DS34LV86T www.ti.com SNLS115D - JUNE 2000 - REVISED APRIL 2013 DS34LV86T 3V Enhanced CMOS Quad Differential Line Receiver Check for Samples: DS34LV86T FEATURES DESCRIPTION * * The DS34LV86T is a high speed quad differential CMOS receiver that meets the requirements of both TIA/EIA-422-B and ITU-T V.11. The CMOS DS34LV86T features typical low static ICC of 9 mA which makes it ideal for battery powered and power conscious applications. The Tri-State enables, EN, allow the device to be disabled when not in use to minimize power consumption. The dual enable scheme allows for flexibility in turning receivers on and off. 1 * * * * * * * * * * * Low Power CMOS Design (30 mW Typical) Interoperable With Existing 5V RS-422 Networks Industrial Temperature Range Meets TIA/EIA-422-B (RS-422) and ITU-T V.11 Recommendation 3.3V Operation 7V Common Mode Range @ VID = 3V 10V Common Mode Range @ VID = 0.2V Receiver OPEN Input Failsafe Feature Ensured AC Parameter: - Maximum Receiver Skew: 4 ns - Transition Time: 10 ns Pin Compatible With DS34C86T 32 MHz Toggle Frequency >6.5k ESD Tolerance (HBM) Available in SOIC Packaging The receiver output (RO) is ensured to be High when the inputs are left open. The receiver can detect signals as low as 200 mV over the common mode range of 10V. The receiver outputs (RO) are compatible with TTL and LVCMOS levels. Connection Diagram Figure 1. SOIC (Top View) See Package Number D 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2013, Texas Instruments Incorporated DS34LV86T SNLS115D - JUNE 2000 - REVISED APRIL 2013 www.ti.com TRUTH TABLE (1) Enable EN (1) Inputs RI+-RI- Output RO L X Z H VID +0.2V H H VID -0.2V L H Open H L = Logic Low H = Logic High X = Irrelevant Z = Tri-State = Open, Not Terminated These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Supply Voltage (VCC) +7V Enable Input Voltage (EN) +7V Receiver Input Voltage (VID: RI+, RI-) 14V Receiver Input Voltage (VCM: RI+, RI-) 14V -0.5V to VCC + 0.5V Receiver Output Voltage (RO) Receiver Output Current (RO) Maximum Package Power Dissipation @ +25C 25 mA D Package 1190 mW Derate D Package 9.8 mW/C above +25C Storage Temperature Range -65C to +150C Lead Temperature Range Soldering (4 Seconds) +260C ESD Ratings (HBM, 1.5k, 100 pF) Receiver Inputs and Enables 6.5 kV 2 kV Other Pins (1) (2) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. The table of Electrical Characteristics specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. RECOMMENDED OPERATING CONDITIONS Supply Voltage (VCC) Operating Free Air 2 Temperature (TA) Min Typ Max 3.0 3.3 3.6 V -40 +25 +85 C Submit Documentation Feedback Units Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: DS34LV86T DS34LV86T www.ti.com SNLS115D - JUNE 2000 - REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS (1) (2) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. Symbol Parameter Conditions VTH Differential Input Threshold VOUT = VOH or VOL -7V < VCM < +7V VHY Hysteresis VCM = 1.5V VIH Minimum High Level Input Voltage VIL Minimum Low Level Input Voltage RIN Input Resistance VIN = -7V, +7V (Other Input = GND) IIN Input Current (Other Input = 0V, Power On or VCC = 0V) VIN = +10V Pin Min Typ Max Units RI+, RI- -200 17.5 +200 mV 35 EN VIN = +3V VIN = 0.5V VIN = -3V VIN = -10V IEN VIN = 0V to VCC VOH High Level Output Voltage IOH = -6 mA, VID = +1V IOH = -6 mA, VID = OPEN VOH High Level Output Voltage IOH = -100 A, VID = +1V IOH = -100 A, VID = OPEN VOL Low Level Output Voltage IOL = +6 mA, VID = -1V IOZ Output Tri-State Leakage Current VIN = VCC or GND EN = VIL ISC Output Short Circuit Current VO = 0V, VID |200 mV| See (3) ICC Power Supply Current No Load, All RI+, RI- = Open, EN = VCC or GND (1) (2) (3) V 0.8 5.0 RI+, RI- 8.5 V k 0 1.1 0 0.27 mA -0.02 mA 0 -0.43 mA 0 -1.26 EN 2.4 -10 1.8 mA -2.2 mA 1 A 3 V VCC - 0.1 V 0.13 RO VCC mV 2.0 0.5 V 50 A -35 -70 mA 9 15 mA Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VID. All typicals are given for: VCC = +3.3V, TA = +25C. Short one output at a time to ground. Do not exceed package power dissipation ratings. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: DS34LV86T 3 DS34LV86T SNLS115D - JUNE 2000 - REVISED APRIL 2013 www.ti.com SWITCHING CHARACTERISTICS (1) (2) (3) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. Symbol Parameter Conditions Typ Max Units 6 17.5 35 ns 6 17.8 35 ns tPHL Propagation Delay High to Low tPLH Propagation DeIay Low to High tr Rise Time (20% to 80%) 4.1 10 ns tf Fall Time (80% to 20%) 3.3 10 ns tPHZ Disable Time 40 ns tPLZ Disable Time 40 ns tPZH Enable Time 40 ns tPZL Enable Time tSK1 Skew, |tPHL - tPLH| See (4) tSK2 Skew, Pin to Pin See (5) CL = 50 pF See (Figure 4 and Figure 5) Skew, Part to Part See fMAX Maximum Operating Frequency See (7) (7) CL = 15 pF (6) tSK3 (1) (2) (3) (4) (5) (6) CL = 15 pF See (Figure 2 and Figure 3 ) Min CL = 15 pF 40 ns 0.3 4 ns 0.6 4 ns 7 17 32 ns MHz All typicals are given for: VCC = +3.3V, TA = +25C. Generator waveform for all tests unless otherwise specified: f = 1 MHz, Duty Cycle = 50%, ZO = 50, tr 10 ns, tf 10 ns. CL includes probe and jig capacitance. tSK1 is the |tPHL - tPLH| of a channel. tSK2 is the maximum skew between any two channels within a device, on either edge. tSK3 is the difference in propagation delay times between any channels of any devices. This specification (maximum limit) applies to devices within VCC 0.1V of one another,and a Delta TA = 5C (between devices) within the operating temperature range. This parameter is specified by design and characterization. All channels switching, output duty cycle criteria is 40%/60% measured at 50% Input = 1V to 2V, 50% Duty Cycle, tr/tf 5 ns. This parameter is ensured by design and characterization. PARAMETER MEASUREMENT INFORMATION Generator waveform for all tests unless otherwise specified: f = 1 MHz, Duty Cycle = 50%, ZO = 50, tr 10 ns, tf 10 ns. CL includes probe and jig capacitance. Figure 2. Receiver Propagation Delay and Transition Time Test Circuit 4 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: DS34LV86T DS34LV86T www.ti.com SNLS115D - JUNE 2000 - REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION (continued) Generator waveform for all tests unless otherwise specified: f = 1 MHz, Duty Cycle = 50%, ZO = 50, tr 10 ns, tf 10 ns. CL includes probe and jig capacitance. Figure 3. Receiver Propagation Delay and Transition Time Waveform Figure 4. Receiver Tri-State Test Circuit Generator waveform for all tests unless otherwise specified: f = 1 MHz, Duty Cycle = 50%, ZO = 50, tr 10 ns, tf 10 ns. CL includes probe and jig capacitance. Figure 5. Receiver Tri-State Output Enable and Disable Waveforms Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: DS34LV86T 5 DS34LV86T SNLS115D - JUNE 2000 - REVISED APRIL 2013 www.ti.com TYPICAL APPLICATION INFORMATION General application guidelines and hints for differential drivers receivers may be found in the following application notes: AN-214 (SNLA137), AN-457 (SNLA148), AN-805 (SNOA233), AN-847 (SNLA031), AN-903 (SNLA034), AN-912 (SNLA036), AN-916 (SNLA219) Power Decoupling Recommendations: Bypass caps must be used on power pins. High frequency ceramic (surface mount is recommended) 0.1 F in paraIIel with 0.01 F at the power supply pin. A 10 F or greater solid tantalum or electrolytic should be connected at the power entry point on the printed circuit board. RT is optional although highly recommended to reduce reflection Figure 6. Typical Receiver Connections Figure 7. Typical Receiver Output Waveforms 6 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: DS34LV86T DS34LV86T www.ti.com SNLS115D - JUNE 2000 - REVISED APRIL 2013 Figure 8. Typical Receiver Input Circuit Figure 9. Typical ICC vs Frequency Figure 10. IIN vs VIN (Power On, Power Off) Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: DS34LV86T 7 DS34LV86T SNLS115D - JUNE 2000 - REVISED APRIL 2013 www.ti.com Figure 11. IOL vs VOL Figure 12. IOH vs VOH 8 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: DS34LV86T DS34LV86T www.ti.com SNLS115D - JUNE 2000 - REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D * Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: DS34LV86T 9 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) DS34LV86TM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 DS34LV86 TM DS34LV86TMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 DS34LV86 TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Mar-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS34LV86TMX/NOPB Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 10.3 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Mar-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS34LV86TMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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