DATA SH EET
INTEGRATED CIRCUITS
HT1 DC20 S30
HITAGTM1 Stick Transponder
Product Specification
Revision 3.0 2000 Apr 19
2000 Apr 19 2
Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19
HITAGTM1 Stick Transponder HT1 DC20 S30
CONTENTS
1 FEATURES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . 3
3 ORDERING INFORMATION. . . . . . . . . . . . . . . . . . . 4
4 QUICK REFERENCE DATA. . . . . . . . . . . . . . . . . . . 4
5 BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 RELATED DOCUMENTS . . . . . . . . . . . . . . . . . . . . . 6
7 WRITE COMMAND - SAFETY INSTRUCTIONS . . . 6
8 LIMITING VALUES . . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 ELECTRICAL CHARACTERISTICS. . . . . . . . . . . . . 7
10 MECHANICAL CHARACTERISTICS . . . . . . . . . . . . 8
11 DEFINITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 LIFE SUPPORT APPLICATIONS. . . . . . . . . . . . . . . 9
13 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . 10
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Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19
HITAGTM1 Stick Transponder HT1 DC20 S30
1 FEATURES
Complete identification transponder for use in
contactless applications
Operating frequency 125 kHz
Data transmission and supply energy via RF link, no
internal battery
Low power EEPROM technology for writing distance
that equals reading distance
Total memory size 2048 bit
Parts of memory can be write protected by the user
Effective communication protocol with outstanding data
integrity check
Secure mutual authentication function
Encrypted data transmission
Anticollision protocol for handling of multiple
transponders inside the field of the reader antenna.
2 GENERAL DESCRIPTION
The HT1 DC20 S30, based on the HITAG 1 IC, is a high
performance transponder for bi-directional data
transmission in half duplex mode.
Data are stored in the transponder in a non –volatile
memory (EEPROM). The transponder acts as a passive
device, thus not having the need for any internal power
supply (battery).
It derives power from the magnetic component of the RF
carrier frequency generated by the reader. Data is
transmitted by modulating this carrier.
The HT1 DC20 S30 is dedicated for use in secure access
systems where the transponder and the reader have to
identify each other.
TheEEPROMhas acapacity of2048bitsandis organised
in 64 pages. Access is provided either in page mode or in
block mode, where 1 block includes 4 pages.
Absorption modulation is used to transmit data from the
transponder to the reader. The transponder absorbs the
magnetic field which hence modulates the current in the
reader antenna. Data transmission to the HT1 DC20 S30
uses binary pulse length modulation (BPLM).
The anticollision feature of the transponder allows to
operateseveraltransponderssimultaneouslyin thefieldof
the reader antenna. To use that feature, the reader needs
tohave implementedtheanticollisionprotocolandmust be
able to detect bit-collisions. (e.g. the Philips HTRM800
long range reader module includes the anticollision
protocol.)
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HITAGTM1 Stick Transponder HT1 DC20 S30
3 ORDERING INFORMATION
4 QUICK REFERENCE DATA
EXTENDED TYPE NUMBER PACKAGE DRAWING TEMPERATURE
RANGE (°C)
HT1 DC20 S30/F SOT385-1 SOT385BA4 40 to +85
PARAMETER VALUE UNIT
Carrier frequency 125 kHz (typical)
Data transmission mode half-duplex
Transfer rate
transponder -> reader
reader -> transponder 4.0
5.2
kbit/s
kbit/s
Coding
transponder -> reader
reader -> transponder Manchester / Biphase
BPLM (binary pulse length modulation)
Modulation ASK (amplitude shift keying)
Memory size 2048 bit
Memory organization 64 page
Encrypted mutual authentication
Serial Number
Secret Key 32
32
bit
bit
Special features user defined write protection
unique 32 bit serial number for each transponder
encrypted data transmission possible
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Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19
HITAGTM1 Stick Transponder HT1 DC20 S30
5 BLOCK DIAGRAM
Fig.1 Blockdiagram transponder.
