STTH1R06-Y Automotive Turbo 2 ultrafast high voltage rectifier Datasheet - production data Description K A A The STTH1R06-Y is an ultrafast recovery power rectifier dedicated to energy recovery in automotive application housed in SMBflat to improve space saving. It is especially designed for clamping function in energy recovery block. K The compromise between forward voltage drop and recovery time offers optimized performances. SMBflat Table 1. Device summary Features * Ultrafast recovery * Low switching losses * High surge capability * Low leakage current Symbol Value IF(AV) 1A VRRM 600 V Tj (max) 175 C VF (typ) 1.1 V Trr (typ) 30 ns * High junction temperature * AEC-Q101 qualified * ECOPACK(R)2 compliant component * VRRM guaranteed from -40 to +175 C August 2014 This is information on a product in full production. DocID026713 Rev 1 1/9 www.st.com Characteristics 1 STTH1R06-Y Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified) Symbol 1. Parameter Value Unit VRRM Repetitive peak reverse voltage Tj = -40 to +175 C 600 V IF(AV) Average forward current, square waveform TL = 135 C = 0.5 1 A IFSM Forward Surge current tp = 10 ms 17 A Tstg Storage temperature range -65 to + 175 C Tj(1) Operating temperature range -40 to + 175 C 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Parameter Value Unit 21 C/W Junction to lead Table 4. Static electrical characteristics Symbol Parameter Tests conditions IR(1) Reverse leakage current VF(2) Forward voltage drop Tj = 25 C Tj = 150 C Tj = 25 C Tj = 150 C Min. Typ. Max. VR = 600 V 1 A - 10 75 IF = 1 A Unit 1.9 V - 1.1 1.4 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 1.1 x IF(AV) + 0.30 x IF2(RMS) Table 5. Dynamic electrical characteristics Symbol Tests conditions Min. Typ. Max. Unit trr I = 1 A, dIF/dt = -50 A/s, Reverse recovery time Tj = 25 C F VR = 30 V - tfr Forward recovery time IF = 2 A, dIF/dt = 100 A/s, VFR = 3.5 V - 90 IF = 2 A, dIF/dt = 100 A/s - 8 VFP 2/9 Parameter Forward recovery voltage Tj = 25 C DocID026713 Rev 1 30 45 ns V STTH1R06-Y Characteristics Figure 1. Average forward power dissipation versus average forward current PF(AV)(W) 2.0 Figure 2. Forward voltage drop versus forward current (typical values) IF(A) 10.00 = 0.05 = 0.1 = 0.2 = 0.5 =1 1.6 Tj = 150C 1.00 Tj = 25C 1.2 0.8 0.10 T 0.4 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 tp =tp/T IF(AV)(A) 0.0 0.8 0.9 1.0 0.0 1.2 Figure 3. Forward voltage drop versus forward current (maximum values) 10.00 VF(V) 0.01 1.1 IF(A) 0.5 1.0 1.5 2.0 2.5 3.0 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration 1.0 Zth(j-l)/Rth(j-l) 0.9 0.8 Tj = 150C 0.7 1.00 0.6 Tj = 25C 0.5 0.4 0.10 0.3 Single pulse 0.2 0.1 VF(V) 0.01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Figure 5. Peak reverse recovery current versus dIF/dt (typical values) 9 IRM(A) 8 7 IF = IF(av) 6 5 IF = 0.25 x IF(av) 3 2 1 dIF/dt(A/s) 0 0 50 100 150 200 250 300 1.E-02 350 400 450 500 1.E-01 1.E+00 1.E+01 tRR(ns) VR = 400 V Tj = 125 C IF = 2 x IF(av) 100 90 80 70 60 50 IF = 0.5 x IF(av) 4 1.E-03 Figure 6. Reverse recovery time versus dIF/dt (typical values) 140 130 120 110 IF = 2 x IF(av) VR = 400 V Tj = 125 C tp(s) 0.0 1.E-04 IF = IF(av) IF = 0.5 x IF(av) 40 30 20 10 0 dIF/dt(A/s) 0 50 DocID026713 Rev 1 100 150 200 250 300 350 400 450 500 3/9 9 Characteristics STTH1R06-Y Figure 7. Reverse recovery charges versus dIF/dt (typical values) 250 Qrr(nC) Sfactor 6 VR = 400 V Tj = 125 C 225 Figure 8. Reverse recovery softness factor versus dIF/dt (typical values) IF = IF(av) VR = 400 V Tj = 125 C IF = 2 x IF(av) 5 200 175 4 150 IF = IF(av) 3 125 IF = 0.5 x IF(av) 100 2 75 50 1 25 dIF/dt(A/s) 0 0 50 100 150 200 250 300 350 400 450 dIF/dt(A/s) 0 500 0 Figure 9. Relative variation of dynamic parameters versus junction temperature 100 150 200 250 300 350 400 450 500 Figure 10. Transient peak forward voltage versus dIF/dt (typical values) 1.0 VFP(V) 16 0.9 50 Sfactor IF = 2 A Tj = 125 C 14 0.8 IRM 12 0.7 0.6 10 QRR 0.5 8 0.4 6 0.3 4 0.2 0.1 IF = IF(av) VR = 400 V Reference: Tj = 125 C Tj(C) 0.0 2 dIF/dt(A/s) 0 25 50 75 100 125 20 40 60 80 100 120 140 160 180 200 Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus reverse (typical values) voltage applied (typical values) 100 tFR(ns) IF = 2 A VFR = 3.5 V Tj = 125 C 100 C(pF) F = 1 MHz Vosc = 30 mVRMS Tj = 25 C 80 60 10 40 20 dIF/dt(A/s) 0 20 4/9 40 60 80 100 120 140 160 180 200 VR(V) 1 1 DocID026713 Rev 1 10 100 1000 STTH1R06-Y Characteristics Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 Rth(j-a)(C/W) epoxy printed circuit board FR4, copper thickness: 35 m SMBflat 150 100 50 Scu(cm) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 DocID026713 Rev 1 4.0 4.5 5.0 5/9 9 Package information 2 STTH1R06-Y Package information * Epoxy meets UL94,V0 * Lead-free package * Band indicates cathode In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 14. SMBflat dimensions definitions A c D L 2x L2 2x E E1 L L1 2x b 6/9 DocID026713 Rev 1 STTH1R06-Y Package information Table 6. SMBflat dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.155 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.029 0.059 L1 0.40 0.016 L2 0.60 0.024 Figure 15. SMBflat footprint, dimensions in mm (inches) 5.84 (0.230) 2.07 (0.082) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) DocID026713 Rev 1 7/9 9 Ordering information 3 STTH1R06-Y Ordering information Table 7. Ordering information 4 Order codes Marking Package Weight Base qty Delivery mode STTH1R06UFY F1R6Y SMBflat 50 mg 5000 Tape and reel Revision history Table 8. Document revision history 8/9 Date Revision 04-Aug-2014 1 Changes Initial release. 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