 dB
Pjam =20 dBm; fjam = 850 MHz 18.5 20.5 21.5 dB
Pjam =20 dBm; fjam = 1850 MHz 18.5 20.5 21.5 dB
40 CTamb +85 C
Pi < 40 d B m, no jammer 16 - 21 dB
Pi = 20 d B m, no jammer 17 - 22 dB
Pjam =20 dBm; fjam = 850 MHz 17 - 22 dB
Pjam =20 dBm; fjam = 1850 MHz 17 - 22 dB
RLin input return loss Pi < 40 dBm 4 5.5 - dB
Pi = 20 dBm 6 9 - dB
RLout output return loss Pi < 40dBm 1526- dB
Pi = 20dBm 1527- dB
ISL isolation 22 24 - dB
NF noise figure Tamb =25C
Pi < 40 d Bm, no jammer [1] - 0.75 1.1 dB
Pi < 40 d B m, no jammer [2] - 0.80 1.2 dB
Pi = 20 d B m, no jammer [2] -1.01.4dB
Pjam =20 dBm; fjam =850MHz [2] -0.81.2dB
Pjam =20 dBm; fjam = 1850 MHz [2] -1.11.5dB
40 CTamb +85 C
Pi < 40 d Bm, no jammer [2] --1.5dB
Pi = 20 d B m, no jammer [2] --1.7dB
Pjam =20 dBm; fjam =850MHz [2] --1.5dB
Pjam =20 dBm; fjam = 1850 MHz [2] --1.8dB

BGU8007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 30 March 2012  5 of 19
NXP Semiconductors BGU8007
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
[1] PCB losses are subtracted.
[2] Including PCB losses.
[3] Out of band.
[4] f1 = 1713 MHz; f2 = 1851 MHz; P1=P
2=30 dBm.
[5] Within 10 % of the final gain.
 
Pi(1dB) input power at 1 dB gain compression f = 1559 MHz to 1610 MHz
VCC =1.5V 15 12 - dBm
VCC =1.8V 14 11 - dBm
VCC =2.2V 13 10 - dBm
f = 806 MHz to 928 MHz
VCC =1.5V [3] 13 10 - dBm
VCC =1.8V [3] 13 10 - dBm
VCC =2.2V [3] 12 9- dBm
f = 1612 MHz to 1909 MHz
VCC =1.5V [3] 12 9- dBm
VCC =1.8V [3] 11 8- dBm
VCC =2.2V [3] 10 7- dBm
IP3iinput third-order intercept point  f = 1.575 GHz
VCC =1.5V [4] 14- dBm
VCC =1.8V [4] 14- dBm
VCC =2.2V [4] 25- dBm
ton turn-on time [5] --2 s
toff turn-off time [5] --1 s
Table 7. Characteristics …continued
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < 

40 dBm; Tamb =25

C; input matched to 50

 using a 
5.6 nH inductor; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 8. ENABLE (pin 5)

40 

C 

 Tamb 

 +85 

C; 1.5 V 

 VCC 

 2.5 V
VENABLE (V) State
 0.3 OFF
 0.8 ON

Product data sheet Rev. 2 — 30 March 2012 6 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

8. Application information

8.1 GNSS LNA

For a list of components see Table 9.

Fig 1. Schematics GNSS LNA evaluation board

Table 9. List of components

For schematics see Figure 1.

Component Description Value Supplier Remarks

C1 decoupling capacitor 1 nF variou s

IC1 BGU8007 - NXP

L1 high quality matching inductor 5.6 nH Murata LQW15A

001aak685

RF input

IC1

RF output

Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Pi=45 dBm.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Fig 2. Supply current as a function of supply voltage;

typical valu e s Fig 3. Supply current as a functi on of ambient

temperature; typical value s

1.0 1.5 2.0 2.5 3.0

ICC

(mA)

VCC (V)

aaa-001027

(1)

(3)

(2)

-55 -15 25 65 105

ICC

(mA)

Tamb (ºC)

aaa-001028

(2)

(1)

(3)

Product data sheet Rev. 2 — 30 March 2012 7 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

VCC = 1.8 V; Tamb =25C.

(1) Pi = 45 dBm

(2) Pi = 30 dBm

(3) Pi = 20 dBm

(4) Pi = 15 dBm

Fig 4. Power gain as a function of frequency;

typical values Fig 5. Power gain as a function of frequency;

typical values

500 1000 1500 2000 2500 3000

f (MHz)

aaa-001029

(dB)

(1)

(3)

(2)

(4)

(3)

(1)

500 1000 1500 2000 2500 3000

(dB)

f (MHz)

aaa-001031

(2)

Pi=45 dBm; Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Fig 6. Power gain as a function of frequency;

typical values Fig 7. Power gain as a function of input power;

typical values

(dB)

500 1000 1500 2000 2500 3000

f (MHz)

(3)

(2)

(1)

aaa-001032

Pi (dBm)

-50 0-10-30 -20-40

(dB)

aaa-001033

(3)

ICC

(mA)

(1)

(2)

(3)

(1)

ICC

Product data sheet Rev. 2 — 30 March 2012 8 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

VCC = 1.8 V; Tamb =25C; no jammer.

Fig 8. Noise figure as a function of frequency; typical values

f (MHz)

1550 162016061578 15921564

0.8

0.4

1.2

1.6

(dB)

aaa-001034

f = 1575 MHz; Tamb =25C; no jammer. f = 1575 MHz; VCC = 1.8 V; no jammer.

Fig 9. Noise figure as a function of supply voltage;

typical values Fig 10. Noise figure as a function of ambient

temperature; typical value s

VCC (V)

1.4 2.42.21.8 2.01.6

0.8

0.4

1.2

1.6

(dB)

aaa-001035

Tamb (

°C

)

-50 1007010 40-20

0.8

0.4

1.2

1.6

(dB)

aaa-001036

Product data sheet Rev. 2 — 30 March 2012 9 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

fjam= 850 MHz; Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2V

fjam= 1850 MHz; Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Fig 11. Noise figure as a function of jamming power;

typical values Fig 12. Noise figure as a function of jamming power;

typical values

Pjam (

dBm

)

-50 0-10-30 -20-40

(dB)

(1)

(2)

aaa-001038

(3)

Pjam (dBm)

-50 0-10-30 -20-40

(dB)

(1)

(3)

(2)

aaa-001039

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

VCC = 1.8 V; Tamb =25C.

(1) Pi = 45 dBm

(2) Pi = 30 dBm

(3) Pi = 20 dBm

(4) Pi = 15 dBm

Fig 13. Input return loss as a function of frequency;

typical valu e s Fig 14. Input return loss as a function of frequency;

typical values

-25

-15

-20

-10

-5

500 1000 1500 2000 2500 3000

f (MHz)

(1)

(3)

(2)

RLin

(dB)

aaa-001040

-30

-20

-15

-10

-5

500 1000 1500 2000 2500 3000

RLin

(dB)

f (MHz)

-25

(3)

(4)

(2)

(1)

aaa-001041

Product data sheet Rev. 2 — 30 March 2012 10 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

Pi=45 dBm; Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Fig 15. Input return loss as a function of frequency;

typical valu e s Fig 16. Input return loss as a function of input power;

typical values

-25

-15

-20

-10

-5

500 1000 1500 2000 2500 3000

f (MHz)

RLin

(dB)

(1)

(3)

(2)

aaa-001042

-15

-9

-12

-6

-3

-50 -40 -30 -20 -10 0

(dBm)

(dB)

(3)

(2)

(1)

aaa-001043

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

VCC = 1.8 V; Tamb =25C.

