MIL-M-38510/352A
16 June 2004 __
SUPERSEDING
MIL-M-38510/352
7 August 1987
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, BIPOLAR ADVANCED SCHOTTKY TTL,
NAND BUFFERS, MONOLITHIC SILICON
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, Advanced Schottky TTL,
NAND buffers. Two product assurance classes and a choice of case outlines and lead finishes are provided for each
type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been
superseded by MIL-PRF-38535, (see 6.3).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type Circuit
01 Quad 2-input NAND buffer
02 Quad 2-input NAND buffer (open collector)
03 Dual 4-input NAND buffer
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
C GDIP1-T14 or CDIP2-T14 14 Dual-in-line
D GDFP1-F14 or CDFP2-F14 14 Flat pack
2 CQCC1-N20 20 Square leadless chip carrier
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to
bipolar@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address infor mat ion us ing the ASSIST Online databa se at ww w . dodssp.d aps .mil.
AMSC N/A FSC 5962
INCH
-
POUND
Reactivated after 16 June 2004 and may be used for either new or existing design acquisition.
MIL-M-38510/352A
2
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc
Input voltage range ................................................................................ -1.2 V dc at -18 mA to +7.0 V dc
Storage temperatur e range .................................................................... -65° to +150°C
Maximum power dissipation, per device (PD) 1/
Device type 01 ................................................................................. 182 mW
Device type 02 ................................................................................. 165 mW
Device type 03 ................................................................................. 94 mW
Lead temperature (solderin g, 10 seco nds) ............................................. +300°C
Thermal resistance, junction to case (θJC):
Cases C, D, and 2 ................................................................................ (See MIL-STD-1835)
Junction temperature (TJ) 2/ ................................................................... 175°C
1.4 Recommended operating conditions.
Supply voltage ....................................................................................... 4.5 V dc minimum to 5.5 V dc
maximum
Minimum high level input voltage (VIH) ................................................... 2.0 V dc
Maximum low level input voltage (VIL) .................................................... 0.8 V dc
Normalized fanout (each output) 3/:
Low level 01, 03 ............................................................................... 80 maximum
Low level 02 ..................................................................................... 16 maximum
High level 01, 03 .............................................................................. 50 maximum
High level 02 .................................................................................... 12 maximum
Case operating temperature range (TC) ................................................. -55° to +125°C
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-
5094.)
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ The device should fanout in both high and low levels to the specified number of inputs of the same device type as
that being tested.
MIL-M-38510/352A
3
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific ex empt ion has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract aw ard (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as
specified on figure 1.
3.3.2 Truth tables. The truth tables shall be as specified on figure 2.
3.3.3 Schematic circuits. The schemati c circu its sh all be ma intained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 9 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
MIL-M-38510/352A
4
TABLE I. Electrical performance characteristics.
Test Symbol Conditions Device Limits Unit
-55°C ≤ TC ≤ +125°C
unless otherw ise sp eci f ied type Min Max
High level output voltage
V
OH V
CC = 4.5 V, VIL = 0.8 V, 01, 03 2.5 V
IOH = -1 mA, VIH = 2.0 V
Low level output voltage
V
OL V
CC = 4.5 V, IOL = 48 mA, All 0.55
V
VIH = 2.0 V, VIL = 0.8 V
Input clamp voltag e
V
I C V
CC = 4.5 V, IL = -18 mA, All -1.2 V
TC = +25°C
High level input current
I
IH1 V
CC = 5.5 V, VIN = 2.7 V All 20 µA
I
IH2 V
CC = 5.5 V, VIN = 7.0 V All 100 µA
Low level input current
I
IL1 V
CC = 5.5 V, VIL = 0.5 V All 0 -1.2 mA
Short circuit output
I
OS V
CC = 5.5 V, VOS = 0.0 V 01, 03 -100 -225 mA
current 1/
Maximum collector cut-off
I
CEX V
CC = 4.5 V, VIN = 0.8 V, 02 250 µA
current
Supply current
I
CCL V
CC = 5.5 V 01 33 mA
02 30
03 17
I
CCH 01 6 mA
02 7
03 4
Propagation delay time,
t
PHL VCC = 5.0 V, CL = 50 pF ±10%, 01 1.0 5.5 ns
high-to-low level
RL = see figure 3 02 1.0 6.0
03 1.0 5.5
Propagation delay time,
t
PLH 01 1.5 7.0 ns
low to high level
02 6.5 14.5
03 1.0 6.5
1/ Not more than one output should be shorted at a time.
