LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 LM95241 Dual Remote Diode Temperature Sensor with SMBus Interface and TruThermTM Technology (65nm/90nm) Check for Samples: LM95241 FEATURES KEY SPECIFICATIONS * * 1 2 * * * * * * * * * * * * * * Accurately Senses Die Temperature of Remote ICs or Diode Junctions Uses TruTherm Technology for Precision "Thermal Diode" Temperature Measurement Thermal Diode Input Stage with Analog Filtering Thermal Diode Digital Filtering Intel Processor on 65nm or 90nm Process or 2N3904 Non-Ideality Selection Remote Diode Fault Detection On-board Local Temperature Sensing Remote Temperature Readings Without Digital Filtering: - 0.125 C LSb - 10-bits Plus Sign or 11-bits Programmable Resolution - 11-bits Resolves Temperatures Above 127 C Remote Temperature Readings with Digital Filtering: - 0.03125 C LSb with Filtering - 12-bits Plus Sign or 13-bits Programmable Resolution - 13-bits Resolves Temperatures Above 127 C Local Temperature Readings: - 0.25 C - 9-bits Plus Sign Status Register Support Programmable Conversion Rate Allows User Optimization of Power Consumption Shutdown Mode One-shot Conversion Control SMBus 2.0 Compatible Interface, Supports TIMEOUT 8-pin VSSOP Package * * * Remote Diode Temperature Accuracy - TA = 20C to 40C, TD = 45C to 85C 1.25 C (Max) - TA = 0C to 85C, TD = 25C to 140C 2.5 C (Max) Local Temperature Accuracy - TA = 0C to 85C 3.0 C (Max) Supply Voltage 3.0 V to 3.6 V Average Supply Current 471 A (Typ) APPLICATIONS * * * Processor/Computer System Thermal Management - (e.g. Laptop, Desktop, Workstations, Server) Electronic Test Equipment Office Electronics DESCRIPTION The LM95241 is a precision dual remote diode temperature sensor (RDTS) that uses TI's TruTherm technology. The 2-wire serial interface of the LM95241 is compatible with SMBus 2.0. The LM95241 can sense three temperature zones, it can measure the temperature of its own die as well as two diode connected transistors. The LM95241 includes digital filtering and an advanced input stage that includes analog filtering and TruTherm technology that reduces processor-to-processor nonideality spread. The diode connected transistors can be a "thermal diode" as found in Intel and AMD processors or can simply be a diode connected MMBT3904 transistor. TruTherm technology allows accurate measurement of "thermal diodes" found on small geometry processes such as 90nm and 65nm. The LM95241 supports user selectable thermal diode non-ideality of either Intel processor on 90nm or 65nm process or 2N3904. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2013, Texas Instruments Incorporated LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com DESCRIPTION (CONTINUED) The LM95241 resolution format for remote temperature readings can be programmed to be 11-bits signed or unsigned with the digital filtering disabled. When the filtering is enabled the resolution increases to 13-bits signed or unsigned. In the unsigned mode the LM95241 remote diode readings can resolve temperatures above 127C. Local temperature readings have a resolution of 9-bits plus sign. Connection Diagram D1+ 1 D1- 2 8 SMBCLK 7 D2+ 3 6 SMBDAT VDD D2- 4 5 GND LM95241 Figure 1. VSSOP-8 TOP VIEW PIN DESCRIPTIONS 2 Label Pin # Function D1+ 1 Diode Current Source To Diode Anode. Connected to remote discrete diodeconnected transistor junction or to the diode-connected transistor junction on a remote IC whose die temperature is being sensed. A capacitor is not required between D1+ and D1-. A 100 pF capacitor between D1+ and D1- can be added and may improve performance in noisy systems. Typical Connection D1- 2 Diode Return Current Sink To Diode Cathode. A capacitor is not required between D1+ and D1-. A 100 pF capacitor between D1+ and D1- can be added and may improve performance in noisy systems. D2+ 3 Diode Current Source To Diode Anode. Connected to remote discrete diodeconnected transistor junction or to the diode-connected transistor junction on a remote IC whose die temperature is being sensed. A capacitor is not required between D2+ and D2-. A 100 pF capacitor between D2+ and D2- can be added and may improve performance in noisy systems. D2- 4 Diode Return Current Sink To Diode Cathode. A capacitor is not required between D2+ and D2-. A 100 pF capacitor between D2+ and D2- can be added and may improve performance in noisy systems. GND 5 Power Supply Ground System low noise ground VDD 6 Positive Supply Voltage Input DC Voltage from 3.0 V to 3.6 V. VDD should be bypassed with a 0.1 F capacitor in parallel with 100 pF. The 100 pF capacitor should be placed as close as possible to the power supply pin. Noise should be kept below 200 mVp-p, a 10 F capacitor may be required to achieve this. SMBDAT 7 SMBus Bi-Directional Data Line, From and to Controller; may require an external pull-up resistor Open-Drain Output SMBCLK 8 SMBus Clock Input From Controller; may require an external pull-up resistor Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 Simplified Block Diagram 3.0V-3.6V LM95241 Local Diode Selector D+ DD+ D- '-6 Converter 11-Bit or 10-Bit Plus Sign Remote 9-bit Plus Sign Local TruThermTM Temperature Sensor Circuitry Remote Diode1 Selector Remote Diode2 Selector Local Remote 1 Remote 2 Diode Type Control Temperature Temperature Temperature Selection Logic Registers Registers Registers Register Diode TruTherm Control Register Config and Status Register Diode Filter Control Registers Revision and Manufacturer ID Registers SMBDAT SMBCLK SMBus Two Wire Serial Interface Typical Application +3.3V Standby C4** 100 pF 65nm/90nm PROCESSOR 1 2 3 C5** 100 pF 4 D1+ D1D2+ D2- SMBCLK 7 SMBDAT VDD 6 5 GND LM95241 Q1 MMBT3904 R2 1.3k R1 1.3k 8 SMBCLK SMBDAT C1* 100 pF C2 0.1 PF C3 10 PF + SMBus Master * Place close to LM95241 pins. ** Optional may be required in noisy systems; place close to LM95241 pins. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 3 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) -0.3 V to 6.0 V Supply Voltage -0.5V to 6.0V Voltage at SMBDAT, SMBCLK -0.3 V to (VDD + 0.3 V) Voltage at Other Pins Input Current at All Pins (2) Package Input Current 5 mA (2) 30 mA SMBDAT Output Sink Current 10 mA Junction Temperature (3) +125C -65C to +150C Storage Temperature ESD Susceptibility (4) Human Body Model Machine Model Charged Device Model Model 2000 V 200 V 1000 V For soldering specifications, see http://www.ti.com/lit/SNOA549. (5) (1) (2) (3) (4) (5) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5 mA. Parasitic components and or ESD protection circuitry are shown in Figure 2 and Table 1 for the LM95241's pins. Care should be taken not to forward bias the parasitic diode, D1, present on pins: D1+, D2+, D1-, D2-. Doing so by more than 50 mV may corrupt the temperature measurements. Thermal resistance junction-to-ambient when attached to a printed circuit board with 1oz. foil and no air flow: -- VSSOP-8 = 210C/W Human body model (HBM), 100pF discharged through a 1.5k resistor. Machine model (MM), 200pF discharged directly into each pin. Charged Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged. Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not. Operating Ratings (1) (2) Operating Temperature Range 0C to +125C Electrical Characteristics Temperature Range TMINTATMAX LM95241CIMM 0CTA+85C Supply Voltage Range (VDD) +3.0V to +3.6V (1) (2) 4 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. Thermal resistance junction-to-ambient when attached to a printed circuit board with 1oz. foil and no air flow: -- VSSOP-8 = 210C/W Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 Temperature-to-Digital Converter Characteristics Unless otherwise noted, these specifications apply for VDD=+3.0Vdc to 3.6Vdc. Boldface limits apply for TA = TJ = TMINTATMAX; all other limits TA= TJ=+25C, unless otherwise noted. TJ is the junction temperature of the LM95241. TD is the junction temperature of the remote thermal diode. Parameter Conditions TA = 0C to +85C (3) Accuracy Using Local Diode Accuracy Using Remote Diode, see Diode Processor Type. (4) for Thermal Typical (1) Limits (2) Units (Limit) 1 3 C (max) TA = +20C to +40C TD = +45C to +85C 1.25 C (max) TA = +0C to +85C TD = +25C to +140C 2.5 C (max) Remote Diode Measurement Resolution with filtering turned off 10+sign/11 0.125 C Remote Diode Measurement Resolution with digital filtering turned on 12+sign/13 Bits Local Diode Measurement Resolution Bits 0.03125 C 9+sign Bits 0.25 Conversion Time of All Temperatures at the Fastest Setting (5) Average Quiescent Current (6) 76.5 86.1 ms (max) TruTherm Mode Enabled for All Remote Channels 79.1 88.9 ms (max) SMBus Inactive, 1 Hz conversion rate 471 640 A (max) Shutdown 356 A 0.4 V D- Source Voltage Diode Source Current Ratio Diode Source Current 16 (VD+ - VD-)=+ 0.65V; high-level Low-level Power-On Reset Threshold (1) (2) (3) (4) (5) (6) C TruTherm Mode Disabled for All Remote Channels Measure on VDD input, falling edge 172 230 A (max) 100 A (min) 2.7 1.6 V (max) V (min) 11 A Typical figures are at TA = 25C and represent most likely parametric norms at the time of product characterization. The typical specifications are not ensured. Limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level). Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power dissipation of the LM95241 and the thermal resistance. See Note 2 of the Operating Ratings table for the thermal resistance to be used in the self-heating calculation. The accuracy of the LM95241CIMM is ensured when using a typical thermal diode of an Intel processor on a 65 nm process or an MMBT3904 diode-connected transistor, as selected in the Remote Diode Model Select register. See typical performance curve for performance with Intel processor on a 90nm process. This specification is provided only to indicate how often temperature data is updated. The LM95241 can be read at any time without regard to conversion state (and will yield last conversion result). Quiescent current will not increase substantially when the SMBus is active. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 5 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com Logic Electrical Characteristics Digital DC Characteristics Unless otherwise noted, these specifications apply for VDD=+3.0 to 3.6 Vdc. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA= TJ=+25C, unless otherwise noted. Symbol Parameter Conditions Typical (1) Limits (2) Units (Limit) SMBDAT, SMBCLK INPUTS VIN(1) Logical "1" Input Voltage 2.1 V (min) VIN(0) Logical "0"Input Voltage 0.8 V (max) VIN(HYST) SMBDAT and SMBCLK Digital Input Hysteresis IIN(1) Logical "1" Input Current VIN = VDD 0.005 10 A (max) IIN(0) Logical "0" Input Current VIN = 0 V -0.005 10 A (max) CIN Input Capacitance 400 mV 5 pF SMBDAT OUTPUT IOH High Level Output Current VOH = VDD 10 A (max) VOL SMBus Low Level Output Voltage IOL = 4mA IOL = 6mA 0.4 0.6 V (max) (1) (2) Typical figures are at TA = 25C and represent most likely parametric norms at the time of product characterization. The typical specifications are not ensured. Limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level). Logic Electrical Characteristics SMBus Digital Switching Characteristics Unless otherwise noted, these specifications apply for VDD=+3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80 pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25C, unless otherwise noted. The switching characteristics of the LM95241 fully meet or exceed the published specifications of the SMBus version 2.0. The following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM95241. They adhere to but are not necessarily the SMBus bus specifications. Symbol (2) (3) (4) (5) 6 Conditions fSMB SMBus Clock Frequency tLOW SMBus Clock Low Time from VIN(0)max to VIN(0)max Typical (1) Limits (2) Units (Limit) 100 10 kHz (max) kHz (min) 4.7 25 s (min) ms (max) tHIGH SMBus Clock High Time from VIN(1)min to VIN(1)min tR,SMB SMBus Rise Time See (3) 1 s (max) tF,SMB SMBus Fall Time See (4) 0.3 s (max) tOF Output Fall Time CL = 400pF, IO = 3mA (4) tTIMEOUT (1) Parameter 4.0 s (min) 250 ns (max) SMBDAT and SMBCLK Time Low for Reset of Serial Interface (5) 25 35 ms (min) ms (max) tSU;DAT Data In Setup Time to SMBCLK High 250 ns (min) tHD;DAT Data Out Stable after SMBCLK Low 300 1075 ns (min) ns (max) tHD;STA Start Condition SMBDAT Low to SMBCLK Low (Start condition hold before the first clock falling edge) 100 ns (min) tSU;STO Stop Condition SMBCLK High to SMBDAT Low (Stop Condition Setup) 100 ns (min) tSU;STA SMBus Repeated Start-Condition Setup Time, SMBCLK High to SMBDAT Low 0.6 s (min) Typical figures are at TA = 25C and represent most likely parametric norms at the time of product characterization. The typical specifications are not ensured. Limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level). The output rise time is measured from (VIN(0)max + 0.15V) to (VIN(1)min - 0.15V). The output fall time is measured from (VIN(1)min - 0.15V) to (VIN(1)min + 0.15V). Holding the SMBDAT and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM95241's SMBus state machine, therefore setting SMBDAT and SMBCLK pins to a high impedance state. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 Logic Electrical Characteristics SMBus Digital Switching Characteristics (continued) Unless otherwise noted, these specifications apply for VDD=+3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80 pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25C, unless otherwise noted. The switching characteristics of the LM95241 fully meet or exceed the published specifications of the SMBus version 2.0. The following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM95241. They adhere to but are not necessarily the SMBus bus specifications. Symbol tBUF Parameter Typical (1) Conditions SMBus Free Time Between Stop and Start Conditions Limits (2) Units (Limit) 1.3 s (min) tLOW tR tF VIH SMBCLK VIL tHD;STA tHD;DAT tBUF tHIGH tSU;STA tSU;DAT tSU;STO VIH SMBDAT VIL P S S P Figure 2. SMBus Communication Table 1. Parasitic components and ESD protection circuitry Pin # Label Circ uit 1 D1+ A 2 D1- A 3 D2+ A 4 D2- A 5 GND B 6 VDD B 7 SMBDAT C 8 SMBCLK C All Input ESD Protection Structure Circuits V+ V+ D2 ESD Clamp PIN D1 D3 6.5V ESD CLAMP D2 160 k D3 80 k D1 6.5V GND GND PIN D1 SNP GND Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 7 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics 8 Intel Processor on 65nm Process or 90nm Process Thermal Diode Performance Comparison Thermal Diode Capacitor or PCB Leakage Current Effect Remote Diode Temperature Reading Figure 3. Figure 4. Remote Temperature Reading Sensitivity to Thermal Diode Filter Capacitance Conversion Rate Effect on Average Power Supply Current Figure 5. Figure 6. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 FUNCTIONAL DESCRIPTION The LM95241 is a digital sensor that can sense the temperature of 3 thermal zones using a sigma-delta analogto-digital converter. It can measure its local die temperature and the temperature of two external transistor junctions using a Vbe temperature sensing method. The LM95241 can support two external transistor types, a Intel processor on 65nm or 90mn process thermal diode or a 2N3904 diode connected transistor. The transistor type is register programmable and does not require software intervention after initialization. The LM95241 has an advanced input stage using Texas Instruments' TruTherm technology that reduces the spread in non-ideality found in Intel processors on 65nm or 90nm process. Internal analog filtering has been included in the thermal diode input stage thus minimizing the need for external thermal diode filter capacitors. In addition a digital filter has been added. These noise immunity improvements in the analog input stage along with the digital filtering will allow longer trace tracks or cabling to the thermal diode than previous thermal diode sensor devices. The 2-wire serial interface, of the LM95241, is compatible with SMBus 2.0 and I2C. Please see the SMBus 2.0 specification for a detailed description of the differences between the I2C bus and SMBus. The temperature conversion rate is programmable to allow the user to optimize the current consumption of the LM95241 to the system requirements. The LM95241 can be placed in shutdown to minimize power consumption when temperature data is not required. While in shutdown, a 1-shot conversion mode allows system control of the conversion rate for ultimate flexibility. The remote diode temperature resolution is variable and depends on whether the digital filter is activated. When the digital filter is active the resolution is thirteen bits and is programmable to 13-bits unsigned or 12-bits plus sign, with a least-significant-bit (LSb) weight for both resolutions of 0.03125C. When the digital filter is inactive the resolution is eleven bits and is programmable to 11-bits unsigned or 10-bits plus sign, with a least-significantbit (LSb) weight for both resolutions of 0.125C. The unsigned resolution allows the remote diodes to sense temperatures above 127C. Local temperature resolution is not programmable and is always 9-bits plus sign and has a 0.25C LSb. The LM95241 remote diode temperature accuracy is trimmed for the typical thermal diode of a Intel processor on 65nm or 90nm process or a typical 2N3904 transistor and the accuracy is ensured only when using either of these diodes when selected appropriately. TruTherm mode should be enabled when measuring a Intel processor on 65nm or 90nm process and disabled when measuring a 3904 transistor. Diode fault detection circuitry in the LM95241 can detect the presence of a remote diode. The LM95241 register set has an 8-bit data structure and includes: 1. Most-Significant-Byte (MSB) Local Temperature Register 2. Least-Significant-Byte (LSB) Local Temperature Register 3. MSB Remote Temperature 1 Register 4. LSB Remote Temperature 1 Register 5. MSB Remote Temperature 2 Register 6. LSB Remote Temperature 2 Register 7. Status Register: busy, diode fault 8. Configuration Register: resolution control, conversion rate control, standby control 9. Remote Diode Filter Setting 10. Remote Diode Model Select 11. Remote Diode TruTherm Mode Control 12. 1-shot Register 13. Manufacturer ID 14. Revision ID Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 9 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com CONVERSION SEQUENCE In the power up default state the LM95241 typically takes 77.8 ms to convert the Local Temperature, Remote Temperature 1 and 2, and to update all of its registers. Only during the conversion process is the busy bit (D7) in the Status register (02h) high. These conversions are addressed in a round robin sequence. The conversion rate may be modified by the Conversion Rate bits found in the Configuration Register (03h). When the conversion rate is modified a delay is inserted between conversions, the actual maximum conversion time remains at 88.9 ms. Different conversion rates will cause the LM95241 to draw different amounts of supply current as shown in Figure 7. Figure 7. Conversion Rate Effect on Power Supply Current POWER-ON-DEFAULT STATES LM95241 always powers up to these known default states. The LM95241 remains in these states until after the first conversion. 