SCBS689H - MAY 1997 - REVISED OCTOBER 2003 D Support Mixed-Mode Signal Operation D D D D OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q LE SN54LVTH373 . . . FK PACKAGE (TOP VIEW) description/ordering information 2D 2Q 3Q 3D 4D These octal latches are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. 4 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND LE 5Q 5D While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs. 3 8Q D (5-V Input and Output Voltages With 3.3-V VCC) Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Support Unregulated Battery Operation Down to 2.7 V Ioff and Power-Up 3-State Support Hot Insertion Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) 1D 1Q OE VCC D SN54LVTH373 . . . J OR W PACKAGE SN74LVTH373 . . . DB, DW, NS, OR PW PACKAGE (TOP VIEW) A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. ORDERING INFORMATION PACKAGE ORDERABLE PART NUMBER Tube SN74LVTH373DW Tape and reel SN74LVTH373DWR SOP - NS Tape and reel SN74LVTH373NSR LVTH373 SSOP - DB Tape and reel SN74LVTH373DBR LXH373 Tube SN74LVTH373PW Tape and reel SN74LVTH373PWR CDIP - J Tube SNJ54LVTH373J SNJ54LVTH373J CFP - W Tube SNJ54LVTH373W SNJ54LVTH373W LCCC - FK Tube SNJ54LVTH373FK TA SOIC - DW -40C to 85C TSSOP - PW -55C -55 C to 125 125C C TOP-SIDE MARKING LVTH373 LXH373 SNJ54LVTH373FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated &0$'"& &# !+" '# 0 1%&!'"& '"+ !"# !0$ " #+!&0&!'"&# + ",+ "+$# 0 +2'# #"$+"# #"'' -''"/ !"& !+##&. +# " +!+##'&%/ &!%+ "+#"&. 0 '%% ''$+"+# !"# !$%&'" " ( ) * '%% ''$+"+# '+ "+#"+ %+## ",+-&#+ "+ '%% ",+ !"# !"& !+##&. +# " +!+##'&%/ &!%+ "+#"&. 0 '%% ''$+"+# POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCBS689H - MAY 1997 - REVISED OCTOBER 2003 description/ordering information (continued) OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z logic diagram (positive logic) OE LE 1 11 C1 1D 3 2 1D To Seven Other Channels 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1Q SCBS689H - MAY 1997 - REVISED OCTOBER 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . -0.5 V to VCC + 0.5 V Current into any output in the low state, IO: SN54LVTH373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74LVTH373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Current into any output in the high state, IO (see Note 2): SN54LVTH373 . . . . . . . . . . . . . . . . . . . . . . . 48 mA SN74LVTH373 . . . . . . . . . . . . . . . . . . . . . . . 64 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Package thermal impedance, JA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This current flows only when the output is in the high state and VO > VCC. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4) SN54LVTH373 SN74LVTH373 MIN MAX MIN MAX 2.7 3.6 2.7 3.6 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 5.5 5.5 V IOH IOL High-level output current -24 -32 mA Low-level output current 48 64 mA t/v Input transition rise or fall rate t/VCC TA Power-up ramp rate 200 Operating free-air temperature -55 High-level input voltage 2 2 0.8 Outputs enabled V 0.8 10 10 -40 V ns/V s/V 200 125 V 85 C NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCBS689H - MAY 1997 - REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 2.7 V, VCC = 2.7 V to 3.6 V, II = -18 mA IOH = -100 A VCC = 2.7 V, IOH = -8 mA IOH = -24 mA VCC = 3 V VCC = 2.7 V VOL VCC = 3 V II Control inputs Data inputs Ioff II(hold) SN74LVTH373 TYP MAX MIN -1.2 VCC-0.2 2.4 -1.2 2 0.2 0.2 IOL = 24 mA IOL = 16 mA 0.5 0.5 0.4 0.4 IOL = 32 mA IOL = 48 mA 0.5 0.5 10 10 VCC = 3.6 V, VI = VCC or GND 1 1 1 1 VCC = 3.6 V VI = VCC VI = 0 -5 -5 VI = 2 V V 0.55 VCC = 0 or 3.6 V, VCC = 3 V V V 2 IOH = -32 mA IOL = 100 A VI or VO = 0 to 4.5 V VI = 0.8 V UNIT VCC-0.2 2.4 IOL = 64 mA VI = 5.5 V VCC = 0, Data inputs SN54LVTH373 TYP MAX MIN 0.55 