INTEGRATED CIRCUITS DATA SHEET HT1 DC20 S30 HITAGTM1 Stick Transponder Product Specification Revision 3.0 2000 Apr 19 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder HT1 DC20 S30 CONTENTS 1 FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . 3 3 ORDERING INFORMATION. . . . . . . . . . . . . . . . . . . 4 4 QUICK REFERENCE DATA . . . . . . . . . . . . . . . . . . . 4 5 BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 RELATED DOCUMENTS . . . . . . . . . . . . . . . . . . . . . 6 7 WRITE COMMAND - SAFETY INSTRUCTIONS . . . 6 8 LIMITING VALUES . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . 7 10 MECHANICAL CHARACTERISTICS . . . . . . . . . . . . 8 11 DEFINITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 LIFE SUPPORT APPLICATIONS . . . . . . . . . . . . . . . 9 13 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . 10 2000 Apr 19 2 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder 1 HT1 DC20 S30 FEATURES 2 * Complete identification transponder for use in contactless applications GENERAL DESCRIPTION The HT1 DC20 S30, based on the HITAG 1 IC, is a high performance transponder for bi-directional data transmission in half duplex mode. * Operating frequency 125 kHz * Data transmission and supply energy via RF link, no internal battery Data are stored in the transponder in a non -volatile memory (EEPROM). The transponder acts as a passive device, thus not having the need for any internal power supply (battery). * Low power EEPROM technology for writing distance that equals reading distance * Total memory size 2048 bit It derives power from the magnetic component of the RF carrier frequency generated by the reader. Data is transmitted by modulating this carrier. * Parts of memory can be write protected by the user * Effective communication protocol with outstanding data integrity check The HT1 DC20 S30 is dedicated for use in secure access systems where the transponder and the reader have to identify each other. * Secure mutual authentication function * Encrypted data transmission The EEPROM has a capacity of 2048 bits and is organised in 64 pages. Access is provided either in page mode or in block mode, where 1 block includes 4 pages. * Anticollision protocol for handling of multiple transponders inside the field of the reader antenna. Absorption modulation is used to transmit data from the transponder to the reader. The transponder absorbs the magnetic field which hence modulates the current in the reader antenna. Data transmission to the HT1 DC20 S30 uses binary pulse length modulation (BPLM). The anticollision feature of the transponder allows to operate several transponders simultaneously in the field of the reader antenna. To use that feature, the reader needs to have implemented the anticollision protocol and must be able to detect bit-collisions. (e.g. the Philips HTRM800 long range reader module includes the anticollision protocol.) 2000 Apr 19 3 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder 3 ORDERING INFORMATION EXTENDED TYPE NUMBER HT1 DC20 S30/F 4 HT1 DC20 S30 PACKAGE DRAWING TEMPERATURE RANGE (C) SOT385-1 SOT385BA4 -40 to +85 QUICK REFERENCE DATA PARAMETER VALUE Carrier frequency 125 Data transmission mode half-duplex UNIT kHz (typical) Transfer rate * transponder -> reader 4.0 kbit/s * reader -> transponder 5.2 kbit/s Coding * transponder -> reader Manchester / Biphase * reader -> transponder BPLM (binary pulse length modulation) Modulation ASK (amplitude shift keying) Memory size 2048 bit Memory organization 64 page * Serial Number 32 bit * Secret Key 32 bit Special features * user defined write protection Encrypted mutual authentication * unique 32 bit serial number for each transponder * encrypted data transmission possible 2000 Apr 19 4 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder 5 HT1 DC20 S30 BLOCK DIAGRAM HT1 DC20 S30 CONTACTLESS INTERFACE CONTROL LOGIC RECTIFIER VOLTAGE LIMITER DATA ACQUISITION POWER-ON RESET EEPROM ACCESS CONTROL CLOCK RECOVERY L CALCULATION UNIT C MODULATOR DEMODULATOR EEPROM TRANSPONDER IC Fig.1 Blockdiagram transponder. 