RECTIFIER
VOLTAGE LIMITER DATA
ACQUISITION
POWER-ON
RESET
CLOCK
RECOVERY
MODULATOR
DEMODULATOR
EEPROM
ACCESS CONTROL
CALCULATION UNIT
EEPROM
CONTROL LOGIC
CONTACTLESS INTERFACE
TRANSPONDER IC
HT1 DC20 S30
C
L
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Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19
HITAGTM1 Stick Transponder HT1 DC20 S30
6 RELATED DOCUMENTS
For additional informations on the functional description of the HT1 DC20 S30, in particular the protocol between reader
and transponder please refer to the document „Data Sheet, HT1 Transponder Family, Communication Protocol
Reader HITAG 1 Transponder.“
7 WRITE COMMAND - SAFETY INSTRUCTIONS
When writing to page 1 (configuration page) we strongly recommend to carefully follow the instructions in the document
"HT1 Transponder Family, Communication Protocol, Reader - HITAG1 Transponder". In particular, overwriting the
reserved bits in configuration page 1 may lead to reduced reading range of the HT1 DC20 S30.
8 LIMITING VALUES
All values are in accordance with the Absolute Maximum Rating System (IEC 134).
PARAMETER CONDITION MIN. MAX. UNIT
number of erase/write cycles of the EEPROM 22 °C 100000
data retention time of the EEPROM @ 55 °C 10 years
operating temperature range 40 85 °C
storage temperature range 55 125 °C
magnetic flux density (resistivity against
magnetic pulses) 0.2 T
vibration 10 2000 Hz
3-axis
IEC 68-2-6, Test Fc
10 g
shock 3-axis
IEC 68-2-27, Test Ea
1500 g
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HITAGTM1 Stick Transponder HT1 DC20 S30
9 ELECTRICAL CHARACTERISTICS
T0 = 8 µs (period length for f0 = 125 kHz). All parameters are guaranteed within the temperature range from
Tamb =40°C to +85°C.
All parameters are characterized with the SCEMTEC test equipment (STM-1), available from SCEMTEC,
Reichshof-Wenrath, Germany.
Note
1. Maximum available field strength of the test equipment. Transponder limit has not been characterized.
SYMBOL PARAMETER CONDITION MIN. MAX. UNIT
fRES resonance frequency 120 130 kHz
BWbandwidth 2.3 kHz
BTHR magnetic flux density,
data transmission from transponder fCARRIER = 125 kHz 50 400 (1) µTpp
BPRG magnetic flux density for programming
the EEPROM m = 0.95
f0 = 125 kHz
tLOW = 8 T0
50 400 (1) µTpp
BAUTH magnetic flux density for mutual
authentication m = 0.95
f0 = 125 kHz
tLOW = 8 T0
50 400 (1) µTpp
BREAD field absorption due to the modulation
of the transponder f0= 125 kHz
BFIELD =50µTpp
8µTpp
MIPRG modulation index (m) of the base
station for programming and
authentication
f0= 125 kHz
BFIELD =50µTpp
tLOW = 8 T0
95 100 %
Fig.2 Definition of modulation index.
B
min
B
max
mBmax Bmin
()
Bmax Bmin
+()
--------------------------------------------
=
Bread Bmax Bmin
=
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Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19
HITAGTM1 Stick Transponder HT1 DC20 S30
10 MECHANICAL CHARACTERISTICS
The transponder is sealed in epoxy resin moulding compound. The outline of the package is given in Fig.3. The
designation of the package is SOT385-1.
PARAMETER VALUE UNIT
mechanical dimensions 12 x 6 x 3 mm
protection class IP67
casting material epoxy resin
Fig.3 Package outlines SOT385-1.
otherwise specified
Protruding plastic must not exceed
specified dimension by more than 0.2 mm
all Radii, if not
A
A
1.1-1.2
2.9-3.05
4.9-5.1 1.9-2.1
4.4 - 4.6
11.9-12.1
5.9-6.1
R 0.5 max.
0-7˚ (5x)
0-7˚ (5x)
44˚-46˚
0.165
( without Scale )
Cross Section A-A
R 0.9-1.0
2000 Apr 19 9
Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19
HITAGTM1 Stick Transponder HT1 DC20 S30
11 DEFINITIONS
12 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so on their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
2000 Apr 19 10
Philips Semiconductors Product Specification Revision 3.0 2000 Apr 19
HITAGTM1 Stick Transponder HT1 DC20 S30
13 REVISION HISTORY
Table 1 HITAGTM1 Stick Transponder Revision History
REVISION DATE CPCN PAGE DESCRIPTION
3.0 April 2000 - Initial version.
2000 Apr 19 11
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HITAGTM1 Stick Transponder HT1 DC20 S30
NOTES
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