1. Command Register set to 00h 2. Local Temperature set to 0C until the end of the first conversion 3. Remote Diode Temperature set to 0C until the end of the first conversion 4. Remote Diode digital filters are on. 5. Remote Diode 1 model is set to Intel processor on 65nm or 90nm process with TruTherm Mode enabled. Remote Diode 2 model is set to 2N3904/MMBT3904 with TruTherm mode disabled. 6. Status Register depends on state of thermal diode inputs 7. Configuration register set to 00h; continuous conversion SMBus INTERFACE The LM95241 operates as a slave on the SMBus, so the SMBCLK line is an input and the SMBDAT line is bidirectional. The LM95241 never drives the SMBCLK line and it does not support clock stretching. According to SMBus specifications, the LM95241 has a 7-bit slave address. All bits A6 through A0 are internally programmed and cannot be changed by software or hardware. The SMBus slave address is dependent on the LM95241 part number ordered: Version A6 A5 A4 A3 A2 A1 A0 LM95241CIMM 0 1 0 1 0 1 1 LM95241CIMM-1 0 0 1 1 0 0 1 LM95241CIMM-2 0 1 0 1 0 1 0 10 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 TEMPERATURE DATA FORMAT Temperature data can only be read from the Local and Remote Temperature registers . Remote temperature data with the digital filter off is represented by an 11-bit, two's complement word or unsigned binary word with an LSb (Least Significant Bit) equal to 0.125C. The data format is a left justified 16-bit word available in two 8-bit registers. Unused bits will always report "0". Table 2. 11-bit, 2's complement (10-bit plus sign) Temperature Digital Output Binary Hex +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.125C 0000 0000 0010 0000 0020h 0C 0000 0000 0000 0000 0000h -0.125C 1111 1111 1110 0000 FFE0h -1C 1111 1111 0000 0000 FF00h -25C 1110 0111 0000 0000 E700h -55C 1100 1001 0000 0000 C900h Table 3. 11-bit, unsigned binary Temperature Digital Output Binary Hex +255.875C 1111 1111 1110 0000 FFE0h +255C 1111 1111 0000 0000 FF00h +201C 1100 1001 0000 0000 C900h +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.125C 0000 0000 0010 0000 0020h 0C 0000 0000 0000 0000 0000h Remote temperature data with the digital filter on is represented by a 13-bit, two's complement word or unsigned binary word with an LSb (Least Significant Bit) equal to 0.03125C (1/32C). The data format is a left justified 16bit word available in two 8-bit registers. Unused bits will always report "0". Table 4. 13-bit, 2's complement Temperature Digital Output Binary Hex +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.03125C 0000 0000 0000 1000 0008h 0C 0000 0000 0000 0000 0000h -0.03125C 1111 1111 1111 0111 FFF7h -1C 1111 1111 0000 0000 FF00h -25C 1110 0111 0000 0000 E700h -55C 1100 1001 0000 0000 C900h Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 11 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com Table 5. 13-bit, unsigned binary Temperature Digital Output Binary Hex +255.875C 1111 1111 1110 0000 FFE0h +255C 1111 1111 0000 0000 FF00h +201C 1100 1001 0000 0000 C900h +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.03125C 0000 0000 0000 1000 0008h 0C 0000 0000 0000 0000 0000h Local Temperature data is represented by a 10-bit, two's complement word with an LSb (Least Significant Bit) equal to 0.25C. The data format is a left justified 16-bit word available in two 8-bit registers. Unused bits will always report "0". Local temperature readings greater than +127.75C are clamped to +127.75C, they will not roll-over to negative temperature readings. Temperature Digital Output Binary Hex +125C 0111 1101 0000 0000 7D00h +25C 0001 1001 0000 0000 1900h +1C 0000 0001 0000 0000 0100h +0.25C 0000 0000 0100 0000 0040h 0C 0000 0000 0000 0000 0000h -0.25C 1111 1111 1100 0000 FFC0h -1C 1111 1111 0000 0000 FF00h -25C 1110 0111 0000 0000 E700h -55C 1100 1001 0000 0000 C900h SMBDAT OPEN-DRAIN OUTPUT The SMBDAT output is an open-drain output and does not have internal pull-ups. A "high" level will not be observed on this pin until pull-up current is provided by some external source, typically a pull-up resistor. Choice of resistor value depends on many system factors but, in general, the pull-up resistor should be as large as possible without effecting the SMBus desired data rate. This will minimize any internal temperature reading errors due to internal heating of the LM95241. The maximum resistance of the pull-up to provide a 2.1V high level, based on LM95241 specification for High Level Output Current with the supply voltage at 3.0V, is 82k(5%) or 88.7k(1%). DIODE FAULT DETECTION The LM95241 is equipped with operational circuitry designed to detect fault conditions concerning the remote diodes. In the event that the D+ pin is detected as shorted to GND, D-, VDD or D+ is floating, the Remote Temperature reading is -128.000 C if signed format is selected and +255.875 if unsigned format is selected. In addition, the appropriate status register bits RD1M or RD2M (D1 or D0) are set. COMMUNICATING WITH THE LM95241 The data registers in the LM95241 are selected by the Command Register. At power-up the Command Register is set to "00", the location for the Read Local Temperature Register. The Command Register latches the last location it was set to. Each data register in the LM95241 falls into one of four types of user accessibility: 1. Read only 2. Write only 3. Write/Read same address 4. Write/Read different address 12 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 A Write to the LM95241 will always include the address byte and the command byte. A write to any register requires one data byte. Reading the LM95241 can take place either of two ways: 1. If the location latched in the Command Register is correct (most of the time it is expected that the Command Register will point to one of the Read Temperature Registers because that will be the data most frequently read from the LM95241), then the read can simply consist of an address byte, followed by retrieving the data byte. 2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another address byte will accomplish a read. The data byte has the most significant bit first. At the end of a read, the LM95241 can accept either acknowledge or No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master has read its last byte). When retrieving all 11 bits