September 1983
Revised February 1999
MM74HC540 • MM74HC541 Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer
© 1999 Fairchild Semicond uctor Corpor ation DS005341.prf www.f airchildsemi.com
MM74HC540 • MM74HC541
Inverting Octa l 3-STATE Buffer • Octal 3-STATE Buffer
General Descript ion
The MM74HC540 and MM74HC541 3-STATE buffers uti-
lize advanced silicon-gate CMOS technology. They pos-
sess high drive current outputs which enable high speed
operation even when driving large bus capacitances.
These circuits achieve speeds comparable to low power
Schottky devices, while retaining the advantage of CMOS
cir c ui try, i.e., high no i se i m m un i ty, and lo w power co nsu mp -
tion. Both devices have a fanout of 15 LS-TTL equivalent
inputs.
The MM74HC540 is an inverting buffer and the
MM74HC541 is a non-inverting buffer. The 3-STATE con-
trol gate ope r a t es a s a t w o- i n put N OR s u c h th at i f e i t he r G1
or G2 are HIGH, all eight outputs are in the high-imped-
ance state.
In order to enhance PC board layout, the MM74HC540 and
MM74HC 541 offers a pinout having in puts and outpu ts on
opposite sides of the package. All inputs are protected from
damage due to static discharge by diodes to VCC and
ground.
Features
■Typical propagation delay: 12 ns
■3-STATE outputs for connection to system buses
■Wide power supply range: 2–6V
■Low quiescent current: 80 µA maximum (74HC Series)
■Output current: 6 mA
Ordering Code:
Devices also available in Tape and Reel. Specify by appen ding the suffix lett er “X” to the orde ring code.
Connection Diagrams
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View
MM74HC540 Top View
MM74HC541
Order Number Package Number Package Description
MM74HC540WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
MM74HC540SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC540MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC540N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
MM74HC541WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
MM74HC541SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC541MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC541N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide