CX-3225SB 24.576MHZ 8PF/?}15PPM - KYOCERA

Kyocera's series of Multilayer Ceramic Chip Capacitors

are designed to meet a wide variety of needs. We offer

a complete range of products for both general and

specialized applications, including CM series for general-

purpose, CT series for low profile, CA series for arrays,

CL series for ICs, CF series for high-voltage, and DM

series for automotive.

Features

•

We have factories worldwide in order to supply our global customer

bases quickly and efficiently and to maintain our reputation as one

of the highest−volume producers in the industry.

• All our products are highly reliable due to their monolithic structure

of high−purity and superfine uniform ceramics and their integral

internal electrodes.

• By combining superior manufacturing technology and materials

with high dielectric constants, we produce extremely compact

components with exceptional specifications.

• Our stringent quality control in every phase of production from

material procurement to shipping ensures consistent manufacturing

and super quality.

• Kyocera components are available in a wide choice of dimensions,

temperature characteristics, rated voltages, and terminations to

meet specific configurational requirements.

series

General

series

Arrays

series

Automotive

series

ICs

series

Low Profile

series

High-Voltage

Multilayer

Ceramic Chip

Capacitors

RoHS Compliant

Tape and Reel Bulk Case

Please contact your local AVX, Kyocera sales office or distributor for

specifications not covered in this catalog.

Our products are continually being improved. As a result, the

capacitance range of each series is subject to change without notice.

Please contact an sales representative to confirm compatibility with

your application.

External Termination

Electrodes

Internal Electrodes

(Pd, Pd/ Ag or Ni)

Dielectric Ceramic Layer

Temperature compensation: Titanate family

Zirconate family

High dielectric constant:

Barium Titanate family

Nickel Barrier Termination Products

Ag or Cu or

CuNi

Ni Plating

Sn or Au Plating

Structure

Multilayer Ceramic Chip Capacitors

Kyocera Ceramic Chip Capacitors are available for different applications as classified below:

Series Dielectric Options Typical Applications Features Terminations Available Size

C0G (NP0)

X5R

X7R

∗X6S

∗X7S

Y5V

General purpose Wide cap range Nickel barrier

01005, 0201, 0402

0603, 0805, 1206

1210, 1812

X5R

X7R

Y5V

IC card

(Decoupling) Low profile Nickel barrier 0201, 0402, 0603

0805, 1206, 1210

CA C0G (NP0)

X5R, X7R

Digital signal

Pass line

Reduction in

placing cost Nickel barrier 0405, 0508

CL X7S ICs

(Decoupling) Low inductance Nickel barrier 0204, 0306

CF C0G (NP0)

X7R

High voltage

Power circuits

High voltage

250VDC, 630VDC

1000VDC, 2000VDC

3000VDC, 4000VDC

Nickel barrier

0805, 1206, 1210

1812, 2208, 1808

2220

DM X7R Automotive

Thermal shock

Resistivity

High reliability

Nickel barrier 0603,0805,1206

∗ Option

∗ Negative temperature coefficient dielectric types are available on request.

Multilayer Ceramic Chip Capacitors

Dimensions

0〜0

Dimensions and Packaging Quantities

Size Code Dimension

Code

Dimensions (mm) Maximum quantity per reel

JIS EIA L W T P min. P max.

P to P min.

φ180 Reel φ330 Reel

02 0402 01005 A0.4±0.02 0.2±0.02 0.2±0.02 0.07 0.14 0.13 40kp (E4/1) -

20kp (P8/2) -

03 0603 0201

A0.6±0.03 0.3±0.03 0.22 max. 0.10 0.20 0.20

30kp (P8/1) 150kp (P8/1)

15kp (P8/2) 50kp (P8/2)

B0.3±0.03 30kp (P8/1) 150kp (P8/1)

15kp (P8/2) 50kp (P8/2)

C0.6±0.05 0.3±0.05 0.3±0.05 0.13 0.23 0.19 30kp (P8/1) 150kp (P8/1)

15kp (P8/2) 50kp (P8/2)

D0.6±0.09 0.3±0.09 0.3±0.09 0.10 0.20 0.20 15kp (P8/2) -

E0.25 max. 15kp (P8/2) -

05 1005 0402

1.0±0.05 0.5±0.05

0.25 max.

0.15 0.35 0.30

20kp (P8/1) 100kp (P8/1)

10kp (P8/2) 50kp (P8/2)

B0.33 max. 10kp (P8/2) -

C0.35 max. 20kp (P8/1) 100kp (P8/1)

10kp (P8/2) 50kp (P8/2)

D0.5±0.05 20kp (P8/1) 100kp (P8/1)

10kp (P8/2) 50kp (P8/2)

E1.0±0.10 0.5±0.10 0.35 max. 20kp (P8/1) 100kp (P8/1)

10kp (P8/2) 50kp (P8/2)

F0.5±0.10 20kp (P8/1) 50kp (P8/2)

10kp (P8/2)

G1.0±0.15 0.5±0.15 0.5±0.15 20kp (P8/1) 50kp (P8/2)

10kp (P8/2)

105 1608 0603

A1.6±0.10 0.8±0.10 0.55 max.

0.20 0.60 0.50

4kp (P8/4) 10kp (P8/4)

B0.8±0.10 8kp (P8/2) 20kp (P8/2)

4kp (P8/4) 10kp (P8/4)

C1.6±0.15 0.8±0.15 0.55 max. 8kp (P8/2) 20kp (P8/2)

4kp (P8/4) 10kp (P8/4)

D0.8±0.15 8kp (P8/2) 20kp (P8/2)

4kp (P8/4) 10kp (P8/4)

E1.6±0.2 0.8±0.2 0.55 max. 8kp (P8/2) 20kp (P8/2)

4kp (P8/4) 10kp (P8/4)

F0.8±0.2 ∗-

21 2012 0805

2.0±0.10 1.25±0.10

0.55 max.

0.20 0.75 0.70

4kp (P8/4) 10kp (P8/4)

B0.95 max. 4kp (P8/4) 10kp (P8/4)

C1.00 max. 4kp (E8/4) 10kp (E8/4)

D0.60±0.1 4kp (P8/4) 10kp (P8/4)

E0.85±0.10 4kp (P8/4) 10kp (P8/4)

F1.05±0.10 3kp (E8/4) 10kp (E8/4)

G1.25±0.10 3kp (E8/4) 10kp (E8/4)

H2.0±0.15 1.25±0.15 0.55 max. 4kp (P8/4) 10kp (P8/4)

J0.95 max. 4kp (P8/4) 10kp (P8/4)

K1.25±0.15 3kp (E8/4) 10kp (E8/4)

L2.0±0.20 1.25±0.20 0.95 max. 4kp (P8/4) 10kp (P8/4)

M1.25±0.20 3kp (E8/4) 10kp (E8/4)

316 3216 1206

3.2±0.20 1.6±0.15

0.85±0.10

0.30 0.85 1.40

4kp (P8/4) 10kp (P8/4)

B0.95 max. 4kp (P8/4) 10kp (P8/4)

C1.00 max. 4kp (E8/4) 10kp (E8/4)

D1.15±0.10 3kp (E8/4) 10kp (E8/4)

E1.25±0.10 3kp (E8/4) 10kp (E8/4)

F1.6±0.15 2.5kp (E8/4) 5kp (E8/4)

G3.2±0.20 1.6±0.20 0.95 max. 4kp (P8/4) 10kp (P8/4)

H1.00 max. 4kp (E8/4) 10kp (E8/4)

J1.6±0.20 2.5kp (E8/4) 5kp (E8/4)

32 3225 1210

3.2±0.20 2.5±0.20

1.00 max.

0.30 1.00 1.40

4kp (E8/4) 10kp (E8/4)

B1.40 max. 3kp (E8/4) 10kp (E8/4)

C1.60 max. 2.5kp (E8/4) 5kp (E8/4)

D1.6±0.15 2.5kp (E8/4) 5kp (E8/4)

E2.20 max. 2kp (E8/4) 5kp (E8/4)

F2.0±0.2 2kp (E8/4) 5kp (E8/4)

G2.5±0.2 1kp (E8/4) 4kp (E8/4)

42 4520 1808 A4.5±0.20 2.0±0.20 1.6 max. 0.15 0.85 2.60 2kp (E12/4) -

B2.2 max. 2kp (E12/4) -

43 4532 1812

4.5±0.30 3.2±0.20

2.0 max.

0.30 1.10 2.00

1kp (E12/8) -

B2.0±0.2 1kp (E12/8) -

C2.5 max. 0.5kp (E12/8) -

D2.5±0.2 0.5kp (E12/8) -

E2.8 max. 0.5kp (E12/8) -

F2.8±0.2 0.5kp (E12/8) -

52 5720 2208 A5.7±0.40 2.0±0.20 2.2 max. 0.15 0.85 4.20 2kp (12/8) -

55 5750 2220 A5.7±0.40 5.0±0.40 2.0 max. 0.30 1.40 2.50 1kp (E12/8) -

B2.5 max. 0.5kp (E12/8) -

C2.8 max. 0.5kp (E12/8) -

Note: Taping denotes the quantity packaged per reel (kp means 1000 pieces).

∗ Please contact us.

Multilayer Ceramic Chip Capacitors

Ordering Information

KYOCERA PART NUMBER CM 21 X7R 104 K 50 A T □□□

SERIES CODE

CM = General Purpose

CT = Low Profile

CA = Arrays

CL = ICs

CF = High Voltage

DM = Automotive

SIZE CODE

SIZE EIA (JIS)

02 = 01005 (0402)

03 = 0201 (0603)

05 = 0402 (1005)

105 = 0603 (1608)

21 = 0805 (2012)

316 = 1206 (3216)

SIZE EIA (JIS)

32 = 1210 (3225)

42 = 1808 (4520)

43 = 1812 (4532)

52 = 2208 (5720)

55 = 2220 (5750)

SIZE EIA (JIS)

D11 = 0405 (1014)/ 2 cap

F12 = 0508 (1220)/ 4 cap

DIELECTRIC CODE

CODE EIA CODE

CG = C0G (NPO)

X5R = X5R

X7R = X7R

X7S = X7S (Option)

X6S = X6S (Option)

Y5V = Y5V

Negative temperature coefficient dielectric types are available on request.

CAPACITANCE CODE

Capacitance expressed in pF.

Two significant digits plus number of zeros.

For Values < 10pF, Letter R denotes decimal point,

eg.

100000pF = 104

0.1μF = 104

4700pF = 472

1.5pF = 1R5

0.5pF = R50

100μF = 107

TOLERANCE CODE

A = ±0.05pF (option)

B = ±0.1pF

C = ±0.25pF

D = ±0.5pF

G = ±2% (option)

J = ±5%

K = ±10%

= ±20%

Z = −20 to +80%

VOLTAGE CODE

04 = 4VDC

06 = 6.3VDC

10 = 10VDC

16 = 16VDC

25 = 25VDC

35 = 35VDC

50 = 50VDC

100 = 100VDC

250 = 250VDC

400 = 400VDC

630 = 630VDC

1000 = 1000VDC

2000 = 2000VDC

3000 = 3000VDC

4000 = 4000VDC

TERMINATION CODE

A = Nickel Barrier/ Tin K = Nickel Barrier/ Au

PACKAGING CODE

B = Bulk

C = Bulk Cassette (option)

T = 7" Reel Taping & 4mm or 8mm∗1 Cavity pitch

Q = 7" Reel Taping & 1mm Cavity pitch

L = 13" Reel Taping & 4mm Cavity pitch

H = 7" Reel Taping & 2mm Cavity pitch

N = 13" Reel Taping & 2mm Cavity pitch

W = 13" Reel Taping & 1mm Cavity pitch

∗ P = 7" Reel Taping & 1mm Cavity pitch

∗ Carrier tape width 4mm.

∗1 Applied for size 43 to 55.

OPTION

Thickness max. value is indicated in CT series

EX. 125 → 1.25mm max.

095 → 0.95mm max.

Multilayer Ceramic Chip Capacitors

Temperature Characteristics and Tolerance

Temperature Compensation Type

Dielectric C0G (NPO)

0 ppm/ °C

UΔ (N750)

−750 ppm/ °C

+350 to −1000ppm/ °C

Value (pF)

0.5 to 2.7 CK UK SL

3.0 to 3.9 CJ UJ SL

4.0 to 9.0 CH UJ SL

≥10 CG UJ SL

K = ±250ppm/ °C, J = ±120ppm/ °C, H = ±60ppm/ °C, G = ±30ppm/ °C

e.g. CG = 0±30ppm/ °C

Note: All parts of C0G will be marked as “CG” but will conform to the above table.

High Dielectric Constant Type

EIA Dielectric Temperature Range ΔC max.

X5R −55 to 85°C±15%

X7R −55 to 125°C

∗X7S −55 to 125°C±22%

∗X6S −55 to 105°C

Y5V −30 to 85°C−82 to +22%

∗ option

Available Tolerances

Dielectric materials, capacitance values and tolerances are

available in the following combinations only:

EIA Dielectric Tolerance Capacitance

C0G

C=±0.25pF

D=±0.50pF

∗1 <10pF

∗3 A=±0.05pF

B=±0.1pF

<0.5pF

≤5pF

∗3 G=±2%

J=±5%

K=±10%

≥10pF

E12 Series

∗2 K=±10%

M=±20%

∗4 E3 Series

∗3 X6S

∗3 X7S

X5R

X7R

Y5V Z=−20% to +80% E3 Series

Note:

∗1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,

2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF

∗2 J = ±5% for X7R (X5R) is available on request.

∗3 option

∗4 E6 series is available on request.

