General Description
The MAX77826 is a subpower management IC for the
latest 3G/4G smartphones and tablets. The MAX77826
contains a high-efficiency BUCK regulator, a BUCK
BOOST regulator and 15 LDOs to power up peripherals.
The MAX77826 also provides power on/off control logic
and an I2C serial interface to program individual regulator
output voltages and on/off control for complete flexibility.
The linear regulators support a remote cap feature and
provide greater than 70dB PSRR and less than 45µVRMS
noise.
The MAX77826 features I2C-compatible, 2-wire serial
interface that comprises a bidirectional serial data line
(SDA) and a serial clock line (SCL). The MAX77826 sup-
ports SCL clock rates up to 3.4MHz.
Applications
GSM, GPRS, EDGE, CDMA WCDMA, and LTE
Smartphones and Tablets
Benets and Features
Compact Total Solution Size Allows More Peripheral
Devices in Smartphones and Tablets
3A High-E󰀩ciency BUCK Regulator
DVS (Dynamic Voltage Scaling) Through HS I2C
±1% (typ) Output Voltage DC Accuracy
Low Power Mode
2A BUCK BOOST Regulator
15 Linear Regulators with Remote Cap
3 NMOS LDOs (VOUT Range: 0.6V to 2.1875V
with 12.5mV Step)
1 x 150mA
1 x 450mA
1 x 600mA
6 PMOSLV LDOs (VOUT Range: 0.8V to 3.975V
with 25mV Step)
3 x 150mA
3 x 300mA
6 PMOSLS LDOs (VOUT Range: 0.8V to 3.975V
with 25mV Step)
3 x 150mA
3 x 300mA
±1.5% Typical Output Voltage DC Accuracy
70dB PSRR at 1kHz
Low Power Mode with 2µA (typ) for all LDOs
Simple Management of Power-Up/Down Sequence,
Output Voltage Setting, and Fault Detection
High-Speed (Up to 3.4MHz) I2C Serial Interface
Ordering Information appears at end of data sheet.
19-6893; Rev 1; 7/15
MAX77826 Power Management IC
EVALUATION KIT AVAILABLE
SYS, VIO, INL1, INL2, INL3,
INL4, INL5 to GND ...........................................-0.3V to +6.0V
INB to PGNDB......................................................-0.3V to +6.0V
INBB, OUTBB to PGNDBB ..................................-0.3V to +6.0V
PGNDB, PGNDBB to GND ..................................-0.3V to +0.3V
IRQB, CE, SDA, SCL to GND ................. -0.3V to (VVIO + 0.3V)
FB_B, ENBB, ENB, ENL12,
REFBYP to GND ................................ -0.3V to (VSYS + 0.3V)
FB_BB to PGNDBB ............................ -0.3V to (VOUTBB + 0.3V)
LXB to PGNDB ........................................ -0.3V to (VINB + 0.3V)
LXBB1 to PGNDBB ............................... -0.3V to (VINBB + 0.3V)
LXBB2 to PGNDBB ............................-0.3V to (VOUTBB + 0.3V)
LDO1, LDO2 to GND ............................. -0.3V to (VINL1 + 0.3V)
LDO3 to GND ......................................... -0.3V to (VINL2 + 0.3V)
LDO4, LDO5, LDO6, LDO7, LDO8,
LDO9 to GND ..................................... -0.3V to (VINL3 + 0.3V)
LDO10, LDO11 to GND .......................... -0.3V to (VINL4 + 0.3V)
LDO12, LDO13, LDO14,
LDO15 to GND ................................... -0.3V to (VINL5 + 0.3V)
LXB Continuous RMS Current (Note 1) ..................................3A
LXBB1/LXBB2 Continuous RMS Current (Note 1) ..............3.3A
Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
WLP
Junction-to-Ambient Thermal Resistance (θJA) ..........37°C/W
(Note 2)
Note 1: LX_ node has internal clamp diodes to PGND_ and INB_. Applications that give forward bias to these diodes should ensure
that the total power loss does not exceed IC’s package power dissipation limits.
(VSYS = VIN_ = +3.7V, VIO = 1.8V, TA = -40°C to +85°C, unless otherwise noted.)
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Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Package Thermal Characteristics
General Electrical Characteristics
VPARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Shutdown Supply Current ISHDN_SYS CE = low 2.5 10 µA
Standby Current IQ_SYS CE = high and all regulators are o󰀨 35 µA
Shutdown VIO Current ISHDN_VIO All regulators are o󰀨 0 µA
No Load Supply Current 1 INO_LOAD1
BUCK is on in normal mode
(no switching) 60 µA
No Load Supply Current 2 INO_LOAD2
BUCK and BUCK BOOST are on in
normal mode (no switching) 120 µA
No Load Supply Current 3 INO_LOAD3
All regulators are on in normal
mode (no switching) 400 700 µA
VSYS UNDERVOLTAGE LOCKOUT
VSYS Undervoltage Lockout
Threshold
VUVLO_R VSYS rising 2.375 2.50 2.625 V
VUVLO_F VSYS falling (default) 2.05
REFERENCE
REFBYP Output Voltage 0.786 0.80 0.814 V
REFBYP Supply Rejection 2.7V ≤ VSYS ≤ 5.5V 0.2 mV/V
(VSYS = VIN_ = +3.7V, VIO = 1.8V, TA = -40°C to +85°C, unless otherwise noted.)
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General Electrical Characteristics (continued)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
THERMAL SHUTDOWN
Thermal Shutdown Threshold TSHDN TJ rising, 15°C hysteresis +165 °C
Thermal Interrupt at +120°C T120 TJ rising, 15°C hysteresis +120 °C
Thermal Interrupt at +140°C T140 TJ rising, 15°C hysteresis +140 °C
LOGIC AND CONTROL INPUTS
Input Low Level VIL
ENB, ENBB,
ENL12
VSYS ≤ 4.5V
TA = +25°C 0.4 V
CE TA = +25°C 0.3 x VVIO
Input High Level VIH
ENB, ENBB,
ENL12
VSYS ≤ 4.5V
TA = 25°C 1.2 V
CE TA = +25°C 0.7 x VVIO
Logic Input Leakage Current ILEAK
CE
(0V < VIO < 1.8V)
TA = +25°C -1 +1 µA
TA = +85°C 0.1
IRQB Output Low Voltage VOL ISINK = 1mA 0.4 V
IRQB Output High Leakage IOZH VIO = 5.5V TA = +25°C -1 +1 µA
TA = +85°C 0.1
INTERNAL PULLDOWN RESISTANCE
ENB, ENBB, ENL12 RPD Pulldown resistor to GND 400 800 1600 kΩ
(VSYS = VIN_ = +3.7V, VIO = 1.8V, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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I2C Electrical Characteristics
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
VIO Voltage VVIO 1.7 3.6 V
SDA AND SCL I/O STAGES
SCL, SDA Input High Voltage VIH 0.7 x VVIO V
SCL, SDA Input Low Voltage VIL 0.3 x VVIO V
SCL, SDA Input Hysteresis VHYS 0.05 x VVIO V
SCL, SDA Input Current IIVIO = 3.7V -10 +10 µA
SDA Output Low Voltage VOL ISINK = 20mA 0.4 V
SCL, SDA Pin Capacitance CI10 pF
Output Fall Time from
VIO to 0.3 x VIO
tOF 120 ns
I2C-COMPATIBLE INTERFACE TIMING (STANDARD, FAST, AND FAST MODE PLUS) (Note 3)
Clock Frequency fSCL 1000 kHz
Hold Time (REPEATED) START
Condition tHD;STA 0.26 µs
CLK Low Period tLOW 0.5 µs
CLK High Period tHIGH 0.26 µs
Setup Time REPEATED START
Condition tSU;STA 0.26 µs
DATA Hold Time tHD:DAT 0 µs
DATA Setup Time tSU;DAT 50 ns
Setup Time for STOP Condition tSU;STO 0.26 µs
Bus-Free Time Between
STOP and START tBUF 0.5 µs
Capacitive Load for
Each Bus Line CB550 pF
Maximum Pulse Width of
Spikes That Must Be
Suppressed by the Input Filter
50 ns
(VSYS = VIN_ = +3.7V, VIO = 1.8V, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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I2C Electrical Characteristics (continued)
PARAMETER SYMBOL CONDITIONS CB = 100pF CB = 400pF UNITS
MIN TYP MAX MIN TYP MAX
I2C-COMPATIBLE INTERFACE TIMING (HS MODE)
Clock Frequency fSCL 3.4 1.7 MHz
Set-Up Time REPEATED
START Condition tSU;STA 160 160 ns
Hold Time (REPEATED)
START Condition tHD;STA 160 160 ns
CLK Low Period tLOW 160 320 ns
CLK High Period tHIGH 60 120 ns
DATA Setup time tSU:DAT 10 10 ns
DATA Hold Time tHD:DAT 35 75 ns
SCL Rise Time
(Note 3) tRCL TA = +25°C 10 40 20 80 ns
Rise Time of SCL Signal
After a REPEATED
START Condition and
After an Acknowledge Bit
(Note 3)
trCL1 TA = +25°C 10 80 20 160 ns
SCL Fall Time
(Note 3) tfCL TA = +25°C 10 40 20 80 ns
SDA Rise Time
(Note 3) trDA TA = +25°C 80 160 ns
SDA Fall Time
(Note 3) tfDA TA = +25°C 80 160 ns
Set-Up Time for STOP
Condition tSU;STO 160 160 ns
Capacitive Load for Each
Bus Line CB100 400 pF
Maximum Pulse Width
of Spikes That Must Be
Suppressed by the Input
Filter
10 10 ns
(VSYS = VINB = +3.7V, VFB_B = VOUT = 1.25V, TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 4)
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BUCK Electrical Characteristics
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range Parametric 2.6 5.5 V
Shutdown Supply Current
(Note 3) 0.1 µA
Supply Quiescent Current
(Note 3)
No switching,
No load
Normal mode 22 µA
Low power mode 8
Output Voltage Range I2C-programmable 6.25mV step 0.5 1.8 V
Output Voltage Accuracy VINB = 2.6V to 4.5V,
VOUT = 1.25V, no load
PWM mode, TA = +25°C -1.0 +1.0 %
Low power mode -3.0 +4.0
Line Regulation VINB = 2.6V to 4.5V 0.200 %/V
Load Regulation (Note 3) VOUT = 1.25V 0.125 %/A
Transient Load Response,
VDROOP (Note 3)
VOUT = 1.25V, IOUT changes from 0A to 1.5A in 6µs,
COUT_ACTUAL = 22µF, L = 0.47µH -50 mV
Soft-Start Slew Rate 14 mV/µs
Output Voltage Ramp-Up Slew
Rate
RAMP[1:0] = 00b (default) 12.5
mV/µs
RAMP[1:0] = 01b 25
RAMP[1:0] = 10b 50
RAMP[1:0] = 11b 100
Maximum Output Current Normal mode 3000 mA
Low power mode 10
Peak Current Limit 3.30 4.25 5.50 A
Valley Current Limit 3.825 A
Negative Current Limit 1.000 A
N-FET Zero-Crossing
Threshold Skip mode 20 mA
Switching Frequency 1.8 2 2.2 MHz
Turn-On Delay Time EN signal to LX switching with bias ON 30 µs
HS PMOS RDSON VINB = 3.7V, INB to LX, ILX = 200mA 60 mΩ
LS NMOS RDSON VINB = 3.7V, LX to PGNDB, ILX = 200mA 35 mΩ
Output Active Discharge
Resistance Output disabled, resistance from FB_B to PGNDB 100
LX Leakage VLXB = 5.5V or 0V TA = +25°C -1 0.1 +1 µA
TA = +85°C 1
POWER-OK COMPARATOR
Output POK Trip Level VOUT POK rising threshold 90 %
Output POK Hysteresis VOUT when VPOK switches 5 %
(VINBB = +3.7V, VOUTBB = +3.5V, TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 5)
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BUCK BOOST Electrical Characteristics
PARAMETER CONDITIONS MIN TYP MAX UNITS
GENERAL
Operating Input Voltage Range Supplied from VSYS 2.6 5.5 V
Shutdown Supply Current VINBB = 5.5V,
VOUTBB = 0V
TA = +25°C 0.01 µA
TA = +85°C 1
Input Supply Current Enabled, no
load
HSKIP mode (no switching) 60 µA
FPWM mode (switching) 9 mA
Active Discharge Resistance 100 Ω
Thermal Shutdown TA rising, 20°C hysteresis +165 °C
H-BRIDGE
Maximum Output Current (Note 6) VINBB = 3.0V, VOUTBB = 3.5V 2000 mA
VINBB = 2.6V, VOUTBB = 3.5V 1500
Default Output Voltage No load, BB_VOUT[6:0] = 0x48 3.5 V
Output Voltage Accuracy BB_VOUT[6:0] = 0x48,
no load
PWM mode -1.0 +1.0
%
HSKIP mode
TA = +25°C -1.0 +4.0
Output Voltage Range I2C programmable (12.5mV step) 2.6 4.1875 V
Line Regulation VINBB = 2.6V to 5.5V 0.200 %/V
Load Regulation (Note 3) VOUTBB = 3.5V 0.125 %/A
Transient Load Response, VDROOP
(Note 3)
VINBB = 3.8V, VOUTBB = 3.5V,
IOUT changes from 10mA to 1A in 10µs, COUT_
ACTUAL = 47µF, L = 1µH
-100 mV
Output Overvoltage Threshold With respect to
VOUTBB
BB_OVP_TH[1:0] = 01b 110
%
BB_OVP_TH[1:0] = 10b 115
BB_OVP_TH[1:0] = 11b
(default) 120
Switching Frequency 2-phase BUCK or BOOST mode 1.6 1.8 2.0 MHz
3-phase mode 0.9
LXBB1, LXBB2 Leakage Current
VLXBB1/2 = 0V or 5.5V,
VOUTBB = 5.5V, VSYS =
VINBB = 5.5V
TA = +25°C 0.1 1
µA
TA = +85°C 0.2
LXBB1/2 Current Limit 3.5 4.5 5.5 A
PMOS On-Resistance ILXBB = 100mA, per switch 65
NMOS On-Resistance ILXBB = 100mA, per switch 55
(VINBB = +3.7V, VOUTBB = +3.5V, TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 5)
Note: LDO12 can also be enabled/disabled by external logic inputs, ENL12.