(1) Pi = 45 dBm

(2) Pi = 30 dBm

(3) Pi = 20 dBm

(4) Pi = 15 dBm

Fig 17. Output return loss as a function of frequency;

typical valu e s Fig 18. Output return loss as a function of frequency;

typical values

500 10001500200025003000

f (MHz)

aaa-001044

-35

-30

-25

-20

-15

-10

-5

RLout

(dB)

(1)

(3)

(2)

f (

MHz

)

500 300025001500 20001000

-20

-30

-10

RLout

(dB)

-40

(4)

(2)

(3)

(1)

aaa-001045

Product data sheet Rev. 2 — 30 March 2012 11 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

Pi=45 dBm; Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Fig 19. Output return loss as a function of frequency;

typical valu e s Fig 20. Output return loss as a function of input

power; typical values

f (

MHz

)

500 300025001500 20001000

-20

-30

-10

RLout

(dB)

-40

(1)

(3)

(2)

aaa-001046

Pi (

dBm

)

-50 0-10-30 -20-40

aaa-001047

-20

-30

-10

RLout

(dB)

-40

(1)

(3)

(2)

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

VCC = 1.8 V; Tamb =25C.

(1) Pi = 45 dBm

(2) Pi = 30 dBm

(3) Pi = 20 dBm

(4) Pi = 15 dBm

Fig 21. Isolation as a function of frequency; typical

values Fig 22. Isolation as a fun ction of frequency; typical

values

f (

MHz

)

500 300025001500 20001000

-20

-30

-10

-25

-35

-15

-5

ISL

(dB)

-40

(1)

(3)

(2)

aaa-001048

f (

MHz

)

500 300025001500 20001000

-20

-30

-10

ISL

(dB)

-40

(3)

(1)

(2)

(4)

aaa-001050

Product data sheet Rev. 2 — 30 March 2012 12 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

Pi=45 dBm; Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Tamb =25C; f = 1575 MHz.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Fig 23. Isolation as a function of frequency; typical

values Fig 24. Isolation as a function of input power;

typical values

f (

MHz

)

500 300025001500 20001000

-20

-30

-10

-25

-35

-15

-5

ISL

(dB)

-40

(1)

(3)

(2)

aaa-001051

Pi (dBm)

-50 0-10-30 -20-40

-20

-30

-10

-25

-35

-15

-5

ISL

(dB)

-40

aaa-001052

(1)

(3)

(2)

f = 1575 MHz.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

f = 850 MHz.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 25. Input power at 1 dB gai n co m p r e ssion as a

function of supply voltage; typical values Fig 26. Inpu t power at 1 dB gain compression as a

function of supply voltage; typical values

VCC (V)

1.2 2.42.22.01.6 1.81.4

Pi(1dB)

(dBm)

-20

aaa-001053

-16

-12

-8

-4

(3)

(1)

(2)

VCC (V)

1.2 2.42.22.01.6 1.81.4

Pi(1dB)

(dBm)

-20

aaa-001054

-16

-12

-8

-4

(3)

(1)

(2)

Product data sheet Rev. 2 — 30 March 2012 13 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

f = 1850 MHz.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 27. Input power at 1 dB gain compression as a function of supply voltage;

typical values

VCC (V)

1.2 2.42.22.01.6 1.81.4

Pi(1dB)

(dBm)

-20

aaa-001055

-16

-12

-8

-4

(3)

(1)

(2)

f = 1575 MHz; f1 = 1713 MHz; f2= 1851 MHz;

Tamb =25C.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

f = 1575 MHz; f1 = 1713 MHz; f2= 1851 MHz;

VCC =1.8V.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Fig 28. Third order intermodulation disto r tio n an d

output power as function of input power;

typical valu e s

Fig 29. Third order intermodulation distortion and

output power as function of input power;

typical values

(dBm)

-40 -10-15-20-30 -25-35

aaa-001056

-100

-80

-60

-40

-20

of 1713 MHz signal

IMD3 of 1575 MHz signal

(1)

(3)

(2)

(1)

(3)

(2)

IMD3, P

(dBm)

-40 -10-15-20-30 -25-35

IMD3, P

(dBm)

aaa-001057

-100

-80

-60

-40

-20

(1)

(3)

(2)

(1)

(3)

(2)

IMD3 of 1575 MHz signal

of 1713 MHz signal

Product data sheet Rev. 2 — 30 March 2012 14 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

VCC = 1.8 V; Pi=45 dBm.