MIL-M-38510/352A
5
TABLE II. Electrical test requirements.
Subgroups (see table III)
MIL-PRF-38535
test requirements Class S
devices Class B
devices
Interim electrical parameters
1 1
Final electrical test parameters
1*, 2, 3,
9, 10, 11 1*, 2, 3, 9
Group A test requirements
1, 2, 3, 7,
9, 10, 11 1, 2, 3, 7,
9, 10, 11
Group B electrical test parameters
when using the method 5005 QCI option 1, 2, 3,
9, 10, 11 N/A
Group C end-point electrical parameters 1, 2, 3,
9, 10, 11 1, 2, 3
Group D end-point electrical parameters
1, 2, 3 1, 2, 3
*PDA applies to subgroup 1.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Te sts shall be as specified in table II herein.
b. Subgroups 4, 5, 6, and 8 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a. End-point electrical parameters shall be as specif ied in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be
as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point
electrical parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given
are conventional and positive when flowing into the referenced terminal.
MIL-M-38510/352A
6
FIGURE 1. Terminal connections and logic diagram (top view).
MIL-M-38510/352A
7
FIGURE 1. Terminal connections and logic diagram Continued.
MIL-M-38510/352A
8
Device type 01 and 02
Inputs Output
A B Y
L L H
L H H
H L H
H H L
H = High level
L = Low level
Device type 03
Inputs Output
A B C D Y
L X X X H
X L X X H
X X L X H
X X X L H
H H H H L
H = High level
L = Low level
x = Immaterial
FIGURE 2. Truth tables.
MIL-M-38510/352A
9
NOTES:
1. Pulse generator has the following characteristics:
t1 = t0 ≤ 2.5 ns, PRR ≤ 1 MHz, ZOUT ≅50Ω.
2. Inputs not under test are at ground or 2.7 V as specified in table III.
3. CL = 50 pF ±10%, including scope probe, wiring and stray capacitance without package in test fixture.
4. RL = 499Ω ±5%.
5. Voltage measurements are to be made with respect to network ground terminal.
FIGURE 3. Switching time test circuit and waveforms for all device types.
TABLE III. Group A inspection for device type 01.
Terminal conditi ons (pi ns not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
MIL-STD- Cases
C,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup Symbol
883
method Case 1/
2 2 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured
terminal Limits Unit
Test no. A1 B1
1Y A2 B2 2Y GND 3Y B3 A3 4Y B4 A4 VCC Min Max
1 VOH 3006 1 5.5 V 0.8 V -1.0 mA
5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 4.5 V 1Y 2.5 V
Tc = 25°C
" 2 0.8 V 5.5 V -1.0 mA
" 5.5 V “ " " " " " 1Y " "
" 3 5.5 V " " 0.8 V -1.0 mA