from a previous remote diode temperature measurement, the master must insure that all 11 bits are from the same temperature conversion. This may be achieved by reading the MSB register first. The LSB will be locked after the MSB is read. The LSB will be unlocked after being read. If the user reads MSBs consecutively, each time the MSB is read, the LSB associated with that temperature will be locked in and override the previous LSB value locked-in. SMBus Timing Diagrams for Access of Data 1 9 1 9 SMBCLK SMBDAT A6 A5 A4 A3 A2 A1 D7 R/W A0 D6 D5 D4 D3 D2 D1 Ack by LM95241 Start by Master D0 Ack by Stop LM95241 by Master Frame 1 Serial Bus Address Byte Frame 2 Command Byte Figure 8. Serial Bus Write to the Internal Command Register 1 9 1 9 SMBCLK SMBDAT A6 A5 A4 A3 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 Ack by LM95241 Start by Master Ack by LM95241 Frame 1 Serial Bus Address Byte SMBCLK (Continued) SMBDAT (Continued) Frame 2 Command Byte 1 D7 9 D6 D5 D4 D3 D2 D1 D0 Ack by Stop LM95241 by Master Frame 3 Data Byte Figure 9. Serial Bus Write to the internal Command Register followed by a Data Byte Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 13 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com 1 9 1 9 SMBCLK SMBDAT A6 A4 A5 A3 A2 A1 A0 D7 R/W D6 D5 D4 D3 D2 D1 D0 Ack by LM95241 Start by Master NoAck Stop by by Master Master Frame 1 Serial Bus Address Byte Frame 2 Data Byte from the LM95241 Figure 10. Serial Bus byte Read from a Register with the internal Command Register preset to desired value. 1 9 1 9 SMBCLK SMBDAT A6 A5 A4 A3 A2 A1 A0 R/W Start by Master D7 Ack by LM95241 D6 D5 Frame 1 Serial Bus Address Byte SMBCLK (Continued) SMBDAT (Continued) 9 A5 A4 A3 A2 A1 Frame 3 Serial Bus Address Byte D3 D2 D1 D0 Ack Repeat by Start by LM95241 Master Frame 2 Command Byte 1 A6 D4 A0 R/W 1 D7 Ack by LM95241 9 D6 D5 D4 D3 D2 D1 D0 No Ack Stop by by Master Master Frame 4 Data Byte from the LM95241 Figure 11. Serial Bus Write followed by a Repeat Start and Immediate Read SERIAL INTERFACE RESET In the event that the SMBus Master is RESET while the LM95241 is transmitting on the SMBDAT line, the LM95241 must be returned to a known state in the communication protocol. This may be done in one of two ways: 1. When SMBDAT is LOW, the LM95241 SMBus state machine resets to the SMBus idle state if either SMBDAT or SMBCLK are held low for more than 35ms (tTIMEOUT). Note that according to SMBus specification 2.0 all devices are to timeout when either the SMBCLK or SMBDAT lines are held low for 2535ms. Therefore, to insure a timeout of all devices on the bus the SMBCLK or SMBDAT lines must be held low for at least 35ms. 2. When SMBDAT is HIGH, have the master initiate an SMBus start. The LM95241 will respond properly to an SMBus start condition at any point during the communication. After the start the LM95241 will expect an SMBus Address address byte. ONE-SHOT CONVERSION The One-Shot register is used to initiate a single conversion and comparison cycle when the device is in standby mode, after which the device returns to standby. This is not a data register and it is the write operation that causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will always be read from this register. LM95241 Registers Command register selects which registers will be read from or written to. Data for this register should be transmitted during the Command Byte of the SMBus write communication. 14 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 P7 P6 P5 P4 P3 P2 P1 P0 Command P0-P7: Command Table 6. Register Summary Command (Hex) Name Power-On Default Value (Hex) Read/Write # of used bits Comments Status Register 02h - RO 5 4 status bits and 1 busy bit Configuration Register 03h 00h R/W 5 Includes conversion rate control Remote Diode Filter Control 06h 05h R/W 2 Controls thermal diode filter setting Remote Diode Model Type Select 30h 01h R/W 2 Selects the 2N3904 or Intel processor on 65nm or 90nm process thermal diode model Remote Diode TruTherm Mode Control 07h 01h 6 Enables or disables TruTherm technology for Remote Diode measurements 1-shot 0Fh - WO - Activates one conversion for all 3 channels if the chip is in standby mode (i.e. RUN/STOP bit = 1). Data transmitted by the host is ignored by the LM95241. Local Temperature MSB 10h - RO 8 Remote Temperature 1 MSB 11h - RO 8 Remote Temperature 2 MSB 12h - RO 8 Local Temperature LSB 20h - RO 2 All unused bits will report zero Remote Temperature 1 LSB 21h - RO 3/5 All unused bits will report zero Remote Temperature 2 LSB 22h - RO 3/5 All unused bits will report zero Manufacturer ID FEh 01h RO Revision ID FFh A4h RO D5 D4 STATUS REGISTER (Read Only Address 02h): D7 D6 Busy Reserved 0 0 D3 D2 D1 D0 R2TME R1TME RD2M RD1M 0 Bits Name Description 7 Busy When set to "1" the part is converting. 6-4 Reserved Reports "0" when read. 3 Remote 2 TruTherm Mode Enabled (R2TME) When set to "1" indicates that the TruTherm Mode has been activated for Remote diode 2. After being enabled TruTherm Mode will take at most one conversion cycle to be fully active. This bit will be set even if the diode is desconnected. 2 Remote 1 TruTherm Mode Enabled (R1TME) When set to "1" indicates that the TruTherm Mode has been activated for Remote diode 1. After being enabled TruTherm Mode will take at most one conversion cycle to be fully active. This bit will be set even if the diode is disconnected. 1 Remote Diode 2 Missing (RD2M) When set to "1" Remote Diode 2 is missing. (See DIODE FAULT DETECTION for further details.) Temperature Reading is FFE0h which converts to 255.875 C if unsigned format is selected or 8000h which converts to -128.000 C if signed format is selected. Note, connecting a 3904 transistor to Remote 2 inputs with TruTherm mode active may also cause this bit to be set. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 15 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com Bits Name Description 0 Remote Diode 1 Missing (RD1M) When set to "1" Remote Diode 1 is missing. (See DIODE FAULT DETECTION for further details.) Temperature Reading is FFE0h which converts to 255.875 C if unsigned format is selected or 8000h which converts to -128.000 C if signed format is selected. Note, connecting a 3904 transistor to Remote 1 inputs with TruTherm mode active may also cause this bit to be set. CONFIGURATION REGISTER (Read Address 03h /Write Address 03h): D7 D6 D5 D4 D3 D2 D1 D0 0 RUN/STOP CR1 CR0 0 R2DF R1DF 0 Bits Name Description 7 Reserved Reports "0" when read. 6 RUN/STOP Logic 1 disables the conversion and puts the part in standby mode. Conversion can be activated by writing to one-shot register. 