Features
Wide current range
High voltage ratings up to 2400V
High surge current capabilities
Stud cathode and stud anode version
Standard JEDEC types
Typical Applications
Converters
Power supplies
Machine tool controls
High power drives
Medium traction applications
Major Ratings and Characteristics
400 to 2000 2400
IF(AV) 200 200 A
@ TC110 110 °C
IF(RMS) 314 314 A
IFSM @
50Hz 4700 4700 A
@ 60Hz 4920 4920 A
I2t@
50Hz 110 110 KA2s
@ 60Hz 101 101 KA2s
VRRM
range 400 to 2000 2400 V
TJ- 40 to 180 150 °C
Parameters SD200N/R Units
case style
DO-205AC (DO-30)
SD200N/R SERIES
STANDARD RECOVERY DIODES Stud Version
1
Bulletin I2080 rev. B 11/01
200A
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SD200N/R Series
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Bulletin I2080 rev. B 11/01
Voltage VRRM , maximum repetitive VRSM , maximum non- IRRM max.
Type number Code peak reverse voltage repetitive peak rev. voltage @ TJ = TJ max.
VVmA
04 400 500
08 800 900
12 1200 1300
16 1600 1700
20 2000 2100
24 2400 2500
SD200N/R 15
ELECTRICAL SPECIFICATIONS
Voltage Ratings
IF(AV) Max. average forward current 200 A 180° conduction, half sine wave
@ Case temperature 110 °C
IF(AV) Max. average forward current 220 A 180° conduction, half sine wave
@ Case temperature 100 °C
IF(RMS) Max. RMS forward current 314 A DC @ 95°C case temperature
IFSM Max. peak, one-cycle forward, 4700 t = 10ms No voltage
non-repetitive surge current 4920 t = 8.3ms reapplied
3950 t = 10ms 100% VRRM
4140 t = 8.3ms reapplied Sinusoidal half wave,
I2t Maximum I2t for fusing 110 t = 10ms No voltage Initial TJ = TJ max.
101 t = 8.3ms reapplied
78 t = 10ms 100% VRRM
71 t = 8.3ms reapplied
I2t Maximum I2t for fusing 1100 KA2s t = 0.1 to 10ms, no voltage reapplied
VF(TO)1 Low level value of threshold
voltage
VF(TO)2 High level value of threshold
voltage
rf1Low level value of forward
slope resistance
rf2High level value of forward
slope resistance
VFM Max. forward voltage drop 1.40 V Ipk= 630A, TJ = TJ max, tp = 10ms sinusoidal wave
Parameter SD200N/R Units Conditions
Forward Conduction
KA2s
A
V
m
0.64 (I > π x IF(AV)),TJ = TJ max.
0.79 (16.7% x π x IF(AV) < I < π x IF(AV)), TJ = TJ max.
1.00 (I > π x IF(AV)),TJ = TJ max.
0.90 (16.7% x π x IF(AV) < I < π x IF(AV)), TJ = TJ max.
SD200N/R Series
3
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Bulletin I2080 rev. B 11/01
RthJC Conduction
(The following table shows the increment of thermal resistence RthJC when devices operate at different conduction angles than DC)
180° 0.041 0.030 TJ = TJ max.
120° 0.049 0.051
90° 0.063 0.068
60° 0.093 0.096
30° 0.156 0.157
Conduction angle Sinusoidal conduction Rectangular conduction Units Conditions
K/W
Ordering Information Table
SD 20 0 N 24 P B C
1 2 34 5 67
Device Code
8
1- Diode
2- Essential part number
3- 0 = Standard recovery
4- N = Stud Normal Polarity (Cathode to Stud)
R = Stud Reverse Polarity (Anode to Stud)
5- Voltage code: Code x 100 = VRRM (See Voltage Ratings table)
6-P = Stud base DO-205AC (DO-30) 1/2" 20UNF-2A
M = Stud base DO-205AC (DO-30) M12 X 1.75
7- B = Flag top terminal (for Cathode/ Anode Leads)
S = Isolated lead with silicone sleeve
(Red = Reverse Polarity; Blue = Normal Polarity)
None = Non isolated lead
8- C = Ceramic Housing (over 1600V)
V = Glass-metal seal (only up to 1600V)
400 to 2000 2400
TJMax. junction operating temperature range -40 to 180 150 °C
Tstg Max. storage temperature range -55 to 200
RthJC Max. thermal resistance, junction to case 0.23 K/W DC operation
RthCS Max. thermal resistance, 0.08 Mounting surface, smooth, flat and
case to heatsink greased
T Max. allowed mounting torque ±10% 14 Nm Not lubricated threads
wt Approximate weight 120 g
Case style DO-205AC(DO-30) See Outline Table
SD200N/R
Thermal and Mechanical Specifications
Parameter Units Conditions
SD200N/R Series
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Bulletin I2080 rev. B 11/01
Outline Table
Conforms to JEDEC DO-205AC (DO-30)
All dimensions in millimeters (inches)
GLASS-METAL SEAL
MAX.
21 (0.82)
MAX.
16.5 (0.65)
6.5 (0.26) MIN.
DIA. 8.5 (0.33) NOM.
157 (6.18)
55 (2.16) MIN.
DIA. 23.5 (0.93) MAX.
24 (0.94)
MAX.
SW 27
* FOR METRIC DEVICE: M12 X 1.75
170 (6.69)
1/2"-20UNF-2A*
12.5 (0.49)
MAX.
C.S. 16mm
2.6 (0.10) MAX
2
35 (1.38)
MAX.