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BUCK BOOST Electrical Characteristics (continued)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum E󰀨ective Output
Capacitance 0µA < IOUT < 2000mA 16 µF
Turn-On Delay Time From ENBB asserting to LXBB Switching with bias on 6 µs
Soft-Start Time VOUTBB = 3.5V, IOUT = 10mA 40 µs
POWER-OK COMPARATOR
Output POK Trip Level VOUTBB POK rising threshold 80 %
Output POK Hysteresis VOUT when VPOK switches 5 %
LDO Electrical Characteristics
LDO
NO. TYPE VOUT
RANGE (V)
STEP SIZE
(mV)
IOUT
(max, mA)
DEFAULT
VOUT (V)
DEFAULT
ON/OFF
INPUT
PIN COUT (µF)
1 NMOS 0.6–2.1875 12.5 600 1.0 O󰀨 INL1 4.7
2 NMOS 0.6–2.1875 12.5 150 1.0 O󰀨 INL1 1
3 NMOS 0.6–2.1875 12.5 450 1.0 O󰀨 INL2 4.7
4 PMOSLV 0.8–3.975 25 300 1.5 O󰀨 INL3 4.7
5 PMOSLV 0.8–3.975 25 300 1.8 O󰀨 INL3 4.7
6 PMOSLV 0.8–3.975 25 150 1.8 O󰀨 INL3 2.2
7 PMOSLV 0.8–3.975 25 300 1.8 O󰀨 INL3 4.7
8 PMOSLV 0.8–3.975 25 150 1.8 O󰀨 INL3 2.2
9 PMOSLV 0.8–3.975 25 150 1.8 O󰀨 INL3 2.2
10 PMOSLS 0.8–3.975 25 300 2.8 O󰀨 INL4 2.2
11 PMOSLS 0.8–3.975 25 150 2.8 O󰀨 INL4 2.2
12 PMOSLS 0.8–3.975 25 300 3.3 O󰀨 INL5 2.2
13 PMOSLS 0.8–3.975 25 300 3.3 O󰀨 INL5 2.2
14 PMOSLS 0.8–3.975 25 150 3.3 O󰀨 INL5 2.2
15 PMOSLS 0.8–3.975 25 150 3.3 O󰀨 INL5 2.2
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 4.7µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO1 (600mA NMOS)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range
VINLx must be lower than or equal to VSYS VOUT VSYS
VVSYS 2.6 5.5
(Note 7) 1.5
Input Supply Current
Normal mode, no load 2
µA
Low power mode, no load 2
Shutdown < 0.1
System Supply Current
Normal mode, no load 30
µALow power mode, no load 4
Shutdown < 0.1
Output Voltage Programming
Minimum VOUT, Lx_VOUT[6:0] = 7’h00 0.6
VMaximum VOUT, Lx_VOUT[6:0] = 7’h7F 2.1875
Least signicant step size 0.0125
Output Voltage Accuracy
VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V),
VINLx = VOUT + 0.3V to
VSYS
Normal mode
IOUT = 0.1mA to IMAX
-2 +2
%
Low power mode
IOUT = 0.1mA to 5mA -5 +5
Maximum Output Current
(Note 8)
Normal mode 600 mA
Low power mode 5
Load Regulation VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V)
Normal mode
IOUT = 0.1mA to IMAX
0.5
%
Low power mode
IOUT = 0.1mA to 5mA 0.5
Line Regulation
VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V),
IOUT = 0.1mA
Normal mode 0.05
%/V
Low power mode 0.05
Dropout Voltage Normal mode, IOUT = IMAX,
VDO = VINLx - VOUT
VSYS - VOUT = 2.5V 60 150 mV
VSYS - VOUT = 1.5V 100
Output Current Limit VOUT = 90% of
VOUT(TARGET)
Normal mode 900 1800 mA
Low power mode 10
Output Capacitance for Stability DCR < 200mΩ, ESL < 20nH (Note 9) 2.35 4.7 µF
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 4.7µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Noise
Normal mode,
f = 10Hz to 100kHz,
IOUT = 10% of IMAX
VSYS = 2.7V,
VINLx = 1.2V,
VOUT = VOUTMIN
30
µVRMS
VSYS = 2.7V,
VINLx = 1.8V,
VOUT = 1.0V
60
VSYS = VINLx = 5.5V,
VOUT = VOUTMAX
60
Power Supply Rejection Normal mode, f = 1kHz, IOUT = 30mA 70 dB
Output Load Transient
(ΔV/VOUT)
Normal mode, VSYS = 3.7V,
VINLx = 1.8V, VOUT = 1.0V,
IOUT = 1mA to ½ x IMAX to
1mA, tRISE = tFALL = 1µs
COUT = 4.7µF ±5
%
COUT = 10µF ±3
Output Line Transient
Normal mode, VOUT = 1.0V,
IOUT = 1mA, tRISE = tFALL
= 5µs
VSYS = VINLx = 3.7V to
3.2V to 3.7V 5
mV
VSYS = 3.7V, VINLx =
1.8V to 1.5V to 1.8V 5
Output Startup Ramp Rate 10% to 90% 30 mV/µs
Turn-On Delay Time From Lx_EN = 1 to output rising, REFBYP enabled >
300µs prior to LDO being enabled. 5 µs
Output Overshoot during Startup
Overshoot 50 mV
Output Active Discharge
Resistance (Note 10) 100
Thermal Shutdown TJ rising 165 °C
TJ falling 150
POWER-OK COMPARATOR
Output POK Trip Level Rising edge, VOUT when VPOK switches 87.5 %
Output POK Hysteresis VOUT when VPOK switches 5 %
LDO1 (600mA NMOS) (continued)
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 1.0µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO2 (150mA NMOS)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range
VINLx must be lower than or equal to VSYS VOUT VSYS
VVSYS 2.6 5.5
(Note 7) 1.5
Input Supply Current
Normal mode, no load 2
µA
Low power mode, no load 2
Shutdown < 0.1
System Supply Current
Normal mode, no load 25
µALow power mode, no load 3
Shutdown < 0.1
Output Voltage Programming
Minimum VOUT, Lx_VOUT[6:0] = 7’h00 0.6
VMaximum VOUT, Lx_VOUT[6:0] = 7’h7F 2.1875
Least signicant step size 0.0125
Output Voltage Accuracy
VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V),
VINLx = VOUT + 0.3V to
VSYS
Normal mode
IOUT = 0.1mA to IMAX
-2 +2
%
Low power mode
IOUT = 0.1mA to 5mA -5 +5
Maximum Output Current
(Note 8)
Normal mode 150 mA
Low power mode 5
Load Regulation VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V)
Normal mode
IOUT = 0.1mA to IMAX
0.5
%
Low power mode
IOUT = 0.1mA to 5mA 0.5
Line Regulation
VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V),
IOUT = 0.1mA
Normal mode 0.05
%/V
Low power mode 0.05
Dropout Voltage
Normal mode,
IOUT = IMAX,
VDO = VINLx - VOUT
VSYS - VOUT = 2.5V 60 150
mV
VSYS - VOUT = 1.5V 100
Output Current Limit VOUT = 90% of VOUT
(TARGET)
Normal mode 225 450 mA
Low power mode 10
Output Capacitance for Stability DCR < 200mΩ, ESL < 20nH (Note 9) 0.5 1.0 µF
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 1.0µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Noise
Normal mode,
f = 10Hz to 100kHz,
IOUT = 10% of IMAX
VSYS = 2.7V,
VINLx = 1.2V,
VOUT = VOUTMIN
30
µVRMS
VSYS = 2.7V,
VINLx = 1.8V,
VOUT = 1.0V
60
VSYS = VINLx = 5.5V,
VOUT = VOUTMAX
60
Power Supply Rejection Normal mode, f = 1kHz, IOUT = 30mA 70 dB
Output Load Transient
(ΔV/VOUT)
Normal mode, VSYS = 3.7V,
VINLx = 1.8V, VOUT = 1.0V,
IOUT = 1mA to ½ x IMAX to
1mA, tRISE = tFALL = 1µs
COUT = 1.0µF ±5
%
COUT = 10µF ±3
Output Line Transient
Normal mode, VOUT = 1.0V,
IOUT = 1mA, tRISE = tFALL
= 5µs
VSYS = VINLx = 3.7V to
3.2V to 3.7V 5
mV
VSYS = 3.7V, VINLx = 1.8V
to 1.5V to 1.8V 5
Output Startup Ramp Rate 10% to 90% 30 mV/µs
Turn-On Delay Time From Lx_EN = 1 to output rising, REFBYP enabled >
300µs prior to LDO being enabled. 5 µs
Output Overshoot During
Startup Overshoot 50 mV
Output Active Discharge
Resistance (Note 10) 100
Thermal Shutdown TJ rising 165 °C
TJ falling 150
POWER-OK COMPARATOR
Output POK Trip Level Rising edge, VOUT when VPOK switches 87.5 %
Output POK Hysteresis VOUT when VPOK switches 5 %
LDO2 (150mA NMOS) (continued)
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 4.7µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO3 (450mA NMOS)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range
VINLx must be lower than or equal to VSYS VOUT VSYS
VVSYS 2.6 5.5
(Note 7) 1.5
Input Supply Current
Normal mode, no load 2
µA
Low power mode, no load 2
Shutdown < 0.1
System Supply Current
Normal mode, no load 25
µALow power mode, no load 3
Shutdown < 0.1
Output Voltage Programming
Minimum VOUT, Lx_VOUT[6:0] = 7’h00 0.6
VMaximum VOUT, Lx_VOUT[6:0] = 7’h7F 2.1875
Least signicant step size 0.0125
Output Voltage Accuracy
VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V),
VINLx = VOUT + 0.3V to VSYS
Normal mode
IOUT = 0.1mA to IMAX
-2 +2
%
Low power mode
IOUT = 0.1mA to 5mA -5 +5
Maximum Output Current
(Note 8)
Normal mode 450 mA
Low power mode 5
Load Regulation VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V)
Normal mode
IOUT = 0.1mA to IMAX
0.5
%
Low power mode
IOUT = 0.1mA to 5mA 0.5
Line Regulation
VSYS ≥ VOUT + 1.5V
(VSYSMIN = 2.6V),
IOUT = 0.1mA
Normal mode 0.05
%/V
Low power mode 0.05
Dropout Voltage Normal Mode, IOUT = IMAX,
VDO = VINLx - VOUT
VSYS - VOUT = 2.5V 60 150
mV
VSYS - VOUT = 1.5V 100
Output Current Limit VOUT = 90% of VOUT
(TARGET)
Normal mode 675 1350 mA
Low power mode 10
Output Capacitance for Stability DCR < 200mΩ, ESL < 20nH
(Note 9) 2.35 4.7 µF
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 1.0µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO3 (450mA NMOS) (continued)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Noise
Normal mode,
f = 10Hz to 100kHz,
IOUT = 10% of IMAX
VSYS = 2.7V,
VINLx = 1.2V,
VOUT = VOUTMIN
30
µVRMS
VSYS = 2.7V,
VINLx = 1.8V,
VOUT = 1.0V
60
VSYS = VINLx = 5.5V,
VOUT = VOUTMAX
60
Power-Supply Rejection Normal mode, f = 1kHz, IOUT = 30mA 70 dB
Output Load Transient
(ΔV/VOUT)
Normal mode, VSYS = 3.7V,
VINLx = 1.8V, VOUT = 1.2V,
IOUT = 1mA to ½ x IMAX to
1mA, tRISE = tFALL = 1µs
COUT = 4.7µF ±5
%
COUT = 10µF ±3
Output Line Transient
Normal mode, VOUT
= 1.2V, IOUT = 1mA,
tRISE = tFALL = 5µs
VSYS = VINLx = 3.7V to 3.2V to
3.7V 5
mV
VSYS = 3.7V, VINLx = 1.8V to 1.5V
to 1.8V 5
Output Startup Ramp Rate 10% to 90% 30 mV/µs
Turn-On Delay Time From Lx_EN = 1 to output rising, REFBYP enabled >
300µs prior to LDO being enabled 5 µs
Output Overshoot during Startup
Overshoot 50 mV
Output Active Discharge
Resistance (Note 10) 100
Thermal Shutdown TJ rising 165 °C
TJ falling 150
POWER-OK COMPARATOR
Output POK Trip Level Rising edge, VOUT when VPOK switches 87.5 %
Output POK Hysteresis VOUT when VPOK switches 5 %
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 4.7µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO4, LDO5 and LDO7 (300mA PMOSLV)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VINLx must be lower than or equal to VSYS 1.7 VSYS V
Input Supply Current
Normal mode, no load 15
µA
Low power mode, no load 1.5
Shutdown < 0.1
System Supply Current
Normal mode, no load 3
µALow power mode, no load 0.3
Shutdown < 0.1
Output Voltage Programming
Minimum VOUT, Lx_VOUT[6:0] = 7’h00 0.8
VMaximum VOUT, Lx_VOUT[6:0] = 7’h7F 3.975
Least signicant step size 0.025
Output Voltage Accuracy VINLx = VOUT + 0.3V to
VSYS
Normal mode
IOUT = 0.1mA to IMAX
-2 +2
%
Low power mode
IOUT = 0.1mA to 5mA -5 +5
Maximum Output Current
(Note 8)
Normal mode 300 mA
Low power mode 5
Load Regulation VINLx = VOUT + 0.3V
Normal mode
IOUT = 0.1mA to IMAX
0.5
%
Low power mode
IOUT = 0.1mA to 5mA 0.5
Line Regulation VINLx = VOUT + 0.3V to
VSYS, IOUT = 0.1mA
Normal mode 0.05 %/V
Low power mode 0.05
Dropout Voltage
Normal mode,
VSYS = 3.7V,
IOUT = IMAX,
VDO = VINLx - VOUT
VINLx = 3.7V 60 150
mV
VINLx = 1.7V 100
Output Current Limit VOUT = 90% of
VOUT(TARGET)
Normal mode 600 1120 mA
Low power mode 40
Output Capacitance for Stability DCR < 200mΩ, ESL < 20nH
(Note 9) 2.35 4.7 µF
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 4.7µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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PARAMETER CONDITIONS MIN TYP MAX UNIT
Output Noise
Normal mode,
f = 10Hz to 100kHz,
IOUT = 10% of IMAX
VSYS = VINLx = 2.7V,
VOUT = VOUTMIN
25
µVRMS
VSYS = VINLx = 2.7V,
VOUT = 1.0V 30
VSYS = VINLx = 2.7V,
VOUT = 2.0V 40
VSYS = VINLx = 3.7V,
VOUT = 3.0V 60
VSYS = VINLx = 5.5V,
VOUT = VOUTMAX
60
Power Supply Rejection Normal mode, f = 1kHz, IOUT = 30mA 70 dB
Output Load Transient
(ΔV/VOUT)
Normal mode,
VSYS = VINLx = 3.7V,
VOUT = default,
IOUT = 1mA to ½ x IMAX
to 1mA,
tRISE = tFALL = 1µs
COUT = 4.7µF ±5
%
COUT = 10µF ±3
Output Line Transient
Normal mode,
VOUT = 1.2V,
IOUT = 1mA,
tRISE = tFALL = 5µs
VSYS = VINLx = 3.7V to 3.2V
to 3.7V 5
mV
VSYS = 3.7V,
VINLx = 2.0V to 1.7V to 2.0V 5
Output Startup Ramp Rate 10% to 90% 30 mV/µs
Turn-On Delay Time From Lx_EN = 1 to output rising, REFBYP enabled >
300µs prior to LDO being enabled 5 µs
Output Over-shoot during
Startup Over-shoot 50 mV
Output Active Discharge
Resistance (Note 10) 100
Thermal Shutdown TJ rising +165 °C
TJ falling +150
POWER-OK COMPARATOR
Output POK Trip Level Rising edge, VOUT when VPOK switches 87.5 %
Output POK Hysteresis VOUT when VPOK switches 3 %
LDO4, LDO5 and LDO7 (300mA PMOSLV) (continued)
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 2.2µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO6, LDO8, and LDO9 (150mA PMOSLV)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VINLx must be lower than or equal to VSYS 1.7 VSYS V
Input Supply Current
Normal mode, no load 15
µA
Low power mode, no load 1.5
Shutdown < 0.1
System Supply Current
Normal mode, no load 3
µALow power mode, no load 0.3
Shutdown < 0.1
Output Voltage Programming
Minimum VOUT, Lx_VOUT[6:0] = 7’h00 0.8
VMaximum VOUT, Lx_VOUT[6:0] = 7’h7F 3.975
Least signicant step size 0.025
Output Voltage Accuracy VINLx = VOUT + 0.3V
to VSYS
Normal mode
IOUT = 0.1mA to IMAX
-2 +2
%
Low power mode
IOUT = 0.1mA to 5mA, -5 +5
Maximum Output Current
(Note 8)
Normal mode 150 mA
Low power mode 5
Load Regulation VINLx = VOUT + 0.3V
Normal mode
IOUT = 0.1mA to IMAX
0.5
%
Low power mode
IOUT = 0.1mA to 5mA 0.5
Line Regulation VINLx = VOUT + 0.3V to
VSYS, IOUT = 0.1mA
Normal mode 0.05 %/V
Low power mode 0.05
Dropout Voltage
Normal mode, VSYS = 3.7V,
IOUT = IMAX,
VDO = VINLx - VOUT
VINLx = 3.7V 60 150
mV
VINLx = 1.7V 100
Output Current Limit VOUT = 90% of
VOUT(TARGET)
Normal mode 300 560 mA
Low power mode 40
Output Capacitance for Stability DCR < 200mΩ, ESL < 20nH
(Note 9) 1.1 2.2 µF
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 2.2µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO6, LDO8, and LDO9 (150mA PMOSLV) (continued)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Noise
Normal mode,
f = 10Hz to 100kHz,
IOUT = 10% of IMAX
VSYS = VINLx = 2.7V,
VOUT = VOUTMIN
25
µVRMS
VSYS = VINLx = 2.7V,
VOUT = 1.0V 30
VSYS = VINLx = 2.7V,
VOUT = 2.0V 40
VSYS = VINLx = 3.7V,
VOUT = 3.0V 60
VSYS = VINLx = 5.5V,
VOUT = VOUTMAX
60
Power Supply Rejection Normal mode, f = 1kHz, IOUT = 30mA 70 dB
Output Load Transient
(ΔV/VOUT)
Normal mode,
VSYS = VINLx = 3.7V,
VOUT = default,
IOUT = 1mA to ½ x IMAX to
1mA, tRISE = tFALL = 1µs
COUT = 2.2µF ±5
%
COUT = 10µF ±3
Output Line Transient
Normal mode, VOUT = 1.2V,
IOUT = 1mA,
tRISE = tFALL = 5µs
VSYS = VINLx = 3.7V to
3.2V to 3.7V 5
mV
VSYS = 3.7V, VINLx =
2.0V to 1.7V to 2.0V 5
Output Startup Ramp Rate 10% to 90% 30 mV/µs
Turn-On Delay Time From Lx_EN = 1 to output rising, REFBYP enabled >
300µs prior to LDO being enabled 5 µs
Output Overshoot During
Startup Overshoot 50 mV
Output Active Discharge
Resistance (Note 10) 100
Thermal Shutdown TJ rising +165 °C
TJ falling +150
POWER-OK COMPARATOR
Output POK Trip Level Rising edge, VOUT when VPOK switches 87.5 %
Output POK Hysteresis VOUT when VPOK switches 3 %
(VSYS = +3.7V, CSYS = 1.0µF, COUT = 2.2µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO11, LDO14 and LDO15 (150mA PMOSLS)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VINLx 2.6 5.5 V
VSYS 2.6 5.5
Input Supply Current
Normal mode, no load 15
µALow power mode, no load 4
Shutdown < 0.1
System Supply Current
Normal mode, no load 3.25
µALow power mode, no load 0.85
Shutdown < 0.1
Output Voltage Programming
Minimum VOUT, Lx_VOUT[6:0] = 7’h00 0.8
VMaximum VOUT, Lx_VOUT[6:0] = 7’h7F 3.975
Least signicant step size 0.025
Output Voltage Accuracy VINLx = VOUT + 0.3V to
VSYS
Normal mode
IOUT = 0.1mA to IMAX
-2 +2
%
Low power mode
IOUT = 0.1mA to 5mA -5 +5
Maximum Output Current
(Note 8)
Normal mode 150 mA
Low power mode 5
Load Regulation VINLx = VOUT + 0.3V
Normal mode
IOUT = 0.1mA to IMAX
0.5
%
Low power mode
IOUT = 0.1mA to 5mA 0.5
Line Regulation VINLx = VOUT + 0.3V to
VSYS, IOUT = 0.1mA
Normal mode 0.05 %/V
Low power mode 0.05
Dropout Voltage Normal mode, VSYS = VINLx = 3.7V,
IOUT = IMAX, VDO = VINLx - VOUT
100 200 mV
Output Current Limit VOUT = 90% of
VOUT(TARGET)
Normal mode 300 560 mA
Low power mode 40
Output Capacitance for Stability DCR < 200mΩ, ESL < 20nH (Note 9) 0.6 2.2 µF
(VSYS = VINLx = +3.7V, CSYS = 1.0µF, COUT = 2.2µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO11, LDO14 and LDO15 (150mA PMOSLS) (continued)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Noise
Normal mode,
f = 10Hz to 100kHz,
IOUT = 10% of IMAX
VSYS = VINLx = 2.7V,
VOUT = VOUTMIN
25
µVRMS
VSYS = VINLx = 2.7V,
VOUT = 1.0V 30
VSYS = VINLx = 2.7V,
VOUT = 2.0V 40
VSYS = VINLx = 3.7V,
VOUT = 3.0V 60
VSYS = VINLx = 5.5V,
VOUT = VOUTMAX
60
Power Supply Rejection Normal mode, f = 1kHz, IOUT = 30mA 70 dB
Output Load Transient
(ΔV/VOUT)
Normal mode,
VSYS = VINLx = 3.7V,
VOUT = default, IOUT =
1mA to ½ x IMAX to 1mA,
tRISE = tFALL = 1µs
COUT = 2.2µF ±5
%
COUT = 10µF ±3
Output Line Transient Normal mode, VINLx = 3.7V to 3.2V to 3.7V,
VOUT = default, IOUT = 1mA, tRISE = tFALL = 5µs 5 mV
Output Startup Ramp Rate 10% to 90% 30 mV/µs
Turn-On Delay Time From Lx_EN = 1 to output rising, REFBYP enabled >
300µs prior to LDO being enabled 5 µs
Output Overshoot During
Startup Overshoot 50 mV
Output Active Discharge
Resistance (Note 10) 100
Thermal Shutdown TJ rising 165 °C
TJ falling 150
POWER-OK COMPARATOR
Output POK Trip Level Rising edge, VOUT when VPOK switches 87.5 %
Output POK Hysteresis VOUT when VPOK switches 3 %
(VSYS = +3.7V, CSYS = 1.0µF, COUT = 2.2µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
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LDO10, LDO12 and LDO13 (300mA PMOSLS)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VINLx 2.6 5.5 V
VSYS 2.6 5.5
Input Supply Current
Normal mode, no load 15
µALow power mode, no load 4
Shutdown < 0.1
System Supply Current
Normal mode, no load 3.25
µALow power mode, no load 0.85
Shutdown < 0.1
Output Voltage Programming
Minimum VOUT, Lx_VOUT[6:0] = 7’h00 0.8
VMaximum VOUT, Lx_VOUT[6:0] = 7’h7F 3.975
Least signicant step size 0.025
Output Voltage Accuracy VINLx = VOUT + 0.3V to
VSYS
Normal mode
IOUT = 0.1mA to IMAX
-2 +2
%
Low power mode
IOUT = 0.1mA to 5mA -5 +5
Maximum Output Current
(Note 8)
Normal mode 300 mA
Low power mode 5
Load Regulation VINLx = VOUT + 0.3V
Normal mode
IOUT = 0.1mA to IMAX
0.5
%
Low power mode
IOUT = 0.1mA to 5mA 0.5
Line Regulation VINLx = VOUT + 0.3V to
VSYS, IOUT = 0.1mA
Normal mode 0.05 %/V
Low power mode 0.05
Dropout Voltage Normal mode, VSYS = VINLx = 3.7V,
IOUT = IMAX, VDO = VINLx - VOUT
100 200 mV
Output Current Limit VOUT = 90% of
VOUT(TARGET)
Normal mode 600 1120 mA
Low power mode 40
Output Capacitance for Stability DCR < 200mΩ, ESL < 20nH (Note 9) 0.6 2.2 µF
(VSYS = +3.7V, CSYS = 1.0µF, COUT = 2.2µF, CREFBYP = 100nF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
Note 3: Guaranteed by design. Not production tested.