5-4 Conversion Rate (CR1:CR0) 00: continuous mode 76.5 ms, 13.1 Hz (typ), when TruTherm Mode is disabled (Diode Equation) for both remote channels; 77.8 ms, 12.9 Hz (typ), when TruTherm Mode is enabled (Transistor Equation) for one remote channel. 01: converts every 182 ms, 5.5 Hz (typ) 10: converts every 1 second, 1 Hz (typ) 11: converts every 2.7 seconds, 0.37 Hz (typ) 3 Reserved Reports "0" when read. 2 Remote 2 Data Format (R2DF) Logic 0: unsigned Temperature format (0 C to +255.875 C) Logic 1: signed Temperature format (-128 C to +127.75 C) 1 Remote 1 Data Format (R1DF) Logic 0: unsigned Temperature format (0 C to +255.875 C) Logic 1: signed Temperature format (-128 C to +127.75 C) 0 Reserved Reports "0" when read. Power up default is with all bits "0" (zero) REMOTE DIODE FILTER CONTROL REGISTER (Read/write Address 06h): D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 R2FE 0 R1FE Bits Name Description 7-3 Reserved Reports "0" when read. 2 Remote 2 Filter Enable (R2FE) 0: Filter Off 1: Noise Filter On 1 Reserved Reports "0" when read. 0 Remote 1Filter Enable (R1FE) 0: Filter Off 1: Noise Filter On Power up default is 05h. REMOTE DIODE MODEL TYPE SELECT REGISTER (Read/Write Address 30h): 16 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 R2MS 0 R1MS Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 Bits Name Description 7-3 Reserved Reports "0" when read. 2 Remote Diode 2 Model Select (R2MS) 0: 2N3904 model (make sure TruTherm mode is disabled) 1: Intel processor on 65nm or 90nm process model (make sure TruTherm mode is enabled) Power up default is 0. 1 Reserved Reports "0" when read. 0 Remote Diode 1 Model Select (R1MS) 0: 2N3904 model (make sure TruTherm mode is disabled) 1: Intel processor on 65nm or 90nm process model (make sure TruTherm mode is enabled) Power up default is 1. Power up default is 01h. REMOTE DIODE TruTherm MODE CONTROL (Read/Write Address 07h): D7 D6 D5 D4 D3 D2 D1 D0 Reserved R2M2 R2M1 R2M0 Reserved R1M2 R1M1 R1M0 Bits Description 7 Reserved Must be left at 0. 6-4 R2M2:R2M0 000: Remote 2 TruTherm Mode disabled; used when measuring MMBT3904 transistors 001: Remote 2 TruTherm Mode enabled; used when measuring Processors 111: Remote 2 TruTherm Mode enabled; used when measuring Processors Note, all other codes provide unspecified results and should not be used. 3 Reserved Must be left at 0. 2-0 R1M2:R1M0 000: Remote 1 TruTherm Mode disabled; used when measuring MMBT3904 transistors 001: Remote 1 TruTherm Mode enabled; used when measuring Processors 111: Remote 1 TruTherm Mode enabled; used when measuring Processors Note, all other codes provide unspecified results and should not be used. Power up default is 01h. LOCAL AND REMOTE MSB AND LSB TEMPERATURE REGISTERS Local Temperature MSB (Read Only Address 10h) 9-bit plus sign format: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value SIGN 64 32 16 8 4 2 1 Temperature Data: LSb = 1C. Local Temperature LSB (Read Only Address 20h) 9-bit plus sign format: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value 0.5 0.25 0 0 0 0 0 0 Temperature Data: LSb = 0.25C. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 17 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com Remote Temperature MSB (Read Only Address 11h, 12h) 10-bit plus sign format: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value SIGN 64 32 16 8 4 2 1 Temperature Data: LSb = 1C. Remote Temperature MSB (Read Only Address 11h, 12h) 11-bit plus sign format: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value 128 64 32 16 8 4 2 1 Temperature Data: LSb = 1C. Remote Temperature LSB (Read Only Address 21, 22h) 10-bit plus sign or 11-bit unsigned binary formats with filter off: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value 0.5 0.25 0.125 0 0 0 0 0 Temperature Data: LSb = 0.125C or 1/8C. Remote Temperature LSB 12-bit plus sign or 13-bit unsigned binary formats with filter on: BIT D7 D6 D5 D4 D3 D2 D1 D0 Value 0.5 0.25 0.125 0.0625 0.03125 0 0 0 Temperature Data: LSb = 0.03125C or 1/32C. For data synchronization purposes, the MSB register should be read first if the user wants to read both MSB and LSB registers. The LSB will be locked after the MSB is read. The LSB will be unlocked after being read. If the user reads MSBs consecutively, each time the MSB is read, the LSB associated with that temperature will be locked in and override the previous LSB value locked-in. MANUFACTURERS ID REGISTER (Read Address FEh) The default value is 01h. DIE REVISION CODE REGISTER (Read Address FFh) The default value is A4h. This register will increment by 1 every time there is a revision to the die by Texas Instruments. Applications Hints The LM95241 can be applied easily in the same way as other integrated-circuit temperature sensors, and its remote diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit board, and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively be that of the printed circuit board lands and traces soldered to the LM95241's pins. This presumes that the ambient air temperature is almost the same as the surface temperature of the printed circuit board; if the air temperature is much higher or lower than the surface temperature, the actual temperature of the LM95241 die will be at an intermediate temperature between the surface and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board temperature will contribute to the die temperature much more strongly than will the air temperature. 