NE5534, NE5534A, SA5534. SA5534A
LOW-NOISE OPERATIONAL AMPLIFIERS
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DEquivalent Input Noise Voltage . . .
3.5 nV//Hz Typ
DUnity-Gain Bandwidth . . . 10 MHz Typ
DCommon-Mode Rejection Ratio . . .
100 dB Typ
DHigh DC Voltage Gain . . . 100 V/mV Typ
DPeak-to-Peak Output Voltage Swing
32 V Typ With VCC+ = +18 V and RL = 600 W
DHigh Slew Rate . . . 13 V/ms Typ
DWide Supply-Voltage Range +3 V to +20 V
DLow Harmonic Distortion
DOffset Nulling Capability
DExternal Compensation Capability
description/ordering information
The NE5534, NE5534A, SA5534, and SA5534A are high-performance operational amplifiers combining
excellent dc and ac characteristics. Some of the features include very low noise, high output-drive capability,
high unity-gain and maximum-output-swing bandwidths, low distortion, and high slew rate.
These operational amplifiers are compensated internally for a gain equal to or greater than three. Optimization
of the frequency response for various applications can be obtained by use of an external compensation
capacitor between COMP and COMP/BAL. The devices feature input-protection diodes, output short-circuit
protection, and offset-voltage nulling capability with use of the BALANCE and COMP/BAL pins (see the
application circuit diagram).
For the NE5534A and SA5534A, a maximum limit is specified for the equivalent input noise voltage.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2004, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
BALANCE
IN−
IN+
VCC−
COMP/BAL
VCC+
OUT
COMP
NE5534, SA5534 ...D (SOIC), P (PDIP),
OR PS (SOP) PACKAGE
NE5534A, SA5534A ...D (SOIC) OR P (PDIP) PACKAGE
(TOP VIEW)
NE5534, NE5534A, SA5534. SA5534A
LOW-NOISE OPERATIONAL AMPLIFIERS
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
ORDERING INFORMATION
TA
VIOmax
AT 25°CPACKAGE†ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (P)
Tube of 50 NE5534P NE5534P
PDIP (P) Tube of 50 NE5534AP NE5534AP
Tube of 75 NE5534D
NE5534
0°C to 70°C4 mV
SOIC (D)
Reel of 2500 NE5534DR NE5534
SOIC (D) Tube of 75 NE5534AD
5534A
Reel of 2500 NE5534ADR 5534A
SOP (PS) Reel of 2000 NE5534PSR N5534
PDIP (P)
Tube of 50 SA5534P SA5534P
PDIP (P) Tube of 50 SA5534AP SA5534AP
Tube of 75 SA5534D
SA5534
40°Cto85°C
4mV
SOIC (D)
Reel of 2500 SA5534DR SA5534
−40°C to 85°C4 mV SOIC (D) Tube of 75 SA5534AD
SA5534A
Reel of 2500 SA5534ADR SA5534A
SOP (PS)
Tube of 80 SA553APS
SA5534
SOP (PS) Reel of 2000 SA553APSR SA5534
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
schematic
VCC−
OUT
15 Ω
15 Ω
12 kΩ12 kΩ
7 pF
12 pF
40 pF
100 pF
IN+
IN−
BALANCE COMPCOMP/BAL
857
4
6
2
3
1
All component values shown are nominal.
VCC+
NE5534, NE5534A, SA5534. SA5534A
LOW-NOISE OPERATIONAL AMPLIFIERS
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
symbol
IN−
COMP/BAL
COMP
OUT
BALANCE
−
+
IN+
application circuit
−
+
22 kΩ
100 kΩ
7
2
3
VCC−
4
6
5
8
VCC+
1
CC
5534
Frequency Compensation and Offset-Voltage Nulling Circuit
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage: VCC+ (see Note 1) 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCC− (see Note 1) −22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage either input (see Notes 1 and 2) VCC+
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current (see Note 3) ±10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 5 and 6): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
P package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package 95°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC−.
2. The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
3. Excessive current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some
limiting resistance is used.
