LM380
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SNAS546C –DECEMBER 1994–REVISED APRIL 2013
LM380 2.5W Audio Power Amplifier
Check for Samples: LM380
1FEATURES DESCRIPTION
The LM380 is a power audio amplifier for consumer
• Wide Supply Voltage Range: 10V-22V applications. In order to hold system cost to a
• Low Quiescent Power Drain: 0.13W (VS= 18V) minimum, gain is internally fixed at 34 dB. A unique
• Voltage Gain Fixed at 50 input stage allows ground referenced input signals.
The output automatically self-centers to one-half the
• High Peak Current Capability: 1.3A supply voltage.
• Input Referenced to GND The output is short circuit proof with internal thermal
• High Input Impedance: 150kΩlimiting. The package outline is standard dual-in-line.
• Low Distortion The LM380N uses a copper lead frame. The center
• Quiescent Output Voltage is at One-Half of the three pins on either side comprise a heat sink. This
Supply Voltage makes the device easy to use in standard PC layouts.
• Standard Dual-In-Line Package Uses include simple phonograph amplifiers,
intercoms, line drivers, teaching machine outputs,
alarms, ultrasonic drivers, TV sound systems, AM-FM
radio, small servo drivers, power converters, etc.
A selected part for more power on higher supply
voltages is available as the LM384. For more
information see SNAA086.
Connection Diagrams
(Dual-In-Line Packages, Top View)
Figure 1. 14-Pin PDIP Figure 2. 8-Pin PDIP
See NFF0014A Package See P Package
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1994–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM380
www.ti.com
SNAS546C –DECEMBER 1994–REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage 22V
Peak Current 1.3A
Package Dissipation 14-Pin PDIP(3) 8.3W
8-Pin PDIP(3) 1.67W
Input Voltage ±0.5V
Storage Temperature −65°C to +150°C
Operating Temperature 0°C to +70°C
Junction Temperature +150°C
Lead Temperature (Soldering, 10 sec.) +260°C
ESD rating to be determined
Thermal Resistance θJC (14-Pin PDIP) 30°C/W
θJC (8-Pin PDIP) 37°C/W
θJA (14-Pin PDIP) 79°C/W
θJA (8-Pin PDIP) 107°C/W
(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The package is to be derated at 15°C/W junction to heat sink pins for 14-pin pkg; 75°C/W for 8-pin.
Electrical Characteristics(1)
Symbol Parameter Conditions Min Typ Max Units
POUT(RMS) Output Power RL= 8Ω, THD = 3%(2)(3) 2.5 W
AVGain 40 50 60 V/V
VOUT Output Voltage Swing RL= 8Ω14 Vp-p
ZIN Input Resistance 150k Ω
THD Total Harmonic Distortion See(3)(4) 0.2 %
PSRR Power Supply Rejection Ratio See(5) 38 dB
VSSupply Voltage 10 22 V
BW Bandwidth POUT = 2W, RL= 8Ω100k Hz
IQQuiescent Supply Current 7 25 mA
VOUTQ Quiescent Output Voltage 8 9.0 10 V
IBIAS Bias Current Inputs Floating 100 nA
ISC Short Circuit Current 1.3 A
(1) VS= 18V and TA= 25°C unless otherwise specified.
(2) With device Pins 3, 4, 5, 10, 11, 12 soldered into a 1/16″epoxy glass board with 2 ounce copper foil with a minimum surface of 6 square
inches.
(3) CBYPASS = 0.47 μfd on Pin 1.
(4) The maximum junction temperature of the LM380 is 150°C.
(5) Rejection ratio referred to the output with CBYPASS = 5 μF.
Copyright © 1994–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM380
LM380
SNAS546C –DECEMBER 1994–REVISED APRIL 2013
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Heat Sink Dimensions
Staver Heat Sink #V-7
Staver Company
41 Saxon Ave.
P.O. Drawer H
Bayshore, NY 11706
Tel: (516) 666-8000
Copper Wings
2 Required
Soldered to
Pins 3, 4, 5,
10, 11, 12
Thickness 0.04
Inches
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LM380
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SNAS546C –DECEMBER 1994–REVISED APRIL 2013
Typical Performance Characteristics
Maximum Device Dissipation vs Ambient Temperature Device Dissipation vs Output Power—4ΩLoad
Figure 6. Figure 7.
Device Dissipation vs Output Power—8ΩLoad Device Dissipation vsOutput Power—16ΩLoad
Figure 8. Figure 9.
Power Supply Current vs Supply Voltage Total Harmonic Distortion vs Frequency
Figure 10. Figure 11.
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Product Folder Links: LM380
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SNAS546C –DECEMBER 1994–REVISED APRIL 2013
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Typical Performance Characteristics (continued)
Output Voltage Gain and Phase vs Frequency Total Harmonic Distortion vs Output Power
Figure 12. Figure 13.
Device Dissipation vs Output Power Supply Decoupling vs Frequency
Figure 14. Figure 15.
6Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated
Product Folder Links: LM380
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SNAS546C –DECEMBER 1994–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 8
Copyright © 1994–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LM380
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jun-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM380N-8/NOPB ACTIVE PDIP P 8 40 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM
380N-8
LM380N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM380N
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jun-2016
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
N0014A
www.ti.com
N14A (Rev G)
NFF0014A
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