TLP3052A,TLP3052AF Photocouplers GaAs Infrared LED & Photo Triac TLP3052A,TLP3052AF 1. Applications * Solid-State Relays * Triac Drivers * Home Electric Appliances * Office Equipment 2. General The TLP3052A consists of a non zero crossing photo triac, optically coupled to a gallium arsenide infrared emitting diode. The TLP3052A is housed in the DIP6 package and guarantees insulation thickness of 0.4 mm (min). Therefore, the TLP3052A meets the reinforced insulation class requirements of international safety standards. 3. Features (1) Halogen-free For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet. (2) Peak off-state voltage: 600 V (min) (3) Non zero crossing functionary (NZC) (4) Trigger LED current: 10 mA (max) (5) On-state current: 100 mA (max) (6) Isolation voltage: 5000 Vrms (min) (7) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory Note 1: When a VDE approved type is needed, please designate the Option (D4) (D4). Table 3.1 Mechanical Parameters 7.62 mm Pitch TLP3052A 10.16 mm Pitch TLP3052AF Unit Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Characteristics Start of commercial production (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 1 2015-08 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 4. Packaging (Note) TLP3052A TLP3052A(LF1,TP1) TLP3052AF(LF4,TP4) 11-7A1002S Note: 11-7A1005S 11-7A1001S 11-7A10S TLP3052AF TLP3052A(LF5,TP5) 11-7A1004S Through-hole type: TLP3052A, TLP3052AF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 5. Pin Assignment 1: Anode 2: Cathode 3: N.C. 4: Triac terminal 6: Triac terminal (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 2 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 6. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP3052A(TP1,F Part number: TLP3052A Tape type: TP1 (Note 1) [[G]]/RoHS COMPATIBLE: F (Note 2) Note 1: At the part of tape type, below options are used including lead forming type. TLP3052A: LF1, TP1, LF5, TP5 TLP3052AF: LF4, TP4 Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 3 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Input forward current derating (Ta 53 ) Note Rating Unit IF 50 mA IF/Ta -0.7 mA/ 1 A 5 V Input forward current (pulsed) IFP Input reverse voltage VR Input power dissipation (Note 1) PD 100 mW PD/Ta -1.0 mW/ Junction temperature Tj 125 Detector Off-state output terminal voltage VDRM 600 V IT(RMS) 100 mA 50 mA -1.1 mA/ 2 A Input power dissipation derating R.M.S. on-state current (Ta 25 ) (Ta = 25 ) (Ta = 70 ) R.M.S. on-state current derating (Ta 25 ) IT(RMS)/Ta ON-state current (pulsed) IONP (Note 2) Peak non-repetitive surge current ITSM (Note 3) 1.2 A PO 300 mW PO/Ta -4.0 mW/ Tj 125 Output power dissipation Output power dissipation derating (Ta 25 ) Junction temperature Common Total power dissipation PT 400 mW PT/Ta -4.4 mW/ Operating temperature Topr -40 to 100 Storage temperature Tstg -55 to 125 Total power dissipation derating Lead soldering temperature Isolation voltage (Ta 25 ) (10 s) Tsol AC, 60 s, R.H. 60 % BVS 260 (Note 4) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) 100 s, 100 pps Note 2: Pulse width (PW) 100 s, 120 pps Note 3: Pulse width (PW) 10 ms Note 4: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4 and 6 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics AC mains voltage Input forward current Symbol Note VAC (Note 1) IF Min Typ. Max Unit 240 V 15 20 25 mA ON-state current (pulsed) IONP 1 A Operating temperature Topr -25 85 Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note 1: AC use only. (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 4 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 9. Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward voltage Note Test Condition Min Typ. Max Unit 1.15 1.3 V VF IF = 10 mA 1.0 Input reverse current IR VR = 5 V 10 A Input capacitance Ct V = 0 V, f = 1 MHz 30 pF Detector Peak off-state current IDRM VDRM = 600 V 10 1000 nA Peak on-state voltage VTM ITM = 100 mA 1.7 3.0 V 0.6 mA Vin = 240 V, Ta = 25 See Fig. 9.1 2000 V/s Vin = 60 Vrms, IT = 15 mA See Fig. 9.1 0.2 Holding current IH Critical rate of rise of off-state voltage Critical rate of rise of commutating voltage (dv/dt) dv/dt dv/dt(c) Fig. 9.1 dv/dt Test Circuit and Waveform 10. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Trigger LED current Symbol Note IFT Test Condition Min Typ. Max Unit 10 mA Min Typ. Max Unit 0.8 pF 1 x 1012 1014 5000 Vrms AC, 1 s in oil 10000 DC, 60 s in oil 10000 VT = 6 V 11. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Test Condition Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz Isolation resistance RS (Note 1) VS = 500 V, R.H. 60% Isolation voltage BVS (Note 1) AC, 60 s Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4 and 6 are shorted together. (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 5 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 12. Characteristics Curves (Note) Fig. 12.1 IF - Ta Fig. 12.2 IT(RMS) - Ta Fig. 12.3 IF - VF Fig. 12.4 IFP - DR Fig. 12.5 VF/Ta - IF Fig. 12.6 IFP - VFP (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 6 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF Note: Fig. 12.7 Normalized IFT - Ta Fig. 12.8 Normalized IDRM - Ta Fig. 12.9 Normalized VDRM - Ta Fig. 12.10 Normalized IH - Ta The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 7 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 13.