Note 4: 100% production tested at TA = +25°C, limits over the operating range are guaranteed by design.
Note 5: Limits are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed through
correlation using statistical quality control methods.
Note 6: The maximum output current spec is not directly tested. Instead, it is guaranteed by LX NMOS current limit test.
Note 7: For NMOS LDOs, VSYS must be at least 1.5V above VOUT (VSYS ≥ VOUT + 1.5V).
Note 8: The maximum output current is guaranteed by the output voltage accuracy tests.
Note 9: For stability, guaranteed by design and not production tested.
Note 10: There is an n-channel MOSFET in series with the output active discharge resistance. This NMOS requires VSYS > 1.2V to
be enhanced.
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LDO10, LDO12 and LDO13 (300mA PMOSLS) (continued)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Noise
Normal mode,
f = 10Hz to 100kHz,
IOUT = 10% of IMAX
VSYS = VINLx = 2.7V,
VOUT = VOUTMIN
25
µVRMS
VSYS = VINLx = 2.7V,
VOUT = 1.0V 30
VSYS = VINLx = 2.7V,
VOUT = 2.0V 40
VSYS = VINLx = 3.7V,
VOUT = 3.0V 60
VSYS = VINLx = 5.5V,
VOUT = VOUTMAX
60
Power Supply Rejection Normal mode, f = 1kHz, IOUT = 30mA 70 dB
Output Load Transient
(ΔV/VOUT)
Normal mode,
VSYS = VINLx = 3.7V,
VOUT = default, IOUT =
1mA to ½ x IMAX to 1mA,
tRISE = tFALL = 1µs
COUT = 2.2µF ±5
%
COUT = 10µF ±3
Output Line Transient Normal mode, VINLx = 3.7V to 3.2V to 3.7V, VOUT =
default, IOUT = 1mA, tRISE = tFALL = 5µs 5 mV
Output Startup Ramp Rate 10% to 90% 30 mV/µs
Turn-On Delay Time From Lx_EN = 1 (or ENL12 = high) to output rising,
REFBYP enabled > 300µs prior to LDO being enabled 5 µs
Output Overshoot During
Startup Overshoot 50 mV
Output Active Discharge
Resistance (Note 10) 100
Thermal Shutdown TJ rising +165 °C
TJ falling +150
POWER-OK COMPARATOR
Output POK Trip Level Rising edge, VOUT when VPOK switches 87.5 %
Output POK Hysteresis VOUT when VPOK switches 3 %
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Pin Congurations
Pin Description
SCLSDA
SYS
IRQB
LDO12
V
IO
LDO7 LDO6
INL3
LDO5
LDO3
ENBB
LDO10
LDO14
INL4
LDO11
LDO13
INL5
LDO9
PGNDB PGNDB
LDO4
FB_BLXB LXB
ENB
INL1 LDO8
LDO1
LDO15
INB INB
INL2
LDO2
INBB
OUTBB LXBB1PGNDBB
INBB
LXBB1PGNDBB
LXBB2
ENL12
REFBYP
OUTBB LXBB2
FB_BB
1234567
A
B
C
D
E
F
G
GND
CE
+
MAX77826
PIN NAME FUNCTION
C4 CE
Active-High Chip Enable Input. When CE = high (standby), the I2C interface is enabled
and regulators are ready to be turned on. When CE = low (shutdown), all regulators
are turned o󰀨 and all Type-O registers are reset to their POR default values.
D5 ENB Active-High BUCK External Enable Input. An 800kΩ internal pull-down resistance to
the GND. If this pin is not used, leave it oating.
E6 ENBB Active-High BUCK BOOST External Enable Input. An 800kΩ internal pulldown
resistance to the GND. If this pin is not used, leave it unconnected.
E4 ENL12 Active-High LDO12 External Enable Input. An 800kΩ internal pulldown resistance to
the GND. If this pin is not used, leave it unconnected.
B3 FB_B BUCK Output Voltage Feedback
E5 FB_BB BUCK BOOST Output Voltage Feedback
E7 GND Ground
A1, A2 INB BUCK Input. Bypass to PGNDB with a 10µF capacitor.
F7, G7 INBB BUCK BOOST Input
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Pin Description (continued)
PIN NAME FUNCTION
B4 INL1 Input for LDO1 and 2. Bypass to GND with a 4.7µF capacitor.
B5 INL2 Input for LDO3. Bypass to GND with a 1µF capacitor.
C7 INL3 Input for LDO4, 5, 6, 7, 8, and 9. Bypass to GND with a 4.7µF capacitor.
F2 INL4 Input for LDO10 and 11. Bypass to GND with a 4.7µF capacitor.
F1 INL5 Input for LDO12, 13, 14, and 15. Bypass to GND with a 4.7µF capacitor.
E3 IRQB Interrupt Output. A 100kΩ external pullup resistor to VIO is required.
B1, B2 LXB BUCK Switching Node
F6, G6 LXBB1 BUCK BOOST Switching Node 1
F4, G4 LXBB2 BUCK BOOST Switching Node 2
A4 LDO1 LDO1 (600mA NMOS) Output. Bypass to GND with a 4.7µF capacitor.
C6 LDO2 LDO2 (150mA NMOS) Output. Bypass to GND with a 1µF capacitor.
A5 LDO3 LDO3 (450mA NMOS) Output. Bypass to GND with a 4.7µF capacitor.
D7 LDO4 LDO4 (300mA PMOSLV) Output. Bypass to GND with a 4.7µF capacitor.
B7 LDO5 LDO5 (300mA PMOSLV) Output. Bypass to GND with a 4.7µF capacitor.
A7 LDO6 LDO6 (150mA PMOSLV) Output. Bypass to GND with a 2.2µF capacitor.
A6 LDO7 LDO7 (300mA PMOSLV) Output. Bypass to GND with a 4.7µF capacitor.
B6 LDO8 LDO8 (150mA PMOSLV) Output. Bypass to GND with a 2.2µF capacitor.
D6 LDO9 LDO9 (150mA PMOSLV) Output. Bypass to GND with a 2.2µF capacitor.
G1 LDO10 LDO10 (300mA PMOSLS) Output. Bypass to GND with a 2.2µF capacitor.
G2 LDO11 LDO11 (150mA PMOSLS) Output. Bypass to GND with a 2.2µF capacitor.
D1 LDO12 LDO12 (300mA PMOSLS) Output. Bypass to GND with a 2.2µF capacitor.
E1 LDO13 LDO13 (300mA PMOSLS) Output. Bypass to GND with a 2.2µF capacitor.
E2 LDO14 LDO14 (150mA PMOSLS) Output. Bypass to GND with a 2.2µF capacitor.
D2 LDO15 LDO15 (150mA PMOSLS) Output. Bypass to GND with a 2.2µF capacitor.
F3, G3 OUTBB BUCK BOOST Output
C1, C2 PGNDB BUCK Power GND
F5, G5 PGNDBB BUCK BOOST Power GND
C5 REFBYP LDO Reference Bypass Node. Connect a 0.1µF Cap to GND.
D4 SCL I2C Clock Input. High Impedance in O󰀨 State.
A 1.5kΩ~2.2kΩ of pullup resistor to VIO is required.
D3 SDA I2C Data I/O. High Impedance in O󰀨 State. A 1.5kΩ–2.2kΩ of pullup resistor to VIO is
required.
A3 SYS System (Battery) Voltage Input. Bypass to GND with a 1µF capacitor.
C3 VIO IO Supply Voltage Input. Bypass to GND with a 0.1µF capacitor.
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Block Diagram
SYS
BUCK
3A
FB_B
LXB
PGNDB
INB
ENBB
ON/OFF CONTROL
AND
I
2
C INTERFACE
BUCK-BOOST
2A
LXBB1
PGNDBB
INBB
SBIAS, REF, UVLO,
TSHDN
800k
V
IO
V
IO
IRQB
SCL
SDA
INL1
LDO1
(N600)
LDO2
(N150)
LDO1
LDO2
ENL12
800k
MAX77826
LXBB2
INL2
LDO3
(N450)
LDO3
INL3
LDO4
(P300LV)
LDO4
LDO5
(P300LV)
LDO6
(P150LV)
LDO5
LDO6
LDO7
(P300LV)
LDO7
LDO8
(P150LV)
LDO9
(P150LV)
LDO8
LDO9
INL4
LDO11
(P150LS)
LDO11
LDO10
(P300LS)
LDO10
INL5
LDO13
(P300LS)
LDO13
LDO14
(P150LS)
LDO15
(P150LS)
LDO14
LDO15
FB_BB
LDO12
(P300LS)
LDO12
800k
ENB
REFBYP
GND
CE
OUTBB
Detailed Description
Top System Management
System Faults
The MAX77826 monitors the system for the following
faults: global thermal, local thermal shutdown, and under-
voltage lockout.
Global Thermal Fault
The MAX77826 has a centralized thermal protection
circuit which monitors temperature on the die. If the die
temperature exceeds +165°C (TSHDN), a thermal shut-
down event initiates, and the MAX77826 enters its global
shutdown state.
In addition to the +165°C threshold, there are two addi-
tional comparators that trip at +120°C and +140°C.
Interrupts are generated in the event the die temperature
reaches +120°C or +140°C.
There is a 15°C thermal hysteresis. After the thermal shut-
down, if the die temperature reduces by 15°C, the thermal
shutdown bus deasserts.
Local Thermal Shutdown
If any of the BUCK BOOST or LDOs reach the thermal
shutdown threshold, the MAX77826 shuts down the cor-
responding block locally. If the temperature goes below a
threshold, that block goes back to normal operation.
Undervoltage Lockout
When VSYS falls below VUVLO_F (typ 2.05V), the
MAX77826 enters its undervoltage lockout (UVLO) mode.
UVLO forces the MAX77826 to a dormant state until the
source voltage is high enough to allow the MAX77826
to be securely functional. I2C does not function and the
Type-O register contents are reset to their default values
in UVLO mode. UVLO rising threshold is set to 2.5V by
an OTP option.
Chip Enable (CE)
A logic-high on CE pin puts the MAX77826 into standby
mode (enabled). In standby mode, all user registers are
accessible through I2C so that the host processor can
overwrite the default output voltages of regulators and
each regulator can be enabled by either I2C or the GPIO
input if applicable.
When the CE pin goes high, the MAX77826 turns on the
top-level bias circuitry, and it takes typically 85µs to settle.
As soon as the top-level bias is ready, BUCK BOOST is
ready to be turned on. However, BUCK and LDOs require
additional 85µs (typ) for REFBYP to settle. Total, it takes
170µs (85µs + 85µs) for REFBYP to settle from CE =
high. In the worst-case scenario, it can take up to 230µs.
Once REFBYP is ready, all the regulators are allowed
to be tuned on through I2C or the ENx pins. In case the
regulars are enabled before the bias circuitry is ready, the
regulators require longer time to startup.
When CE pin is pulled low, the MAX77826 goes into
shutdown mode (disabled) and turns off all the regulators
regardless of ENx pins. This event also resets all Type-O
registers to their POR default values.
Immediate Shutdown Events
The following events initiate immediate shutdown: ther-
mal protection (TJ > +165°C), VSYS < VSYS UVLO
falling threshold (VUVLO_F), VIO < VIO OK threshold
(VTH_VIO_OK)
The events in this category are associated with potentially
hazardous system states. Powering down the host pro-
cessor and resetting all Type-O registers help mitigate any
issues that can occur due to these potentially hazardous
conditions. Note that the MAX77826 cannot be enabled
until the junction temperature drops below +150°C in case
thermal protection caused the immediate shutdown.
Operating Mode (OPMD)
Each regulator (BUCK, BUCK BOOST, and LDO) has
independent register bits to control its operating mode.
These bits determines on/off operation during initial
startup, output enable control, and sleep mode operation
based on the enable control logic of each regulator. The
POR default values of output enable bits (x_EN) are 0
(output off).
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
26
Enable Control Logic1
BUCK, BUCK BOOST, and LDO12 have independent
I2C enable bits and dedicated GPIO enable pins (ENB,
ENBB, and ENL12). As shown in Table 1, regulators can
be turned on/off by ENx or I2C control bits.
Enable Control Logic 2
LDO1–LDO11 and LDO13–LDO15 have independent I2C
enable bits. As shown in Table 2, regulators can be turned
on/off by the I2C control bits.
Reset Conditions
System Reset
When VSYS voltage drops below its POR threshold
(≈1.55V), all Type-S1 registers are reset to their POR
default values.
Off Reset
Off reset occurs by any power-off events. This condition
resets all Type-O registers to their POR default values.
Interrupt and Mask
IRQB pin is used to indicate to the host processor that
the status on the MAX77826 has changed. IRQB signal is
asserted whenever one or more interrupts are triggered.
The host processor reads the interrupt source register
(ADDR 0x00) and the interrupt registers as indicated by
the interrupt source register in order to see the cause of
interrupt event.
Each interrupt register can be read at a time. IRQB pin
goes high (cleared) as soon as the read sequence finish-
es. If an interrupt is captured during the read sequence,
IRQB pin is held low. Note that the interrupt source regis-
ter is cleared when the corresponding interrupt registers
are read by the host processor.
Each interrupt can be masked (disabled) by setting the
corresponding interrupt mask register bit. In case an inter-
rupt mask bit is set (masked), the corresponding interrupt
bit is not supposed to be set even when the interrupt con-
dition is met. As a result, the IRQB pin stays high for this
event. If the mask bit is cleared for an active interrupt, the
corresponding interrupt bit is set to pull the IRQB pin low.
Figure 1. Enable Control Logic 1
Figure 2. Enable Control Logic 2
*The BUCK BOOST regulator does not have a low power
mode.
Table 1. Enable Control
Logic 1 Truth Table
Table 2. Enable Control
Logic 2 Truth Table
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
27
BUCK,
BUCK BOOST,
LDO12
EN
LOGIC 1
LOGIC 1: OPERATING
MODE CONTROL
B_EN (I
2
C)
B_LPM (I
2
C)
ENx
LPM
BB_EN (I
2
C)
L12_EN (I
2
C)
L12_LPM (I
2
C)
CE
LDO1 LDO11,
LDO13LDO15
EN
LOGIC 2
LOGIC 2: OPERATING
MODE CONTROL
Lx_EN (I
2
C)
Lx_LPM (I
2
C) LPM
CE
CE ENx
B_EN
BB_EN
L12_EN
B_LPM
L12_LPM
OPERATING
MODE
Low x x x Device o󰀨
High Low 0 x Output o󰀨
High High x 1 Output on (low
power mode*)
High High x 0 Output on
High x 1 1 Output on (low
power mode*)
High x 1 0 Output on
CE Lx_EN Lx_LPM OPERATING MODE
Low x x Device o󰀨
High 0 x Output o󰀨
High 1 1 Output on
(low power mode)
High 1 0 Output on
BUCK Regulator
The MAX77826 includes a 3A current-mode BUCK regu-
lator. In normal operation, BUCK consumes only 22µA
quiescent current. In low power mode, the quiescent
current is decreased to 8µA with reduced load capability.