100 75 75 -75 -75 500 -750 A A A VCC = 3.6 V, VI = 0 to 3.6 V IOZH IOZL VCC = 3.6 V, VCC = 3.6 V, VO = 3 V VO = 0.5 V 5 5 A -5 -5 A IOZPU VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don't care 100 100 A IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don't care 100 100 A VCC = 3.6 V, IO = 0, VI = VCC or GND 0.19 0.19 ICC Outputs high Outputs low Outputs disabled ICC VCC = 3 V to 3.6 V, One input at VCC - 0.6 V, Other inputs at VCC or GND Ci VI = 3 V or 0 VO = 3 V or 0 Co 5 5 0.19 0.19 0.2 0.2 3 3 7 7 mA mA pF pF On products compliant to MIL-PRF-38535, this parameter is not production tested. All typical values are at VCC = 3.3 V, TA = 25C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCBS689H - MAY 1997 - REVISED OCTOBER 2003 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVTH373 VCC = 3.3 V 0.3 V MIN MAX SN74LVTH373 VCC = 3.3 V 0.3 V VCC = 2.7 V MIN MAX MIN MAX VCC = 2.7 V MIN UNIT MAX tw tsu Pulse duration, LE high 3 3 3 3 ns Setup time, data before LE 1.1 0.4 1.1 0.4 ns th Hold time, data after LE 1.7 2 1.4 1.4 ns switching characteristics over recommended free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54LVTH373 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D Q tPLH tPHL LE Q tPZH tPZL OE Q tPHZ tPLZ OE Q VCC = 3.3 V 0.3 V SN74LVTH373 VCC = 2.7 V VCC = 3.3 V 0.3 V VCC = 2.7 V MAX MIN TYP MAX 4.1 4.7 1.5 2.6 3.9 4.5 4.1 4.7 1.5 2.6 3.9 4.5 1.6 4.4 5.1 1.7 2.7 4.2 4.9 1.6 4.4 5.1 1.7 2.7 4.2 4.9 1.2 5 6.1 1.3 3 4.8 5.9 1.2 5 5.7 1.3 3 4.8 5.5 1.6 5.5 5.7 1.9 3 4.6 4.9 0.8 4.8 4.9 1.9 3 4.5 4.6 MIN MAX 1.4 1.4 MIN MIN UNIT MAX ns ns ns ns All typical values are at VCC = 3.3 V, TA = 25C. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 SCBS689H - MAY 1997 - REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 500 From Output Under Test 6V Open S1 GND CL = 50 pF (see Note A) 500 TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND 2.7 V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 2.7 V Input 1.5 V 1.5 V th 2.7 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V 1.5 V Input 1.5 V 0V tPHL tPLH VOH 1.5 V Output 1.5 V VOL 1.5 V 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPLZ 3V 1.5 V tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPLH tPHL 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-9950901Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-9950901QRA ACTIVE CDIP J 20 1 TBD Call TI Call TI 1 TBD Call TI Call TI TBD Call TI Call TI 5962-9950901QSA ACTIVE CFP W 20 SN74LVTH373DBLE OBSOLETE SSOP DB 20 SN74LVTH373DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty 70 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) SN74LVTH373PWG4 ACTIVE TSSOP PW 20 SN74LVTH373PWLE OBSOLETE TSSOP PW 20 SN74LVTH373PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH373PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54LVTH373FK ACTIVE LCCC FK 20 1 TBD SNJ54LVTH373J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54LVTH373W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type TBD (3) CU NIPDAU Level-1-260C-UNLIM Call TI Call TI POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 OTHER QUALIFIED VERSIONS OF SN54LVTH373, SN74LVTH373 : * Catalog: SN74LVTH373 * Enhanced Product: SN74LVTH373-EP, SN74LVTH373-EP * Military: SN54LVTH373 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVTH373DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74LVTH373DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LVTH373NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LVTH373PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVTH373DBR SN74LVTH373DWR SSOP DB 20 2000 367.0 367.0 38.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74LVTH373NSR SO NS 20 2000 367.0 367.0 45.0 SN74LVTH373PWR TSSOP PW 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated