IP4234CZ6,125 - NEXPERIA

IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Rev. 3.0 — 31 January 2018 Product data sheet

1 Product profile

1.1 General description

The IP4234CZ6 is designed to protect Input/Output (I/O) USB 2.0 ports, that are sensitive

to capacitive loads, from being damaged by ElectroStatic Discharge (ESD). The π-

filter structure is implemented with a small series resistor to provide the necessary

protection to signal and supply components from ESD voltages greater than ±8 kV

contact discharge according IEC 61000-4-2, level 4.

The ESD protection is independent of the supply voltage due to the rail-to-rail diode

architecture being connected to a Zener diode.

The IP4234CZ6 is fabricated using monolithic silicon technology and integrates two ultra-

low capacitance π-filter ESD protection diodes plus a Zener diode in a miniature 6-lead

SOT457 package.

1.2 Features

•Pb-free and RoHS compliant

•Simple, direct signal routing provides for high speed signal integrity

•ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge

•Four low input capacitance (3.1 pF typical) rail-to-rail ESD protection diodest

•Low voltage clamping due to an integrated Zener diode

•Small 6-lead SO6 (SOT457) package

•IEC 61000-4-5 15 A Lightning (8/20 μs) compliant

1.3 Applications

•General-purpose downstream ESD protection high frequency analog signals and high-

speed serial data transmission for ports inside:

–Cellular and PCS mobile handsets

–PC/Notebook USB2.0/IEEE1394 ports

–DVI interfaces

–HDMI interfaces

–Cordless telephones

–Wireless data (WAN/LAN) systems

–PDAs

Nexperia IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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2 Pinning information

Table 1. Pinning

Pin Description Simplified outline Graphic symbol

1 ESD protection I/O channel 1

2 ground

3 ESD protection I/O channel 1

4 ESD protection I/O channel 2

5 supply voltage

6 ESD protection I/O channel 2

1 32

456

R R

2001aaj950

1 4

3 Ordering information

Table 2. Ordering options

PackageType number

Name Description Version

IP4234CZ6 TSOP6 plastic surface-mounted

package (TSOP6); 6 leads

SOT457

4 Limiting values

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VIinput voltage GND - 0.5 +5.5 V

Vesd electrostatic

discharge voltage

all pins; IEC 61000-4-2 level 4;

contact discharge

-15 +15 kV

PPP peak pulse power tp = 8/20 μs; IEC 61000-4-5 15 A

lightning

- 100 W

Tstg storage

temperature

-55 +125 °C

5 Recommended operating conditions

Table 4. Operating conditions

Symbol Parameter Conditions Min Max Unit

Tamb ambient temperature -40 +85 °C

Nexperia IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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6 Characteristics

Table 5. Characteristics

Tamb = 25 °C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

C(I/O-GND) input/output to ground

capacitance

pins 1, 3, 4, 6; VI = 0 V;

f = 1 MHz; VCC = 3.0 V

[1] - 3.1 3.8 pF

C(zd-GND) Zener diode to ground

capacitance

pin 5 to pin 2; VI = 0 V;

f = 1 MHz; VCC = 3.0 V

[1] - 40 - pF

ILR reverse leakage

current

pins 1, 3, 4, 6 to ground;

VI = 3.0 V

- - 100 nA

VBRzd Zener diode

breakdown voltage

pin 5 to pin 2; I = 1 mA 6 - 9 V

VFforward voltage [1] - 0.7 - V

Rsseries resistance Tcase = 25 °C [1] - 0.5 - Ω

[1] Guaranteed by design.

7 Application information

7.1 Universal serial bus 2.0 protection

The IP4234CZ6 is optimized to protect a USB 2.0 port from ESD. The device is capable

of protecting both USB data lines and the VBUS supply. A typical application is shown

below.

654

123

001aaj951

VBUS

D-

D+

GND

USB 2.0/

IEEE1394

TRANSCEIVER

Figure 1. Typical application of IP4234CZ6

To avoid a short circuit on the data lines when VBUS is shut down, a back drive protection

diode can be attached to the IP4234CZ6.

Nexperia IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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8 Package outline

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT457 SC-74

w BM

pin 1

index A

detail X

vMA

scale

1 32

456

0 1 2 mm

Plastic surface-mounted package (TSOP6); 6 leads SOT457

UNIT A1bpc D EHELpQ ywv

mm 0.1

0.013

0.40

0.25

3.1

2.7

0.26

0.10

1.7

1.3

0.95 3.0

2.5 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2

0.33

0.23

1.1

0.9

05-11-07

06-03-16

Figure 2. Package outline SOT457 (TSOP6)

Nexperia IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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9 Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

9.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached

to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides

both the mechanical and the electrical connection. There is no single soldering method

that is ideal for all IC packages. Wave soldering is often preferred when through-hole

and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is

not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

9.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming

from a standing wave of liquid solder. The wave soldering process is suitable for the

following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus SnPb soldering

9.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Nexperia IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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9.4 Reflow soldering

Key characteristics in reflow soldering are:

•Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 3) than a SnPb process, thus reducing

the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board

is heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder

paste characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with Table 6

and 7

Table 6. SnPb eutectic process (from J-STD-020C)

Package reflow temperature (°C)

Volume (mm3)

Package thickness (mm)

< 350 ≥350

< 2.5 235 220

≥ 2.5 220 220

Table 7. Lead-free process (from J-STD-020C)

Package reflow temperature (°C)

Volume (mm3)

Package thickness (mm)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 3.

Nexperia IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

MSL: Moisture Sensitivity Level

Figure 3. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

10 Abbreviations

Table 8. Abbreviations

Acronym Description

DVI Digital Video Interface

ESD ElectroStatic Discharge

HDMI High Definition Multimedia interface

LAN Local Area Network

PCS Personal Computing System

PDA Personal Digital Assistant

RoHS Restriction of Hazardous Substances

USB Universal Serial Bus

WAN Wide Area Network

11 Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

IP4234CZ6 v.3 20180131 Product data sheet - IP4234CZ6 v.2

•Data sheet changed to Product status

IP4234CZ6 v.2 20180109 Preliminary data sheet - IP4234CZ6_1

IP4234CZ6_1 20090416 Product data sheet - -

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Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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12 Legal information

12.1 Data sheet status

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product

development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nexperia.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. Nexperia does not give any representations or

warranties as to the accuracy or completeness of information included herein

and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local Nexperia

sales office. In case of any inconsistency or conflict with the short data sheet,

the full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

Nexperia and its customer, unless Nexperia and customer have explicitly

agreed otherwise in writing. In no event however, shall an agreement be

valid in which the Nexperia product is deemed to offer functions and qualities

beyond those described in the Product data sheet.

12.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, Nexperia does not give any

representations or warranties, expressed or implied, as to the accuracy

or completeness of such information and shall have no liability for the

consequences of use of such information. Nexperia takes no responsibility

for the content in this document if provided by an information source outside

of Nexperia. In no event shall Nexperia be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -

lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory. Notwithstanding any damages that

customer might incur for any reason whatsoever, Nexperia's aggregate and

cumulative liability towards customer for the products described herein shall

be limited in accordance with the Terms and conditions of commercial sale of

Nexperia.

Right to make changes — Nexperia reserves the right to make changes

to information published in this document, including without limitation

specifications and product descriptions, at any time and without notice. This

document supersedes and replaces all information supplied prior to the

publication hereof.

Suitability for use — Nexperia products are not designed, authorized or

warranted to be suitable for use in life support, life-critical or safety-critical

systems or equipment, nor in applications where failure or malfunction

of an Nexperia product can reasonably be expected to result in personal

injury, death or severe property or environmental damage. Nexperia and its

suppliers accept no liability for inclusion and/or use of Nexperia products in

such equipment or applications and therefore such inclusion and/or use is at

the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Nexperia makes no representation

or warranty that such applications will be suitable for the specified use

without further testing or modification. Customers are responsible for the

design and operation of their applications and products using Nexperia

products, and Nexperia accepts no liability for any assistance with

applications or customer product design. It is customer’s sole responsibility

to determine whether the Nexperia product is suitable and fit for the

customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should

provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products. Nexperia does not accept

any liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using Nexperia products in order to avoid a default of the

applications and the products or of the application or use by customer’s third

party customer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — Nexperia products are

sold subject to the general terms and conditions of commercial sale, as

published at http://www.nexperia.com/profile/terms, unless otherwise agreed

in a valid written individual agreement. In case an individual agreement is

concluded only the terms and conditions of the respective agreement shall

apply. Nexperia hereby expressly objects to applying the customer’s general

terms and conditions with regard to the purchase of Nexperia products by

customer.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

the grant, conveyance or implication of any license under any copyrights,

patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

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Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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Non-automotive qualified products — Unless this data sheet expressly

states that this specific Nexperia product is automotive qualified, the

product is not suitable for automotive use. It is neither qualified nor tested in

accordance with automotive testing or application requirements. Nexperia

accepts no liability for inclusion and/or use of non-automotive qualified

products in automotive equipment or applications. In the event that customer

uses the product for design-in and use in automotive applications to

automotive specifications and standards, customer (a) shall use the product

without Nexperia's warranty of the product for such automotive applications,

use and specifications, and (b) whenever customer uses the product for

automotive applications beyond Nexperia's specifications such use shall be

solely at customer’s own risk, and (c) customer fully indemnifies Nexperia

for any liability, damages or failed product claims resulting from customer

design and use of the product for automotive applications beyond Nexperia's

standard warranty and Nexperia's product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Nexperia IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Product data sheet Rev. 3.0 — 31 January 2018

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Tables

Tab. 1. Pinning ...............................................................2

Tab. 2. Ordering options ................................................2

Tab. 3. Limiting values .................................................. 2

Tab. 4. Operating conditions ......................................... 2

Tab. 5. Characteristics ...................................................3

Tab. 6. SnPb eutectic process (from J-STD-020C) ....... 6

Tab. 7. Lead-free process (from J-STD-020C) .............. 6

Tab. 8. Abbreviations .....................................................7

Tab. 9. Revision history .................................................7

Figures

Fig. 1. Typical application of IP4234CZ6 ......................3

Fig. 2. Package outline SOT457 (TSOP6) ................... 4

Fig. 3. Temperature profiles for large and small

components ....................................................... 7

Nexperia IP4234CZ6

Single USB 2.0 ESD protection to IEC 61000-4-2 level 4

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release: 31 January 2018

Document identifier: IP4234CZ6

Contents

1 Product profile .................................................... 1

1.1 General description ............................................1

1.2 Features .............................................................1

1.3 Applications ........................................................1

2 Pinning information ............................................ 2

3 Ordering information .......................................... 2

4 Limiting values ....................................................2

5 Recommended operating conditions ................ 2

6 Characteristics .................................................... 3

7 Application information ......................................3

7.1 Universal serial bus 2.0 protection .................... 3

8 Package outline ...................................................4

9 Soldering of SMD packages ...............................5

9.1 Introduction to soldering .................................... 5

9.2 Wave and reflow soldering ................................ 5

9.3 Wave soldering ..................................................5

9.4 Reflow soldering ................................................ 6

10 Abbreviations ...................................................... 7

11 Revision history .................................................. 7

12 Legal information ................................................ 8