MC10EP16, MC100EP16 3.3 V / 5 V ECL Differential Receiver/Driver Description The EP16 is a world-class differential receiver/driver. The device is functionally equivalent to the EL16 and LVEL16 devices with higher performance capabilities. With output transition times significantly faster than the EL16 and LVEL16, the EP16 is ideally suited for interfacing with high frequency sources. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. Under open input conditions (pulled to VEE) internal input clamps will force the Q output LOW. The 100 Series contains temperature compensation. www.onsemi.com 8 8 1 1 SOIC-8 NB TSSOP-8 DFN8 D SUFFIX DT SUFFIX MN SUFFIX CASE 751-07 CASE 948R-02 CASE 506AA MARKING DIAGRAMS* Features * * * * * * VCC = 3.0 V to 5.5 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = -3.0 V to -5.5 V Open Input Default State Safety Clamp on Inputs Q Output Will Default LOW with Inputs Open or at VEE VBB Output These Devices are Pb-Free, Halogen Free and are RoHS Compliant HEP16 ALYW G 1 1 5L MG G 8 8 HP16 ALYWG G 1 KP16 ALYWG G 1 4 8 8 KEP16 ALYW G 1 1 SOIC-8 NB H K 5L 3B M = MC10 = MC100 = MC10 = MC100 = Date Code TSSOP-8 A L Y W G 3B MG G * 220 ps Typical Propagation Delay * Maximum Frequency = > 4 GHz Typical * PECL Mode Operating Range: 4 DFN8 = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. (c) Semiconductor Components Industries, LLC, 2016 August, 2016 - Rev. 7 1 Publication Order Number: MC10EP16/D MC10EP16, MC100EP16 NC 1 8 D 2 7 Q D 3 6 Q VBB 4 Table 1. PIN DESCRIPTION VCC 5 PIN FUNCTION D*, D** Q, Q VBB VCC VEE NC ECL Data Inputs ECL Data Outputs Reference Voltage Output Positive Supply Negative Supply No Connect EP (DFN8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. VEE Figure 1. 8-Lead Pinout (Top View) and Logic Diagram * Pins will default LOW when left open. ** Pins will default to VCC/2 when left open. Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor 37.5kW ESD Protection Human Body Model Machine Model Charged Device Model > 4 kV > 200 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC-8 NB TSSOP-8 DFN8 Flammability Rating Pb-Free Pkg Level 1 Level 3 Level 1 Oxygen Index: 28 to 34 Transistor Count UL 94 V-0 @ 0.125 in 167 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. www.onsemi.com 2 MC10EP16, MC100EP16 Table 3. MAXIMUM RATINGS Symbol Rating Unit VCC PECL Mode Power Supply Parameter VEE = 0 V Condition 1 Condition 2 6 V VEE NECL Mode Power Supply VCC = 0 V -6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 -6 V Iout Output Current Continuous Surge 50 100 mA IBB VBB Sink/Source 0.5 mA TA Operating Temperature Range -40 to +85 C Tstg Storage Temperature Range -65 to +150 C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC-8 NB SOIC-8 NB 190 130 C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC-8 NB 41 to 44 C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm TSSOP-8 TSSOP-8 185 140 C/W qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP-8 41 to 44 C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 C/W Tsol Wave Solder (Pb-Free) 265 C qJC Thermal Resistance (Junction-to-Case) 35 to 40 C/W VI VCC VI VEE (Note 2) DFN8 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. JEDEC standard multilayer board - 2S2P (2 signal, 2 power) Table 4. 10EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1)) -40C Symbol Characteristic 25C 85C Min Typ Max Min Typ Max Min Typ Max Unit 20 24 31 20 24 31 20 24 32 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV VOL Output LOW Voltage (Note 2) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV VIH Input HIGH Voltage (Single-Ended) 2090 2415 2155 2480 2215 2540 mV VIL Input LOW Voltage (Single-Ended) 1365 1690 1430 1755 1490 1815 mV VBB Output Voltage Reference 1790 1990 1855 2055 1915 2115 mV 3.3 2.0 3.3 2.0 3.3 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) IIH Input HIGH Current IIL Input LOW Current D D 1890 2.0 150 0.5 -150 1955 150 0.5 -150 0.5 -150 2015 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V. 2. All loading with 50 W to VCC - 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 3 MC10EP16, MC100EP16 Table 5. 10EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1)) Symbol Characteristic Min -40C Typ Max Min 25C Typ Max Min 85C Typ Max Unit 20 24 31 20 24 31 20 24 32 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mV VOL Output LOW Voltage (Note 2) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV VIH Input HIGH Voltage (Single-Ended) 3790 4115 3855 4180 3915 4240 mV VIL Input LOW Voltage (Single-Ended) 3065 3390 3130 3455 3190 3515 mV VBB Output Voltage Reference 3490 3690 3555 3755 3615 3815 mV 5.0 2.0 5.0 2.0 5.0 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) IIH Input HIGH Current IIL Input LOW Current D D 3590 2.0 3655 150 3715 150 0.5 -150 0.5 -150 mA 0.5 -150 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to -0.5 V. 2. All loading with 50 W to VCC - 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 6. 10EP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = -5.5 V to -3.0 V (Note 1)) Symbol IEE Characteristic Power Supply Current Min -40C Typ Max Min 25C Typ Max Min 85C Typ Max Unit 20 24 31 20 24 31 20 24 32 mA VOH Output HIGH Voltage (Note 2) -1135 -1010 -885 -1070 -945 -820 -1010 -885 -760 mV VOL Output LOW Voltage (Note 2) -1935 -1810 -1685 -1870 -1745 -1620 -1810 -1685 -1560 mV VIH Input HIGH Voltage (Single-Ended) -1210 -885 -1145 -820 -1085 -760 mV VIL Input LOW Voltage (Single-Ended) -1935 -1610 -1870 -1545 -1810 -1485 mV VBB Output Voltage Reference -1510 -1310 -1445 -1245 -1385 -1185 mV 0.0 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) IIH Input HIGH Current IIL Input LOW Current D D -1410 VEE + 2.0 0.0 VEE + 2.0 150 0.5 -150 -1345 0.0 VEE + 2.0 150 0.5 -150 -1285 0.5 -150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC - 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 4 MC10EP16, MC100EP16 Table 7. 100EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1)) -40C Symbol Characteristic 25C 85C Min Typ Max Min Typ Max Min Typ Max Unit 17 25 36 17 25 36 22 26 38 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 2) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV VIH Input HIGH Voltage (Single-Ended) 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage (Single-Ended) 1355 1675 1355 1675 1355 1675 mV VBB Output Voltage Reference 1775 1975 1775 1975 1775 1975 mV 3.3 2.0 3.3 2.0 3.3 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) IIH Input HIGH Current IIL Input LOW Current D D 1875 2.0 1875 150 0.5 -150 1875 150 0.5 -150 mA 0.5 -150 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V. 2. All loading with 50 W to VCC - 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 8. 100EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1)) -40C Symbol Characteristic 25C 85C Min Typ Max Min Typ Max Min Typ Max Unit 17 25 36 17 25 36 22 26 38 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV VOL Output LOW Voltage (Note 2) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV VIH Input HIGH Voltage (Single-Ended) 3775 4120 3775 4120 3775 4120 mV VIL Input LOW Voltage (Single-Ended) 3055 3375 3055 3375 3055 3375 mV VBB Output Voltage Reference 3475 3675 3475 3675 3475 3675 mV 5.0 2.0 5.0 2.0 5.0 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note3) IIH Input HIGH Current IIL Input LOW Current D D 3575 2.0 150 0.5 -150 3575 150 0.5 -150 0.5 -150 3575 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to -0.5 V. 2. All loading with 50 W to VCC - 2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 5 MC10EP16, MC100EP16 Table 9. 