The summary of features is:
3A of maximum output current rating
2.6V to 5.5V input voltage range
Output voltage range from 0.50V to 1.80V in 6.25mV
steps
±1% (typ) output voltage DC accuracy
2MHz (typ) switching frequency
Automatic SKIP/PWM or forced PWM modes
> 90% peak efficiency
Programmable slew rate for increasing output voltage
settings
Operating Mode Control
The operating mode bit resides in the top level that con-
trols the enable/disable state of BUCK through the B_EN
register and also controls the operating mode (low power
or normal mode) through the B_LPM register.
SKIP/Forced PWM Operation
In normal operating mode, BUCK automatically transitions
from SKIP mode to fixed frequency operation as load cur-
rent increases. For operating modes where lowest output
ripple is required, forced PWM switching behavior can be
enabled by writing 1 to B_FPWM bit.
Low Power Mode Operation
In low power mode, the quiescent current is reduced from
22µA to 8µA. The output current is limited to 10mA. It
is not recommended to adjust the output voltage in low
power mode. The regulator does not automatically enter/
exit low power mode. The host processor needs to control
low power mode operation in times of known low power
states through the I2C serial interface.
Startup and Soft-Start
When starting up BUCK regulator, the bias circuitry must
be enabled and provided with adequate time to settle. The
bias circuitry is guaranteed to settle within 250µs, at which
time, the BUCK regulators’ power-up sequences can
commence. Note that attempting to implement a power-
up sequence before BIASOK signal is generated results
in all enabled regulators starting up at the same time.
The BUCK regulator supports starting into a prebiased
output. For example, if the output capacitor has an ini-
tial voltage of 0.4V when the regulator is enabled, the
regulator gradually increases the capacitor voltage to the
required target voltage such as 1.0V. This is unlike other
regulators without the start into prebias feature in which
they can force the output capacitor voltage to 0V before
the soft-start ramp begins.
The BUCK regulator has a soft-start rate of 14mV/µs. The
controlled soft-start rate and BUCK regulator current limit
(ILIMP) limit the input inrush current to the output capaci-
tor (IINRUSH). IINRUSH = min (ILIMP and COUT x dv/dt).
Note that the input current of BUCK regulator is lower
than the inrush current to the output capacitor by the ratio
of output to input voltage.
Output Voltage Setting
The output voltage is programmable from 0.50V to 1.80V
in 6.25mV steps to allow fine adjustment to the processor
supply voltage under light load conditions to minimize
power loss within the processor. The default output volt-
age is set by an OTP option at the factory. The default out-
put voltage can be overwritten by changing the contents
in B_VOUT[7:0] register prior to enabling the regulator.
The output voltage can also be adjusted during normal
operation.
Changing Output Voltage While Operating
In a typical smartphone or tablet application, there are
several power domains in which the operating frequency
of the processor increases or decreases (DVFS). When
the operating frequency needs to be changed, it is
expected that BUCK regulator responds to a command to
change the output voltages to new target values quickly.
The high peak current limit, coupled with low inductance
and small output capacitance, allows the BUCK regulator
to respond to a positive step change in output voltage and
settle to the new target value quickly. The BUCK regulator
provides programmable ramp-up slew rates to accommo-
date different requirements.
For a negative step change in output voltage, the settling
time is not critical. In forced PWM mode (either B_FPWM
bit or B_FSRAD bit is enabled), the negative inductor
current through NMOS discharges energy from the out-
put capacitor to help the output voltage decrease to the
new target value faster. In skip mode, negative inductor
current is not allowed so that the output voltage settling
time is dependent on the load current and the output
capacitance.
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
28
Output Voltage Slew Rate Control
The BUCK regulator supports programmable slew rate
control feature when increasing and decreasing the output
voltage. The ramp-up slew rate can be set to 12.5mV/µs,
25mV/µs, 50mV/µs or 100mV/µs independently through
the B_RAMP[1:0] bits, while the ramp-down slew rate is
fixed to 6.25mV/µs.
Output Active Discharge Resistance
BUCK provides an internal 100Ω resistor for output active
discharge function. If the active discharge function is
enabled (B_AD = 1), the internal resistor discharges the
energy stored in the output capacitor to GND whenever
the regulator is disabled.
Either the regulator remains enabled or the active dis-
charge function is disabled (B_AD = 0), the internal resis-
tor is disconnected from the output. If the active discharge
function is disabled, the output voltage decays at a rate
that is determined by the output capacitance and the load
current when the regulator is turned off.
Inductor Selection
BUCK is optimized for a 0.47µH inductor. The lower the
inductor DCR, the higher BUCK efficiency is. Users need
to trade off inductor size with DCR value and choose a
suitable inductor for BUCK.
Input Capacitor Selection
The input capacitor, CIN, reduces the current peaks
drawn from the battery or input power source and reduces
switching noise in the IC. The impedance of CIN at the
switching frequency should be kept very low. Ceramic
capacitors with X5R or X7R dielectrics are highly rec-
ommended due to their small size, low ESR, and small
temperature coefficients. For most applications, a 10µF
capacitor is sufficient.
Output Capacitor Selection
The output capacitor, COUT, is required to keep the out-
put voltage ripple small and to ensure regulation loop
stability. COUT must have low impedance at the switching
frequency. Ceramic capacitors with X5R or X7R dielectric
are highly recommended due to their small size, low ESR,
and small temperature coefficients. Due to the unique
feedback network, the output capacitance can be very
low. The recommended minimum output capacitance for
BUCK is 22µF.
BUCK BOOST Regulator
The MAX77826 BUCK BOOST regulator utilizes a four-
switch H-bridge configuration to realize BUCK, BUCK
BOOST, and BOOST operating modes. In this way, this
topology maintains output voltage regulation when the
input voltage is greater than, equal to, or less than the
output voltage. The MAX77826 BUCK BOOST is ideal
in Li-ion battery powered applications, providing 2.6V
to 4.1875V output voltage and up to 2A output current
across the input voltage range. High switching frequency
and a unique control algorithm allow the smallest solution
size, low output noise, and highest efficiency across a
wide input voltage and output current range.
The MAX77826 BUCK BOOST regulator typically gener-
ates a 3.50V output voltage. The input current limit is set
to 3.5A (typ) to guarantee delivery of 2A at 3.50V from
3.0V input. Internal soft-start limits the inrush current at
startup.
Table 3. Suggested Inductors for BUCK
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
29
MANUFACTURER SERIES
NOMINAL
INDUCTANCE
(µH)
DC
RESISTANCE
(typ, mΩ)
CURRENT
RATING (A)
-30% (∆L/L)
CURRENT
RATING (A)
∆T = +40°C
RISE
DIMENSIONS
L x W x H
(mm)
Semco CIGT201610G
MR47MNE 0.47 35 4.0 2.9 2.0 x 1.6 x 1.0
Toko DFE201610-H
-R47N 0.47 37 3.5 3.5 2.0 x 1.6 x 1.0
H-Bridge Controller
The H-bridge architecture operates at 3MHz fixed fre-
quency with a pulse width modulated (PWM), current
mode control scheme. This topology is in a cascade of
a BOOST regulator and a BUCK regulator using a single
inductor and output capacitor. BUCK, BUCK BOOST,
and BOOST stages are 100% synchronous for highest
efficiency in portable applications.
There are three phases implemented with the H-bridge
switch topology, as shown in Figure 4:
Φ1 switch period (Phase 1: P1 = on, N2 = on) stores
energy in the inductor, ramping up the inductor current at
a rate proportional to the input voltage divided by induct-
ance; VINBB/L.
Φ2 switch period (Phase 2: P1 = on, N3 = on) ramps the
inductor current up or down, depending on the differen-
tial voltage across the inductor, divided by inductance;
±(VINBB - VOUTBB)/L.
Φ3 switch period (Phase 3: N1 = on, N3 = on) ramps
down the inductor current at a rate proportional to the
output voltage divided by inductance, -VOUTBB/L.
Figure 3. BUCK BOOST Block Diagram
Figure 4. BUCK BOOST Switching Intervals
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
30
OSC SHUT-
DOWN
V
OUTBB
PGNDBB
LXBB2LXBB1
P1
N1
P2
N2
BUFFER
SNSBB
P1 CS P2 CS
V
INBB
DRIVERDRIVER
CONTROL LOGIC
R1
R2
REF
LXBB
1µH
2x 22µF
10µF
REGISTER
CONTROL
Ф1
Ф2
Ф3
V
INBB
P1
N1
L
LXBB1
CHARGE LDISCHARGE L
CHARGE/
DISCHARGE L
V
OUTBB
P2
N2
LXBB2
2-Phase BUCK topology is utilized when VINBB > VOUTBB.
A switching cycle is completed in one clock periods.
Switch period Φ2 is followed by switch period Φ3, result-
ing in an inductor current waveform similar to Figure 5.
3-Phase BUCK topology is utilized when VINBB > VOUTBB
and 2-Phase BUCK cannot support VO. Switch period is:
Φ1 Φ2 Φ3. Switch period Φ1 is fixed. This results in
an inductor current waveform similar to Figure 6.
2-Phase BOOST topology is utilized when VINBB <
VOUTBB. A switching cycle is completed in one clock
periods. Switch period Φ1 is followed by switch period
Φ2, resulting in an inductor current waveform similar to
Figure 7.
3-Phase BOOST topology is utilized when VINBB <
VOUTBB and 2-Phase BOOST cannot support VO. Switch
period is: Φ1 Φ2 Φ3. Switch period Φ3 is fixed. This
results in an inductor current waveform similar to Figure 8.
Inductor Selection
BUCK BOOST is optimized for a 1µH inductor. The lower
the inductor DCR, the higher BUCK BOOST efficiency is.
Users need to trade off inductor size with DCR value and
choose a suitable inductor for BUCK BOOST.
The input capacitor, CIN, reduces the current peaks
drawn from the battery or input power source and reduces
switching noise in the IC. The impedance of CIN at the
switching frequency should be kept very low. Ceramic
capacitors with X5R or X7R dielectrics are highly rec-
ommended due to their small size, low ESR, and small
temperature coefficients. For most applications, a 10µF
capacitor is sufficient.
Output Capacitor Selection
The output capacitor, COUT, is required to keep the out-
put voltage ripple small and to ensure regulation loop
stability. COUT must have low impedance at the switching
frequency. Ceramic capacitors with X5R or X7R dielectric
are highly recommended due to their small size, low ESR,
and small temperature coefficients. Due to the unique
feedback network, the output capacitance can be very
low. The recommended minimum output capacitance for
BUCK BOOST is 47µF.
Figure 5. 2-Phase BUCK Switching Current Waveforms Figure 7. 2-Phase BOOST Mode Switching Current Waveform
Figure 6. 3-Phase BUCK Switching Current Waveforms When
VINBB > VOUTBB
Figure 8. BOOST Mode Switching Current Waveforms When
VINBB < VOUTBB
Table 4. Suggested Inductors for BUCK BOOST
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
31
CLK CLK
t
SW1
Ф2
Ф3
CLK
t
SW1
Ф2
Ф3
CLK CLK
t
SW2
Ф2
Ф3
Ф1
CLK
t
SW2
Ф2
Ф3
Ф1
Ф2
Ф1
CLK CLK
t
SW2
Ф3Ф2
Ф1
CLK
t
SW2
Ф3
CLK CLK
t
SW1
Ф2
Ф1
CLK
t
SW1
Ф2
Ф1
MANUFACTURER SERIES
NOMINAL
INDUCTANCE
(µH)
DC
RESISTANCE
(typ, mΩ)
CURRENT
RATING (A)
-30% (∆L/L)
CURRENT
RATING (A)
∆T = +40°C
RISE
DIMENSIONS
L x W x H
(mm)
TDK TFM201610GHM
-1R0MTAA 1.0 50 3.8 3.0 2.0 x 1.6 x 1.0
Linear Regulators
The MAX77826 provides 15 low dropout linear reg-
ulators including 3 NMOS LDOs, 6 PMOSLV LDOs,
and 6 PMOSLS LDOs. Each of these regulators draws
27µA/18µA (NMOS/PMOS) of quiescent current in normal
operating mode and < 5µA in low power mode. PMOSLV
LDOs allow input voltages as low as 1.7V for optimized
system efficiency.
All regulators can be operated in low power mode that
supports up to 5mA of maximum load current.
The summary of features is:
3 NMOS LDOs (VOUT range: 0.6V to 2.1875V with
12.5mV step)
1 x 150mA
1 x 450mA
1 x 600mA
6 PMOSLV LDOs (VOUT range: 0.8V to 3.975V with
25mV step)
3 x 150mA
3 x 300mA
6 PMOSLS LDOs (VOUT range: 0.8V to 3.975V with
25mV step)
3 x 150mA
3 x 300mA
±1.5% typical Output Voltage DC Accuracy
70dB PSRR at 1kHz
LDO Reference
The MAX77826 has a single LDOREF bias rail. LDOREF
is enabled or disabled along with the central bias block
(SBIA) so that LDOREF is ready whenever any LDO turns
on. It has a very low quiescent current of 2µA typical.
Operating Mode Control
The operation mode bits for each LDO reside in the top
level that controls the enable/disable state for each LDO
through the Lx_EN signal and also controls the operation
modes (low power or normal mode) for each LDO through
the Lx_LPM signal.
Low Power Mode
In low power mode, the quiescent current of each LDO
is reduced from 27µA/18µA (NMOS/PMOS) to less than
5µA. The output current of each LDO is limited to 5mA if
operating in low power mode. Each LDO can be individu-
ally enabled to operate in low power mode.
Soft-Start and Dynamic Voltage Change
When a regulator is enabled, the output voltage ramps to
the final voltage at the slew rate of 30mV/µs. The 30mV/
µs ramp rate results in around 30mA inrush current with
a 1.0µF output capacitor under no load condition. For a
1.8V LDO ramping from 0V, the output voltage regulation
is achieved within 60µs. The soft-start ramp rate is also
the rate of change at the output when switching dynami-
cally between two output voltages without disabling. The
soft-start circuitry of LDOs supports starting into a prebi-
ased output.
Output Active Discharge
Each LDO provides an internal 100Ω resistor for output
active discharge function. If the active discharge function
is enabled (Lx_AD = 1), the internal resistor discharges
the energy stored in the output capacitor to GND when-
ever the regulator is disabled.
Either the regulator remains enabled or the active dis-
charge function is disabled (Lx_AD = 0), the internal resis-
tor is disconnected from the output. If the active discharge
function is disabled, the output voltage decays at a rate
that is determined by the output capacitance and the load
current when the regulator is turned off.
Thermal Considerations
In most applications, the MAX77826 does not dissipate
much heat because of its high efficiency. However, in
applications where the MAX77826 runs with heavy loads
at high ambient temperature, the junction temperature
can exceed the maximum operating temperature. In case
the junction temperature reaches approximately +165°C,
the thermal overload protection triggers. The maximum
power dissipation of the MAX77826 depends on the ther-
mal resistance of the IC package and PCB. The power
dissipated in the device is:
PD = POUT x (1/η - 1)
where η is the efficiency of the regulator and POUT is the
output power delivered to the load.
The maximum allowed power dissipation is:
PMAX = (TJMAX - TA)/θJA
TJMAX - TA is the temperature difference between the
maximum rated junction temperature and the ambient
temperature, θJA is the thermal resistance between the
junction and the ambient.
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
32
Serial Interface
The I2C-compatible, 2-wire serial interface is used for
regulator on/off control, setting output voltages, and other
functions. See the Register Map for details.
The I2C serial bus consists of a bidirectional serial-data
line (SDA) and a serial clock (SCL). I2C is an open-drain
bus. SDA and SCL require pullup resistors (500Ω or
greater). Optional 24Ω resistors in series with SDA and
SCL help to protect the device inputs from high voltage
spikes on the bus lines. Series resistors also minimize
crosstalk and undershoot on bus lines.
System Conguration
I2C bus is a multimaster bus. The maximum number of
devices that can attach to the bus is only limited by bus
capacitance.
The figure above shows an example of a typical I2C sys-
tem. A device on I2C bus that sends data to the bus in
called a transmitter. A device that receives data from the
bus is called a receiver. The device that initiates a data
transfer and generates SCL clock signals to control the
data transfer is a master. Any device that is addressed by
the master is considered a slave. When the MAX77826
I2C-compatible interface is operating in normal mode, it is
a slave on I2C bus, and it can be both a transmitter and
a receiver.
Bit Transfer
One data bit transfers for each SCL clock cycle. The data
on SDA must remain stable during the high portion of SCL
clock pulse. Changes in SDA while SCL is high are control
signals (START and STOP conditions).
START and STOP Conditions
When the I2C serial interface is inactive, SDA and SCL
idle high. A master device initiates communication by
issuing a START condition. A START condition is a high-
to-low transition on SDA with SCL high. A STOP condition
is a low-to-high transition on SDA, while SCL is high.
A START condition from the master signals the beginning
of a transmission to the MAX77826. The master termi-
nates transmission by issuing a NOT ACKNOWLEDGE
followed by a STOP condition.
A STOP condition frees the bus. To issue a series of com-
mands to the slave, the master can issue REPEATED
START (Sr) commands instead of a STOP command to
maintain control of the bus. In general, a REPEATED
START command is functionally equivalent to a regular
START command.
When a STOP condition or incorrect address is detected,
the MAX77826 internally disconnects SCL from the I2C
serial interface until the next START condition, minimizing
digital noise and feedthrough.
Figure 9. Functional Logic Diagram for Communications Controller
Figure 10. I2C Bit Transfer Figure 11. START and STOP Conditions
MAX77826 Power Management IC
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33
MASTER
TRANSIMTTER/
RECEIVER
SDA
SCL
SLAVE
RECEIVER
SLAVE
TRANSMITTER
SLAVE
TRANSIMTTER/
RECEIVER
MASTER
TRANSIMTTER/
RECEIVER
SDA
SCL
CHANGE
OF DATA
ALLOWED
DATA LINE STABLE
DATA VALID
S PSr
SCL
SDA
t
HD;STA
t
SU;STA
t
SU;STO
t
HD;STA
Acknowledge
Both the I2C bus master and MAX77826 (slave) generate
acknowledge bits when receiving data. The acknowledge
bit is the last bit of each 9-bit data packet. To generate an
ACKNOWLEDGE (A), the receiving device must pull SDA
low before the rising edge of the acknowledge-related clock
pulse (ninth pulse) and keep it low during the high period of
the clock pulse. To generate a NOT-ACKNOWLEDGE (nA),
the receiving device allows SDA to be pulled high before
the rising edge of the acknowledge-related clock pulse and
leaves it high during the high period of the clock pulse.
