MMBZ5226BW-7 - Diodes

MMBZ5221BW - MMBZ5259BW

Document number: DS31037 Rev. 13 - 2 1 of 5

www.diodes.com April 2009

MMBZ5221BW - MMBZ5259BW

200mW SURFACE MOUNT ZENER DIODE

Features

• Planar Die Construction

• Ultra-Small Surface Mount Package

• General Purpose

• Ideally Suited for Automated Assembly Processes

• Lead Free/RoHS Compliant (Note 2)

• Qualified to AEC-Q101 Standards for High Reliability

• "Green" Device (Notes 3 and 4)

Mechanical Data

• Case: SOT-323

• Case Material: Molded Plastic, "Green" Molding Compound

(Note 4). UL Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020D

• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

• Polarity: See Diagram

• Marking Information: See Page 3

• Ordering Information: See Page 3

• Weight: 0.006 grams (approximate)

Maximum Ratings @TA = 25°C unless otherwise specified

Characteristic Symbol Value Unit

Forward Voltage @ IF = 10mA VF 0.9 V

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation (Note 1) PD 200 mW

Thermal Resistance, Junction to Ambient Air (Note 1) R

JA 625 °C/W

Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C

Notes: 1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with date code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date

code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

Top View Device Schematic

MMBZ5221BW - MMBZ5259BW

Document number: DS31037 Rev. 13 - 2 2 of 5

www.diodes.com April 2009

MMBZ5221BW - MMBZ5259BW

Electrical Characteristics @TA = 25°C unless otherwise specified

Type

Number Marking

Code

Zener Voltage Range (Note 5) Test Current Maximum Zener Impedance

(Note 6) Maximum Reverse

Leakage Current (Note 5)