E Standard Number

E3 E6 E12 E24 (Option)

1.0

1.0 1.0 1.0 1.1

1.2 1.2 1.3

1.5 1.5 1.5 1.6

1.8 1.8 2.0

2.2

2.2 2.2 2.2 2.4

2.7 2.7 3.0

3.3 3.3 3.3 3.6

3.9 3.9 4.3

4.7

4.7 4.7 4.7 5.1

5.6 5.6 6.2

6.8 6.8 6.8 7.5

8.2 8.2 9.1

Temperature Compensation Dielectric

Size

(EIA Code)

CM02

(01005)

CM03

(0201)

CM05

(0402)

CM105

(0603)

CM21

(0805)

Temperature

CΔ∗1CΔ∗1UΔ∗2SL CΔ∗1SL CΔ∗1CΔ∗1

Rated Voltage (VDC)

16 25 50 16 25 25 50 50 50 16 25 50

Capacitance (pF)

R20 0.2

R50 0.5

1R0 1.0

1R5 1.5

2.0

3.0

4.0

5.0

6.0

7.0

8.0

9.0

100 10

120 12

101 100

121 120

150

180

220

270

330

390

470

560

680

820

102 1000

122 1200

1500

1800

2200

2700 E

3300

3900

4700

5600

6800

8200

103 10000

123 12000

15000

18000

E12 Series

Please contact for capacitance value other than standard.

Optional Spec.

∗1: CG,CH,CJ,CK

∗2: UJ,UK

Alphabets in capacitance chart denote dimensions.

Please refer to the below table for detail.

Size Size

Code

Dimension (mm)

LWT

02 A 0.4±0.02 0.2±0.02 0.2±0.02

03 B 0.6±0.03 0.3±0.03 0.3±0.03

05 D 1.0±0.05 0.5±0.05 0.5±0.05

105 B 1.6±0.10 0.8±0.10 0.8±0.10

21 E2.0±0.10 1.25±0.10 0.85±0.10

G1.25±0.10

(Example)

In case of “B” for CM03;

L : 0.6±0.03mm

W : 0.3±0.03mm

T : 0.3±0.03mm

[RoHS Compliant Products]

CM Series

Features

We offer a diverse product line ranging from ultra−compact

(0.4×0.2mm) to large (4.5×3.2mm) components configured for a

variety of temperature characteristics, rated voltages, and packages.

We offer the choice and flexibility for almost any applications.

Applications

This standard type is ideal for use in a wide range of applications,

from commercial to industrial equipment.

CM Series

[RoHS Compliant Products]

X5R Dielectric

Size

(EIA Code) CM02

(01005) CM03

(0201) CM05

(0402) CM105

(0603) CM21

(0805)

Rated Voltage (VDC)

6.3 10 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 50

Capacitance (pF)

101 100

151 150

220

330

470

680

102 1000

152 1500

2200

3300

4700

6800

103 10000

153 15000

22000

33000

47000

68000

104 100000

D3 D3 B1

220000

B8 B5 D8 D8

470000 B8

105 1000000 C8 D7 D8 B4

B3 D8

2200000 D8 F8 D8

B5 B8 B8 G3

4700000 G9 G8 D5 D8 G5 G4 K8

106 10000000 D8 M5 M8 M8

22000000 M7

47000000

107 100000000

Size

(EIA Code) CM316

(1206) CM32

(1210) CM43

(1812)

Rated Voltage (VDC)

6.3 10 16 25 50 100 4 6.3 10 16 25 50 6.3 50

Capacitance (pF)

220000 D1

470000 D3 B1

105 1000000 B3 F1

2200000 F3 D1

4700000

J3 C3 G3

106 10000000 F5 F4 F3

J8 F4 G3

22000000 J8 J8 G4 G3 G8

47000000 J5 G5

107 100000000 G5 F5

CM21 size and smaller : E6 Series

CM316 size and larger / capacitance value of 0.1μF and larger : E3 Series

Please contact for capacitance value other than standard.

Optional Spec.

Two digits alphanumerics in capacitance chart denote dimensions and tan δ.

Please refer to the below table for detail.

Size Size

Code

Dimension (mm)

LWT

316

D3.2±0.20 1.6±0.15 1.15±0.10

F3.2±0.20 1.6±0.15 1.6±0.15

J3.2±0.20 1.6±0.20 1.6±0.20

B3.2±0.20 2.5±0.20 1.40 max.

C3.2±0.20 2.5±0.20 1.60 max.

F3.2±0.20 2.5±0.20 2.0±0.2

G3.2±0.20 2.5±0.20 2.5±0.2

43 D4.5±0.30 3.2±0.20 2.5±0.2

F4.5±0.30 3.2±0.20 2.8±0.2

Size Size

Code

Dimension (mm)

LWT

02 A 0.4±0.02 0.2±0.02 0.2±0.02

B0.6±0.03 0.3±0.03 0.3±0.03

C0.6±0.05 0.3±0.05 0.3±0.05

D0.6±0.09 0.3±0.09 0.3±0.09

D1.0±0.05 0.5±0.05 0.5±0.05

F1.0±0.10 0.5±0.10 0.5±0.10

G1.0±0.15 0.5±0.15 0.5±0.15

105 B1.6±0.10 0.8±0.10 0.8±0.10

D1.6±0.15 0.8±0.15 0.8±0.15

G2.0±0.10 1.25±0.10 1.25±0.10

K2.0±0.15 1.25±0.15 1.25±0.15

M2.0±0.20 1.25±0.20 1.25±0.20

Tan δ

Code Tan δ

12.5% max.

23.5% max.

35.0% max.

47.0% max.

57.5% max.

10.0% max.

12.5% max.

20.0% max.

(Example)

In case of “B2” for CM03;

L : 0.6±0.03mm

W : 0.3±0.03mm

T : 0.3±0.03mm

Tan

δ : 3.5% max.

Two digits alphanumerics in capacitance chart denote dimensions and tan δ.

Please refer to the below table for detail.

[RoHS Compliant Products]

CM Series

X7R Dielectric

Size

(EIA Code)

CM02

(01005)

CM03

(0201)

CM05

(0402)

CM105

(0603)

CM21

(0805)

Rated Voltage (VDC)

10 10 16 25 16 25 6.3 10 16 25 50 6.3 10 16 25 50

Capacitance (pF)

101 100

151 150

220

330

470

680

102 1000

A8 B2

152 1500

2200

3300

4700

6800

103 10000

153 15000

22000 D2

33000

47000

68000

104 100000

D8 D8

B2 B2

220000 B3 G2

470000 D8 G2

105 1000000 B8 B8 G3 G8 G8 M3

2200000 D8 M8

4700000 M8 M8

106 10000000 M8 M8

22000000

Size

(EIA Code)

CM316

(1206)

CM32

(1210)

CM43

(1812)

Rated Voltage (VDC)

6.3 10 16 25 50 100 10 16 25 50 100 50 100

Capacitance (pF)

47000 D1

104 100000 A1 B1

220000 D1 F1 F1

470000 D2 B1 G1

105 1000000 D2 F2 B2 F1 B1 D1

2200000 F3 F2 D1

4700000 J8 J3 G2

106 10000000 J8 J8 J3 G8 G3

22000000 J8 J5 G8 G8

Optional Spec.