4. The output may be shorted to ground or to either power supply. Temperature and/or supply voltages must be limited to ensure the
maximum dissipation rating is not exceeded.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN MAX UNIT
VCC+ Supply voltage 5 15 V
VCC− Supply voltage −5 −15 V
T
Operating free air temperature range
NE5534, NE5534A 0 70
°C
TAOperating free-air temperature range SA5534, SA5534A −40 85 °C
NE5534, NE5534A, SA5534. SA5534A
LOW-NOISE OPERATIONAL AMPLIFIERS
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics, VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS†MIN TYP MAX UNIT
V
Input offset voltage
V
O
= 0, TA = 25°C 0.5 4
mV
VIO Input offset voltage
VO
=
0
,
RS = 50 ΩTA = Full range 5mV
I
Input offset current
V 0
TA = 25°C 20 300
nA
IIO Input offset current VO = 0 TA = Full range 400 nA
I
Input bias current
V 0
TA = 25°C 500 1500
nA
IIB Input bias current VO = 0 TA = Full range 2000 nA
VICR Common-mode input voltage range ±12 ±13 V
V
Maximum peak to peak output voltage swing
R≥600 Ω
VCC± = ±15 V 24 26
V
VO(PP) Maximum peak-to-peak output voltage swing RL ≥ 600 ΩVCC± = ±18 V 30 32 V
A
Large signal differential voltage amplification
V
O
= ±10 V, TA = 25°C 25 100
V/mV
AVD Large-signal differential voltage amplification
VO
=
±10
V
,
RL ≥ 600 ΩTA = Full range 15 V/mV
A
Small signal differential voltage amplification
f 10 kHz
CC = 0 6
V/mV
Avd Small-signal differential voltage amplification f = 10 kHz CC = 22 pF 2.2 V/mV
V±10 V
CC = 0 200
BOM
Maximum-output-swing bandwidth
VO = ±10 V CC = 22 pF 95
kHz
B
OM
M
ax
i
mum-output-sw
i
ng
b
an
d
w
id
t
h
VCC± = ±18 V,
RL ≥ 600 Ω,
VO = ±14 V,
CC = 22 pF 70
kH
z
B1Unity-gain bandwidth CC = 22 pF, CL = 100 pF 10 MHz
riInput resistance 30 100 kΩ
zoOutput impedance AVD = 30 dB,
CC = 22 pF,
RL ≥ 600 Ω,
f = 10 kHz 0.3 Ω
CMRR Common-mode rejection ratio VO = 0,
RS = 50 Ω
VIC = VICRmin,
70 100 dB
kSVR Supply-voltage rejection ratio (ΔVCC/ΔVIO)
VCC+ = ±9 V to ±15 V,
VO = 0
RS = 50 Ω,80 100 dB
IOS Output short-circuit current 38 mA
ICC Supply current VO = 0, No load TA = 25°C 4 8 mA
†All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified.
For NE5534 and NE5534A, full range is 0°C to 70°C. For SA5534 and SA5534A, full range is −40°C to 85°C.
NE5534, NE5534A, SA5534. SA5534A
LOW-NOISE OPERATIONAL AMPLIFIERS
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operating characteristics, VCC ± = ±15 V, TA = 25°C
PARAMETER TEST CONDITIONS
NE5534,
SA5534 NE5534A, SA5534A UNIT
TEST
CONDITIONS
TYP MIN TYP MAX
UNIT
SR
Slew rate
CC = 0 13 13
V/ s
SR Slew rate CC = 22 pF 6 6 V/μs
Rise time VI = 50 mV,
R600 Ω
AVD = 1,
CC=22pF
20 20 ns
t
Overshoot factor
RL = 600 Ω,
CL = 100 pF
C
C = 22 pF
20 20 %
trRise time VI = 50 mV,
R600 Ω
AVD = 1,
CC=47pF
50 50 ns
Overshoot factor
RL = 600 Ω,
CL = 500 pF
C
C = 47 pF
35 35 %
V
Equivalent input noise voltage
f = 30 Hz 7 5.5 7
nV/√Hz
VnEquivalent input noise voltage f = 1 kHz 4 3.5 4.5 nV/√Hz
I
Equivalent input noise current
f = 30 Hz 2.5 1.5
pA/√H
InEquivalent input noise current f = 1 kHz 0.6 0.4 pA/√Hz
FAverage noise figure RS = 5 kΩ, f = 10 Hz to 20 kHz 0.9 dB
NE5534, NE5534A, SA5534. SA5534A
LOW-NOISE OPERATIONAL AMPLIFIERS
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS†
Figure 1
1
0.8
0.6
0.4
−75 −50 −25 0 25 50
Normalized Input Bias Current and Input Offset Current
1.2
1.4
NORMALIZED INPUT BIAS CURRENT
AND INPUT OFFSET CURRENT
vs
FREE-AIR TEMPERATURE
1.6
75 100 125
TA − Free-Air Temperature − °C
VCC± = ±15 V
Offset
Bias
Figure 2
100 1 k 10 k 100 k 1 M
V
f − Frequency − Hz
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
vs
FREQUENCY
OPP
− Maximum Peak-to-Peak Output Voltage − V
30
25
20
15
10
5
0
ÁÁ
ÁÁ
ÁÁ
VO(PP)
VCC± = ±15 V
TA = 25°C