VZ @ IZT IZT Z

ZT @ IZT ZZK @ IZK

= 0.25mA IR @ VR

Nom (V) Min (V) Max (V) mA Ω μA V

MMBZ5221BW KC1 2.4 2.28 2.52 20 30 1200 100 1.0

MMBZ5223BW KC3 2.7 2.57 2.84 20 30 1300 75 1.0

MMBZ5225BW KC5 3.0 2.85 3.15 20 30 1600 50 1.0

MMBZ5226BW KG1 3.3 3.14 3.47 20 28 1600 25 1.0

MMBZ5227BW KG2 3.6 3.42 3.78 20 24 1700 15 1.0

MMBZ5228BW KG3 3.9 3.71 4.10 20 23 1900 10 1.0

MMBZ5229BW KG4 4.3 4.09 4.52 20 22 2000 5.0 1.0

MMBZ5230BW KG5 4.7 4.47 4.94 20 19 1900 5.0 2.0

MMBZ5231BW KE1 5.1 4.85 5.36 20 17 1600 5.0 2.0

MMBZ5232BW KE2 5.6 5.32 5.88 20 11 1600 5.0 3.0

MMBZ5233BW KE3 6 5.70 6.30 20 7.0 1600 5.0 3.5

MMBZ5234BW KE4 6.2 5.89 6.51 20 7.0 1000 5.0 4.0

MMBZ5235BW KE5 6.8 6.46 7.14 20 5.0 750 3.0 5.0

MMBZ5236BW KF1 7.5 7.13 7.88 20 6.0 500 3.0 6.0

MMBZ5237BW KF2 8.2 7.79 8.61 20 8.0 500 3.0 6.5

MMBZ5239BW KF4 9.1 8.65 9.56 20 10 600 3.0 7.0

MMBZ5240BW KF5 10 9.50 10.50 20 17 600 3.0 8.0

MMBZ5241BW KH1 11 10.45 11.55 20 22 600 2.0 8.4

MMBZ5242BW KH2 12 11.40 12.60 20 30 600 1.0 9.1

MMBZ5243BW KH3 13 12.35 13.65 9.5 13 600 0.5 9.9

MMBZ5245BW KH5 15 14.25 15.75 8.5 16 600 0.1 11

MMBZ5246BW KJ1 16 15.20 16.80 7.8 17 600 0.1 12

MMBZ5248BW KJ3 18 17.10 18.90 7.0 21 600 0.1 14

MMBZ5250BW KJ5 20 19.00 21.00 6.2 25 600 0.1 15

MMBZ5251BW KK1 22 20.90 23.10 5.6 29 600 0.1 17

MMBZ5252BW KK2 24 22.80 25.20 5.2 33 600 0.1 18

MMBZ5254BW KK4 27 25.65 28.35 5.0 41 600 0.1 21

MMBZ5255BW KK5 28 26.60 29.40 4.5 44 600 0.1 21

MMBZ5256BW KM1 30 28.50 31.50 4.2 49 600 0.1 23

MMBZ5257BW KM2 33 31.35 34.65 3.8 58 700 0.1 25

MMBZ5258BW KM3 36 34.20 37.80 3.4 70 700 0.1 27

MMBZ5259BW KM4 39 37.05 40.95 3.2 80 800 0.1 30

Notes: 5. Short duration pulse test used to minimize self-heating effect.

6. f = 1KHz.

0.1

0.2

0.3

0.4

2505075

100 125 150

DISSI

N (W)

T , AMBIENT TEMPERA TURE ( C)

Fig. 1 Power Derating Curve

012345678910

I, ZENE

(mA)

V , Z ENER VOL TAGE (V)

Fig . 2 Typical Zener Brea kdown Charact er i stics

MMBZ5221BW - MMBZ5259BW

Document number: DS31037 Rev. 13 - 2 3 of 5

www.diodes.com April 2009

MMBZ5221BW - MMBZ5259BW

I, ZENE

(mA)

V , ZENER VOLT AGE (V)

Fig. 3 Typical Zener Breakdown Characteristics

10 20 30 40

T = 25°C

Test current I

Nominal Zener Voltage

33 36

C , TOTAL CAPACITANCE (pF)

100

1,000

10 1001V , NOMINAL ZENER VOLTAGE (V)

Fig. 4 Typical Total Capacitance vs. Nominal Zener V oltage

T= 25 °C

f = 1MHz

V = 1V

V = 2V

100

1,000

110100

V , ZENER VOLTAGE (V)

Fig. 5 Typical Zener Impedence Characteristics

Z , ZENER IMPEDANCE ( )

100

110 100

EAK S

(W)

PULSE WIDT H (ms)

Fig. 6 Maximum Non-repetit iv e Surge Power

1,000

Ordering Information (Notes 4 & 7)

Device Packaging Shipping

(Type Number)-7-F* SOT-323 3000/Tape & Reel

* Add “-7-F” to the appropriate type number in Electrical Characteristics Table from Page 2. Example: 6.2V Zener = MMBZ5234BW-7-F.

Notes: 7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.

Marking Information

Date Code Key

Year 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

Code J K L M N P R S T U V W X Y Z

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

xxx = Product Type Marking Code

(See Electrical Characteristics Table)

YM = Date Code Marking

Y = Year (ex: N = 2002)

M = Month (ex: 9 = September)

xxx

MMBZ5221BW - MMBZ5259BW

Document number: DS31037 Rev. 13 - 2 4 of 5

www.diodes.com April 2009

MMBZ5221BW - MMBZ5259BW

Package Outline Dimensions

Suggested Pad Layout

SOT-323

Dim Min Max Typ

A 0.25 0.40 0.30

B 1.15 1.35 1.30

C 2.00 2.20 2.10

D - - 0.65

G 1.20 1.40 1.30

H 1.80 2.20 2.15

J 0.0 0.10 0.05

K 0.90 1.00 1.00

L 0.25 0.40 0.30

M 0.10 0.18 0.11

α 0° 8° -

All Dimensions in mm

Dimensions Value (in mm)

Z 2.8

X 0.7

Y 0.9

C 1.9

E 1.0

MMBZ5221BW - MMBZ5259BW

Document number: DS31037 Rev. 13 - 2 5 of 5

www.diodes.com April 2009

MMBZ5221BW - MMBZ5259BW

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated p roducts for any unintended or una uthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign p atents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.