2000 Apr 19 5 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder 6 HT1 DC20 S30 RELATED DOCUMENTS For additional informations on the functional description of the HT1 DC20 S30, in particular the protocol between reader and transponder please refer to the document Data Sheet, HT1 Transponder Family, Communication Protocol Reader HITAG 1 Transponder." 7 WRITE COMMAND - SAFETY INSTRUCTIONS When writing to page 1 (configuration page) we strongly recommend to carefully follow the instructions in the document "HT1 Transponder Family, Communication Protocol, Reader - HITAG1 Transponder". In particular, overwriting the reserved bits in configuration page 1 may lead to reduced reading range of the HT1 DC20 S30. 8 LIMITING VALUES All values are in accordance with the Absolute Maximum Rating System (IEC 134). PARAMETER number of erase/write cycles of the EEPROM data retention time of the EEPROM CONDITION MIN. 22 C 100000 @ 55 C 10 MAX. UNIT years operating temperature range -40 85 C storage temperature range -55 125 C 0.2 T 10 g 1500 g magnetic flux density (resistivity against magnetic pulses) vibration 10 - 2000 Hz 3-axis IEC 68-2-6, Test Fc shock 3-axis IEC 68-2-27, Test Ea 2000 Apr 19 6 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder HT1 DC20 S30 9 ELECTRICAL CHARACTERISTICS T0 = 8 s (period length for f0 = 125 kHz). All parameters are guaranteed within the temperature range from Tamb = -40C to +85C. All parameters are characterized with the SCEMTEC test equipment (STM-1), available from SCEMTEC, Reichshof-Wenrath, Germany. SYMBOL PARAMETER CONDITION MIN. MAX. 130 UNIT fRES resonance frequency 120 BW bandwidth 2.3 BTHR magnetic flux density, data transmission from transponder fCARRIER = 125 kHz 50 400 (1) Tpp BPRG magnetic flux density for programming the EEPROM m = 0.95 f0 = 125 kHz tLOW = 8 T0 50 400 (1) Tpp BAUTH magnetic flux density for mutual authentication m = 0.95 f0 = 125 kHz tLOW = 8 T0 50 400 (1) Tpp BREAD field absorption due to the modulation of the transponder f0 = 125 kHz BFIELD = 50 Tpp 8 MIPRG modulation index (m) of the base station for programming and authentication f0 = 125 kHz BFIELD = 50 Tpp tLOW = 8 T0 95 Tpp 100 Note Bmin Bmax 1. Maximum available field strength of the test equipment. Transponder limit has not been characterized. ( B max - B min ) m = -------------------------------------------( B max + B min ) B read = B max - B min Fig.2 Definition of modulation index. 2000 Apr 19 7 kHz kHz % Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder HT1 DC20 S30 10 MECHANICAL CHARACTERISTICS The transponder is sealed in epoxy resin moulding compound. The outline of the package is given in Fig.3. The designation of the package is SOT385-1. PARAMETER mechanical dimensions VALUE UNIT 12 x 6 x 3 mm protection class IP67 casting material epoxy resin . ax t ed o fi .5 if n eci 1.1-1.2 11.9-12.1 0.165 A m 0 , p R adii se s i lR w 5.9-6.1 4.4 - 4.6 al her ot A 0-7 ( 5x ) 4.9-5.1 44 -46 1.9-2.1 2.9-3.05 Cross Section A-A ( without Scale ) x) (5 0-7 Protruding plastic must not exceed specified dimension by more than 0.2 mm Fig.3 Package outlines SOT385-1. 2000 Apr 19 8 0 -1. .9 R0 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder HT1 DC20 S30 11 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 12 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Apr 19 9 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder HT1 DC20 S30 13 REVISION HISTORY Table 1 HITAGTM1 Stick Transponder Revision History REVISION 3.0 2000 Apr 19 DATE April 2000 CPCN - PAGE DESCRIPTION Initial version. 10 Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19 HITAGTM1 Stick Transponder HT1 DC20 S30 NOTES 2000 Apr 19 11 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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