18 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 To measure temperature external to the LM95241's die, use a remote diode. This diode can be located on the die of a target IC, allowing measurement of the IC's temperature, independent of the LM95241's temperature. A discrete diode can also be used to sense the temperature of external objects or ambient air. Remember that a discrete diode's temperature will be affected, and often dominated, by the temperature of its leads. Most silicon diodes do not lend themselves well to this application. It is recommended that a 2N3904 transistor base emitter junction be used with the collector tied to the base. The LM95241's TruTherm technology allows accurate sensing of integrated thermal diodes, such as those found on sub-micron geometry processors. With TruTherm technology turned off, the LM95241 can measure a diode connected transistor such as the 2N3904 or MMBT3904. The LM95241 has been optimized to measure the remote thermal diode integrated in a Intel processor on 65nm or 90nm process or an MMBT3904 transistor. Using the Remote Diode Model Select register either pair of remote inputs can be assigned to measure either a Intel processor on 65nm or 90nm process or an MMBT3904 transistor. DIODE NON-IDEALITY Diode Non-Ideality Factor Effect on Accuracy When a transistor is connected as a diode, the following relationship holds for variables VBE, T and IF: IF = IS x e VBE K x Vt -1 where * * * * * * * * kT Vt = q q = 1.6x10-19 Coulombs (the electron charge) T = Absolute Temperature in Kelvin k = 1.38x10-23joules/K (Boltzmann's constant) is the non-ideality factor of the process the diode is manufactured on IS = Saturation Current and is process dependent If= Forward Current through the base emitter junction VBE = Base Emitter Voltage drop (1) In the active region, the -1 term is negligible and may be eliminated, yielding the following equation Vbe IF = IS e KVt (2) In Equation 2, and IS are dependant upon the process that was used in the fabrication of the particular diode. By forcing two currents with a very controlled ratio(IF2/IF1) and measuring the resulting voltage difference, it is possible to eliminate the IS term. Solving for the forward voltage difference yields the relationship: 'VBE = K x K qx T x ln IF2 IF1 (3) Solving Equation 3 for temperature yields: T= 'VBE x q IF2 K x k x ln IF1 (4) Equation 4 holds true when a diode connected transistor such as the MMBT3904 is used. When this "diode" equation is applied to an integrated diode such as a processor transistor with its collector tied to GND as shown in Figure 12 it will yield a wide non-ideality spread. This wide non-ideality spread is not due to true process variation but due to the fact that Equation 4 is an approximation. TruTherm technology uses the transistor equation, Equation 5, which is a more accurate representation of the topology of the thermal diode found in an FPGA or processor. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 19 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 T= www.ti.com 'VBE x q IC2 K x k x ln IC1 (5) 65nm/90nm PROCESSOR IE = IF 100 pF 1 2 3 IC IR 100 pF 4 D1+ D1D2+ D2- LM95241 IF Q1 MMBT3904 IR Figure 12. Thermal Diode Current Paths TruTherm should only be enabled when measuring the temperature of a transistor integrated as shown in the processor of Figure 12, because Equation 5 only applies to this topology. Calculating Total System Accuracy The voltage seen by the LM95241 also includes the IFRS voltage drop of the series resistance. The non-ideality factor, , is the only other parameter not accounted for and depends on the diode that is used for measurement. Since VBE is proportional to both and T, the variations in cannot be distinguished from variations in temperature. Since the non-ideality factor is not controlled by the temperature sensor, it will directly add to the inaccuracy of the sensor. For the Pentium D processor on 65nm process, Intel specifies a +4.06%/-0.89% variation in from part to part when the processor diode is measured by a circuit that assumes diode equation, Equation 4, as true. As an example, assume a temperature sensor has an accuracy specification of 1.25C at a temperature of 65 C (338 Kelvin) and the processor diode has a non-ideality variation of +4.06%/-0.89%. The resulting system accuracy of the processor temperature being sensed will be: TACC = + 1.25C + (+4.06% of 338 K) = +14.97 C (6) TACC = - 1.25C + (-0.89% of 338 K) = -4.26 C (7) and TrueTherm technology uses the transistor equation, Equation 5, resulting in a non-ideality spread that truly reflects the process variation which is very small. The transistor equation non-ideality spread is 0.4% for the Pentium D processor on 65nm process. The resulting accuracy when using TruTherm technology improves to: TACC = 1.25C + (0.4% of 338 K) = 2.60 C (8) The next error term to be discussed is that due to the series resistance of the thermal diode and printed circuit board traces. The thermal diode series resistance is specified on most processor data sheets. For the Pentium D processor on 65 nm process, this is specified at 4.52 typical. The LM95241 accommodates the typical series resistance of the Pentium D processor on 65nm process. The error that is not accounted for is the spread of the Pentium's series resistance, that is 2.79 to 6.24 or 1.73. The equation to calculate the temperature error due to series resistance (TER) for the LM95241 is simply: TER = RPCB x 0.62C/ : (9) Solving Equation 9 for RPCB equal to 1.73 results in the additional error due to the spread in the series resistance of 1.07C. The spread in error cannot be canceled out, as it would require measuring each individual thermal diode device. This is quite difficult and impractical in a large volume production environment. Equation 9 can also be used to calculate the additional error caused by series resistance on the printed circuit board. Since the variation of the PCB series resistance is minimal, the bulk of the error term is always positive and can simply be cancelled out by subtracting it from the output readings of the LM95241. Processor Family Intel processor on 65nm process 20 Transistor Equation nD, non-ideality min typ max 0.997 1.001 1.005 Submit Documentation Feedback Series R 4.52 Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 Diode Equation D, non-ideality Processor Family Pentium III CPUID 67h Series R min typ max 1 1.0065 1.0125 Pentium III CPUID 68h/PGA370Socket/ Celeron 1.0057 1.008 1.0125 Pentium 4, 423 pin 0.9933 1.0045 1.0368 Pentium 4, 478 pin 0.9933 1.0045 1.0368 Pentium 4 on 0.13 micron process, 2-3.06GHz 1.0011 1.0021 1.0030 3.64 Pentium 4 on 90 nm process 1.0083 1.011 1.023 3.33 Pentium on 65 nm porcess Pentium M Processor (Centrino) 1.000 1.009 1.050 4.52 1.00151 1.00220 1.00289 3.06 MMBT3904 1.003 AMD Athlon MP model 6 1.002 1.008 1.016 AMD Athlon 64 1.008 1.008 1.096 AMD Opteron 1.008 1.008 1.096 AMD Sempron 1.00261 0.93 Compensating for Different Non-Ideality In order to compensate for the errors introduced by non-ideality, the temperature sensor is calibrated for