“ " " " " " 2Y " "
" 4 " " 0.8 V 5.5 V -1.0 mA
“ " " " " " 2Y " "
" 5 " " 5.5 V " “ -1.0 mA
" 0.8 V " " " 3Y " "
" 6 " " " " “ -1.0 mA
0.8 V 5.5 V " " " 3Y " "
" 7 " " " " “ 5.5 V " -1.0 mA
" 0.8 V " 4Y " "
" 8 " " " " “ " " -1.0 mA
0.8 V 5.5 V " 4Y " "
V
OL 3007 9 " 2.0 V 48 mA " " " " " 5.5 V " " 1Y 0.55 "
" 10 2.0 V 5.5 V 48 mA " " “ " " " " " 1Y " "
" 11 5.5 V " " 2.0 V 48 mA “ " " " " " 2Y " "
" 12 " " 2.0 V 5.5 V 48 mA “ " " " " " 2Y " "
" 13 " " 5.5 V " “ 48 mA " 2.0 V " " " 3Y " "
" 14 " " " " “ 48 mA 2.0 V 5. 5 V " " " 3Y " "
" 15 " " " " “ 5.5 V " 48 mA " 2.0 V " 4Y " "
" 16 " " " " “ " " 48 mA 2.0 V 5.5 V " 4Y " "
V
I C 17 -18 mA " " " “ " " 5.5 V " " A1 -1.2 "
18 5.5 V -18 mA
" " “ " " " " " B1 " "
19 " 5.5 V -18 mA
" “ " " " " " A2 " "
20 " " 5.5 V -18 mA
“ " " " " " B2 " "
21 " " " 5.5 V “ -18 mA
" " " " B3 " "
22 " " " " “ 5.5 V -18 mA
" " " A3 " "
23 " " " " “ " 5.5 V -18 mA
" " B4 " "
24 " " " " “ " 5.5 V 5.5 V -18 mA " A4 " "
I
IH1 3010 25 2.7 V “ 5.5 V A1 20
µA
" 26 2.7 V “ " B1 " "
" 27 2.7 V “ " A2 " "
" 28 2.7 V “ " B2 " "
" 29 “ 2.7 V " B3 "
" 30 “ 2.7 V " A3 " "
" 31 “ 2.7 V " B4 " "
" 32 “ 2.7 V " A4 " "
I
IH2 " 33 7.0 V “ " A1 100 "
" 34 7.0 V “ " B1 " "
" 35 7.0 V “ " A2 " "
" 36 7.0 V “ " B2 " "
" 37 “ 7.0 V " B3 " "
" 38 “ 7.0 V " A3 " "
" 39 “ 7.0 V " B4 " "
" 40 “ 7.0 V " A4 " "
See footnotes at end of device type 03.
10
MIL-M-38510/352A
TABLE III. Group A inspection for device type 01 – Continued.
Terminal conditi ons (pi ns not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
MIL-STD-
Cases
C,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup Symbol
883
method Case 1/
2 2 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured
terminal Limits Unit
Test no. A1 B1
1Y A2 B2 2Y GND 3Y B3 A3 4Y B4 A4 VCC Min Max
1 IIL 3009 41 0.5 V 5.5 V 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V A1 2/ 2/ mA
Tc = 25°C " 42 5.5 V 0.5 V 5.5 V " “ " " " " " B1 " " "
" 43 " 5.5 V 0.5 V " “ " " " " " A2 " " "
" 44 " " 5.5 V 0.5 V “ " " " " " B2 " " "
" 45 " " " 5.5 V “ 0.5 V " " " " B3 " " "
" 46 " " " " “ 5.5 V 0.5 V " " " A3 " " "
" 47 " " " " “ " 5.5 V 0.5 V " " B4 " " "
" 48 " " " " “ " 5.5 V 5.5 V 0.5 V " A4 " " "
I
OS 3011 49 0.0 V 0.0 V 0.0 V " " " " " " 5.5 V " 1Y -100 -255 "
" 50 5.5 V 5.5 V 0.0 V 0.0 V 0.0 V “ " " " " " 2Y " "
" 51 " " 5.5 V 5.5 V “ 0.0 V 0.0 V 0.0 V " " " 3Y " "
" 52 " " 5.5 V 5.5 V “ 5.5 V 5.5 V 0.0 V 0.0 V 0.0 V " 4Y " "
I
CCL 3005 53 " " " " “ 5.5 V 5.5 V 5.5 V 5.5 V " VCC 33 "
I
CCH 3005 54 0.0 V 0.0 V 0.0 V 0.0 V “ 0.0 V 0.0 V 0.0 V 0.0 V " VCC 6 "