Size Size

Code

Dimension (mm)

LWT

02 A 0.4±0.02 0.2±0.02 0.2±0.02

03 B 0.6±0.03 0.3±0.03 0.3±0.03

05 D 1.0±0.05 0.5±0.05 0.5±0.05

105 B1.6±0.10 0.8±0.10 0.8±0.10

D1.6±0.15 0.8±0.15 0.8±0.15

21 G2.0±0.10 1.25±0.10 1.25±0.10

M2.0±0.20 1.25±0.20 1.25±0.20

316

3.2±0.20 1.6±0.15

0.85±0.10

D1.15±0.10

F1.6±0.15

J3.2±0.20 1.6±0.20 1.6±0.20

3.2±0.20 2.5±0.20

1.40 max.

F2.0±0.2

G2.5±0.2

43 B4.5±0.30 3.2±0.20 2.0±0.2

D2.5±0.2

(Example)

In case of “B3” for CM03;

L : 0.6±0.03mm

W : 0.3±0.03mm

T : 0.3±0.03mm

Tan

δ : 5.0% max.

Tan δ

Code Tan δ

12.5% max.

23.5% max.

35.0% max.

57.5% max.

12.5% max.

CM21 size and smaller : E6 Series

CM316 size and larger / capacitance value of 0.1μF and larger : E3 Series

Please contact for capacitance value other than standard.

CM Series

[RoHS Compliant Products]

Y5V Dielectric

Size

(EIA Code)

CM05

(0402)

CM105

(0603)

CM21

(0805)

CM316

(1206)

CM32

(1210)

Rated Voltage (VDC)

10 10 16 10 16 25 10 16 25 10 16 25

Capacitance (pF)

102 1000

2200

472 4700

103 10000

22000

473 47000

104 100000

220000 D8

474 470000

105 1000000 B8 B6 G4

2200000 G6 D4

475 4700000 G8 D6

106 10000000 G9 F8 F6 C6 C6

22000000 F9 F8

476 47000000

E3 Series

Please contact for capacitance value other than standard.

Two digits alphanumerics in capacitance chart denote dimensions and tan δ.

Please refer to the below table for detail.

Size Size

Code

Dimension (mm)

LWT

05 D 1.0±0.05 0.5±0.05 0.5±0.05

105 B 1.6±0.10 0.8±0.10 0.8±0.10

21 G 2.0±0.10 1.25±0.10 1.25±0.10

316 D3.2±0.20 1.6±0.15 1.15±0.10

F3.2±0.20 1.6±0.15 1.6±0.15

32 C3.2±0.20 2.5±0.20 1.60 max.

F3.2±0.20 2.5±0.20 2.0±0.2

Tan δ

Code Tan δ

35.0% max.

47.0% max.

69.0% max.

12.5% max.

16.0% max.

(Example)

In case of “C8” for CM05;

L : 1.0±0.05mm

W : 0.5±0.05mm

T : 0.5±0.05mm

Tan

δ : 12.5% max.

Multilayer Ceramic Chip Capacitors

Test Conditions and Standards

Test Conditions and Specifications for Temperature Compensation Type (CΔ to UΔ

•

SL Characteristics)

CM/ CT/ CF Series

Test Items Test Conditions Specifications

Capacitance Value (C)

Capacitance

Frequency Volt

C≤1000pF 1MHz±10% 0.5 to 5Vrms

C>1000pF 1kHz±10%

Within tolerance

QC≥30pF : Q≥1000

C<30pF : Q≥400+20C

Insulation Resistance (IR)

Measured after the rated voltage is applied for 1

minute at room ambient.

For the rated voltage of over 630V, apply 500V

for 1 minute at room ambient.

The charge and discharge current of the capacitor

must not exceed 50mA.

Over 10000MΩ or 500MΩ • μF, whichever is less

Dielectric Resistance

Apply 3 times of the rated voltage for 1 to 5 seconds.

Apply 1.5 times when the rated voltage is 250V or over.

Apply 1.2 times when the rated voltage is 630V or over.

The charge and discharge current of the capacitor

must not exceed 50mA.

No problem observed

Appearance Microscope No problem observed

Termination Strength

Apply a sideward force of 500g (5N) to a PCB-

mounted sample. Apply 2N for 0201, and 1N for

01005 size.

No problem observed

Bending Strength

Glass epoxy PCB: Fulcrum spacing: 90mm, duration

time 10 seconds.

No significant damage at 1mm bent

Vibration

Test

Appearance Vibration frequency: 10 to 55 (Hz)

Amplitude: 1.5mm

Sweeping condition: 10→55→10Hz/ 1 minute in X,

Y and Z

Directions: 2 hours each, 6 hours total.

No problem observed

ΔCWithin Tolerance

QC≥30pF : Q≥1000

C<30pF : Q≥400+20C

Soldering

Heat

Resistance

Appearance Soak the sample in 260°C±5°C solder for 10±0.5

seconds and place in room ambient, and measure

after 24±2 hours.

(Pre-heating conditions)

Order Temperature Time

180 to 100°C 2 minutes

2150 to 200°C 2 minutes

The charge and discharge current of the capacitor

must not exceed 50mA for IR and withstanding

voltage measurement.

No problem observed

ΔCWithin ±2.5% or ±0.25pF, whichever is larger

QC≥30pF : Q≥1000

C<30pF : Q≥400+20C

IR Over 10000MΩ or 500MΩ • μF whichever is less

Withstanding

Voltage Resist without problem

Solderablity

Soaking condition

Sn-3Ag-0.5Cu

245±5°C3

±0.5 sec.

Sn63 Solder

235±5°C2

±0.5 sec.

Solder coverage : 90% min.

Temperature

Cycle

Appearance (Cycle)

Room temperature (3min.)→

Lowest operation temperature (30min.)→

Room temperature (3min.)→

Highest operation temperature(30min.)

After 5 cycles, measure after 24±2 hours.

The charge and discharge current of the capacitor

must not exceed 50mA for IR and withstanding

voltage measurement.

No problem observed

ΔCWithin ±2.5% or ±0.25pF, whichever is larger

QC≥30pF : Q≥1000

C<30pF : Q≥400+20C

IR Over 10000MΩ or 500MΩ • μF, whichever is less

Withstanding

Voltage Resist without problem

Load

Humidity

Test

(Except CF

Series)

Appearance After applying rated voltage for 500+12/ −0 hours

in pre-condition at 40°C±2°C, humidity 90 to

95%RH, allow parts to stabilize for 24±2 hours, at

room temperature before measurement.

The charge and discharge current of the capacitor

must not exceed 50mA for IR measurement.

No problem observed

ΔCWithin ±7.5% or ±0.75pF, whichever is larger

QC≥30pF : Q≥200

C<30pF : Q≥100+10C/ 3

IR Over 500MΩ or 25MΩ • μF, whichever is less

High-

Temperature

with Loading

Appearance After applying twice the rated voltage at the

temperature of 125±3°C for 1000+12/ −0 hours,

measure the sample after 24±2 hours.

Apply 1.5 times when the rated voltage is 250V or over.

Apply 1.2 times when the rated voltage is 630V or over.

The charge and discharge current of the capacitor

must not exceed 50mA for IR measurement.

No problem observed.