CC = 22 pF
CC = 47 pF
CC = 0
Figure 3
A
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREQUENCY
f − Frequency − Hz
VCC± = ±15 V
TA = 25°C
CC = 0 pF
CC = 22 pF
106
105
104
103
102
10
1
VD − Differential Voltage Amplification − V/mV
10 100 1 k 10 k 100 k 1 M 10 M 100 M
Figure 4
0.8
0.6
0.5
0.4
0510
Normalized Slew Rate and Unity-Gain Bandwidth
1
1.1
NORMALIZED SLEW RATE AND
UNITY-GAIN BANDWIDTH
vs
SUPPLY VOLTAGE
1.2
15 20
0.9
0.7
| VCC± | − Supply Voltage − V
TA = 25°C
Unity-Gain
Bandwidth
Slew Rate
†Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
NE5534, NE5534A, SA5534. SA5534A
LOW-NOISE OPERATIONAL AMPLIFIERS
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS†
Figure 5
1
0.9
0.8
−75 −50 −25 0 25 50
Normalized Slew Rate and Unity-Gain Bandwidth
1.1
NORMALIZED SLEW RATE AND
UNITY-GAIN BANDWIDTH
vs
FREE-AIR TEMPERATURE
1.2
75 100 125
VCC± = ±15 V
TA − Free-Air Temperature − °C
Unity-Gain
Bandwidth
Slew Rate
Figure 6
100 400 1 k
THD − Total Harmonic Distortion − %
f − Frequency − Hz
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
4 k 10 k 40 k 100 k
0.01
0.007
0.004
0.002
0.001
VCC± = ±15 V
AVD = 1
VI(rms) = 2 V
TA = 25°C
Figure 7
10 100
− Equivalent Input Noise Voltage −
f − Frequency − Hz
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
1 k 10 k 100 k
VnnV/ Hz
10
7
4
2
1
VCC± = ±15 V
TA = 25°C
SA5534A, NE5534A
SA5534, NE5534
Figure 8
10 100
f − Frequency − Hz
1 k 10 k 100 k
EQUIVALENT INPUT NOISE CURRENT
vs
FREQUENCY
− Equivalent Input Noise Current −
InpA/ Hz
10
7
4
2
1
0.7
0.4
0.2
0.1
VCC± = ±15 V
TA = 25°C
SA5534, NE5534
SA5534A, NE5534A
†Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
NE5534, NE5534A, SA5534. SA5534A
LOW-NOISE OPERATIONAL AMPLIFIERS
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 9
0.7
0.4
0.2
0.1
100 1 k 10 k 100 k 1 M
Total Equivalent Input Noise Voltage −
1
TOTAL EQUIVALENT INPUT NOISE VOLTAGE
vs
SOURCE RESISTANCE
7
4
2
10
70
40
20
100
μV
RS − Source Resistance − Ω
VCC± = ±15 V
TA = 25°C
f = 10 Hz to 20 kHz
f = 200 Hz to 4 kHz
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
NE5534AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534AJG OBSOLETE CDIP JG 8 TBD Call TI Call TI
NE5534AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE5534APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE5534D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
NE5534IP OBSOLETE PDIP P 8 TBD Call TI Call TI
NE5534P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
NE5534PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA5534AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SA5534ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA5534APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA5534D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SA5534P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA5534PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SA5534PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5534PSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SA5534PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 3
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
NE5534ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
NE5534DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SA5534ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SA5534DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SA5534PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
NE5534ADR SOIC D 8 2500 340.5 338.1 20.6
NE5534DR SOIC D 8 2500 340.5 338.1 20.6
SA5534ADR SOIC D 8 2500 340.5 338.1 20.6
SA5534DR SOIC D 8 2500 340.5 338.1 20.6
SA5534PSR SO PS 8 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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