100EP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = -5.5 V to -3.0 V (Note 1)) Symbol Characteristic Min -40C Typ Max Min 25C Typ Max Min 85C Typ Max Unit 17 25 36 17 25 36 22 26 38 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) -1145 -1020 -895 -1145 -1020 -895 -1145 -1020 -895 mV VOL Output LOW Voltage (Note 2) -1945 -1820 -1695 -1945 -1820 -1695 -1945 -1820 -1695 mV VIH Input HIGH Voltage (Single-Ended) -1225 -880 -1225 -880 -1225 -880 mV VIL Input LOW Voltage (Single-Ended) -1945 -1625 -1945 -1625 -1945 -1625 mV VBB Output Voltage Reference -1525 -1325 -1525 -1325 -1525 -1325 mV 0.0 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) IIH Input HIGH Current IIL Input LOW Current D D -1425 VEE + 2.0 0.0 -1425 VEE + 2.0 150 0.5 -150 0.0 -1425 VEE + 2.0 150 0.5 -150 mA 0.5 -150 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC -2.0 V. 3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 10. AC CHARACTERISTICS (VCC = 0 V; VEE = -3.0 V to -5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 1)) -40C Symbol Characteristic Min Typ 25C Max Min Typ Max fmax Maximum Frequency (Figure 2) tPLH, tPHL Propagation Delay to Output Differential tSKEW Duty Cycle Skew (Note 2) 5.0 20 5.0 20 tJITTER Cycle-to-Cycle Jitter (Figure 2) 0.2 <1 0.2 <1 150 800 1200 150 800 1200 70 120 170 80 130 180 VPP tr tf Input Voltage Swing (Differential Configuration) Output Rise/Fall Times Q, Q (20%-80%) >4 85C 150 Min >4 220 280 150 220 Typ Max >4 280 160 240 Unit GHz 300 ps 5.0 20 ps 0.2 <1 ps 150 800 1200 mV 100 150 200 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC - 2.0 V. 2. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs. www.onsemi.com 6 MC10EP16, MC100EP16 800 VOUTpp (mV) 700 Measured Simulated 600 7 6 500 5 400 4 300 3 200 2 EEEEEEEE EEEEEEEE EEEEEEEE E E 100 0 0 1000 2000 JITTEROUT ps (RMS) 8 1 (JITTER) 3000 4000 5000 6000 FREQUENCY (MHz) Figure 2. Fmax/Jitter Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC - 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.) www.onsemi.com 7 MC10EP16, MC100EP16 ORDERING INFORMATION Package Shipping MC10EP16DG SOIC-8 NB (Pb-Free) 98 Units / Tube MC10EP16DR2G SOIC-8 NB (Pb-Free) 2500 / Tape & Reel MC10EP16DTG TSSOP-8 (Pb-Free) 100 Units / Tube MC10EP16DTR2G TSSOP-8 (Pb-Free) 2500 / Tape & Reel MC100EP16DG SOIC-8 NB (Pb-Free) 98 Units / Tube MC100EP16DR2G SOIC-8 NB (Pb-Free) 2500 / Tape & Reel MC100EP16DTG TSSOP-8 (Pb-Free) 100 Units / Tube MC100EP16DTR2G TSSOP-8 (Pb-Free) 2500 / Tape & Reel MC100EP16MNR4G DFN8 (Pb-Free) 1000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D - ECL Clock Distribution Techniques AN1406/D - Designing with PECL (ECL at +5.0 V) AN1503/D - ECLinPSt I/O SPiCE Modeling Kit AN1504/D - Metastability and the ECLinPS Family AN1568/D - Interfacing Between LVDS and ECL AN1672/D - The ECL Translator Guide AND8001/D - Odd Number Counters Design AND8002/D - Marking and Date Codes AND8020/D - Termination of ECL Logic Devices AND8066/D - Interfacing with ECLinPS AND8090/D - AC Characteristics of ECL Devices www.onsemi.com 8 MC10EP16, MC100EP16 PACKAGE DIMENSIONS SOIC-8 NB D SUFFIX CASE 751-07 ISSUE AK -X- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. A 8 5 S B 0.25 (0.010) M Y M 1 4 -Y- K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE -Z- 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10EP16, MC100EP16 PACKAGE DIMENSIONS TSSOP-8 DT SUFFIX CASE 948R-02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF M T U V S 0.25 (0.010) B -U- 4 M A -V- S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S F DETAIL E C 0.10 (0.004) -T- SEATING PLANE D -W- G DETAIL E www.onsemi.com 10 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC10EP16, MC100EP16 PACKAGE DIMENSIONS DFN8 2x2, 0.5 P MN SUFFIX CASE 506AA ISSUE F D PIN ONE REFERENCE 2X 0.10 C 2X A B L1 CC CC 0.10 C DETAIL A E OPTIONAL CONSTRUCTIONS EE EE CC EXPOSED Cu TOP VIEW A DETAIL B 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L DIM A A1 A3 b D D2 E E2 e K L L1 EE CC CC A3 MOLD CMPD A1 DETAIL B 0.08 C (A3) NOTE 4 SIDE VIEW ALTERNATE CONSTRUCTIONS A1 C MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.30 REF 0.25 0.35 --- 0.10 SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* DETAIL A D2 1 4 8X L E2 K 8 5 e/2 e 8X 1.30 PACKAGE OUTLINE 0.90 b 2.30 1 0.10 C A B 0.05 C 8X 0.50 8X 0.50 PITCH 0.30 NOTE 3 BOTTOM VIEW DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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