2 Same tests, terminal conditions and limits as for subgroup 1 , except TC = +125°C and VIC tests are omitted.
3 Same tests, terminal conditions and limits as for subgroup 1 , except TC = 55°C and VIC tests are omitted.
7 Func- 3014 55 B B H B B H GND H B B H B B 3/ All
Tc = 25°C tional " 56 A B " A B " “ " B A " B A " outputs
tests " 57 B A " B A " “ " A B " A B " "
4/ " 58 A A L A A L “ L A A L A A " "
9 tPLH 3003 59 IN 2.7 V OUT GND 5.0 V
A1 to 1Y 1.5 5.5 ns
Tc = 25°C Fig. 3 60 2.7 V IN OUT “ "
B1 to 1Y “ “ “
" 61 IN 2.7 V OUT " "
A2 to 2Y " " "
" 62 2.7 V IN OUT " "
B2 to 2Y " " "
" 63 " OUT IN 2.7 V "
B3 to 3Y " " "
" 64 " OUT 2.7 V IN "
A3 to 3Y " " "
" 65 " OUT IN 2.7 V "
B4 to 4Y " " "
" 66 " OUT 2.7 V IN "
A4 to 4Y " " "
t
PHL " 67 IN 2.7 V OUT “ "
A1 to 1Y 1.0 4.5 “
" 68 2.7 V IN OUT " "
B1 to 1Y " " "
" 69 IN 2.7 V OUT " "
A2 to 2Y " " "
" 70 2.7 V IN OUT " "
B2 to 2Y " " "
" 71 " OUT IN 2.7 V "
B3 to 3Y " " "
" 72 " OUT 2.7 V IN "
A3 to 3Y " " "
" 73 " OUT IN 2.7 V "
B4 to 4Y " " "
" 74 “ OUT 2.7 V IN "
A4 to 4Y “ " “
10 Same tests and terminal conditions as for subgroup 9, except TC = +125° C and use limits from table I.
11 Same tests, terminal conditions and limits as for subgroup 10, except TC = -55° C.
See footnotes at end of device type 03.
11
MIL-M-38510/352A
TABLE III. Group A inspection for device type 02.
Terminal conditi ons (pi ns not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
MIL-STD- Cases
C,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup Symbol
883
method Case 1/
2 2 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured
terminal Limits Unit
Test no. A1 B1
1Y A2 B2 2Y GND 3Y B3 A3 4Y B4 A4 VCC Min Max
1 VOH 3006 1 5.5 V 2.0 V 48 mA 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 4.5 V 1Y 0.55 V
Tc = 25°C
" 2 2.0 V 5.5 V 48 mA " 5.5 V “ " " " " " 1Y " "
" 3 5.5 V " " 2.0 V 48 mA “ " " " " " 2Y " "
" 4 " " 2.0 V 5.5 V 48 mA “ " " " " " 2Y " "
" 5 " " 5.5 V " “ 48 mA " 2.0 V " " " 3Y " "
" 6 " " " " “ 48 mA 2.0 V 5.5 V " " " 3Y " "
" 7 " " " " “ 5.5 V " 48 mA " 2.0 V " 4Y " "
" 8 " " " " “ " " 48 mA 2.0 V 5.5 V " 4Y " "
V
I C 9 -18 mA " " " “ " " 5.5 V " " A1 -1.2 "
10 5.5 V -18 mA
" " “ " " " " " B1 " "
11 " 5.5 V -18 mA
" “ " " " " " A2 " "
12 " " 5.5 V -18 mA
“ " " " " " B2 " "
13 " " " 5.5 V “ -18 mA
" " " " B3 " "
14 " " " " “ 5.5 V -18 mA
" " " A3 " "
15 " " " " “ " 5.5 V -18 mA
" " B4 " "
16 " " " " “ " 5.5 V 5.5 V -18 mA " A4 " "
I
IH1 3010 17 2.7 V “ 5.5 V A1 20
µA
" 18 2.7 V “ " B1 " "
" 19 2.7 V “ " A2 " "
" 20 2.7 V “ " B2 " "
" 21 “ 2.7 V " B3 "
" 22 “ 2.7 V " A3 " "
" 23 “ 2.7 V " B4 " "
" 24 “ 2.7 V " A4 " "
I
IH2 " 25 7.0 V “ " A1 100 "
" 26 7.0 V “ " B1 " "
" 27 7.0 V “ " A2 " "
" 28 7.0 V “ " B2 " "
" 29 “ 7.0 V " B3 " "
" 30 “ 7.0 V " A3 " "
" 31 “ 7.0 V " B4 " "
" 32 “ 7.0 V " A4 " "
I
IL 3009 33 0.5 V 5.5 V 5.5 V 5.5 V " 5.5 V 5.5 V 5.5 V 5.5 V " A1 2/ 2/ mA
" 34 5.5 V 0.5 V 5.5 V " “ " " " " " B1 " " "
" 35 " 5.5 V 0.5 V " “ " " " " " A2 " " "
" 36 " " 5.5 V 0.5 V “ " " " " " B2 " " "
" 37 " " " 5.5 V “ 0.5 V " " " " B3 " " "
" 38 " " " " “ 5.5 V 0.5 V " " " A3 " " "
" 39 " " " " “ " 5.5 V 0.5 V " " B4 " " "
" 40 " " " " “ " 5.5 V 5.5 V 0.5 V " A4 " " "
See footnotes at end of device type 03.