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used * When using soldering flow Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 8 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 14. Land Pattern Dimensions (for reference only) (Unit: mm) Fig. 14.1 TLP3052A Lead forming and taping option (LF1), (TP1), (LF5), (TP5) (c)2016-2018 Toshiba Electronic Devices & Storage Corporation Fig. 14.2 TLP3052AF Lead forming and taping option (LF4), (TP4) 9 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 15. EN60747-5-5 Option (D4) Specification * Part number: TLP3052A (Note 1) * The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP3052A(D4TP1,F D4: EN60747 option TP1: Tape type F: [[G]]/RoHS COMPATIBLE (Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP3052A(D4TP1,F TLP3052A Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Fig. 15.1 EN60747 Insulation Characteristics (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 10 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF Table Insulation Related Specifications (Note) Insulation Related Parameters Symbol TLP3052A TLP3052AF Minimum creepage distance Cr 7.0 mm 8.0 mm Minimum clearance Cl 7.0 mm 8.0 mm ti 0.4 mm 0.4 mm CTI 175 175 Minimum insulation thickness Comparative tracking index Note: Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall take suitable measures. This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 15.2 Marking on packing for EN60747 (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 11 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF Fig. 15.3 Measurement Procedure (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 12 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF 16. Ordering Information (Example of Item Name) Item Name Packaging (Note 1) VDE Option Packing (MOQ) TLP3052A(F TH Magazine (50 pcs) TLP3052A(LF1,F LF1 Magazine (50 pcs) TLP3052A(LF5,F LF5 Magazine (50 pcs) TLP3052A(TP1,F LF1 Tape and reel (1500 pcs) TLP3052A(TP5,F LF5 TLP3052A(D4,F TH EN60747-5-5 Magazine (50 pcs) TLP3052A(D4LF1,F LF1 EN60747-5-5 Magazine (50 pcs) TLP3052A(D4LF5,F LF5 EN60747-5-5 Magazine (50 pcs) TLP3052A(D4TP1,F LF1 EN60747-5-5 Tape and reel (1500 pcs) TLP3052A(D4TP5,F LF5 EN60747-5-5 Tape and reel (1500 pcs) TLP3052AF(F TH, Wide forming Magazine (50 pcs) TLP3052AF(LF4,F LF4, Wide forming Magazine (50 pcs) TLP3052AF(TP4,F LF4, Wide forming TLP3052AF(D4,F TH, Wide forming EN60747-5-5 Magazine (50 pcs) TLP3052AF(D4LF4F LF4, Wide forming EN60747-5-5 Magazine (50 pcs) TLP3052AF(D4TP4F LF4, Wide forming EN60747-5-5 Tape and reel (1000 pcs) Tape and reel (1500 pcs) Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF: Lead forming for surface mount 17. Devices in Halogen-Free Resin Packages This product is Halogen-Free Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor product" as a semiconductor product in which: (1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony (Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or (2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine, chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in printed circuit boards. For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At). In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product other than the encapsulating resins and the resin portion(s) in printed circuit boards. The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and belief on information provided by third parties, and Toshiba makes no representation or warranty as to the accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide accurate information to its customers, but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 13 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF Package Dimensions Unit: mm TLP3052A Weight: 0.40 g (typ.) Package Name(s) TOSHIBA: 11-7A10S (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 14 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF Package Dimensions Unit: mm TLP3052A(LF1,TP1) Weight: 0.39 g (typ.) Package Name(s) TOSHIBA: 11-7A1001S (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 15 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF Package Dimensions Unit: mm TLP3052A(LF5,TP5) Weight: 0.39 g (typ.) Package Name(s) TOSHIBA: 11-7A1005S (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 16 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF Package Dimensions Unit: mm TLP3052AF Weight: 0.40 g (typ.) Package Name(s) TOSHIBA: 11-7A1002S (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 17 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF Package Dimensions Unit: mm TLP3052AF(LF4,TP4) Weight: 0.39 g (typ.) Package Name(s) TOSHIBA: 11-7A1004S (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 18 2018-01-30 Rev.5.0 TLP3052A,TLP3052AF RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". * TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. (c)2016-2018 Toshiba Electronic Devices & Storage Corporation 19 2018-01-30 Rev.5.0