LM148QML
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LM148QML Quad 741 Op Amps
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1FEATURES DESCRIPTION
The LM148 is a true quad LM741. It consists of four
2• 741 Op Amp Operating Characteristics independent, high gain, internally compensated, low
• Class AB Output Stage—No Crossover power operational amplifiers which have been
Distortion designed to provide functional characteristics
• Pin Compatible with the LM124 identical to those of the familiar LM741 operational
amplifier. In addition the total supply current for all
• Overload Protection for Inputs and Outputs four amplifiers is comparable to the supply current of
• Low Supply Current Drain: 0.6 mA/Amplifier a single LM741 type op amp. Other features include
• Low Input Offset Voltage: 1 mV input offset currents and input bias current which are
much less than those of a standard LM741. Also,
• Low Input Offset Current: 4 nA excellent isolation between amplifiers has been
• Low Input Bias Current 30 nA achieved by independently biasing each amplifier and
• High Degree of Isolation between Amplifiers: using layout techniques which minimize thermal
120 dB coupling.
• Gain Bandwidth Product (Unity Gain): 1.0 MHz The LM148 can be used anywhere multiple LM741 or
LM1558 type amplifiers are being used and in
applications where amplifier matching or high packing
density is required.
Connection Diagram
Figure 1. Top View
See Package Number J0014A
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
123 20 19
11109 12 13
4
5
6
7
8
N/C
4IN+
VCC-
3IN+
N/C
1IN+
VCC+
2IN+
N/C
N/C
1IN-
1OUT
N/C
4OUT
4IN-
2OUT
N/C
3OUT
3IN-
2IN-
18
17
16
15
14
LM148QML
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Figure 2. Top View
See Package Number NAJ0020A
Schematic Diagram
* 1 pF in the LM149
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)
Supply Voltage ±22V
Differential Input Voltage ±44V
Output Short Circuit Duration(2) Continuous
Power Dissipation (Pdat 25°C)(3) 1100mW
Thermal Resistance θJA CDIP (Still Air) 103°C/W
CDIP (500LF/ Min Air flow) 52°C/W
LCCC (Still Air) 90°C/W
LCCC (500LF/ Min Air flow) 66°C/W
θJC CDIP 19°C/W
LCCC 21°C/W
Maximum Junction Temperature (TjMAX) 150°C
Operating Temperature Range −55°C ≤TA≤+125°C
Storage Temperature Range −65°C ≤TA≤+150°C
Lead Temperature (Soldering, 10 sec.) Ceramic 300°C
ESD tolerance(4) 500V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) Any of the amplifier outputs can be shorted to ground indefinitely; however, more than one should not be simultaneously shorted as the
maximum junction temperature will be exceeded.
(3) The maximum power dissipation for these devices must be derated at elevated temperatures and is dicated by TJMAX,θJA, and the
ambient temperature, TA. The maximum available power dissipation at any temperature is Pd= (TJMAX −TA)/θJA or the number given in
the Absolute Maximum Ratings, whichever is less.
(4) Human body model, 1.5 kΩin series with 100 pF
Quality Conformance Inspection
MIL-STD-883, Method 5005 — Group A
Subgroup Description Temp ( °C)
1 Static tests at +25
2 Static tests at +125
3 Static tests at -55
4 Dynamic tests at +25
5 Dynamic tests at +125
6 Dynamic tests at -55
7 Functional tests at +25
8A Functional tests at +125
8B Functional tests at -55
9 Switching tests at +25
10 Switching tests at +125
11 Switching tests at -55
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Electrical Characteristics
DC PARAMETERS (The following conditions apply to all parameters, unless otherwise specified.)