12
MIL-M-38510/352A
TABLE III. Group A inspection for device type 02 – Continued.
Terminal conditi ons (pi ns not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
MIL-STD-
Cases
C,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup Symbol
883
method Case 1/
2 2 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured
terminal Limits Unit
Test no. A1 B1
1Y A2 B2 2Y GND 3Y B3 A3 4Y B4 A4 VCC Min Max
1 ICEX 3009 41 5.5 V 0.8 V 4.5 V 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 4.5 V 1Y 250
µA
Tc = 25°C " 42 0.8 V 5.5 V 4.5 V 5.5 V " “ " " " " " 1Y " "
" 43 5.5 V " 0.8 V " 4.5 V “ " " " " " 2Y " "
" 44 " " 5.5 V 0.8 V 4.5 V “ " " " " " 2Y " "
" 45 " " " 5.5 V “ 4.5 V " 0.8 V " " " 3Y " "
" 46 " " " " “ 4.5 V 0.8 V 5.5 V " " " 3Y " "
" 47 " " " " “ 5.5 V " 4.5 V " 0.8 V " 4Y " "
" 48 " " " " “ " " 4.5 V 0.8 V 5.5 V " 4Y " "
I
CCL 3005 49 " " " " “ " " 5.5 V 5.5 V 5.5 V VCC 30 mA
I
CCH 3005 50 0.0 V 0.0 V 0.0 V 0.0 V “ 0.0 V 0.0 V 0.0 V 0.0 V 5.5 V VCC 7 mA
2 Same tests, terminal conditions and limits as for subgroup 1 , except TC = +125°C and VIC tests are omitted.
3 Same tests, terminal conditions and limits as for subgroup 1 , except TC = 55°C and VIC tests are omitted.
7 Func- 3014 51 B B H B B H GND H B B H B B 3/ All
Tc = 25°C tional " 52 A B " A B " “ " B A " B A " outputs
tests " 53 B A " B A " “ " A B " A B " "
4/ " 54 A A L A A L “ L A A L A A " "
9 tPLH 3003 55 IN 2.7 V OUT GND 5.0 V
A1 to 1Y 6.5 12.5 ns
Tc = 25°C Fig. 3 56 2.7 V IN OUT “ "
B1 to 1Y “ “ “
" 57 IN 2.7 V OUT " "
A2 to 2Y " " "
" 58 2.7 V IN OUT " "
B2 to 2Y " " "
" 59 " OUT 2.7 V IN "
A3 to 3Y " " "
" 60 " OUT IN 2.7 V "
B3 to 3Y " " "
" 61 " OUT 2.7 V IN "
A4 to 4Y " " "
" 62 " OUT IN 2.7 V "
B4 to 4Y " " "
t
PHL " 63 IN 2.7 V OUT “ "
A1 to 1Y 1.0 5.0 “
" 64 2.7 V IN OUT " "
B1 to 1Y " " "
" 65 IN 2.7 V OUT " "
A2 to 2Y " " "
" 66 2.7 V IN OUT " "
B2 to 2Y " " "
" 67 " OUT 2.7 V IN "
A3 to 3Y " " "
" 68 " OUT IN 2.7 V "
B3 to 3Y " " "
" 69 " OUT 2.7 V IN "
A4 to 4Y " " "
" 70 “ OUT IN 2.7 V "
