DESCRIPTION:
The CENTRAL SEMICONDUCTOR 3SMC5.0CA
Series types are Surface Mount Bi-Directional Glass
Passivated Junction Transient Voltage Suppressors
designed to protect voltage sensitive components
from high voltage transients.
THIS DEVICE IS MANUFACTURED WITH A
GLASS PASSIVATED CHIP FOR OPTIMUM RELI-
ABILITY.
Note: For Uni-directional devices, please refer to the
3SMC5.0A Series data sheet.
MARKING CODE: SEE MARKING CODE ON
ELECTRICAL CHARACTERISTIC TABLE
3SMC5.0CA THRU 3SMC170CA
SURFACE MOUNT BI-DIRECTIONAL
GLASS PASSIVATED JUNCTION
SILICON TRANSIENT
VOLTAGE SUPPRESSOR
3000 WATTS, 5.0 THRU 170 VOLTS
SMC CASE
Central
Semiconductor Corp.
TM
R4 (3-March 2008)
STAND-OFF VOLTAGE
Specified by
• This series is UL listed, UL file number E130224
Notes: (1) Non-repetitive 10x1,000μs pulse
TYPE
REVERSE
STAND-OFF
VOLTAGE
BREAKDOWN
VOLTAGE
(VBR @ IT)
TEST
CURRENT
MAXIMUM
REVERSE
LEAKAGE
MAXIMUM
CLAMPING
VOLTAGE
PEAK
PULSE
CURRENT
(Note 1) MARKING
CODE
VRWM MIN MAX ITIR@ VRWM VC@ IPP IPP
V V V mA μA V A
3SMC5.0CA 5.0 6.40 7.25 10 2000 9.2 326.0 CIDE
3SMC6.0CA 6.0 6.67 7.67 10 2000 10.3 291.3 CIDG
3SMC6.5CA 6.5 7.22 8.30 10 1000 11.2 267.9 CIDK
3SMC7.0CA 7.0 7.78 8.95 10 400 12.0 250.0 CIDM
3SMC7.5CA 7.5 8.33 9.58 1.0 200 12.9 232.6 CIDP
3SMC8.0CA 8.0 8.89 10.23 1.0 100 13.6 220.6 CIDR
3SMC8.5CA 8.5 9.44 10.82 1.0 50 14.4 208.4 CIDT
3SMC9.0CA 9.0 10.0 11.5 1.0 20 15.4 194.8 CIDV
3SMC10CA 10 11.1 12.8 1.0 5.0 17.0 176.4 CIDX
3SMC11CA 11 12.2 14.0 1.0 5.0 18.2 184.8 CIDZ
3SMC12CA 12 13.3 15.3 1.0 5.0 19.9 150.6 CIEE
3SMC13CA 13 14.4 16.5 1.0 5.0 21.5 139.4 CIEG
3SMC14CA 14 15.6 17.9 1.0 5.0 23.2 129.4 CIEK
3SMC15CA 15 16.7 19.2 1.0 5.0 24.4 123.0 CIEM
3SMC16CA 16 17.8 20.5 1.0 5.0 26.0 115.4 CIEP
3SMC17CA 17 18.9 21.7 1.0 5.0 27.6 106.6 CIER
3SMC18CA 18 20.0 23.3 1.0 5.0 29.2 102.8 CIET
3SMC20CA 20 22.2 25.5 1.0 5.0 32.4 92.6 CIEV
3SMC22CA 22 24.4 28.0 1.0 5.0 35.5 84.4 CIEX
3SMC24CA 24 26.7 30.7 1.0 5.0 38.9 77.2 CIEZ
3SMC26CA 26 28.9 33.2 1.0 5.0 42.1 71.2 CIFE
3SMC28CA 28 31.1 35.8 1.0 5.0 45.4 66.0 CIFG
3SMC30CA 30 33.3 38.3 1.0 5.0 48.4 62.0 CIFK
MAXIMUM RATINGS: (TA=25°C unless otherwise noted) SYMBOL UNITS
Peak Power Dissipation (Note 1) PDM 3000 W
Peak Forward Surge Current (JEDEC Method) IFSM 200 A
Operating and Storage Junction Temperature TJ, Tstg -65 to +150 °C
ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted)
Central
Semiconductor Corp.