ΔCWithin ±3% or ±0.3pF, whichever is larger

C≥30pF : Q≥350

10pF<C<30pF : Q≥275+5C/ 2

C<10pF : Q≥200+10C

IR Over 1000MΩ or 50MΩ • μF, whichever is less

Please ask for individual specification for the hatched range in previous chart.

Multilayer Ceramic Chip Capacitors

Test Conditions and Standards

Test Conditions and Specifications for High Dielectric Type (X5R, X7R)

CM/ CT/ CA Series

Test Items Test Conditions Specifications

Capacitance Value (C) Measure after heat treatment

Capacitance

Frequency Volt

C≤10μF 1kHz±10% 1.0±0.2Vrms

C>10μF 120Hz±10% 0.5±0.2Vrms

Within tolerance

Tanδ (%) Refer to capacitance chart

Insulation Resistance (IR)

Measured after the rated voltage is applied for 1

minute at room ambient.

The charge and discharge current of the capacitor

must not exceed 50mA.

Over 10000MΩ or 500MΩ • μF, whichever is less

Dielectric Resistance

Apply 2.5 times of the rated voltage for 1 to 5 seconds.

The charge and discharge current of the capacitor

must not exceed 50mA. No problem observed

Appearance Microscope No problem observed

Termination Strength

Apply a sideward force of 500g (5N) to a PCB-mounted sample.

note : 2N for 0201 size in for 01005 size.

Exclude CT series with thickness of less than 0.66mm.

No problem observed

Bending Strength

Glass epoxy PCB: Fulcrum spacing: 90mm, duration

time 10 seconds.

Exclude CT series with thickness of less than 0.66mm.

No significant damage at 1mm bent

Vibration

Test

Appearance Take the initial value after heat treatment.

Vibration frequency: 10 to 55 (Hz)

Amplitude: 1.5mm

Sweeping condition: 10→55→10Hz/ 1 minute in X, Y and Z

Directions: 2 hours each, 6 hours total.

No problem observed

ΔCWithin tolerance

Tanδ (%) Within tolerance

Soldering

Heat

Resistance

Appearance Take the initial value after heat treatment.

Soak the sample in 260°C±5°C solder for 10±0.5

seconds and place in room ambient, and measure

after 24±2 hours.

(Pre-heating conditions)

Order Temperature Time

180 to 100°C 2 minutes

2150 to 200°C 2 minutes

The charge and discharge current of the capacitor must not

exceed 50mA for IR and withstanding voltage measurement.

No problem observed

ΔCWithin ±7.5%

Tanδ (%) Within tolerance

IR Over 10000MΩor 500MΩ • μF, whichever is less

Withstanding

Voltage Resist without problem

Solderablity

Soaking condition

Sn-3Ag-0.5Cu 245±5°C3

±0.5 sec.

Sn63 Solder 235±5°C2

±0.5 sec.

Solder coverage : 90% min.

Temperature

Cycle

Appearance Take the initial value after heat treatment.

(Cycle)

Room temperature (3min.)→

Lowest operation temperature (30min.)→

Room temperature (3min.)→

Highest operation temperature(30min.)

After 5 cycles, measure after 24±2 hours.

The charge and discharge current of the capacitor must not

exceed 50mA for IR and withstanding voltage measurement.

No problem observed

ΔCWithin ±7.5%

Tanδ (%) Within tolerance

IR Over 10000MΩor 500MΩ • μF, whichever is less

Withstanding

Voltage Resist without problem

Load

Humidity

Test

Appearance Take the initial value after voltage treatment.

After applying rated voltage for 500+12/ −0 hours

in pre-condition at 40°C±2°C, humidity 90 to

95%RH, allow parts to stabilize for 24±2 hours, at

room temperature before measurement.

The charge and discharge current of the capacitor

must not exceed 50mA for IR measurement.

No problem observed

ΔCWithin ±12.5%

Tanδ (%) 200% max. of initial value

IR Over 500MΩor 25MΩ • μF, whichever is less

High-

Temperature

with

Appearance Take the initial value after voltage treatment.

After applying twice the rated voltage at the highest

operation temperature for 1000+12/ −0 hours,

measure the sample after 24±2 hours.

The charge and discharge current of the capacitor

must not exceed 50mA for IR measurement.

Apply 1.5 times when the rated voltage is 10V or less. Applied

voltages for respective products are indicated in the below chart.

No problem observed

ΔCWithin ±12.5%

Tanδ (%) 200% max. of initial value

IR Over 1000MΩor 50MΩ • μF, whichever is less

Pre-

treatment

Heat Keepspecimenat150+0/−10℃for1hour,leavespecimenatroomambientfor24±2hours.

Voltage Applythesametestconditionfor1hour,thenleavethespecimenatroomambientfor24±2hours.

High-temperature with Loading Applied Voltage (Rated Voltage × □)

AppliedVoltage

RatedVoltage

Products

×1.3

4V CT03X5R104

6.3V CM105X5R475, CM316X5R476

CT05X5R104,CT21X5R106,CT03X5R104

×1.5

16V

CM105X7R474-105,CM21X7R105-475,CM316X7R475-106,CM32X7R106-226,CM05X5R224,CM105X5R225,CM21X5R475-106,CM316X5R226

CT105X5R105,CT21X5R225-475,CT316X5R106,CM03X5R332-103

25V

CM105X7R474,CM21X7R105-225,CM316X7R475,CM32X7R106,CM105X5R474-105,CM21X5R225-106,CM316X5R106,CM32X5R106-226

CT316X5R225-106,CM03X5R152-103

50V CM21X5R105, CM32X5R106, CM32X7R106

CT21X5R225,CT316X5R105-475

100V CM32X7RK74,CM43X7R105

Please ask for individual specification for the hatched range in previous chart.

Test Conditions and Specifications for High Dielectric Type (Y5V)

CM/ CT/ CA Series

Test Items Test Conditions Specifications

Capacitance Value (C) Measure after heat treatment

Frequency Volt

1kHz±10% 1.0±0.2Vrms

Within tolerance

Tanδ (%) Refer to capacitance chart

Insulation Resistance (IR)

Measured after the rated voltage is applied for 1

minute at room ambient.

Over 10000MΩ or 500MΩ • μF, whichever is less

Dielectric Resistance

Apply 2.5 times of the rated voltage for 1 to 5 seconds.

The charge and discharge current of the capacitor

must not exceed 50mA.

No problem observed

Appearance Microscope No problem observed

Termination Strength

Apply a sideward force of 500g (5N) to a PCB-

mounted sample.

Exclude CT series with thickness of less than 0.66mm.

No problem observed

Bending Strength

Glass epoxy PCB: Fulcrum spacing: 90mm, duration

time 10 seconds.

Exclude CT series with thickness of less than 0.66mm.

No significant damage at 1mm bent

Vibration

Test

Appearance Take the initial value after heat treatment.

Vibration frequency: 10 to 55 (Hz)

Amplitude: 1.5mm

Sweeping condition: 10→55→10Hz/ 1 minute in X,

Y and Z

Directions: 2 hours each, 6 hours total.