B4 to 4Y “ " “
10 Same tests and terminal conditions as for subgroup 9, except TC = +125° C and use limits from table I.
11 Same tests, terminal conditions and limits as for subgroup 10, except TC = -55° C.
See footnotes at end of device type 03.
13
MIL-M-38510/352A
TABLE III. Group A inspection for device type 03.
Terminal conditi ons (pi ns not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
MIL-STD- Cases
C,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup Symbol
883
method Case 1/
2 2 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured
terminal Limits Unit
Test no. A1 B1 NC C1 D1
1Y GND 2Y D2 C2 NC B2 A2 VCC Min Max
1 VOH 3006 1 0.8 V 5.5 V 5.5 V 5.5 V -1.0 mA
GND 5.5 V 5.5 V 5.5 V 5.5 V 4.5 V 1Y 2.5 V
Tc = 25°C
" 2 5.5 V 0.8 V 5.5 V " " “ " " " " " 1Y " "
" 3 " 5.5 V 0.8 V " " “ " " " " " 1Y " "
" 4 " " 5.5 V 0.8 V " “ " " " " " 1Y " "
" 5 " " " 5.5 V “ -1.0 mA
0.8 V " " " " 2Y " "
" 6 " " " " “ " 5.5 V 0.8 V " " " 2Y " "
" 7 " " " " “ " " 5.5 V 0.8 V " " 2Y " "
" 8 " " " " “ " " " 5.5 V 0.8 V " 2Y " "
V
OL 3007 9 2.0 V " " " 48 mA " " " " 5.5 V " 1Y 0.55 "
" 10 5.5 V 2.0 V " " " “ " " " " " 1Y " "
" 11 " 5.5 V 2.0 V " " “ " " " " " 1Y " "
" 12 " " 5.5 V 2.0 V " “ " " " " " 1Y " "
" 13 " " " 5.5 V “ 48 mA 2.0 V " " " " 2Y " "
" 14 " " " " “ " 5.5 V 2.0 V " " " 2Y " "
" 15 " " " " “ " " 5.5 V 2.0 V " " 2Y " "
" 16 " " " " “ " " " 5.5 V 2.0 V " 2Y " "
V
I C 17 -18 mA " " " “ " " " 5.5 V " A1 -1.2 "
18 5.5 V -18 mA
" " “ " " " " " B1 " "
19 " 5.5 V -18 mA
" “ " " " " " C1 " "
20 " " 5.5 V -18 mA
“ " " " " " D1 " "
21 " " " 5.5 V “ -18 mA
" " " " D2 " "
22 " " " " “ 5.5 V -18 mA
" " " C2 " "
23 " " " " “ " 5.5 V -18 mA
" " B2 " "
24 " " " " “ " 5.5 V 5.5 V -18 mA " A2 " "
I
IH1 3010 25 2.7 V “ 5.5 V A1 20
µA
" 26 2.7 V “ " B1 " "
" 27 2.7 V “ " C1 " "
" 28 2.7 V “ " D1 " "
" 29 “ 2.7 V " D2 "
" 30 “ 2.7 V " C2 " "
" 31 “ 2.7 V " B2 " "
" 32 “ 2.7 V " A2 " "
I
IH2 " 33 7.0 V “ " A1 100 "
" 34 7.0 V “ " B1 " "
" 35 7.0 V “ " C1 " "
" 36 7.0 V “ " D1 " "
" 37 “ 7.0 V " D2 " "
" 38 “ 7.0 V " C2 " "
" 39 “ 7.0 V " B2 " "
" 40 “ 7.0 V " A2 " "
See footnotes at end of device type 03.