TM 3SMC5.0CA THRU 3SMC170CA
SURFACE MOUNT BI-DIRECTIONAL
GLASS PASSIVATED JUNCTION
SILICON TRANSIENT
VOLTAGE SUPPRESSOR
3000 WATTS, 5.0 THRU 170 VOLTS
ELECTRICAL CHARACTERISTICS - Continued:
SMC - CASE - MECHANICAL OUTLINE
R4 (3-March 2008)
TYPE
REVERSE
STAND-OFF
VOLTAGE
BREAKDOWN
VOLTAGE
(VBR @ IT)
TEST
CURRENT
MAXIMUM
REVERSE
LEAKAGE
MAXIMUM
CLAMPING
VOLTAGE
PEAK
PULSE
CURRENT
(Note 1) MARKING
CODE
VRWM MIN MAX ITIR@ VRWM VC@ IPP IPP
V V V mA μA V A
3SMC33CA 33 36.7 42.2 1.0 5.0 53.3 56.2 CIFM
3SMC36CA 36 40.0 46.0 1.0 5.0 58.1 51.6 CIFP
3SMC40CA 40 44.4 51.1 1.0 5.0 64.5 46.4 CIFR
3SMC43CA 43 47.8 54.9 1.0 5.0 69.4 43.2 CIFT
3SMC45CA 45 50.0 57.5 1.0 5.0 72.7 41.2 CIFV
3SMC48CA 48 53.3 61.3 1.0 5.0 77.4 38.8 CIFX
3SMC51CA 51 56.7 65.2 1.0 5.0 82.4 36.4 CIFZ
3SMC54CA 54 60.0 69.0 1.0 5.0 87.1 34.4 CIGE
3SMC58CA 58 64.4 74.1 1.0 5.0 93.6 32.0 CIGG
3SMC60CA 60 66.7 76.7 1.0 5.0 96.8 31.0 CIGK
3SMC64CA 64 71.1 81.8 1.0 5.0 103 29.2 CIGM
3SMC70CA 70 77.8 89.5 1.0 5.0 113 26.6 CIGP
3SMC75CA 75 83.3 95.8 1.0 5.0 121 24.8 CIGR
3SMC78CA 78 86.7 99.7 1.0 5.0 126 22.8 CIGT
3SMC85CA 85 94.4 108.2 1.0 5.0 137 20.8 CIGV
3SMC90CA 90 100.0 115.5 1.0 5.0 146 20.6 CIGX
3SMC100CA 100 111.0 128.0 1.0 5.0 162 18.6 CIGZ
3SMC110CA 110 122.0 140.5 1.0 5.0 177 16.8 CIHE
3SMC120CA 120 133.0 153.0 1.0 5.0 193 15.6 CIHG
3SMC130CA 130 144.0 165.5 1.0 5.0 209 14.4 CIHK
3SMC150CA 150 167.0 192.5 1.0 5.0 243 12.4 CIHM
3SMC160CA 160 178.0 205.0 1.0 5.0 259 11.6 CIHP
3SMC170CA 170 189.0 217.5 1.0 5.0 275 11.0 CIHR
Package Details -
Central
Semiconductor Corp.
www.centralsemi.com
TM
R1 (10-December 2002)
Mechanical Drawing
SMC
Mounting Pad Geometry (Dimensions in mm)
Part Marking: 3-6 Character Alpha/Numeric Code
Lead Code:
Reference individual
device datasheet.
Package Details -
Central
Semiconductor Corp.
www.centralsemi.com
TM
R1 (10-December 2002)
Tape Dimensions and Orientation (Dimensions in mm.)
Tape Width: 16mm
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.
SMC
Packaging Base 13” Reel = 3,000 pcs. (add TR13 suffix to part number)
Bulk = 100 pcs. (add BK suffix to part number)
Reel Packing Information
Ordering Information
• For devices taped and reeled on 13” reels, add TR13 suffix to part number.
• For devices bulk packed, add BK suffix to part number.
• All SMDs are available bulk packed, for prototype and manual placement applications.
Direction of Unreeling
Reel Quantity Number of Box Dimensions Shipping Weight
Size Per Box Reels per Box INCH CM LB KG
13” 39,000 13 14x14x8 36x36x20 22 10
* Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-2-A
Material Composition Specification
SMC Case
Pb (lead)-free plating**
Component Material
Material
Substance CAS No.
Substance
(%wt) (mg) (%wt) (mg) (ppm)
active device doped Si 1.63% 3.8 Si 7440-21-3 1.6% 3.8 16,000
leadframe copper 39.107% 90.92 Cu 7440-50-8 39.107% 90.92 391,070
die attach high temperature
solder paste 1.875% 4.36
Pb 7439-92-1 1.735% 4.033 17,350
Sn 7440-31-5 0.094% 0.218 940
Ag 7440-22-4 0.047% 0.109 470
encapsulation*
EMC 56.77% 132
silica 7631-86-9 38.606% 89.76 386,060
epoxy resin Proprietary 17.032% 39.6 170,320
Sb2O31309-64-4 0.568% 1.32 5,680
TBBA 79-94-7 0.568 % 1.32 5,680
EMC GREEN 56.77 % 132
silica 7631-86-9 39.39% 91.592 393,942
epoxy resin Proprietary 17.38% 40.408 173,798
plating**
tin lead process 0.661% 1.419
Sn 7440-31-5 0.529% 1.135 5,290
Pb 7439-92-1 0.132% 0.335 1,320
100% tin process 0.661% 1.419 Sn 7440-31-5 0.77% 0.708 7,700
CentralTM
Semiconductor Corp.
www.centralsemi.com
R2 (10-March 2008)
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.5 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
*EMC GREEN molding compound is Halogen-Free.
**Specify Lead-Free when ordering 100% tin (Pb-free) plating.
Disclaimer
The information provided in this Material Composition data sheet is, to our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