Monitoring the acknowledge bits allows for detection
of unsuccessful data transfers. An unsuccessful data
transfer occurs if a receiving device is busy or if a system
fault has occurred. In the event of an unsuccessful data
transfer, the bus master should reattempt communication
at a later time.
Slave Address
The I2C slave address of the MAX77826 is shown in
Table 5.
In general, the clock signal generation for the I2C bus is
the responsibility of the master device. The I2C specifica-
tion allows slow slave devices to alter the clock signal by
holding down the clock line. The process in which a slave
device holds down the clock line is typically called clock
stretching. The MAX77826 does not use any form of clock
stretching to hold down the clock line.
General Call Address
The MAX77826 does not implement I2C specification
general call address. If the MAX77826 sees the gen-
eral call address (00000000b), it does not issue an
ACKNOWLEDGE (A).
Communication Speed
The MAX77826 provides an I2C 3.0-compatible (3.4MHz)
serial interface.
I2C revision 3-compatible serial communications
channel
0Hz to 100kHz (standard mode)
0Hz to 400kHz (fast mode)
0Hz to 1MHz (fast mode plus)
0Hz to 3.4MHz (high-speed mode)
Does not utilize I2C clock stretching
Operating in standard mode, fast mode and fast mode
plus do not require any special protocols. The main con-
sideration when changing the bus speed through this
range is the combination of the bus capacitance and pul-
lup resistors. Higher time constants created by the bus
capacitance and pullup resistance (C x R) slow the bus
operation. Therefore, when increasing bus speeds the
pullup resistance must be decreased to maintain a rea-
sonable time constant. Refer to the Pullup Resistor Sizing
section of I2C revision 3.0 specification for detailed guid-
ance on the pullup resistor selection. In general for bus
capacitances of 200pF, a 100kHz bus needs 5.6kΩ pullup
resistors, a 400kHz bus needs about a 1.5kΩ pullup resis-
tors, and a 1MHz bus needs 680Ω pullup resistors. Note
that the pullup resistor dissipates power when the open-
drain bus is low. The lower the value of the pullup resistor,
the higher the power dissipation is (V2/R).
Operating in high-speed mode requires some special
considerations. For the full list of considerations, refer to
the I2C 3.0 specification. The major considerations with
respect to the MAX77826 are:
The I2C bus master uses current source pullups to
shorten the signal rise times.
The I2C slave must use a different set of input filters
on its SDA and SCL lines to accommodate for the
higher bus speed.
The communication protocols need to utilize the high-
speed master code.
Table 5. Power Management Slave
Address
Figure 12. Slave Address Byte Example for Power Block
MAX77826 Power Management IC
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34
SLAVE
ADDRESS
(7 bit)
SLAVE
ADDRESS
(Write)
SLAVE
ADDRESS
(Read)
110 0000 0xC0 (1100 0000) 0xC1 (1100 0001)
S
SCL
SDA
123
011
8 9
ACKNOWLEDGE
4 5 6 7
0 0 0 R/WA0
At power-up and after each STOP condition, the MAX77826
inputs filters are set for standard mode, fast mode, or fast
mode plus (i.e., 0Hz to 1MHz). To switch the input filters
for high-speed mode, use the high-speed master code
protocols that are described in Communication Protocols
section.
Communication Protocols
The MAX77826 supports both writing and reading from
its registers. Table TBD shows the I2C communication
protocols for each functional block. The power block uses
the same communications protocols.
Writing to a Single Register
Figure 13 shows the protocol for the I2C master device to
write one byte of data to the MAX77826. This protocol is
the same as the SMBus specification’s write byte proto-
col. The write byte protocol is as follows:
1) The master sends a START command (S).
2) The master sends the 7-bit slave address followed
by a write bit (R/W = 0).
3) The addressed slave asserts an ACKNOWLEDGE
(A) by pulling SDA low.
4) The master sends an 8-bit register pointer.
5) The slave acknowledges the register pointer.
6) The master sends a data byte.
7) The slave updates with the new data
8) The slave acknowledges or does not acknowledges
the data byte. The next rising edge on SDA loads
the data byte into its target register and the data
becomes active.
9) The master sends a STOP condition (P) or a RE-
PEATED START condition (Sr). Issuing a P ensures
that the bus input lters are set for 1MHz or slower
operation. Issuing a REPEATED START (Sr) leaves
the bus input lters in their current state.
Writing to Sequential Registers
Figure 14 shows the protocol for writing to a sequential
registers. This protocol is similar to the write byte proto-
col, except the master continues to write after it receives
the first byte of data. When the master is done writing,
it issues a STOP or REPEATED START. The writing to
sequential registers protocol is as follows:
1) The master sends a START command (S).
2) The master sends the 7-bit slave address followed
by a write bit (R/W = 0).
Figure 13. Writing to a Single Register with Write Byte Protocol
MAX77826 Power Management IC
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35
1
S
NUMBER OF
BITS
R/W
SLAVE ADDRESS
7
0
1 8
REGISTER POINTER
A
1
A
1 8
DATA A OR nA
1
P OR Sr*
1
SLAVE TO MASTERMASTER TO SLAVE
LEGEND
8 9
ACKNOWLEDGE
7
B0 A
B1
THE DATA IS LOADED INTO
THE TARGET REGISTER AND
BECOMES ACTIVE DURING
THIS RISING EDGE.
SDA
SCL
*P FORCES THE BUS FILTERS TO SWITCH
TO THEIR ≤ 1MHz MODE. Sr LEAVES THE
BUS FILTERS IN THEIR CURRENT STATE.
3) The addressed slave asserts an ACKNOWLEDGE
(A) by pulling SDA LOW.
4) The master sends an 8-bit register pointer.
5) The slave acknowledges the register pointer.
6) The master sends a data byte.
7) The slave acknowledges the data byte. The next
rising edge on SDA loads the data byte into its target
register, and the data becomes active.
8) Steps 6 and 7 are repeated as many times as the
master requires.
9) During the last acknowledge related clock pulse, the
master can issue an ACKNOWLEDGE (A) or a NOT
ACKNOWLEDGE (nA).
10) The master sends a STOP condition (P) or a RE-
PEATED START condition (Sr). Issuing a P ensures
that the bus input lters are set for 1MHz or slower
operation. Issuing a REPEATED START (Sr) leaves
the bus input lters in their current state.
Figure 14. Writing to Sequential Registers X to N
MAX77826 Power Management IC
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1
S
NUMBER OF
BITS
R/NW
SLAVE ADDRESS
7
0
18
REGISTER POINTER XA
1
A
1 8
DATA X A
1
NUMBER OF
BITS
8
DATA X+1 A
1 8
DATA X+2 A
1
NUMBER OF
BITS
8
DATA N-1 A
18
DATA N
SLAVE TO MASTERMASTER TO SLAVE
LEGEND
8 9
ACKNOWLEDGE
7
B0 AB1
THE DATA IS LOADED
INTO THE TARGET
REGISTER AND
BECOMES ACTIVE
DURING THIS RISING
EDGE
SDA
SCL
DETAIL: Α
8 9
ACKNOWLEDGE
7
B0 AB1
THE DATA IS LOADED
INTO THE TARGET
REGISTER AND
BECOMES ACTIVE
DURING THIS RISING
EDGE
SDA
SCL
DETAIL: Β
1
B9
Α
ΑΑ
Α Β
A OR NA
1
P OR SR*
1
*P FORCES THE BUS
FILTERS TO SWITCH TO
THEIR ≤ 1MHz MODE. Sr
LEAVES THE BUS FILTERS IN
THEIR CURRENT STATE.
REGISTER POINTER =
X + 1 REGISTER POINTER = X +
2
REGISTER POINTER =
X + (N - 2)
REGISTER POINTER =
X + (N - 1)
Writing Multiple Bytes using Register-Data Pairs
Figure 15 shows the protocol for I2C master device to
write multiple bytes to the MAX77826 using register-data
pairs. This protocol allows I2C master device to address
the slave only once and then send data to multiple reg-
isters in a random order. Registers can be written con-
tinuously until the master issues a STOP condition. The
multiple byte register-data pair protocol is as follows:
1) The master sends a START command.
2) The master sends the 7-bit slave address followed
by a write bit.
3) The addressed slave asserts an ACKNOWLEDGE
(A) by pulling SDA low.
4) The master sends an 8-bit register pointer.
5) The slave acknowledges the register pointer.
6) The master sends a data byte.
7) The slave acknowledges the data byte. The next
rising edge on SDA loads the data byte into its target
register and the data becomes active.
8) Steps 4 to 7 are repeated as many times as the
master requires.
9) The master sends a STOP condition. During the ris-
ing edge of the stop related SDA edge, the data byte
that was previously written is loaded into the target
register and becomes active.
Figure 15. Writing to Multiple Registers with Multiple Byte Register-Data Pairs Protocol
MAX77826 Power Management IC
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1
S
NUMBER OF BITS
R/nW
SLAVE ADDRESS
7
0
1 8
REGISTER POINTER X
A
1
A
1 8
DATA X
A
1
P
1
NUMBER OF BITS
8
REGISTER POINTER n
A
1 8
DATA n A
1
NUMBER OF BITS
8
REGISTER POINTER Z
A
1 8
DATA Z A
1
SLAVE TO MASTERMASTER TO SLAVE
LEGEND
α
α
β
8 9
ACKNOWLEDGE
7
B0 A
B1
THE DATA IS LOADED
INTO THE TARGET
REGISTER AND
BECOMES ACTIVE
DURING THIS RISING
EDGE
SDA
SCL
DETAIL: α
8 9
ACKNOWLEDGE
7
B0 A
B1
THE DATA IS LOADED
INTO THE TARGET
REGISTER AND
BECOMES ACTIVE
DURING THIS RISING
EDGE
SDA
SCL
DETAIL: β
1
B9
Reading from a Single Register
The I2C master device reads one byte of data to the
MAX77826. This protocol is the same as SMBus specifi-
cation’s read byte protocol. The read byte protocol is as
follows:
1) The master sends a START command (S).
2) The master sends the 7-bit slave address followed
by a write bit (R/W = 0).
3) The addressed slave asserts an ACKNOWLEDGE
(A) by pulling SDA low.
4) The master sends an 8-bit register pointer.
5) The slave acknowledges the register pointer.
6) The master sends a REPEATED START command
(Sr).
7) The master sends the 7-bit slave address followed
by a read bit (R/W = 1).
8) The addressed slave asserts an ACKNOWLEDGE
(A) by pulling SDA low.
9) The addressed slave places 8 bit of data on the bus
from the location specied by the register pointer.
10) The master issues a NOT ACKNOWLEDGE (nA).
11) The master sends a STOP condition (P) or a RE-
PEATED START condition (Sr). Issuing a P ensures
that the bus input lters are set for 1MHz or slower
operation. Issuing a REPEATED START (Sr) leaves
the bus input lters in their current state.
Note that every time MAX77826 receives a STOP, its
register pointer is set to 0x00. If reading register 0x00
after a STOP has been issued, steps 1 to 6 in the above
algorithm can be skipped.
Reading from Sequential Registers
Figure 16 shows the protocol for reading from sequen-
tial registers. This protocol is similar to the read byte
protocol except the master issues an ACKNOWLEDGE
(A) to signal the slave that it wants more data. When
the master has all the data it requires, it issues a NOT
ACKNOWLEDGE (nA) and a STOP (P) to end the trans-
mission. The continuous read from sequential registers
protocol is as follows:
1) The master sends a START command (S).
2) The master sends the 7-bit slave address followed
by a write bit (R/W = 0).
3) The addressed slave asserts an ACKNOWLEDGE
(A) by pulling SDA LOW.
4) The master sends an 8-bit register pointer.
5) The slave acknowledges the register pointer.
6) The master sends a REPEATED START command
(Sr).
7) The master sends the 7-bit slave address followed
by a read bit (R/W = 1).
8) The addressed slave asserts an ACKNOWLEDGE
(A) by pulling SDA low.
9) The addressed slave places 8 bit of data on the bus
from the location specied by the register pointer.
10) The master issues an ACKNOWLEDGE (A) signaling
the slave that it wishes to receive more data.
11) Steps 9 to 10 are repeated as many times as the
master requires. Following the last byte of data, the
master must issue a NOT ACKNOWLEDGE (nA) to
signal that it wishes to stop receiving data.
12) The master sends a STOP condition (P) or a RE-
PEATED START condition (Sr). Issuing a STOP (P)
ensures that the bus input lters are set for 1MHz or
slower operation. Issuing a REPEATED START (Sr)
leaves the bus input lters in their current state.
Note that every time the MAX77826 receives a STOP its
register pointer is set to 0x00. If reading register 0x00
after a STOP has been issued, steps 1 to 6 in the above
algorithm can be skipped.
Engaging HS-Mode for Operation up to 3.4MHz
Figure 17 shows the protocol for engaging HS mode
operation. HS mode operation allows for a bus operating
speed up to 3.4MHz. The engaging HS mode protocol is
as follows:
1) Begin the protocol while operating at a bus speed of
1MHz or lower.
2) The master sends a START command (S).
3) The master sends the 8-bit master code of
00001xxxb where xxxb are don’t care bits.
4) The addressed slave issues a NOT ACKNOWL-
EDGE (nA).
5) The master may now increase its bus speed up to
3.4MHz and issue any read/write operation.
6) The master may continue to issue high-speed read/
write operations until a STOP (P) is issued. Issuing
a STOP (P) ensures that the bus input lters are
set for 1MHz or slower operation. After a STOP has
been issued, steps 1 to 6 in the above algorithm may
be skipped.
MAX77826 Power Management IC
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38
PMIC Registers
Register Reset Conditions
Type-S1: Registers are reset when VSYS < POR (≈1.55V)
Type-O: Registers are reset when VSYS < VUVLO OR VIO < VTH_VIO_OK OR CE = LOW
Figure 16. Reading Continuously from Sequential Registers with X to N
Figure 17. Engaging HS Mode
MAX77826 Power Management IC
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39
1
S
R/W
SLAVE ADDRESS
7
0
1 8
REGISTER POINTER X
A
1
A
11
Sr SLAVE ADDRESS
7
1
1 8
DATA X
A
1
A
1NUMBER OF
BITS
R/W
8
DATA X + 3 A
1NUMBER OF
BITS
8
DATA X + 2 A
1
DATA X + 1 A
8 1
8
DATA n nA
1
8
DATA n-1 A
1
DATA n-2 A
8 1
SLAVE TO MASTERMASTER TO SLAVE
LEGEND
NUMBER OF
BITS
1
P OR Sr*
*P FORCES THE BUS FILTERS TO
SWITCH TO THEIR ≤ 1MHz MODE. Sr
LEAVES THE BUS FILTERS IN THEIR
CURRENT STATE.