14
MIL-M-38510/352A
TABLE III. Group A inspection for device type 03 – Continued.
Terminal conditi ons (pi ns not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
MIL-STD- Cases
C,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup Symbol
883
method Case 1/
2 2 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured
terminal Limits Unit
Test no. A1 B1 NC C1 D1
1Y GND 2Y D2 C2 NC B2 A2 VCC Min Max
1 IIL 3009 41 0.5 V 5.5 V 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V A1 2/ 2/ mA
Tc = 25°C
" 42 5.5 V 0.5 V 5.5 V " “ " " " " " B1 " " "
" 43 " 5.5 V 0.5 V " “ " " " " " C1 " " "
" 44 " " 5.5 V 0.5 V “ " " " " " D1 " " "
" 45 " " " 5.5 V “ 0.5 V " " " " D2 " " "
" 46 " " " " “ 5.5 V 0.5 V " " " C2 " " "
" 47 " " " " “ " 5.5 V 0.5 V " " B2 " " "
" 48 " " " " “ " " 5.5 V 0.5 V " A2 " " "
I
OS 3011 49 0.0 V 0.0 V 0.0 V 0.0 V 0.0 V " " " 5.5 V 5.5 V " 1Y -100 -255 "
3011 50 5.5 V 5.5 V 5.5 V 5.5 V “ 0.0 V 0.0 V 0.0 V 0.0 V 0.0 V " 2Y -100 -255 "
I
CCL 3005 51 5.5 V 5.5 V 5.5 V 5.5 V “ 5.5 V 5.5 V 5.5 V 5.5 V " VCC 17 "
I
CCH 3005 52 0.0 V 0.0 V 0.0 V 0.0 V “ 0.0 V 0.0 V 0.0 V 0.0 V " VCC 4 "
2 Same tests, terminal co nditions and limits as for subgroup 1, except TC = +125°C and VIC tests are omitted.
3 Same tests, terminal co nditions and limits as for subgroup 1, except TC = 55°C and VIC tests are omitted.
7 Func- 3014 53 B B B B H GND H B B B B 3/ All
Tc = 25°C
tional " 54 A B " " " “ " " " B A " outputs
tests " 55 B A " " " " " " " A B " "
4/ " 56 A A " " " “ " " " A A " "
" 57 B B A " " “ " " A B B " "
" 58 A B " " " “ " " " B A " "
" 59 B A " " " “ " " " A B " "
" 60 A A " " " “ " " " A A " "
" 61 B B B A " “ " A B B B " "
" 62 A B " " " “ " " " B A " "
" 63 B A " " " “ " " " A B " "
" 64 A A " " " “ " " " A A " "
" 65 B B A " " “ " " A B B " "
" 66 A B " " " “ " " " B A " "
" 67 B A " " " “ " " " A B " "
" 68 A A " " L “ L " " A A " "
9 tPLH 3003 69 IN 2.7 V 2.7 V 2.7 V OUT " 5.0 V A1 to 1Y 1.0 5.5 ns
Tc = 25°C
Fig. 3 70 2.7 V IN 2.7 V " " “ " B1 to 1Y “ “ “
" 71 " 2.7 V IN " " " "
C1 to 1Y " " "
" 72 " 2.7 V 2.7 V IN " " " D1 to 1Y " " "
" 73 " OUT IN 2.7 V 2.7 V 2.7 V "
D2 to 2Y
" " "
" 74 " " 2.7 V IN 2.7 V " "
C2 to 2Y
" " "
" 75 " " " 2.7 V IN " "
B2 to 2Y " " "
" 76 " " " 2.7 V 2.7 V IN "
A2 to 2Y " " "
See footnotes at end of device type 03.
15
MIL-M-38510/352A
TABLE III. Group A inspection for device type 03 – Continued.
Terminal conditi ons (pi ns not designated may be high ≥ 2.0 V or low ≤ 0.8 V or open).