(1) Tamb = 40 C

(2) Tamb = +25 C

(3) Tamb = +85 C

Tamb = 25 C; Pi=45 dBm.

(1) VCC = 1.5 V

(2) VCC = 1.8 V

(3) VCC = 2.2 V

Fig 30. Rollett stability factor as a function of

frequency; typical values Fig 31. Rollett stability factor as a function of

frequency; typical values

aaa-001058

10-1

0 2000 4000 6000 8000 10000

f (MHz)

(3)

(1)

(2)

102aaa-001059

0 2000 4000 6000 8000 10000

f (MHz)

(3)

(1)

(2)

10-1

102

Product data sheet Rev. 2 — 30 March 2012 15 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

9. Package outline

Fig 32. Package outline SOT886 (XSON6)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT886 MO-252

sot886_po

04-07-22

12-01-05

Unit

mm max

nom

min

0.5 0.04 1.50

1.45

1.40

1.05

1.00

0.95

0.35

0.30

0.27

0.40

0.35

0.32

0.6

A(1)

Dimensions (mm are the original dimensions)

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886

A1b

0.25

0.20

0.17

DEee

0.5

terminal 1

index area

0 1 2 mm

scale

(2)

Product data sheet Rev. 2 — 30 March 2012 16 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

10. Abbreviations

11. Revision history

Table 10. Abbreviations

Acronym Description

AC Alternating Current

ATM Automated Teller Machine (cash dispenser)

DC Direct Current

GLONASS GLObal NAvigation Satellite System

GNSS Global Navigation Satellite System

GPS Global Positioning System

HBM Human Body Model

MMIC Monolithic Microwave Integrate d Circuit

PC Personal Computer

PCB Printed Circui t Boa r d

RF Radio Frequency

SiGe:C Silicon Germanium Carbon

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BGU8007 v.2 20120330 Product data sheet - BGU8007 v.1

Modifications: •Added ‘Compass’ to descriptive title

•Section 1.3 on page 2: added ‘Compass’ to text

•Section 1.2 on page 1: row 7, changed 2.2 V to 2.5 V

•Table 1 on page 2: changed max. value VCC from 2.2 V to 2.5 V

•Table 7 on page 4: changed max. value VCC from 2.2 V to 2.5 V

•Table 8 on page 5: changed max. value VCC from 2.2 V to 2.5 V

•Table 5 on page 3: Several additions and changes

BGU8007 v.1 20111011 Product data sheet - -

Product data sheet Rev. 2 — 30 March 2012 17 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipme nt, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environme ntal

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if presen t) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly ob jects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by cust omer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyri ghts, patents or

other industrial or intellectual property right s.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 30 March 2012 18 of 19

NXP Semiconductors BGU8007

SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omotive use. It i s neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever cust omer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting f rom customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BGU8007
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 March 2012
Document identifier : BGU8007
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’. 
Contents
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .  1
1  General description  . . . . . . . . . . . . . . . . . . . . .  1
2  Features and benefits. . . . . . . . . . . . . . . . . . . .  1
3  Applications  . . . . . . . . . . . . . . . . . . . . . . . . . . .  2
4  Quick reference data . . . . . . . . . . . . . . . . . . . .  2
Pinning information. . . . . . . . . . . . . . . . . . . . . .  2
Ordering information. . . . . . . . . . . . . . . . . . . . .  3
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  3
Thermal characteristics  . . . . . . . . . . . . . . . . . .  3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . .  4
Application information. . . . . . . . . . . . . . . . . . .  6
1  GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6
Package outline . . . . . . . . . . . . . . . . . . . . . . . .  15
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . .  16
Revision history. . . . . . . . . . . . . . . . . . . . . . . .  16
Legal information. . . . . . . . . . . . . . . . . . . . . . .  17
1  Data sheet status . . . . . . . . . . . . . . . . . . . . . .  17
2  Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
3  Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .  17
4  Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .  18
Contact information. . . . . . . . . . . . . . . . . . . . .  18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  19

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

NXP:

OM7816/BGU8007/MMIC,598 OM7817/BGU8007/FE,598