a particular processor. Texas Instruments temperature sensors are always calibrated to the typical non-ideality and series resistance of a given processor type. The LM95241 is calibrated for two non-ideality factors and series resistance values thus supporting the MMBT3904 transistor and the Intel processor on 65nm or 90nm process without the requirement for additional trims. For most accurate measurements TruTherm mode should be turned on when measuring the Intel processor on the 65nm or 90nm process to minimize the error introduced by the false non-ideality spread (see Diode Non-Ideality Factor Effect on Accuracy). When a temperature sensor calibrated for a particular processor type is used with a different processor type, additional errors are introduced. Temperature errors associated with non-ideality of different processor types may be reduced in a specific temperature range of concern through use of software calibration. Typical Non-ideality specification differences cause a gain variation of the transfer function, therefore the center of the temperature range of interest should be the target temperature for calibration purposes. The following equation can be used to calculate the temperature correction factor (TCF) required to compensate for a target non-ideality differing from that supported by the LM95241. TCF = [(S-Processor) / S] x (TCR+ 273 K) where * * * S = LM95241 non-ideality for accuracy specification T = target thermal diode typical non-ideality TCR = center of the temperature range of interest in C (10) The correction factor of Equation 10 should be directly added to the temperature reading produced by the LM95233. For example when using the LM95241, with the 3904 mode selected, to measure a AMD Athlon processor, with a typical non-ideality of 1.008, for a temperature range of 60 C to 100 C the correction factor would calculate to: TCF=[(1.003-1.008)/1.003]x(80+273) =-1.75C (11) Therefore, 1.75C should be subtracted from the temperature readings of the LM95241 to compensate for the differing typical non-ideality target. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 21 LM95241 SNIS143E - AUGUST 2006 - REVISED MARCH 2013 www.ti.com PCB LAYOUT FOR MINIMIZING NOISE Figure 13. Ideal Diode Trace Layout In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced on traces running between the remote temperature diode sensor and the LM95241 can cause temperature conversion errors. Keep in mind that the signal level the LM95241 is trying to measure is in microvolts. The following guidelines should be followed: 1. VDD should be bypassed with a 0.1F capacitor in parallel with 100pF. The 100pF capacitor should be placed as close as possible to the power supply pin. A bulk capacitance of approximately 10F needs to be in the near vicinity of the LM95241. 2. A 100pF diode bypass capacitor is recommended to filter high frequency noise but may not be necessary. Make sure the traces to the 100pF capacitor are matched. Place the filter capacitors close to the LM95241 pins. 3. Ideally, the LM95241 should be placed within 10cm of the Processor diode pins with the traces being as straight, short and identical as possible. Trace resistance of 1 can cause as much as 1C of error. This error can be compensated by using simple software offset compensation. 4. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This GND guard should not be between the D+ and D- lines. In the event that noise does couple to the diode lines it would be ideal if it is coupled common mode. That is equally to the D+ and D- lines. 5. Avoid routing diode traces in close proximity to power supply switching or filtering inductors. 6. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be kept at least 2cm apart from the high speed digital traces. 7. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should cross at a 90 degree angle. 8. The ideal place to connect the LM95241's GND pin is as close as possible to the Processor's GND that is associated with the sense diode. 9. Leakage current between D+ and GND and between D+ and D- should be kept to a minimum. Thirteen nano-amperes of leakage can cause as much as 0.2C of error in the diode temperature reading. Keeping the printed circuit board as clean as possible will minimize leakage current. Noise coupling into the digital lines greater than 400mVp-p (typical hysteresis) and undershoot less than 500mV below GND, may prevent successful SMBus communication with the LM95241. SMBus no acknowledge is the most common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of communication is rather low (100kHz max), care still needs to be taken to ensure proper termination within a system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3db corner frequency of about 40MHz is included on the LM95241's SMBCLK input. Additional resistance can be added in series with the SMBDAT and SMBCLK lines to further help filter noise and ringing. Minimize noise coupling by keeping digital traces out of switching power supply areas as well as ensuring that digital lines containing high speed data communications cross at right angles to the SMBDAT and SMBCLK lines. 22 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 LM95241 www.ti.com SNIS143E - AUGUST 2006 - REVISED MARCH 2013 REVISION HISTORY Changes from Revision D (March 2013) to Revision E * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 22 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LM95241 23 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM95241CIMM-1/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T29C LM95241CIMM-2/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T30C LM95241CIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T28C LM95241CIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 85 T28C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM95241CIMM-1/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95241CIMM-2/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95241CIMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM95241CIMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM95241CIMM-1/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95241CIMM-2/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95241CIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM95241CIMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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