REGISTER POINTER =
X + 1
REGISTER POINTER =
X + 2
REGISTER POINTER =
X + 3
REGISTER POINTER =
X + (N - 3)
REGISTER POINTER =
X + (N - 2)
REGISTER POINTER =
X + (N - 1)
1
S HS MASTER CODE
8
NA
1 1
SR
SLAVE TO MASTER
MASTER TO SLAVE
LEGEND
FAST MODE HS MODE
ANY READ/WRITE PROTOCOL
FOLLOWED BY SR SR ANY READ/WRITE PROTOCOL
FOLLOWED BY SR SR ANY READ/WRITE PROTOCOL P
FAST MODE
Register Map
I2C Slave Address (W/R): 0xC0/0xC1
MAX77826 Power Management IC
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40
ADDR NAME RESET
TYPE R/W BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 RESET
VALUE
0x00 INT_SRC Type-O R RSVD RSVD RSVD RSVD RSVD BB_INT REG_
INT
TOPSYS
_INT 0x00
0x01 SYS_INT Type-S1 R/C RSVD RSVD RSVD RSVD RSVD RSVD TJCT_
120C
TJCT_
140C 0x00
0x02 REG_
INT1 Type-S1 R/C LDO8_
POKn
LDO7_
POKn
LDO6_
POKn
LDO5_
POKn
LDO4_
POKn
LDO3_
POKn
LDO2_
POKn
LDO1_
POKn 0x00
0x03 REG_
INT2 Type-S1 R/C B_POKn LDO15_
POKn
LDO14_
POKn
LDO13_
POKn
LDO12_
POKn
LDO11_
POKn
LDO10_
POKn
LDO9_
POKn 0x00
0x04 BB_
INT Type-S1 R/C RSVD RSVD RSVD RSVD RSVD BB_POKn BB_
OVP BB_OCP 0x00
0x05 INT_
SRC_M Type-O R/W RSVD RSVD RSVD RSVD RSVD BB_
INT_M
REG_
INT_M
TOPSYS
_INT_M 0x07
0x06 TOPSYS
_INT_M Type-O R/W RSVD RSVD RSVD RSVD RSVD RSVD TJCT_
120C_M
TJCT_
140C_M 0x03
0x07 REG_
INT1_M Type-O R/W LDO8_
POKn_M
LDO7_
POKn_M
LDO6_
POKn_M
LDO5_
POKn_M
LDO4_
POKn_M
LDO3_
POKn_M
LDO2_
POKn_M
LDO1_
POKn_M 0xFF
0x08 REG_
INT2_M Type-O R/W B_
POKn_M
LDO15_
POKn_M
LDO14_
POKn_M
LDO13_
POKn_M
LDO12_
POKn_M
LDO11_
POKn_M
LDO10_
POKn_M
LDO9_
POKn_M 0xFF
0x09 BB_
INT_M Type-O R/W RSVD RSVD RSVD RSVD RSVD BB_
POKn_M
BB_
OVP_M
BB_
OCP_M 0x07
0x0A TOPSYS_
STAT Type-O R RSVD RSVD RSVD RSVD RSVD RSVD TJCT_
120C
TJCT_
140C
0x0B REG_
STAT1 Type-O R LDO8_
POKn
LDO7_
POKn
LDO6_
POKn
LDO5_
POKn
LDO4_
POKn
LDO3_
POKn
LDO2_
POKn
LDO1_
POKn
0x0C REG_
STAT2 Type-O R B_POKn LDO15_
POKn
LDO14_
POKn
LDO13_
POKn
LDO12_
POKn
LDO11_
POKn
LDO10_
POKn
LDO9_
POKn
0x0D BB_
STAT Type-O R RSVD RSVD RSVD RSVD RSVD BB_
POKn
BB_
OVP
BB_
OCP
0x0E–
0x0F RSVD
0x10 LDO_
OPMD1 Type-O R/W L4_EN L4_LPM L3_EN L3_LPM L2_EN L2_LPM L1_EN L1_
LPM 0x00
Register Map (continued)
I2C Slave Address (W/R): 0xC0/0xC1 (continued)
MAX77826 Power Management IC
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41
ADDR NAME RESET
TYPE R/W BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 RESET
VALUE
0x11 LDO_
OPMD2 Type-O R/W L8_EN L8_LPM L7_EN L7_LPM L6_EN L6_LPM L5_EN L5_
LPM 0x00
0x12 LDO_
OPMD3 Type-O R/W L12_EN L12_
LPM L11_EN L11_LPM L10_EN L10_LPM L9_EN L9_
LPM 0x00
0x13 LDO_
OPMD4 Type-O R/W RSVD RSVD L15_EN L15_LPM L14_EN L14_LPM L13_
EN
L13_
LPM 0x00
0x14 B_BB_
OPMD Type-O R/W RSVD RSVD RSVD RSVD BB_EN RSVD B_EN B_
LPM 0x00
0x15–
0x1F RSVD
0x20 LDO1_
CFG Type-O R/W L1_AD L1_VOUT[6:0] 0xA0
0x21 LDO2_
CFG Type-O R/W L2_AD L2_VOUT[6:0] 0xA0
0x22 LDO3_
CFG Type-O R/W L3_AD L3_VOUT[6:0] 0xA0
0x23 LDO4_
CFG Type-O R/W L4_AD L4_VOUT[6:0] 0x9C
0x24 LDO5_
CFG Type-O R/W L5_AD L5_VOUT[6:0] 0xA8
0x25 LDO6_
CFG Type-O R/W L6_AD L6_VOUT[6:0] 0xA8
0x26 LDO7_
CFG Type-O R/W L7_AD L7_VOUT[6:0] 0xA8
0x27 LDO8_
CFG Type-O R/W L8_AD L8_VOUT[6:0] 0xA8
0x28 LDO9_
CFG Type-O R/W L9_AD L9_VOUT[6:0] 0xA8
0x29 LDO10_
CFG Type-O R/W L10_AD L10_VOUT[6:0] 0xD0
0x2A LDO11
_CFG Type-O R/W L11_AD L11_VOUT[6:0] 0xD0
Register Map (continued)
I2C Slave Address (W/R): 0xC0/0xC1 (continued)
MAX77826 Power Management IC
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42
ADDR NAME RESET
TYPE R/W BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 RESET
VALUE
0x2B LDO12
_CFG Type-O R/W L12_AD L12_VOUT[6:0] 0xE4
0x2C LDO13_
CFG Type-O R/W L13_AD L13_VOUT[6:0] 0xE4
0x2D LDO14_
CFG Type-O R/W L14_AD L14_VOUT[6:0] 0xE4
0x2E LDO15_
CFG Type-O R/W L15_AD L15_VOUT[6:0] 0xE4
0x2F RSVD
0x30 BUCK_
CFG Type-O R/W B_RAMP[1:0] RSVD RSVD B_AD B_FPWM RSVD B_
FSRADE 0x09
0x31 BUCK_
VOUT Type-O R/W B_VOUT[7:0] 0x78
0x32 BB_CFG Type-O R/W RSVD RSVD BB_OVP_TH[1:0] BB_AD BB_
HSKIP
BB_
FPWM RSVD 0x3C
0x33 BB_
VOUT Type-O R/W RSVD BB_VOUT[6:0] 0x48
0x34–
0x3F RSVD
0x40 BUCK_
SS_FREQ Type-O R/W RSVD RSVD RSVD B_SS RSVD B_FREQ[2:0] 0x04
0x41 UVLO_
FALL Type-O R/W RSVD RSVD RSVD RSVD RSVD RSVD UVLO_F[1:0] 0x01
0x42–
0xFF RSVD
INT_SRC
Interrupt Source Register
TOPSYS_INT
TOPSYS Interrupt Register
REG_INT1
Regulators Interrupt Register1
MAX77826 Power Management IC
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43
ADDRESS MODE TYPE: O RESET VALUE: 0x00
0x00 R
BIT NAME POR DESCRIPTION
7:3 RSVD 0000 0
2 BB_INT 0 1: Interrupt event on BUCK BOOST is detected.
1 REG_INT 0 1: Interrupt event on BUCK or LDOs is detected.
0 TOPSYS_INT 0 1: Interrupt event on TOPSYS is detected.
ADDRESS MODE TYPE: S1 RESET VALUE: 0x00
0x01 R/C
BIT NAME POR DESCRIPTION
7:2 RSVD 0000 00
1 TJCT_120C 0 1: Junction temperature (TJCT ) is higher than +120°C.
0 TJCT_140C 0 1: Junction temperature (TJCT ) is higher than +140°C.
ADDRESS MODE TYPE: S1 RESET VALUE: 0x00
0x02 R/C
BIT NAME POR DESCRIPTION
7 LDO8_POKn 0 1: LDO8 POKn is triggered.
6 LDO7_POKn 0 1: LDO7 POKn is triggered.
5 LDO6_POKn 0 1: LDO6 POKn is triggered.
4 LDO5_POKn 0 1: LDO5 POKn is triggered.
3 LDO4_POKn 0 1: LDO4 POKn is triggered.
2 LDO3_POKn 0 1: LDO3 POKn is triggered.
1 LDO2_POKn 0 1: LDO2 POKn is triggered.
0 LDO1_POKn 0 1: LDO1 POKn is triggered.
REG_INT2
Regulators Interrupt Register2
BB_INT
BUCK BOOST Interrupt Register
INT_SRC_M
Interrupt Source Mask Register
MAX77826 Power Management IC
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44
ADDRESS MODE TYPE: S1 RESET VALUE: 0x00
0x03 R/C
BIT NAME POR DESCRIPTION
7 B_POKn 0 1: BUCK POKn is triggered.
6 LDO15_POKn 0 1: LDO15 POKn is triggered.
5 LDO14_POKn 0 1: LDO14 POKn is triggered.
4 LDO13_POKn 0 1: LDO13 POKn is triggered.
3 LDO12_POKn 0 1: LDO12 POKn is triggered.
2 LDO11_POKn 0 1: LDO11 POKn is triggered.
1 LDO10_POKn 0 1: LDO10 POKn is triggered.
0 LDO9_POKn 0 1: LDO9 POKn is triggered.
ADDRESS MODE TYPE: S1 RESET VALUE: 0x00
0x04 R/C
BIT NAME POR DESCRIPTION
7:3 RSVD 0000 0
2 BB_POKn 0 1: BUCK BOOST POKn is triggered.
1 BB_OVP 0 1: BUCK BOOST OVP is triggered.
0 BB_OCP 0 1: BUCK BOOST OCP is triggered.
ADDRESS MODE TYPE: O RESET VALUE: 0x07
0x05 R/W
BIT NAME POR DESCRIPTION
7:3 RSVD 0000 0
2 BB_INT_M 1 0: Enable BUCK BOOST interrupt events.
1: Mask BUCK BOOST interrupt events.
1 REG_INT_M 1 0: Enable REG interrupt events.
1: Mask REG interrupt events.
0 TOPSYS_INT_M 1 0: Enable TOPSYS interrupt events.
1: Mask TOPSYS interrupt events.
TOPSYS_INT_M
TOPSYS Interrupt Mask Register
REG_INT1_M
Regulators Interrupt Mask Register 1
MAX77826 Power Management IC
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45
ADDRESS MODE TYPE: O RESET VALUE: 0x03
0x05 R/W
BIT NAME POR DESCRIPTION
7:2 RSVD 0000 00
1 TJCT_120C_M 1 0: Enable TJCT_120 interrupt.
1: Mask TJCT_120 interrupt.
0 TJCT_140C_M 1 0: Enable TJCT_140 interrupt.
1: Mask TJCT_140 interrupt.
ADDRESS MODE TYPE: O RESET VALUE: 0xFF
0x07 R/W
BIT NAME POR DESCRIPTION
7 LDO8_POKn_M 1 0: Enable LDO8 POKn interrupt.
1: Mask LDO8 POKn interrupt.
6 LDO7_POKn_M 1 0: Enable LDO7 POKn interrupt.
1: Mask LDO7 POKn interrupt.
5 LDO6_POKn_M 1 0: Enable LDO6 POKn interrupt.
1: Mask LDO6 POKn interrupt.
4 LDO5_POKn_M 1 0: Enable LDO5 POKn interrupt.
1: Mask LDO5 POKn interrupt.
3 LDO4_POKn_M 1 0: Enable LDO4 POKn interrupt.
1: Mask LDO4 POKn interrupt.
2 LDO3_POKn_M 1 0: Enable LDO3 POKn interrupt.
1: Mask LDO3 POKn interrupt.
1 LDO2_POKn_M 1 0: Enable LDO2 POKn interrupt.
1: Mask LDO2 POKn interrupt.
0 LDO1_POKn_M 1 0: Enable LDO1 POKn interrupt.
1: Mask LDO1 POKn interrupt.
REG_INT2_M
Regulators Interrupt Mask Register 2
BB_INT_M
BUCK BOOST Interrupt Mask Register
MAX77826 Power Management IC
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46
ADDRESS MODE TYPE: O RESET VALUE: 0xFF
0x08 R/W
BIT NAME POR DESCRIPTION
7 B_POKn_M 1 0: Enable BUCK POKn interrupt.
1: Mask BUCK POKn interrupt.
6 LDO15_POKn_M 1 0: Enable LDO15 POKn interrupt.
1: Mask LDO15 POKn interrupt.
5 LDO14_POKn_M 1 0: Enable LDO14 POKn interrupt.
1: Mask LDO14 POKn interrupt.
4 LDO13_POKn_M 1 0: Enable LDO13 POKn interrupt.
1: Mask LDO13 POKn interrupt.
3 LDO12_POKn_M 1 0: Enable LDO12 POKn interrupt.
1: Mask LDO12 POKn interrupt.
2 LDO11_POKn_M 1 0: Enable LDO11 POKn interrupt.
1: Mask LDO11 POKn interrupt.
1 LDO10_POKn_M 1 0: Enable LDO10 POKn interrupt.
1: Mask LDO10 POKn interrupt.
0 LDO9_POKn_M 1 0: Enable LDO9 POKn interrupt.
1: Mask LDO9 POKn interrupt.
ADDRESS MODE TYPE: O RESET VALUE: 0x07
0x09 R/W
BIT NAME POR DESCRIPTION
7:3 RSVD 0000 0
2 BB_POKn_M 1 0: Enable BUCK BOOST POKn interrupt.
1: Mask BUCK BOOST POKn interrupt.
1 BB_OVP_M 1 0: Enable BUCK BOOST OVP interrupt.
1: Mask BUCK BOOST OVP interrupt.
0 BB_OCP_M 1 0: Enable BUCK BOOST OCP interrupt.
1: Mask BUCK BOOST OCP interrupt.
TOPSYS_STAT
TOPSYS Status Register
REG_STAT1
Regulators Status Register 1
REG_STAT2
Regulators Status Register 2
MAX77826 Power Management IC
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47
ADDRESS MODE TYPE: O RESET VALUE: N/A
0x0A R
BIT NAME POR DESCRIPTION
7:2 RSVD
1 TJCT_120C 0: Junction temperature (TJCT) ≤ +120°C
1: Junction temperature (TJCT) > +120°C
0 TJCT_140C 0: Junction temperature (TJCT) ≤ +140°C
1: Junction temperature (TJCT) > +140°C
ADDRESS MODE TYPE: O RESET VALUE: 0x00
0x0B R
BIT NAME POR DESCRIPTION
7 LDO8_POKn 0 LDO8 POKn status
6 LDO7_POKn 0 LDO7 POKn status
5 LDO6_POKn 0 LDO6 POKn status
4 LDO5_POKn 0 LDO5 POKn status
3 LDO4_POKn 0 LDO4 POKn status
2 LDO3_POKn 0 LDO3 POKn status
1 LDO2_POKn 0 LDO2 POKn status
0 LDO1_POKn 0 LDO1 POKn status
ADDRESS MODE TYPE: O RESET VALUE: 0x00
0x0C R
BIT NAME POR DESCRIPTION
7 B_POKn 0 BUCK POKn status
6 LDO15_POKn 0 LDO15 POKn status
5 LDO14_POKn 0 LDO14 POKn status
4 LDO13_POKn 0 LDO13 POKn status
3 LDO12_POKn 0 LDO12 POKn status
2 LDO11_POKn 0 LDO11 POKn status
1 LDO10_POKn 0 LDO10 POKn status
0 LDO9_POKn 0 LDO9 POKn status
BB_STAT
BUCK BOOST Status Register
LDO_OPMD1
LDO Operating Mode Register 1
Note: 0x0E–0x0F: RSVD.
MAX77826 Power Management IC
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48
ADDRESS MODE TYPE: O RESET VALUE: 0x00
0x0D R
BIT NAME POR DESCRIPTION
7:3 RSVD 0000 0
2 BB_POKn 0 BUCK BOOST POKn status
1 BB_OVP 0 BUCK BOOST OVP status
0 BB_OCP 0 BUCK BOOST OCP status
ADDRESS MODE TYPE: O RESET VALUE: 0x00
0x10 R/W
BIT NAME POR DESCRIPTION
7 L4_EN 0 0: Output o󰀨
1: Output on
6 L4_LPM 0 0: Normal mode
1: Low power mode
5 L3_EN 0 0: Output o󰀨
1: Output on
4 L3_LPM 0 0: Normal mode
1: Low power mode
3 L2_EN 0 0: Output o󰀨
1: Output on
2 L2_LPM 0 0: Normal mode
1: Low power mode
1 L1_EN 0 0: Output o󰀨
1: Output on
0 L1_LPM 0 0: Normal mode
1: Low power mode
LDO_OPMD2
LDO Operating Mode Register 2
LDO_OPMD3
LDO Operating Mode Register 3
MAX77826 Power Management IC
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49
ADDRESS MODE TYPE: O RESET VALUE: 0x00
0x11 R/W
BIT NAME POR DESCRIPTION
7 L8_EN 0 0: Output o󰀨
1: Output on
6 L8_LPM 0 0: Normal mode
1: Low power mode
5 L7_EN 0 0: Output o󰀨
1: Output on
4 L7_LPM 0 0: Normal mode
1: Low power mode
3 L6_EN 0 0: Output o󰀨
1: Output on
2 L6_LPM 0 0: Normal mode
1: Low power mode
1 L5_EN 0 0: Output o󰀨
1: Output on
0 L5_LPM 0 0: Normal Mode
1: Low Power Mode
ADDRESS MODE ADDRESS RESET VALUE: 0x00
0x12 R/W
BIT NAME POR DESCRIPTION
7 L12_EN 0 0: Output o󰀨
1: Output on
6 L12_LPM 0 0: Normal mode
1: Low power mode
5 L11_EN 0 0: Output o󰀨
1: Output on
4 L11_LPM 0 0: Normal mode
1: Low power mode
3 L10_EN 0 0: Output o󰀨
1: Output on
2 L10_LPM 0 0: Normal mode
1: Low power mode
1 L9_EN 0 0: Output o󰀨
1: Output on
0 L9_LPM 0 0: Normal mode
1: Low power mode
LDO_OPMD4
LDO Operating Mode Register 4
B_BB_OPMD
BUCK and BUCK BOOST Operating Mode Register
Note: 0x14–0x1F: RSVD.