(0.015 s.i.)
CERAMIC HOUSING
MAX.
21 (0.82)
MAX.
16.5 (0.65)
6.5 (0.26) MIN.
DIA. 8.5 (0.33) NOM.
55 (2.16) MIN.
DIA. 22.5 (0.88) MAX.
29 (1.14)
MAX.
SW 27
* FOR METRIC DEVICE: M12 X 1.75
157 (6.18)
170 (6.69)
1/2"-20UNF-2A*
12.5 (0.49)
MAX.
C.S. 16mm
2.6 (0.10) MAX
.
2
35 (1.38)
MAX.
(0.015 s.i.)
SD200N/R Series
5
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Bulletin I2080 rev. B 11/01
Outline Table
DO-205AC (DO-30) Flag
All dimensions in millimeters (inches)
MAX.
GLASS-METAL SEAL
MAX.
21 (0.82)
MAX.
DIA. 23.5 (0.93) MAX.
24 (0.94)
12.5 (0.49)
16.5 (0.65)
5.6 (0.22)
DIA. 5.54 (0.22)
2.4 (0.09)
27 (1.06)
41 (1.61) MAX.
9.5 (0.37)
*FOR METRIC DEVICE. M12 X 1.75
36.5 (1.44)
1/2"-20UNF-2A*
CERAMIC HOUSING
MAX.
21 (0.82)
MAX.
DIA. 22.5 (0.88) MAX.
29 (1.14)
MAX.
12.5 (0.49)
16.5 (0.65)
5.6 (0.22)
DIA. 5.54 (0.22)
2.4 (0.09)
27 (1.06)
40.5 (1.59) MAX .
1/2"-20UNF-2A*
*FOR METRIC DEVICE. M12 X 1.75
9.5 (0.37)
45 (1.77)
SD200N/R Series
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Bulletin I2080 rev. B 11/01
Fig. 3 - Forward Power Loss Characteristics
Fig. 2 - Current Ratings Characteristics
Fig. 4 - Forward Power Loss Characteristics
Fig. 1 - Current Ratings Characteristics
90
100
110
120
130
140
150
160
170
180
0 50 100 150 200 250 300 350
DC
30 60
90
120 180
Conduction Period
Maximum Allowable Case Temperature ( C)
Average Forward Current (A)
SD200N/R Series
R (DC) = 0.23 K/W
thJC
100
110
120
130
140
150
160
170
180
0 40 80 120 160 200 240
30 60 90 120 180
Average Forward Current (A)
Conduction Angle
Maximum Allowable Case Temperature ( C)
SD200N/R Series
R (DC) = 0.23 K/W
thJC
20 40 60 80 100 120 140 160 180
Maximum Allowable Ambient Temperature ( C)
R = 0.08 K/W - Delta R
thSA
0.3 K/W
0.4 K/W
0.2 K/W
0.12 K/W
1.4 K/W
1.8 K/W
0.6 K/W
0.8 K/W
0
50
100
150
200
250
300
350
400
0 50 100 150 200 250 300 350
DC
180
120
90
60
30
RMS Limit
Conduction Period
Maximum Average Forward Power Loss (W)
Average Forward Current (A)
SD200N/R Series
T = 180 C
J
20 40 60 80 100 120 140 160 180
Maximum Allowable Ambient Temperature ( C)
0.3 K/W
0.4 K/W
0.2 K/W
0.12 K/W
1.4 K/W
1.8 K/W
0.6 K/W
0.8 K/W
R = 0.08 K/W - Delta R
thSA
0
50
100
150
200
250
300
0 50 100 150 200 250
180
120
90
60
30
RMS Limit
Conduction Angle
Maximum Average Forward Power Loss (W)
Average Forward Current (A)
SD200N/R Series
T = 180 C
J
SD200N/R Series
7
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Bulletin I2080 rev. B 11/01
Fig. 8 - Thermal Impedance ZthJC Characteristic
Fig. 7 - Forward Voltage Drop Characteristics
Fig. 5 - Maximum Non-Repetitive Surge Current Fig. 6 - Maximum Non-Repetitive Surge Current
100
1000
10000
0.5 1 1.5 2 2.5 3 3.5
T = 25 C
J
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
SD200N/R Series
T = 180 C
J
1000
1500
2000
2500
3000
3500
4000
4500
110100
Number Of Equal Amplitude Half Cycle Current Pulses (N)
Peak Half Sine Wave Forward Current (A)
Initial T = 180 C
@ 60 Hz 0.0083 s
@ 50 Hz 0.0100 s
J
SD200N/R Series
At Any Rated Load Condition And With
Rated V Applied Following Surge.
RRM
1000
1500
2000
2500
3000
3500
4000
4500
5000
0.01 0.1 1
Pulse Train Duration (s)
Peak Half Sine Wave Forward Current (A)
Initial T = 180 C
No Voltage Reapplied
Rated V Reapplied
RRM
Versus Pulse Train Duration.
Maxim um Non Repetitive Surge Current
J
SD200N/R Series
0.01
0.1
1
0.001 0.01 0.1 1 10
Square W ave Pulse Duration (s)
thJC
Transient Thermal Impedance Z (K/W)
Steady State Value:
R = 0.23 K/W
(DC Operation)
thJC
SD200N/R Series
SD200N/R Series
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Bulletin I2080 rev. B 11/01
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7309
Visit us at www.irf.com for sales contact information. 11/01
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial Level.
Qualification Standards can be found on IR's Web site.