No problem observed

ΔCWithin tolerance

Tanδ (%) Within tolerance

Soldering

Heat

Resistance

Appearance Take the initial value after heat treatment.

Soak the sample in 260°C±5°C solder for 10±0.5

seconds and place in room ambient, and measure

after 24±2 hours.

(Pre-heating conditions)

Order Temperature Time

180 to 100°C 2 minutes

2150 to 200°C 2 minutes

The charge and discharge current of the capacitor

must not exceed 50mA for IR and withstanding

voltage measurement.

No problem observed

ΔCWithin ±20%

Tanδ (%) Within tolerance

IR Over 10000MΩ or 500MΩ • μF, whichever is less

Withstanding

Voltage Resist without problem

Solderablity

Soaking condition

Sn-3Ag-0.5Cu

245±5°C3

±0.5 sec.

Sn63 Solder

235±5°C2

±0.5 sec.

Solder coverage : 90% min.

Temperature

Cycle

Appearance Take the initial value after heat treatment.

(Cycle)

Room temperature (3min.)→

Lowest operation temperature (30min.)→

Room temperature (3min.)→

Highest operation temperature(30min.)

After 5 cycles, measure after 24±2 hours.

The charge and discharge current of the capacitor

must not exceed 50mA for IR and withstanding

voltage measurement.

No problem observed

ΔCWithin ±20%

Tanδ (%) Within tolerance

IR Over 10000MΩ or 500MΩ • μF, whichever is less

Withstanding

Voltage Resist without problem

Load

Humidity

Test

Appearance Take the initial value after voltage treatment.

After applying rated voltage for 500+12/ −0 hours

in pre-condition at 40°C±2°C, humidity 90 to

95%RH, allow parts to stabilize for 24±2 hours, at

room temperature before measurement.

The charge and discharge current of the capacitor

must not exceed 50mA for IR measurement.

No problem observed

ΔCWithin ±30%

Tanδ (%) 150% max. of initial value

IR Over 500MΩ or 25MΩ • μF, whichever is less

High-

Temperature

with

Appearance Take the initial value after voltage treatment.

After applying twice the rated voltage at the highest

operation temperature for 1000+12/ −0 hours,

measure the sample after 24±2 hours.

The charge and discharge current of the capacitor

must not exceed 50mA for IR measurement.

No problem observed

ΔCWithin ±30%

Tanδ (%) 150% max. of initial value

IR Over 1000MΩ or 50MΩ • μF, whichever is less

Pre-

treatment

Heat Keepspecimenat150+0/−10℃for1hour,leavespecimenatroomambientfor24±2hours.

Voltage Applythesametestconditionfor1hour,thenleavethespecimenatroomambientfor24±2hours.

Multilayer Ceramic Chip Capacitors

Test Conditions and Standards

Test Conditions and Specifications for High Dielectric Type (X7R)

CF Series

Test Items Test Conditions Specifications

Capacitance Value (C) Measure after heat treatment

Capacitance

Frequency Volt

C≤10μF 1kHz±10% 1.0±0.2Vrms

Within tolerance

Tanδ (%) Within ±2.5%

Insulation Resistance (IR)

Measured after the rated voltage is applied

for 1 minute at room ambient.

Measured after the 500V is applied for 1

minute at room ambient for the rated voltage

over 630V.

The charge and discharge current of the

capacitor must not exceed 50mA.

Over 10000MΩ or 500MΩ • μF, whichever is less

Over

100MΩ

•

μF for CF316X7R104/ 250V and CF43X7R474/ 250V

CF55X7R105/ 250V and CF55X7R224/ 630V

Dielectric Resistance

Apply 1.5 times when the rated voltage is

250V or over, apply 1.2 times when the rated

voltage is 630V or over for 1 to 5 seconds.

The charge and discharge current of the

capacitor must not exceed 50mA.

No problem observed

Appearance Microscope No problem observed

Termination Strength Apply a sideward force of 500g (5N) to a

PCB-mounted sample. No problem observed

Bending Strength Glass epoxy PCB: Fulcrum spacing: 90mm,

duration time 10 seconds. No significant damage at 1mm bent

Vibration

Test

Appearance Take the initial value after heat treatment.

Vibration frequency: 10 to 55 (Hz)

Amplitude: 1.5mm

Sweeping condition: 10→55→10Hz/ 1 minute

in X, Y and Z

Directions: 2 hours each, 6 hours total.

No problem observed

ΔCWithin tolerance

Tanδ (%) Within tolerance

Soldering

Heat

Resistance

Appearance Take the initial value after heat treatment.

Soak the sample in 260°C±5°C solder for

10±0.5 seconds and place in room ambient,

and measure after 24±2 hours.

(Pre-heating conditions)

Order Temperature Time

180 to 100°C 2 minutes

2150 to 200°C 2 minutes

The charge and discharge current of the

capacitor must not exceed 50mA for IR and

withstanding voltage measurement.

No problem observed

ΔCWithin ±7.5%

Tanδ (%) Within tolerance

Over 10000MΩ or 500MΩ • μF, whichever is less

Over

100MΩ

•

μF for CF316X7R104/ 250V and CF43X7R474/ 250V

CF55X7R105/ 250V and CF55X7R224/ 630V

Withstanding

Voltage Resist without problem

Solderablity

Soaking condition

Sn-3Ag-0.5Cu

245±5°C3

±0.5 sec.

Sn63 Solder

235±5°C2

±0.5 sec.

Solder coverage : 90% min.

Temperature

Cycle

Appearance Take the initial value after heat treatment.

(Cycle)

Room temperature (3min.)→

Lowest operation temperature (30min.)→

Room temperature (3min.)→

Highest operation temperature(30min.)

After 5 cycles, measure after 24±2 hours.

The charge and discharge current of the

capacitor must not exceed 50mA for IR and

withstanding voltage measurement.

No problem observed

ΔCWithin ±7.5%

Tanδ (%) Within tolerance

Over 10000MΩ or 500MΩ • μF, whichever is less

Over

100MΩ

•

μF for CF316X7R104/ 250V and CF43X7R474/ 250V

CF55X7R105/ 250V and CF55X7R224/ 630V

Withstanding

Voltage Resist without problem

High-

Temperature

with

Appearance

Take the initial value after voltage treatment.

After applying specified voltage at the highest

operation temperature for 1000

+12/ −0

hours,

then measure the sample after 24±2 hours.

The applied voltage shall be;

1.5 times the rated voltage when the rated

voltage is 250V or over.

1.2 times when the rated voltage is 630V or over.

The charge and discharge current of the capacitor

must not exceed 50mA for IR measurement.

No problem observed

ΔCWithin ±12.5%

Tanδ (%) 200% max. of initial value

IR Over 1000MΩ or 50MΩ • μF, whichever is less

Pre-

treatment

Heat Keepspecimenat150+0/−10℃for1hour,leavespecimenatroomambientfor24±2hours.

Voltage Applythesametestconditionfor1hour,thenleavethespecimenatroomambientfor24±2hours.