MIL-STD- Cases
C,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup Symbol
883
method Case 1/
2 2 3 4 6 8 9 10 12 13 14 16 18 19 20 Measured
terminal Limits Unit
Test no. A1 B1 NC C1 D1
1Y GND 2Y D2 C2 NC B2 A2 VCC Min Max
9 tPHL 3003 77 IN 2.7 V 2.7 V 2.7 V OUT " 5.0 V A1 to 1Y 1.0 4.5 ns
Tc = 25°C
Fig. 3 78 2.7 V IN 2.7 V " " “ " B1 to 1Y “ “ “
" 79 " 2.7 V IN " " " "
C1 to 1Y " " "
" 80 " 2.7 V 2.7 V IN " " " D1 to 1Y " " "
" 81 " OUT IN 2.7 V 2.7 V 2.7 V "
D2 to 2Y
" " "
" 82 " " 2.7 V IN 2.7 V " "
C2 to 2Y
" " "
" 83 " " " 2.7 V IN " "
B2 to 2Y " " "
" 84 " " " 2.7 V 2.7 V IN "
A2 to 2Y " " "
10 Same tests and terminal conditions as for subgroup 9, except TC = +125° C and use limits from table I.
11 Same tests, terminal conditions and limits as for subgroup 10, except TC = -55° C.
1/ For case 2, pins not referenced are N/C.
2/ IIL limits mA minimum/maxim um values for circuits as shown:
Paramet e rs Circ ui t A Circui t B Circuit C Circuit D
IIL -.50/-1.2 0/-1.2
3/ Perform function sequence at VCC = 4.5 V and repeat at VCC = 5.5 V.
4/ A = 2.5 V minimum, B = 0.55 V or GND, H ≥ 2.5 V, L ≤ 0. 5 V.
16
MIL-M-38510/352A
MIL-M-38510/352A
17
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). W hen actual packaging of materiel is to be performed by DoD or in-house contractor
personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements.
Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Service
or Defense Agency, or within the military service's system command. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting
the responsible packaging activity.
6. NOTES
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design
applications and logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of the specification.
b. PIN and compliance identifier, if applicable (see 1.2).
c. Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d. Requirements for certificate of compliance, if applicable.
e. Requirements for notification of change of product or process to contracting activity in addition to
notification to the qualifying activity, if applicable.
f. Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883),
corrective action, and reporting of results, if applicable.
g. Requirements for product assurance options.
h. Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should
not affect the part number. Unless otherwise specified, these requirements will not apply to direct
purchase by or direct shipment to the Government.
i. Requirements for "JAN" marking.
j. Packaging requirements (see 5.1).
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-
38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements
now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have
been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.
6.4 Qualification. W ith respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government test ed for quali fic ation in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
MIL-M-38510/352A
18
6.5 Abbreviations, symbols, and definitions. The abbrev iatio ns, sy mbols, and definit ion s us ed herein are defin ed
in MIL-PRF-38535, MIL-HDBK-1331, and as follows:
GND ........................................... Ground zero voltage potential
I
IN ................................................ Current flowing into an input terminal
V
IN ............................................... Voltage level at an inpu t termi nal
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified,
microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material
and finish A (see 3.4). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users.
Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry
microcircuit types may not have equivalent operational performance characteristics acros s mil itary tempera ture
ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation
to case size. The presence of this information should not be deemed as permitting substitution of generic-industry
types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Military device
type Generic-industry
type
01 54F37
02 54F38
03 54F40
6.8 Manufacturers' designation. Manufacturers' circuits which form a part of this specification are designated with
an "X" as shown in table IV herein.
TABLE IV. Manufacturers' designations.
Circuit
A B C D Device
type National Semiconductor/
Fairchild Semiconductor Motorola Inc. Signetics Texas
Instrument
01 X X
02 X X
03 X
6.9 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect
to the previous issue due to the extensiveness of the changes.
MIL-M-38510/352A
19
Custodians: Preparing activity:
Army - CR DLA - CC
Navy - EC
Air Force - 11 (Project 5962-2045)
DLA - CC
Review activities:
Army - MI, SM
Navy - AS, CG, MC, SH, TD
Air Force - 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at www.dodssp.daps.mil.