VCC = ±15V, RS= 0Ω
Sub-
Symbol Parameter Conditions Notes Min Max Units groups
VIO Input Offset Voltage VCM = 0V, RS= 50 Ω −5 +5 mV 1
−6 +6 mV 2,3
IIO Input Offset Current VCM = 0V −25 +25 nA 1
−75 +75 nA 2,3
±IIB Input Bias Current VCM = 0V 1 100 nA 1
1 325 nA 2,3
Rin Input Resistance See(1) 0.8 MΩ1
PSRR+ Power Supply Rejection Ratio +VCC = +15V and +5V, −VCC =−15V, 77 dB 1, 2, 3
RS= 50Ω
PSRR−Power Supply Rejection Ratio +VCC = +15V, −VCC =−15V and −5V, 77 dB 1, 2, 3
RS= 50Ω
CMRR Common Mode Rejection Ratio +VCM = ±12V, RS= 50Ω70 dB 1, 2, 3
IOS+ Short Circuit Current −55 −14 mA 1
IOS−Short Circuit Current 14 55 mA 1
ICC Power Supply Current 0.4 3.6 mA 1
0.4 4.5 mA 2, 3
AVS+ Large Signal Voltage Gain VOUT = 0V to +10V, RL> 2 kΩ50 V/mV 4
25 V/mV 5, 6
AVS−Large Signal Voltage Gain VOUT = 0V to −10V, RL> 2 kΩ50 V/mV 4
25 V/mV 5, 6
Vout+ Output Voltage Swing RL= 10 kΩ+12 V 4, 5, 6
RL= 2kΩ+10 V 4, 5, 6
Vout−Output Voltage Swing RL= 10 kΩ −12 V 4, 5, 6
RL= 2kΩ −10 V 4, 5, 6
(1) Parameter specified, Not Tested.
Electrical Characteristics
AC PARAMETERS (The following conditions apply to all parameters, unless otherwise specified.)
VCC = ±15V, AV= 1, RS= 0Ω
Sub-
Symbol Parameter Conditions Notes Min Max Units groups
±SR Slew Rate 0.2 V/μs 7, 8A, 8B
GBW Gain Bandwidth Product 0.4 1.4 MHz 7, 8A, 8B
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Typical Performance Characteristics
Supply Current Input Bias Current
Figure 3. Figure 4.
Voltage Swing Positive Current Limit
Figure 5. Figure 6.
Negative Current Limit Output Impedance
Figure 7. Figure 8.
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Typical Performance Characteristics (continued)
Common-Mode Rejection Ratio Open Loop Frequency Response
Figure 9. Figure 10.
Bode Plot LM148 Large Signal Pulse Response (LM148)
Figure 11. Figure 12.
Small Signal Pulse Response (LM148) Undistorted Output Voltage Swing
Figure 13. Figure 14.
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Typical Performance Characteristics (continued)
Gain Bandwidth Slew Rate
Figure 15. Figure 16.
Inverting Large Signal Pulse Response (LM148) Input Noise Voltage and Noise Current
Figure 17. Figure 18.
Positive Common-Mode Input Voltage Limit Negative Common-Mode Input Voltage Limit
Figure 19. Figure 20.
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APPLICATION HINTS
The LM148 series are quad low power LM741 op amps. In the proliferation of quad op amps, these are the first
to offer the convenience of familiar, easy to use operating characteristics of the LM741 op amp. In those
applications where LM741 op amps have been employed, the LM148 series op amps can be employed directly
with no change in circuit performance.
The package pin-outs are such that the inverting input of each amplifier is adjacent to its output. In addition, the
amplifier outputs are located in the corners of the package which simplifies PC board layout and minimizes
package related capacitive coupling between amplifiers.
The input characteristics of these amplifiers allow differential input voltages which can exceed the supply
voltages. In addition, if either of the input voltages is within the operating common-mode range, the phase of the
output remains correct. If the negative limit of the operating common-mode range is exceeded at both inputs, the
output voltage will be positive. For input voltages which greatly exceed the maximum supply voltages, either
differentially or common-mode, resistors should be placed in series with the inputs to limit the current.
Like the LM741, these amplifiers can easily drive a 100 pF capacitive load throughout the entire dynamic output
voltage and current range. However, if very large capacitive loads must be driven by a non-inverting unity gain
amplifier, a resistor should be placed between the output (and feedback connection) and the capacitance to
reduce the phase shift resulting from the capacitive loading.
The output current of each amplifier in the package is limited. Short circuits from an output to either ground or the
power supplies will not destroy the unit. However, if multiple output shorts occur simultaneously, the time
duration should be short to prevent the unit from being destroyed as a result of excessive power dissipation in
the IC chip.