Multilayer Ceramic Chip Capacitors

Test Conditions and Standards

Substrate for Electrical Tests (Unit: mm)

Size

(EIA Code) abc

02 (01005) 0.15 0.50 0.20

03 (0201) 0.26 0.92 0.32

05 (0402) 0.4 1.4 0.5

105 (0603) 1.0 3.0 1.2

21 (0805) 1.2 4.0 1.65

316 (1206) 2.2 5.0 2.0

32 (1210) 2.2 5.0 2.9

42 (1808) 3.5 7.0 3.7

43 (1812) 3.5 7.0 3.7

52 (2208) 4.5 8.0 5.6

55 (2220) 4.5 8.0 5.6





±



PP

5

6ROGHULQJ

/RDG

6XSSRUWφPP

7HVWLQJ%RDUG

7HVWLQJ7DEOH

7HVWLQJ%RDUG *ODVV(SR[\%RDUG&(RU)5

7HVWLQJ%RDUG7KLFNQHVV±PP∗

&LUFXLW7KLFNQHVV ±PP

3UHVVXUH

Substrate for Bending Test (Unit: mm) Substrate for Adhesion Strength Test

∗ 02, 03, 05 and array: 0.8±0.1mm

Multilayer Ceramic Chip Capacitors

Test Conditions and Standards

Multilayer Ceramic Chip Capacitors

Packaging Options

Carrier Tape (Unit: mm)

Size

(EIA Code) A B F

02 (01005)∗0.23±0.02 0.43±0.02 1.0±0.02

0.25±0.03 0.45±0.03 2.0±0.05

03 (0201)∗0.37±0.03 0.67±0.03 1.0±0.05

2.0±0.05

05 (0402)∗0.65±0.1 1.15±0.1 1.0±0.05

2.0±0.05

105 (0603) 1.0±0.2 1.8±0.2 4.0±0.1

21 (0805) 1.5±0.2 2.3±0.2 4.0±0.1

316 (1206) 2.0±0.2 3.6±0.2 4.0±0.1

32 (1210) 2.9±0.2 3.6±0.2 4.0±0.1

42 (1808) 2.4±0.2 4.9±0.2 4.0±0.1

43 (1812) 3.6±0.2 4.9±0.2 8.0±0.1

52 (2208) 2.4±0.2 6.0±0.2 4.0±0.1

55 (2220) 5.3±0.2 6.0±0.2 8.0±0.1

D11 (0405) 1.15±0.2 1.55±0.2 4.0±0.1

F12 (0508) 1.5±0.2 2.3±0.2 4.0±0.1

∗ Option

(Unit: mm)

F Carrier Tape C D E G H J

1.0

±0.02

4mm

Plastic

4.0

+0.08

1.8

±0.02

0.9

±0.05 −2.0

±0.04

0.8

±0.04

1.0

±0.05

1mm

Paper

8.0

+0.3/ −0.1

3.5

±0.05 1.75

±0.1

2.0

±0.05

4.0

±0.05

1.5

+0.1/ −0

2.0

±0.05 8mm

Paper 8.0

±0.3 4.0

±0.1

4.0

±0.1

8mm

Plastic

12mm

Plastic

12.0

±0.3

5.5

±0.05

8.0

±0.1

0.6 max.

GHF

(Plastic)

3.0 max.

Feed Hole Punched rectangular hole to hold capacitor

Holes only for plastic carrier tape. F0.3 min.

F=8mm (43, 55 Type)

(Paper) (Plastic)

0.6 max. 1.1 max.

H G F

2.8 max.

Feed Hole Punched rectangular hole to hold capacitor

Holes only for plastic carrier tape. F0.3 min.

F=4mm (105, D11, F12, 21, 316, 32, 42, 52 Type)

Feed Hole Punched rectangular hole to hold capacitor

FH 03 Type: 0.5 max.

05 Type: 0.75 max.

105 Type: 1.1 max.

(Paper)

F=2mm (03, 05, 105 Type)

(Paper)

Feed Hole Parts insertion cavity

02 Type: 0.4 max.

03 Type: 0.5 max.

05 Type: 0.75 max.

F=1mm (02, 03, 05 Type)

(Plastic)

Feed Hole Punched rectangular

hole to hold

PD[

(

F=1mm (02 Type)

Tape and Reel

• Reel

Reel (Unit: mm)

Code ABCD

Reel

7−inch Reel

(CODE: T, H, Q) 180 +0

−2.0

φ60 min. 13±0.5 21±0.8

7−inch Reel

(CODE: P) 178±2.0

13−inch Reel

(CODE: L, N, W) 330±2.0

Code EW

1W2R

Reel

7−inch Reel

(CODE: T, H, Q)

2.0±0.5

10.5±1.5 16.5 max.

1.0

7−inch Reel

(CODE: P) 4.35±0.3 6.95±1.0

13−inch Reel

(CODE: L, N, W) 9.5±1.0 16.5 max.

∗ Carrier tape width 8mm.

For size 42 (1808) or over, Tape width 12mm and W1: 14±1.5, W2: 18.4mm max.

Carrier Tape

Peeling Direction

Unrolling Direction

165nto180n

Top Tape

Exfoliating angle: 165 to 180 degrees to the carrier tape.

Exfoliating speed: 300 mm/min.

Adhesive tape

The exfoliative strength when peeling off the top tape from the carrier tape by

the method of the following figure shall be

∗

0.1 to 0.7N.

∗

02 Size: 0.1 to 0.5N

When the top tape is peeled off, the adhesive stays on the top tape.

3) Chip capacitors will be in a state free without being stuck on the

thermal adhesive tape.

Slider

Shutter

Connection Area

110

Bulk Case (Unit: mm)

• Please contact Kyocera for details.

Multilayer Ceramic Chip Capacitors

Packaging Options

Detail of leader and trailer

160mm min. 100mm min.

400mm min.

Empty Pockets Components

StartEnd

Leader

Multilayer Ceramic Chip Capacitors

Surface Mounting Information

Dimensions for recommended typical land

Since the amount of solder (size of fillet) to be used has direct

influence on the capacitor after mounting, the sufficient consideration

is necessary.

When the amounts of solder is too much, the stress that a capacitor

receives becomes larger. It may become the cause of a crack in

the capacitor. When the land design of printed wiring board is

considered, it is necessary to set up the form and size of land pattern

so that the amount of solder is suitable.

Chip Capacitor

PCB

Solder

T/ 2 or 0.5mm

Design of printed circuit and Soldering

The recommended fillet height shall be 1/2 of the thickness of

capacitors or 0.5mm. When mounting two or more capacitors in the

common land, it is necessary to separate the land with the solder resist

strike so that it may become the exclusive land of each capacitor.