MAX77826 Power Management IC
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50
ADDRESS MODE TYPE: O RESET VALUE: 0x00
0x13 R/W
BIT NAME POR DESCRIPTION
7:6 RSVD
5 L15_EN 0 0b: Output o󰀨
1b: Output on
4 L15_LPM 0 0b: Normal mode
1b: Low power mode
3L14_EN 0 0b: Output o󰀨
1b: Output on
2 L14_LPM 0 0b: Normal mode
1b: Low power mode
1 L13_EN 0 0b: Output o󰀨
1b: Output on
0 L13_LPM 0 0b: Normal mode
1b: Low power mode
ADDRESS MODE TYPE: O RESET VALUE: 0x00
0x14 R/W
BIT NAME POR DESCRIPTION
7:4 RSVD 0000
3 BB_EN 0 0: BUCK BOOST output o󰀨
1: BUCK BOOST output on
2 RSVD 0
1 B_EN 0 0: BUCK output o󰀨
1: BUCK output on
0 B_LPM 0 0: Normal mode
1: Low power mode
LDO1_CFG
LDO1 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
51
ADDRESS MODE TYPE: O RESET VALUE: 0xA0
0x20 R/W
BIT NAME POR DESCRIPTION
7 L1_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L1_VOUT[6:0] 010 0000
NMOS LDO Output Voltage
0x00 = 0.6000V 0x20 = 1.0000V 0x40 = 1.4000V 0x60 = 1.8000V
0x01 = 0.6125V 0x21 = 1.0125V 0x41 = 1.4125V 0x61 = 1.8125V
0x02 = 0.6250V 0x22 = 1.0250V 0x42 = 1.4250V 0x62 = 1.8250V
0x03 = 0.6375V 0x23 = 1.0375V 0x43 = 1.4375V 0x63 = 1.8375V
0x04 = 0.6500V 0x24 = 1.0500V 0x44 = 1.4500V 0x64 = 1.8500V
0x05 = 0.6625V 0x25 = 1.0625V 0x45 = 1.4625V 0x65 = 1.8625V
0x06 = 0.6750V 0x26 = 1.0750V 0x46 = 1.4750V 0x66 = 1.8750V
0x07 = 0.6875V 0x27 = 1.0875V 0x47 = 1.4875V 0x67 = 1.8875V
0x08 = 0.7000V 0x28 = 1.1000V 0x48 = 1.5000V 0x68 = 1.9000V
0x09 = 0.7125V 0x29 = 1.1125V 0x49 = 1.5125V 0x69 = 1.9125V
0x0A = 0.7250V 0x2A = 1.1250V 0x4A = 1.5250V 0x6A = 1.9250V
0x0B = 0.7375V 0x2B = 1.1375V 0x4B = 1.5375V 0x6B = 1.9375V
0x0C = 0.7500V 0x2C = 1.1500V 0x4C = 1.5500V 0x6C = 1.9500V
0x0D = 0.7625V 0x2D = 1.1625V 0x4D = 1.5625V 0x6D = 1.9625V
0x0E = 0.7750V 0x2E = 1.1750V 0x4E = 1.5750V 0x6E = 1.9750V
0x0F = 0.7875V 0x2F = 1.1875V 0x4F = 1.5875V 0x6F = 1.9875V
0x10 = 0.8000V 0x30 = 1.2000V 0x50 = 1.6000V 0x70 = 2.0000V
0x11 = 0.8125V 0x31 = 1.2125V 0x51 = 1.6125V 0x71 = 2.0125V
0x12 = 0.8250V 0x32 = 1.2250V 0x52 = 1.6250V 0x72 = 2.0250V
0x13 = 0.8375V 0x33 = 1.2375V 0x53 = 1.6375V 0x73 = 2.0375V
0x14 = 0.8500V 0x34 = 1.2500V 0x54 = 1.6500V 0x74 = 2.0500V
0x15 = 0.8625V 0x35 = 1.2625V 0x55 = 1.6625V 0x75 = 2.0625V
0x16 = 0.8750V 0x36 = 1.2750V 0x56 = 1.6750V 0x76 = 2.0750V
0x17 = 0.8875V 0x37 = 1.2875V 0x57 = 1.6875V 0x77 = 2.0875V
0x18 = 0.9000V 0x38 = 1.3000V 0x58 = 1.7000V 0x78 = 2.1000V
0x19 = 0.9125V 0x39 = 1.3125V 0x59 = 1.7125V 0x79 = 2.1125V
0x1A = 0.9250V 0x3A = 1.3250V 0x5A = 1.7250V 0x7A = 2.1250V
0x1B = 0.9375V 0x3B = 1.3375V 0x5B = 1.7375V 0x7B = 2.1375V
0x1C = 0.9500V 0x3C = 1.3500V 0x5C = 1.7500V 0x7C = 2.1500V
0x1D = 0.9625V 0x3D = 1.3625V 0x5D = 1.7625V 0x7D = 2.1625V
0x1E = 0.9750V 0x3E = 1.3750V 0x5E = 1.7750V 0x7E = 2.1750V
0x1F = 0.9875V 0x3F = 1.3875V 0x5F = 1.7875V 0x7F = 2.1875V
LDO2_CFG
LDO2 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
52
ADDRESS MODE TYPE: O RESET VALUE: 0xA0
0x21 R/W
BIT NAME POR DESCRIPTION
7 L2_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L2_VOUT[6:0] 010 0000
NMOS LDO Output Voltage
0x00 = 0.6000V 0x20 = 1.0000V 0x40 = 1.4000V 0x60 = 1.8000V
0x01 = 0.6125V 0x21 = 1.0125V 0x41 = 1.4125V 0x61 = 1.8125V
0x02 = 0.6250V 0x22 = 1.0250V 0x42 = 1.4250V 0x62 = 1.8250V
0x03 = 0.6375V 0x23 = 1.0375V 0x43 = 1.4375V 0x63 = 1.8375V
0x04 = 0.6500V 0x24 = 1.0500V 0x44 = 1.4500V 0x64 = 1.8500V
0x05 = 0.6625V 0x25 = 1.0625V 0x45 = 1.4625V 0x65 = 1.8625V
0x06 = 0.6750V 0x26 = 1.0750V 0x46 = 1.4750V 0x66 = 1.8750V
0x07 = 0.6875V 0x27 = 1.0875V 0x47 = 1.4875V 0x67 = 1.8875V
0x08 = 0.7000V 0x28 = 1.1000V 0x48 = 1.5000V 0x68 = 1.9000V
0x09 = 0.7125V 0x29 = 1.1125V 0x49 = 1.5125V 0x69 = 1.9125V
0x0A = 0.7250V 0x2A = 1.1250V 0x4A = 1.5250V 0x6A = 1.9250V
0x0B = 0.7375V 0x2B = 1.1375V 0x4B = 1.5375V 0x6B = 1.9375V
0x0C = 0.7500V 0x2C = 1.1500V 0x4C = 1.5500V 0x6C = 1.9500V
0x0D = 0.7625V 0x2D = 1.1625V 0x4D = 1.5625V 0x6D = 1.9625V
0x0E = 0.7750V 0x2E = 1.1750V 0x4E = 1.5750V 0x6E = 1.9750V
0x0F = 0.7875V 0x2F = 1.1875V 0x4F = 1.5875V 0x6F = 1.9875V
0x10 = 0.8000V 0x30 = 1.2000V 0x50 = 1.6000V 0x70 = 2.0000V
0x11 = 0.8125V 0x31 = 1.2125V 0x51 = 1.6125V 0x71 = 2.0125V
0x12 = 0.8250V 0x32 = 1.2250V 0x52 = 1.6250V 0x72 = 2.0250V
0x13 = 0.8375V 0x33 = 1.2375V 0x53 = 1.6375V 0x73 = 2.0375V
0x14 = 0.8500V 0x34 = 1.2500V 0x54 = 1.6500V 0x74 = 2.0500V
0x15 = 0.8625V 0x35 = 1.2625V 0x55 = 1.6625V 0x75 = 2.0625V
0x16 = 0.8750V 0x36 = 1.2750V 0x56 = 1.6750V 0x76 = 2.0750V
0x17 = 0.8875V 0x37 = 1.2875V 0x57 = 1.6875V 0x77 = 2.0875V
0x18 = 0.9000V 0x38 = 1.3000V 0x58 = 1.7000V 0x78 = 2.1000V
0x19 = 0.9125V 0x39 = 1.3125V 0x59 = 1.7125V 0x79 = 2.1125V
0x1A = 0.9250V 0x3A = 1.3250V 0x5A = 1.7250V 0x7A = 2.1250V
0x1B = 0.9375V 0x3B = 1.3375V 0x5B = 1.7375V 0x7B = 2.1375V
0x1C = 0.9500V 0x3C = 1.3500V 0x5C = 1.7500V 0x7C = 2.1500V
0x1D = 0.9625V 0x3D = 1.3625V 0x5D = 1.7625V 0x7D = 2.1625V
0x1E = 0.9750V 0x3E = 1.3750V 0x5E = 1.7750V 0x7E = 2.1750V
0x1F = 0.9875V 0x3F = 1.3875V 0x5F = 1.7875V 0x7F = 2.1875V
LDO3_CFG
LDO3 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
53
ADDRESS MODE TYPE: O RESET VALUE: 0xA0
0x22 R/W
BIT NAME POR DESCRIPTION
7 L3_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L3_VOUT[6:0] 010 0000
NMOS LDO Output Voltage Table
0x00 = 0.6000V 0x20 = 1.0000V 0x40 = 1.4000V 0x60 = 1.8000V
0x01 = 0.6125V 0x21 = 1.0125V 0x41 = 1.4125V 0x61 = 1.8125V
0x02 = 0.6250V 0x22 = 1.0250V 0x42 = 1.4250V 0x62 = 1.8250V
0x03 = 0.6375V 0x23 = 1.0375V 0x43 = 1.4375V 0x63 = 1.8375V
0x04 = 0.6500V 0x24 = 1.0500V 0x44 = 1.4500V 0x64 = 1.8500V
0x05 = 0.6625V 0x25 = 1.0625V 0x45 = 1.4625V 0x65 = 1.8625V
0x06 = 0.6750V 0x26 = 1.0750V 0x46 = 1.4750V 0x66 = 1.8750V
0x07 = 0.6875V 0x27 = 1.0875V 0x47 = 1.4875V 0x67 = 1.8875V
0x08 = 0.7000V 0x28 = 1.1000V 0x48 = 1.5000V 0x68 = 1.9000V
0x09 = 0.7125V 0x29 = 1.1125V 0x49 = 1.5125V 0x69 = 1.9125V
0x0A = 0.7250V 0x2A = 1.1250V 0x4A = 1.5250V 0x6A = 1.9250V
0x0B = 0.7375V 0x2B = 1.1375V 0x4B = 1.5375V 0x6B = 1.9375V
0x0C = 0.7500V 0x2C = 1.1500V 0x4C = 1.5500V 0x6C = 1.9500V
0x0D = 0.7625V 0x2D = 1.1625V 0x4D = 1.5625V 0x6D = 1.9625V
0x0E = 0.7750V 0x2E = 1.1750V 0x4E = 1.5750V 0x6E = 1.9750V
0x0F = 0.7875V 0x2F = 1.1875V 0x4F = 1.5875V 0x6F = 1.9875V
0x10 = 0.8000V 0x30 = 1.2000V 0x50 = 1.6000V 0x70 = 2.0000V
0x11 = 0.8125V 0x31 = 1.2125V 0x51 = 1.6125V 0x71 = 2.0125V
0x12 = 0.8250V 0x32 = 1.2250V 0x52 = 1.6250V 0x72 = 2.0250V
0x13 = 0.8375V 0x33 = 1.2375V 0x53 = 1.6375V 0x73 = 2.0375V
0x14 = 0.8500V 0x34 = 1.2500V 0x54 = 1.6500V 0x74 = 2.0500V
0x15 = 0.8625V 0x35 = 1.2625V 0x55 = 1.6625V 0x75 = 2.0625V
0x16 = 0.8750V 0x36 = 1.2750V 0x56 = 1.6750V 0x76 = 2.0750V
0x17 = 0.8875V 0x37 = 1.2875V 0x57 = 1.6875V 0x77 = 2.0875V
0x18 = 0.9000V 0x38 = 1.3000V 0x58 = 1.7000V 0x78 = 2.1000V
0x19 = 0.9125V 0x39 = 1.3125V 0x59 = 1.7125V 0x79 = 2.1125V
0x1A = 0.9250V 0x3A = 1.3250V 0x5A = 1.7250V 0x7A = 2.1250V
0x1B = 0.9375V 0x3B = 1.3375V 0x5B = 1.7375V 0x7B = 2.1375V
0x1C = 0.9500V 0x3C = 1.3500V 0x5C = 1.7500V 0x7C = 2.1500V
0x1D = 0.9625V 0x3D = 1.3625V 0x5D = 1.7625V 0x7D = 2.1625V
0x1E = 0.9750V 0x3E = 1.3750V 0x5E = 1.7750V 0x7E = 2.1750V
0x1F = 0.9875V 0x3F = 1.3875V 0x5F = 1.7875V 0x7F = 2.1875V
LDO4_CFG
LDO4 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
54
ADDRESS MODE TYPE: O RESET VALUE: 0x9C
0x23 R/W
BIT NAME POR DESCRIPTION
7 L4_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L4_VOUT[6:0] 001 1100
PMOSLV LDO Output Voltage Table
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO5_CFG
LDO5 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
55
ADDRESS MODE TYPE: O RESET VALUE: 0xA8
0x24 R/W
BIT NAME POR DESCRIPTION
7 L5_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L5_VOUT[6:0] 010 1000
PMOSLV LDO Output Voltage Table
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO6_CFG
LDO6 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
56
ADDRESS MODE TYPE: O RESET VALUE: 0xA8
0x25 R/W
BIT NAME POR DESCRIPTION
7 L6_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L6_VOUT[6:0] 010 1000
PMOSLV LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO7_CFG
LDO7 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
57
ADDRESS MODE TYPE: O RESET VALUE: 0xA8
0x26 R/W
BIT NAME POR DESCRIPTION
7 L7_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L7_VOUT[6:0] 010 1000
PMOSLV LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO8_CFG
LDO8 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
58
ADDRESS MODE TYPE: O RESET VALUE: 0xA8
0x27 R/W
BIT NAME POR DESCRIPTION
7 L8_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L8_VOUT[6:0] 010 1000
PMOSLV LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO9_CFG
LDO9 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
59
ADDRESS MODE TYPE: O RESET VALUE: 0xA8
0x28 R/W
BIT NAME POR DESCRIPTION
7 L9_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L9_VOUT[6:0] 010 1000
PMOSLV LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO10_CFG
LDO10 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
60
ADDRESS MODE TYPE: O RESET VALUE: 0xD0
0x29 R/W
BIT NAME POR DESCRIPTION
7 L10_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L10_VOUT[6:0] 101 0000
PMOSLS LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO11_CFG
LDO11 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
61
ADDRESS MODE TYPE: O RESET VALUE: 0xD0
0x29 R/W
BIT NAME POR DESCRIPTION
7 L10_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L10_VOUT[6:0] 101 0000
PMOSLS LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO12_CFG
LDO12 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
62
ADDRESS MODE TYPE: O RESET VALUE: 0xE4
0x2B R/W
BIT NAME POR DESCRIPTION
7 L12_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L12_VOUT[6:0] 110 0100
PMOSLS LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO13_CFG
LDO13 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
63
ADDRESS MODE TYPE: O RESET VALUE: 0xE4
0x2C R/W
BIT NAME POR DESCRIPTION
7 L13_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L13_VOUT[6:0] 110 0100
PMOSLS LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO14_CFG
LDO14 Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
64
ADDRESS MODE TYPE: O RESET VALUE: 0xE4
0x2D R/W
BIT NAME POR DESCRIPTION
7 L14_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L14_VOUT[6:0] 110 0100
PMOSLS LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
LDO15_CFG
LDO15 Conguration Register
Note: 0x2F: RSVD.
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
65
ADDRESS MODE TYPE: O RESET VALUE: 0xE4
0x2E R/W
BIT NAME POR DESCRIPTION
7 L15_AD 1
Output Active Discharge
0: Disable
1: Enable
6:0 L15_VOUT[6:0] 110 0100
PMOSLS LDO Output Voltage
0x00 = 0.800V 0x20 = 1.600V 0x40 = 2.400V 0x60 = 3.200V
0x01 = 0.825V 0x21 = 1.625V 0x41 = 2.425V 0x61 = 3.225V
0x02 = 0.850V 0x22 = 1.650V 0x42 = 2.450V 0x62 = 3.250V
0x03 = 0.875V 0x23 = 1.675V 0x43 = 2.475V 0x63 = 3.275V
0x04 = 0.900V 0x24 = 1.700V 0x44 = 2.500V 0x64 = 3.300V
0x05 = 0.925V 0x25 = 1.725V 0x45 = 2.525V 0x65 = 3.325V
0x06 = 0.950V 0x26 = 1.750V 0x46 = 2.550V 0x66 = 3.350V
0x07 = 0.975V 0x27 = 1.775V 0x47 = 2.575V 0x67 = 3.375V
0x08 = 1.000V 0x28 = 1.800V 0x48 = 2.600V 0x68 = 3.400V
0x09 = 1.025V 0x29 = 1.825V 0x49 = 2.625V 0x69 = 3.425V
0x0A = 1.050V 0x2A = 1.850V 0x4A = 2.650V 0x6A = 3.450V
0x0B = 1.075V 0x2B = 1.875V 0x4B = 2.675V 0x6B = 3.475V
0x0C = 1.100V 0x2C = 1.900V 0x4C = 2.700V 0x6C = 3.500V
0x0D = 1.125V 0x2D = 1.925V 0x4D = 2.725V 0x6D = 3.525V
0x0E = 1.150V 0x2E = 1.950V 0x4E = 2.750V 0x6E = 3.550V
0x0F = 1.175V 0x2F = 1.975V 0x4F = 2.775V 0x6F = 3.575V
0x10 = 1.200V 0x30 = 2.000V 0x50 = 2.800V 0x70 = 3.600V
0x11 = 1.225V 0x31 = 2.025V 0x51 = 2.825V 0x71 = 3.625V
0x12 = 1.250V 0x32 = 2.050V 0x52 = 2.850V 0x72 = 3.650V
0x13 = 1.275V 0x33 = 2.075V 0x53 = 2.875V 0x73 = 3.675V
0x14 = 1.300V 0x34 = 2.100V 0x54 = 2.900V 0x74 = 3.700V
0x15 = 1.325V 0x35 = 2.125V 0x55 = 2.925V 0x75 = 3.725V
0x16 = 1.350V 0x36 = 2.150V 0x56 = 2.950V 0x76 = 3.750V
0x17 = 1.375V 0x37 = 2.175V 0x57 = 2.975V 0x77 = 3.775V
0x18 = 1.400V 0x38 = 2.200V 0x58 = 3.000V 0x78 = 3.800V
0x19 = 1.425V 0x39 = 2.225V 0x59 = 3.025V 0x79 = 3.825V
0x1A = 1.450V 0x3A = 2.250V 0x5A = 3.050V 0x7A = 3.850V
0x1B = 1.475V 0x3B = 2.275V 0x5B = 3.075V 0x7B = 3.875V
0x1C = 1.500V 0x3C = 2.300V 0x5C = 3.100V 0x7C = 3.900V
0x1D = 1.525V 0x3D = 2.325V 0x5D = 3.125V 0x7D = 3.925V
0x1E = 1.550V 0x3E = 2.350V 0x5E = 3.150V 0x7E = 3.950V
0x1F = 1.575V 0x3F = 2.375V 0x5F = 3.175V 0x7F = 3.975V
BUCK_CFG
BUCK Conguration Register
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
66
ADDRESS MODE TYPE: O RESET VALUE: 0x09
0x30 R/W
BIT NAME POR DESCRIPTION
7:6 B_RAMP[1:0] 00
Rising Ramp Rate Control
00b: 12.5mV/µs
01b: 25mV/µs
10b: 50mV/µs
11b: 100mV/µs
5:4 RSVD 00
3 B_AD 1
Output Active Discharge
0: Disable
1: Enable
2 B_FPWM 0
Forced PWM
0: Turn o󰀨 Forced PWM
(Automatic SKIP mode operation under light load)
1: Turn on Forced PWM Mode
1 RSVD 0
0 B_FSRAD 1
Falling Slew Rate Active Discharge
0: Disable Active Discharge
BUCK is allowed to operate in SKIP mode during the time the output voltage
decreases (only if B3_FPWM = 0). In SKIP mode, BUCK cannot sink
current from the output capacitor and the output voltage falling slew rate is
a function of the external load. If the load is heavy, the output voltage falling
slew rate is limited to 6.25mV/µs. If the load is light, the output voltage falling
slew rate is a function of the output capacitance and the load. Note that the
internal feedback string always imposes a 2µA load on the output.