As with most amplifiers, care should be taken lead dress, component placement and supply decoupling in order
to ensure stability. For example, resistors from the output to an input should be placed with the body close to the
input to minimize “pickup” and maximize the frequency of the feedback pole which capacitance from the input to
ground creates.
A feedback pole is created when the feedback around any amplifier is resistive. The parallel resistance and
capacitance from the input of the device (usually the inverting input) to AC ground set the frequency of the pole.
In many instances the frequency of this pole is much greater than the expected 3 dB frequency of the closed
loop gain and consequently there is negligible effect on stability margin. However, if the feedback pole is less
than approximately six times the expected 3 dB frequency a lead capacitor should be placed from the output to
the input of the op amp. The value of the added capacitor should be such that the RC time constant of this
capacitor and the resistance it parallels is greater than or equal to the original feedback pole time constant.
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Typical Applications—LM148
fMAX = 5 kHz, THD ≤0.03%
R1 = 100k pot. C1 = 0.0047 μF, C2 = 0.01 μF, C3 = 0.1 μF, R2 = R6 = R7 = 1M,
R3 = 5.1k, R4 = 12Ω, R5 = 240Ω, Q = NS5102, D1 = 1N914, D2 = 3.6V avalanche
diode (ex. LM103), VS= ±15V
A simpler version with some distortion degradation at high frequencies can be made by using A1 as a simple inverting
amplifier, and by putting back to back zeners in the feedback loop of A3.
Figure 21. One Decade Low Distortion Sinewave Generator
VS= ±15V
R = R2, trim R2 to boost CMRR
Figure 22. Low Cost Instrumentation Amplifier
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Adjust R for minimum drift
D3 low leakage diode
D1 added to improve speed
VS= ±15V
Figure 23. Low Drift Peak Detector with Bias Current Compensation
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Tune Q through R0,
For predictable results: fOQ≤4 × 104
Use Band Pass output to tune for Q
Figure 24. Universal State-Variable Filter
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Use general equations, and tune each section separately
Q1stSECTION = 0.541, Q2ndSECTION = 1.306
The response should have 0 dB peaking
Figure 25. A 1 kHz 4 Pole Butterworth
Figure 26.
Ex: fNOTCH = 3 kHz, Q = 5, R1 = 270k, R2 = R3 = 20k, R4 = 27k, R5 = 20k, R6 = R8 = 10k, R7 = 100k, C1 = C2 =
0.001 μF
Better noise performance than the state-space approach.
Figure 27. A 3 Amplifier Bi-Quad Notch Filter
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R1C1 = R2C2 = t
R′1C′1 = R′2C′2 = t′
fC= 1 kHz, fS= 2 kHz, fp= 0.543, fZ= 2.14, Q = 0.841, f′P= 0.987, f′Z= 4.92, Q′= 4.403, normalized to ripple BW
Use the BP outputs to tune Q, Q′, tune the 2 sections separately
R1 = R2 = 92.6k, R3 = R4 = R5 = 100k, R6 = 10k, R0 = 107.8k, RL= 100k, RH= 155.1k,
R′1 = R′2 = 50.9k, R′4 = R′5 = 100k, R′6 = 10k, R′0 = 5.78k, R′L= 100k, R′H= 248.12k, R′f = 100k. All capacitors
are 0.001 μF.
Figure 28. A 4th Order 1 kHz Elliptic Filter (4 Poles, 4 Zeros)
Figure 29. Lowpass Response
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Typical Simulation
For more details, see IEEE Journal of Solid-State Circuits, Vol. SC-9, No. 6, December 1974
o1 = 112IS= 8 × 10−16
o2 = 144*C2 = 6 pF for LM149
Figure 30. LM148, LM741 Macromodel for Computer Simulation
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REVISION HISTORY SECTION
Date Revision Section Originator Changes
Released
02/08/05 A New Release, Corporate format L. Lytle 1 MDS data sheet converted into one Corp.
data sheet format. MNLM148-X, Rev. 2A2.
MDS data sheet will be archived.
03/20/13 A All Changed layout of National Data Sheet to TI
format
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM148J/883 ACTIVE CDIP J 14 25 TBD Call TI Call TI -55 to 125 LM148J/883 Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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