General, High-Voltage (Unit: mm)

Size

(EIA Code) L×Wa b c

02 (01005) 0.4×0.2 0.13 to 0.20 0.12 to 0.18 0.20 to 0.23

03 (0201) 0.6×0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40

05 (0402) 1.0×0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60

105 (0603) 1.6×0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80

21 (0805) 2.0×1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10

316 (1206) 3.2×1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30

32 (1210) 3.2×2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30

42 (1808) 4.5×2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80

43 (1812) 4.5×3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00

52 (2208) 5.7×2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80

55 (2220) 5.7×5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70

Automotive (Unit: mm)

Size

(EIA Code) L×Wa b c

105 (0603) 1.6×0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00

21 (0805) 2.0×1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40

316 (1206) 3.2×1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80

IC (Unit: mm)

Size

(EIA Code) L×Wa b c

05 (0402) 0.5×1.0 0.15 to 0.20 0.20 to 0.30 0.90 to 1.20

105 (0603) 0.8×1.6 0.20 to 0.30 0.30 to 0.50 1.40 to 1.60

Arrays (Unit: mm)

abcd

F12 (0508) 0.5 0.5 0.3 0.5

D11 (0405) 0.69 0.28 0.3 0.64

Ideal Solder Height

Chip Capacitor

PCB

Solder

T/ 2 or 0.5mm

Item Not recommended example Recommended example/ Separated by solder

Multiple parts mount

Solder resist

Mount with

leaded parts

Leaded parts Leaded parts

Solder resist

Wire soldering

after mounting

Soldering iron

Wire Solder resist

Overview

Solder resist Solder resist

(General, High-Voltage, Automotive)

Land Pattern

Sample capacitor

Soldering resist

(Arrays)

F12 D11

c c c c

c c

Multilayer Ceramic Chip Capacitors

Surface Mounting Information

Mounting Design

The chip could crack if the PCB warps during processing after the chip has been soldered.

(Not recommended) (Ideal)

Crack

Support pin

(Not recommended) (Ideal)

Recommended chip position on PCB to minimize stress from PCB warpage

Actual Mounting

1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.

2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.

3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.

4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected.

5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.

The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.

Resin Mold

1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use

a low shrinkage resin.

2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.

3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage.

Such gases may crack the chip capacitor or damage the device itself.

Multilayer Ceramic Chip Capacitors

Surface Mounting Information

Soldering Method

1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature

difference (Delta T) to within 130 degree Celsius.

2) The product size 1.6×0.8mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of bigger than 3.2×1.6mm, or

smaller than 1.6×0.8mm, and capacitor arrays can be used in reflow.

Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.

3) Please see our recommended soldering conditions.

4) In case of using Sn-Zn Solder, please contact us in advance.

5) The following condition is recommended for spot heater application.

Soldering iron

1) Temperature of iron chip

2) Wattage

3) Tip shape of soldering iron

4) Soldering Time

1206 and smaller 350°C max.

1210 and larger 280°C max.

80W max.

φ3.0mm max.

3 sec. max.

5) Cautions

a) Pre−heating is necessary rapid heating must be avoided.

Delta T≤150°C

b) Avoid direct touching to capacitors.

c) Avoid rapid cooling after soldering. Natural cooling is recommended.

∗

Consult as if it is difficult to keep the temperature 280°C max. for 1210 and larger MLCC’S.

•Recommendedspotheatercondition

Item Condition

Distance 5mm min.

Angle 45°

Projection Temp. 400°C max.

Flow rate Set at the minimum

Nozzle diameter 2φ to 4φ (Single hole type)

Application time 10 sec. max. (1206 and smaller)

30 sec.max. (1210 and larger)

How to point spot heater

Single hole nozzle

Angle 45°

Recommended Temperature Profile (62Sn Solder)

Reflow

ΔT

300

250

200

150

100

Preheat

60 seconds

Temperature

Peak temperature

230°C±5°C

15 seconds maximum

60 seconds

More than180°C,

40 seconds maximum

Cool at normal room

temperature after

removing from

furnace.

① Minimize soldering time.

② Ensure that the temperature difference (ΔT) does not exceed 150°C.

③ Ensure that the temperature difference (ΔT) does not exceed 130°C for 3.2×2.5mm size or larger.

④ MLCC can withstand the above reflow conditions up to 3 times.

Wave

① Ensure that the chip capacitor is preheated adequately.

② Ensure that the temperature difference (ΔT) does not exceed 150°C.

③ Cool naturally after soldering.

④

Wave soldering is not applicable for chips with size of 3.2×2.5mm or larger of 1.0×0.5mm or smaller and capacitor arrays.

300

250

200

150

100

Preheat

Temperature (°C)

60 to 120 sec.

5 sec. max.

Cool at normal

room temperature

Peak Temperature

230°C to 260°C

ΔT

Recommended Temperature Profile (Sn−3Ag−0.5Cu)

Reflow

300

250

200

150

100

Preheat

Temperature

250°C±5°C

5 to 10 sec. max.

90±30 sec.

220°C max.

90 sec. max.

170 to 180°C1 to 3°C/ sec.

① Minimize soldering time.

② Ensure that allowable temperature difference does not exceed 150°C.

③ Ensure that allowable temperature difference does not exceed 130°C for 3.2×2.5mm size or larger.

Wave

① Ensure that the chip capacitor is preheated adequately.

② Ensure that the temperature difference (ΔT) does not exceed 150°C.

③ Cool naturally after soldering.

④

Wave soldering is not applicable for chips with size of 3.2×2.5mm or larger of 1.0×0.5mm or smaller and capacitor arrays.

Preheat

300

250

200

150

100

Temperature (°C)

Cool at normal

room temperature

Peak Temperature

245°C to 260°C

ΔT

60 to 120 sec.

5 sec. max.

Circuit Design

1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and

performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior

performance or cause a short, open, smoking, or flaming to occur, etc.

2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical

devices; devices which are highly public orientated; and devices which demand a high standard of liability.

Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate

grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high

reliability design different from that of general purpose capacitors.

Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.

Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and

specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short−circuit may occur.

The capacitor has a loss, and may self−heat due to equivalent series resistance when alternating electric current is passed therethrough. As this

effect becomes especially pronounced in high frequency circuits, please exercise caution.

When using the capacitor in a (self−heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for

usage. Also, please make certain temperature rises remain below 20°C.

4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the

rated voltage when AC voltage is super−imposed to the DC voltage.

In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.

Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case

situations, may cause the capacitor to smoke or flame.

5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse

voltage, even though it is within the rated voltage, please inquire to the manufacturer.

In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is

within the rated voltage, it is possible capacitor reliability will deteriorate.

It is a common phenomenon of high−dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.

Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage

at the time of operation.

7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified

in the catalog and specifications.

In addition, it is a common piezo phenomenon of high dielectric products to have some voltage due to vibration or to have noise due to

voltage change. Please contact sales in such case.

8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the

respective product in order that the assembled product function appropriately.

9. Please contact us upon using conductive adhesives.

Storage

1. If the component is stored in minimal packaging (a heat−sealed or chuck−type plastic bag), the bag should be kept closed. Once the bag

has been opened, reseal it or store it in a desiccator.

2. Keep storage place temperature +5 to +40 degree C, humidity 20 to 70% RH.

3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the

product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected.

4. Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases.

5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are

followed.

6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.

Safety application guideline and detailed information of electrical properties are also provided in Kyocera home page;

URL: http://www.kyocera.co.jp/electronic/

Multilayer Ceramic Chip Capacitors

Precautions