1: Enable Active Discharge
BUCK operates in forced PWM mode during the time the output voltage
decreases. In forced PWM mode, BUCK can sink current from the output
capacitor to ensure that the output voltage falls at the rate of 6.25mV/µs.
To ensure a smooth output voltage ramp-down, forced PMW mode remains
engaged for 50µs after the output voltage decreases to its target voltage.
BUCK_VOUT
BUCK Output Voltage Setting Register
BUCK Output Voltage
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
67
ADDRESS MODE TYPE: O RESET VALUE: 0x78
0x31 R/W
BIT NAME POR DESCRIPTION
7:0 B_VOUT[7:0] 0111 1000 BUCK Output Voltage (see table immediately below)
0x00 =
0.50000V
0x20 =
0.70000V
0x40 =
0.90000V
0x60 =
1.10000V
0x80 =
1.30000V
0xA0 =
1.50000V
0xC0 =
1.70000V
0xE0 =
1.80000V
0x01 =
0.50625V
0x21 =
0.70625V
0x41 =
0.90625V
0x61 =
1.10625V
0x81 =
1.30625V
0xA1 =
1.50625V
0xC1 =
1.70625V
0xE1 =
1.80000V
0x02 =
0.51250V
0x22 =
0.71250V
0x42 =
0.91250V
0x62 =
1.11250V
0x82 =
1.31250V
0xA2 =
1.51250V
0xC2 =
1.71250V
0xE2 =
1.80000V
0x03 =
0.51875V
0x23 =
0.71875V
0x43 =
0.91875V
0x63 =
1.11875V
0x83 =
1.31875V
0xA3 =
1.51875V
0xC3 =
1.71875V
0xE3 =
1.80000V
0x04 =
0.52500V
0x24 =
0.72500V
0x44 =
0.92500V
0x64 =
1.12500V
0x84 =
1.32500V
0xA4 =
1.52500V
0xC4 =
1.72500V
0xE4 =
1.80000V
0x05 =
0.53125V
0x25 =
0.73125V
0x45 =
0.93125V
0x65 =
1.13125V
0x85 =
1.33125V
0xA5 =
1.53125V
0xC5 =
1.73125V
0xE5 =
1.80000V
0x06 =
0.53750V
0x26 =
0.73750V
0x46 =
0.93750V
0x66 =
1.13750V
0x86 =
1.33750V
0xA6 =
1.53750V
0xC6 =
1.73750V
0xE6 =
1.80000V
0x07 =
0.54375V
0x27 =
0.74375V
0x47 =
0.94375V
0x67 =
1.14375V
0x87 =
1.34375V
0xA7 =
1.54375V
0xC7 =
1.74375V
0xE7 =
1.80000V
0x08 =
0.55000V
0x28 =
0.75000V
0x48 =
0.95000V
0x68 =
1.15000V
0x88 =
1.35000V
0xA8 =
1.55000V
0xC8 =
1.75000V
0xE8 =
1.80000V
0x09 =
0.55625V
0x29 =
0.75625V
0x49 =
0.95625V
0x69 =
1.15625V
0x89 =
1.35625V
0xA9 =
1.55625V
0xC9 =
1.75625V
0xE9 =
1.80000V
0x0A =
0.56250V
0x2A =
0.76250V
0x4A =
0.96250V
0x6A =
1.16250V
0x8A =
1.36250V
0xAA =
1.56250V
0xCA =
1.76250V
0xEA =
1.80000V
0x0B =
0.56875V
0x2B =
0.76875V
0x4B =
0.96875V
0x6B =
1.16875V
0x8B =
1.36875V
0xAB =
1.56875V
0xCB =
1.76875V
0xEB =
1.80000V
0x0C =
0.57500V
0x2C =
0.77500V
0x4C =
0.97500V
0x6C =
1.17500V
0x8C =
1.37500V
0xAC =
1.57500V
0xCC =
1.77500V
0xEC =
1.80000V
0x0D =
0.58125V
0x2D =
0.78125V
0x4D =
0.98125V
0x6D =
1.18125V
0x8D =
1.38125V
0xAD =
1.58125V
0xCD =
1.78125V
0xED =
1.80000V
0x0E =
0.58750V
0x2E =
0.78750V
0x4E =
0.98750V
0x6E =
1.18750V
0x8E =
1.38750V
0xAE =
1.58750V
0xCE =
1.78750V
0xEE =
1.80000V
0x0F =
0.59375V
0x2F =
0.79375V
0x4F =
0.99375V
0x6F =
1.19375V
0x8F =
1.39375V
0xAF =
1.59375V
0xCF =
1.79375V
0xEF =
1.80000V
BUCK Output Voltage (continued)
MAX77826 Power Management IC
www.maximintegrated.com Maxim Integrated
68
0x10 =
0.60000V
0x30 =
0.80000V
0x50 =
1.00000V
0x70 =
1.20000V
0x90 =
1.40000V
0xB0 =
1.60000V
0xD0 =
1.80000V
0xF0 =
1.80000V
0x11 =
0.60625V
0x31 =
0.80625V
0x51 =
1.00625V
0x71 =
1.20625V
0x91 =
1.40625V
0xB1 =
1.60625V
0xD1 =
1.80000V
0xF1 =
1.80000V
0x12 =
0.61250V
0x32 =
0.81250V
0x52 =
1.01250V
0x72 =
1.21250V
0x92 =
1.41250V
0xB2 =
1.61250V
0xD2 =
1.80000V
0xF2 =
1.80000V
0x13 =
0.61875V
0x33 =
0.81875V
0x53 =
1.01875V
0x73 =
1.21875V
0x93 =
1.41875V
0xB3 =
1.61875V
0xD3 =
1.80000V
0xF3 =
1.80000V
0x14 =
0.62500V
0x34 =
0.82500V
0x54 =
1.02500V
0x74 =
1.22500V
0x94 =
1.42500V
0xB4 =
1.62500V
0xD4 =
1.80000V
0xF4 =
1.80000V
0x15 =
0.63125V
0x35 =
0.83125V
0x55 =
1.03125V
0x75 =
1.23125V
0x95 =
1.43125V
0xB5 =
1.63125V
0xD5 =
1.80000V
0xF5 =
1.80000V
0x16 =
0.63750V
0x36 =
0.83750V
0x56 =
1.03750V
0x76 =
1.23750V
0x96 =
1.43750V
0xB6 =
1.63750V
0xD6 =
1.80000V
0xF6 =
1.80000V
0x17 =
0.64375V
0x37 =
0.84375V
0x57 =
1.04375V
0x77 =
1.24375V
0x97 =
1.44375V
0xB7 =
1.64375V
0xD7 =
1.80000V
0xF7 =
1.80000V
0x18 =
0.65000V
0x38 =
0.85000V
0x58 =
1.05000V
0x78 =
1.25000V
0x98 =
1.45000V
0xB8 =
1.65000V
0xD8 =
1.80000V
0xF8 =
1.80000V
0x19 =
0.65625V
0x39 =
0.85625V
0x59 =
1.05625V
0x79 =
1.25625V
0x99 =
1.45625V
0xB9 =
1.65625V
0xD9 =
1.80000V
0xF9 =
1.80000V
0x1A =
0.66250V
0x3A =
0.86250V
0x5A =
1.06250V
0x7A =
1.26250V
0x9A =
1.46250V
0xBA =
1.66250V
0xDA =
1.80000V
0xFA =
1.80000V
0x1B =
0.66875V
0x3B =
0.86875V
0x5B =
1.06875V
0x7B =
1.26875V
0x9B =
1.46875V
0xBB =
1.66875V
0xDB =
1.80000V
0xFB =
1.80000V
0x1C =
0.67500V
0x3C =
0.87500V
0x5C =
1.07500V
0x7C =
1.27500V
0x9C =
1.47500V
0xBC =
1.67500V
0xDC =
1.80000V
0xFC =
1.80000V
0x1D =
0.68125V
0x3D =
0.88125V
0x5D =
1.08125V
0x7D =
1.28125V
0x9D =
1.48125V
0xBD =
1.68125V
0xDD =
1.80000V
0xFD =
1.80000V
0x1E =
0.68750V
0x3E =
0.88750V
0x5E =
1.08750V
0x7E =
1.28750V
0x9E =
1.48750V
0xBE =
1.68750V
0xDE =
1.80000V
0xFE =
1.80000V
0x1F =
0.69375V
0x3F =
0.89375V
0x5F =
1.09375V
0x7F =
1.29375V
0x9F =
1.49375V
0xBF =
1.69375V
0xDF =
1.80000V
0xFF =
1.80000V
BB_CFG
BUCK BOOST Conguration Register
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ADDRESS MODE TYPE: O RESET VALUE: 0x3C
0x32 R/W
BIT NAME POR DESCRIPTION
7:6 RSVD 00
5:4 BB_OVP_TH[1:0] 11
Output OVP Threshold
00b: No OVP
01b: 110% of VOUT
10b: 115% of VOUT
11b: 120% of VOUT
3 BB_AD 1
Output Active Discharge
0: Disable 1kΩ active discharge.
1: Enable 1kΩ active discharge.
2 BB_HSKIP 1
High-Skip Mode Enable
0: Disable high-skip mode.
1: Enable high-skip mode.
HSKIP function is active only when BB_FPWM = 0 and BB_HSKIP = 1.
1 BB_FPWM 0
Forced PWM Enable
0: HSKIP mode
HSKIP function is active when BB_FPWM = 0 and BB_HSKIP = 0.
1: Forced PWM
0 RSVD 0
BB_VOUT
BUCK BOOST Output Voltage Setting Register
Note: 0x34–0x3F: RSVD.
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ADDRESS MODE TYPE: O RESET VALUE: 0x48
0x33 R/W
BIT NAME POR DESCRIPTION
7 RSVD 0 Write 0.
6:0 BB_VOUT[6:0] 100 0000
BUCK BOOST Output Voltage
0x00 = 2.6000V 0x20 = 3.0000V 0x40 = 3.4000V 0x60 = 3.8000V
0x01 = 2.6125V 0x21 = 3.0125V 0x41 = 3.4125V 0x61 = 3.8125V
0x02 = 2.6250V 0x22 = 3.0250V 0x42 = 3.4250V 0x62 = 3.8250V
0x03 = 2.6375V 0x23 = 3.0375V 0x43 = 3.4375V 0x63 = 3.8375V
0x04 = 2.6500V 0x24 = 3.0500V 0x44 = 3.4500V 0x64 = 3.8500V
0x05 = 2.6625V 0x25 = 3.0625V 0x45 = 3.4625V 0x65 = 3.8625V
0x06 = 2.6750V 0x26 = 3.0750V 0x46 = 3.4750V 0x66 = 3.8750V
0x07 = 2.6875V 0x27 = 3.0875V 0x47 = 3.4875V 0x67 = 3.8875V
0x08 = 2.7000V 0x28 = 3.1000V 0x48 = 3.5000V 0x68 = 3.9000V
0x09 = 2.7125V 0x29 = 3.1125V 0x49 = 3.5125V 0x69 = 3.9125V
0x0A = 2.7250V 0x2A = 3.1250V 0x4A = 3.5250V 0x6A = 3.9250V
0x0B = 2.7375V 0x2B = 3.1375V 0x4B = 3.5375V 0x6B = 3.9375V
0x0C = 2.7500V 0x2C = 3.1500V 0x4C = 3.5500V 0x6C = 3.9500V
0x0D = 2.7625V 0x2D = 3.1625V 0x4D = 3.5625V 0x6D = 3.9625V
0x0E = 2.7750V 0x2E = 3.1750V 0x4E = 3.5750V 0x6E = 3.9750V
0x0F = 2.7875V 0x2F = 3.1875V 0x4F = 3.5875V 0x6F = 3.9875V
0x10 = 2.8000V 0x30 = 3.2000V 0x50 = 3.6000V 0x70 = 4.0000V
0x11 = 2.8125V 0x31 = 3.2125V 0x51 = 3.6125V 0x71 = 4.0125V
0x12 = 2.8250V 0x32 = 3.2250V 0x52 = 3.6250V 0x72 = 4.0250V
0x13 = 2.8375V 0x33 = 3.2375V 0x53 = 3.6375V 0x73 = 4.0375V
0x14 = 2.8500V 0x34 = 3.2500V 0x54 = 3.6500V 0x74 = 4.0500V
0x15 = 2.8625V 0x35 = 3.2625V 0x55 = 3.6625V 0x75 = 4.0625V
0x16 = 2.8750V 0x36 = 3.2750V 0x56 = 3.6750V 0x76 = 4.0750V
0x17 = 2.8875V 0x37 = 3.2875V 0x57 = 3.6875V 0x77 = 4.0875V
0x18 = 2.9000V 0x38 = 3.3000V 0x58 = 3.7000V 0x78 = 4.1000V
0x19 = 2.9125V 0x39 = 3.3125V 0x59 = 3.7125V 0x79 = 4.1125V
0x1A = 2.9250V 0x3A = 3.3250V 0x5A = 3.7250V 0x7A = 4.1250V
0x1B = 2.9375V 0x3B = 3.3375V 0x5B = 3.7375V 0x7B = 4.1375V
0x1C = 2.9500V 0x3C = 3.3500V 0x5C = 3.7500V 0x7C = 4.1500V
0x1D = 2.9625V 0x3D = 3.3625V 0x5D = 3.7625V 0x7D = 4.1625V
0x1E = 2.9750V 0x3E = 3.3750V 0x5E = 3.7750V 0x7E = 4.1750V
0x1F = 2.9875V 0x3F = 3.3875V 0x5F = 3.7875V 0x7F = 4.1875V
BUCK_SS_FREQ
BUCK Soft-Start and Switching Frequency Conguration Register
UVLO_FALL
VSYS UVLO Falling Threshold Program Register
Note: 0x42–0xFF: RSVD.
MAX77826 Power Management IC
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ADDRESS MODE TYPE: O RESET VALUE: 0x04
0x40 R/W
BIT NAME POR DESCRIPTION
7:5 RSVD 000 Write 0.
4 B_SS 0
BUCK Soft-Start Slew Rate
0: 14mV/µs
1: 25mV/µs
3 RSVD 0 Write 0.
2:0 B_FREQ[2:0] 100
Multiphase Current Mode BUCK Switching Frequency
000b: 3.6MHz
001b: 3.2MHz
010b: 2.8MHz
011b: 2.4MHz
100b: 2.0MHz
101b: 1.6MHz
110b: 1.2MHz
111b: 0.8MHz
ADDRESS MODE TYPE: O RESET VALUE: 0x01
0x41 R/W
BIT NAME POR DESCRIPTION
7:2 RSVD 0000 00 Write 0000 00.
1:0 UVLO_F[1:0] 01
VSYS UVLO Falling Threshold
00b: Not used
01b: 2.05V
10b: 2.25V
11b: 2.45V
MAX77826 Power Management IC
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Typical Application Circuit
SYS
BUCK
3A
FB_B
LXB
PGNDB
0.47µH
10µF
INB
2x 22µF
ENBB
ON/OFF
CONTROL
AND
I
2
C INTERFACE
BUCK-BOOST
2A
OUTBB
LXBB1
PGNDBB
1µH
INBB
SBIAS, REF,
UVLO, TSHDN
1µF
800k
V
IO
V
IO
100k
0.1µ
F
IRQB
SCL
SDA
INL1
4.7µF
LDO1
(N600)
LDO2
(N150)
LDO1
LDO2
1µF
ENL12
800k
MAX77826
LXBB2
3x 22µF
1.5k x 2
INL2
1µF LDO3
(N450)
LDO3
INL3
LDO4
(P300LV)
LDO4
LDO5
(P300LV)
LDO6
(P150LV)
LDO5
LDO6
LDO7
(P300LV)
LDO7
LDO8
(P150LV)
LDO9
(P150LV)
LDO8
LDO9
INL4
4.7µF
LDO11
(P150LS)
LDO11
LDO10
(P300LS) 2.2µF
LDO10
2.2µF
INL5
LDO13
(P300LS)
LDO13
2.2µF
LDO14
(P150LS)
LDO15
(P150LS)
LDO14
2.2µF
LDO15
2.2µF
FB_BB
LDO12
(P300LS)
LDO12
2.2µF
800k ENB
REFBYP
0.1µF
GND
CE
BATT
VIO
BUCK
4.7µF
BUCK
4.7µF
2.15V
4.7µF
4.7µF
4.7µF
2.2µF
4.7µF
2.2µF
2.2µF
BATT
10µF
BATT
BATT
4.7µF
BB
+Denotes a lead(Pb)-free/RoHS-compliant package.
MAX77826 Power Management IC
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Ordering Information
Chip Information
PROCESS: S18B
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PART TEMP RANGE PIN-PACKAGE
MAX77826EWJ+ -40°C to +85°C 49 Bumps (7 x 7)
0.4mm Pitch
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
49 WLP W493E3+1 21-0728
Refer to
Application
Note 1891
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
MAX77826 Power Management IC
© 2015 Maxim Integrated Products, Inc.
74
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 6/15 Initial release
1 7/15 Corrected typos and updated notes in Electrical Characteristics table. 4, 7
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.