MIC45205 26V/6A DC/DC Power Module Features General Description * * * * MIC45205 is a synchronous step-down regulator module, featuring a unique adaptive ON-time control architecture. The module incorporates a DC/DC controller, power MOSFETs, bootstrap diode, bootstrap capacitor, and an inductor in a single package; simplifying the design and layout process for the end user. * * * * * * * * * * No Compensation Required Up to 6A Output Current >93% Peak Efficiency Output Voltage: 0.8V to 0.85 x VIN with 1% Accuracy Adjustable Switching Frequency from 200 kHz to 600 kHz Enable Input and Open-Drain Power Good Output HyperLight Load (MIC45205-1) Improves Light Load Efficiency Hyper Speed Control (MIC45205-2) Architecture Enables Fast Transient Response Supports Safe Startup into Pre-Biased Output -40C to +125C Junction Temperature Range Thermal Shutdown Protection Short-Circuit Protection with Hiccup Mode Adjustable Current-Limit Available in 52-pin 8 mm x 8 mm x 3 mm QFN Package This highly integrated solution expedites system design and improves product time-to-market. The internal MOSFETs and inductor are optimized to achieve high efficiency at a low output voltage. The fully optimized design can deliver up to 6A current under a wide input voltage range of 4.5V to 26V, without requiring additional cooling. The MIC45205-1 uses Microchip's HyperLight Load(R) (HLL) and the MIC45205-2 uses Microchip's Hyper Speed Control(R) architecture that enables ultra-fast load transient response, allowing for a reduction of output capacitance. The MIC45205 offers 1% output accuracy that can be adjusted from 0.8V to 0.85 x VIN with two external resistors. Additional features include thermal shutdown protection, input undervoltage lockout, adjustable current-limit, and short-circuit protection. The MIC45205 allows for safe start-up into a pre-biased output. Applications * High Power Density Point-of-Load Conversion * Servers, Routers, Networking, and Base Stations * FPGAs, DSP, and Low-Voltage ASIC Power Supplies * Industrial and Medical Equipment Typical Application Diagram VIN 12V PVDD ANODE 5VDD BST PG RIA VOUT PVIN VIN CIN MIC45205 FREQ ON FB RIB CFF EN RFB1 COUT RFB2 SW RLIM OFF GND 2017 Microchip Technology Inc. VOUT UP to 6A ILIM PGND DS20005798A-page 1 MIC45205 Functional Block Diagram BST VIN 5VDD VDD VIN ANODE BST PVIN PVDD EN FREQ PWM CONTROLLER DH EN FREQ SW PG FB GND RIB PVDD RINJ RIA CINJ SW VOUT DL PG FB AGND ILIM PGND PGND ILIM DS20005798A-page 2 2017 Microchip Technology Inc. MIC45205 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings VPVIN, VVIN to PGND ................................................................................................................................. -0.3V to +30V VPVDD, V5VDD, VANODE to PGND................................................................................................................. -0.3V to +6V VSW, VFREQ, VILIM, VEN to PGND ....................................................................................................-0.3V to (VIN + 0.3V) VBST to VSW ................................................................................................................................................. -0.3V to +6V VBST to PGND............................................................................................................................................ -0.3V to +36V VPG to PGND ............................................................................................................................... -0.3V to (5VDD + 0.3V) VFB, VRIB to PGND ...................................................................................................................... -0.3V to (5VDD + 0.3V) PGND to GND........................................................................................................................................... -0.3V to +0.3V Operating Ratings Supply Voltage (VPVIN, VVIN) ..................................................................................................................... +4.5V to +26V Output Current ..............................................................................................................................................................6A Enable Input (VEN) ..............................................................................................................................................0V to VIN Power Good (VPG) .......................................................................................................................................... 0V to 5VDD Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Notice: The device is not guaranteed to function outside its operating ratings. TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VEN = 12V, VOUT = 3.3V, VBST - VSW = 5V, TJ = +25C. Bold values indicate -40C < TJ < +125C, unless otherwise noted. Note 1 Parameter Symbol Min. Typ. Max. Units Conditions VIN, PVIN 4.5 -- 26 V Quiescent Supply Current (MIC45205-1) IQ -- 0.35 0.75 mA VFB = 1.5V Quiescent Supply Current (MIC45205-2) IQ -- 2.1 3 mA VFB = 1.5V Operating Current IIN -- 31 -- mA VPVIN = VIN = 12V, VOUT = 1.8V, IOUT = 0A fSW = 600 kHz (MIC45205-2) ISHDN -- 0.1 10 A SW = unconnected, VEN = 0V Power Supply Input Input Voltage Range Shutdown Supply Current -- 5VDD Output VDD 4.8 5.1 5.4 V VIN = 7V to 26V, I5VDD = 10 mA 5VDD UVLO Threshold 5VDD Output Voltage UVLO 3.8 4.2 4.6 V V5VDD rising 5VDD UVLO Hysteresis UVLO_ HYS -- 400 -- mV V5VDD falling LDO Load Regulation VDD(LR) 0.6 2 3.6 % I5VDD = 0 mA to 40 mA Reference Feedback Reference Voltage FB Bias Current 0.792 0.8 0.808 0.784 0.8 0.816 IFB_BIAS -- 5 500 nA VFB = 0.8V ENHIGH 1.8 -- -- V -- VFB V TJ = +25C -40C TJ +125C Enable Control EN Logic Level High 2017 Microchip Technology Inc. DS20005798A-page 3 MIC45205 TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VEN = 12V, VOUT = 3.3V, VBST - VSW = 5V, TJ = +25C. Bold values indicate -40C < TJ < +125C, unless otherwise noted. Note 1 Parameter Symbol Min. Typ. Max. Units EN Logic Level Low ENLOW -- -- 0.6 V -- Conditions EN Hysteresis ENHYS -- 200 -- mV -- EN Bias Current IENBIAS -- 5 10 A VEN = 12V 400 600 750 -- 350 -- Oscillator VFREQ = VIN, IOUT = 2A Switching Frequency fSW Maximum Duty Cycle DMAX -- 85 -- % Minimum Duty Cycle DMIN -- 0 -- % VFB = 1V tOFF(MIN) 140 200 260 ns -- tSS -- 5 -- ms FB from 0V to 0.8V VCL_ -30 -14 0 mV VFB = 0.79V Minimum Off-Time kHz VFREQ = 50% VIN, IOUT = 2A -- Soft-Start Soft-Start Time Short-Circuit Protection Current-Limit Threshold OFFSET Short-Circuit Threshold VSC -23 -7 9 mV VFB = 0V Current-Limit Source Current ICL 55 70 85 A VFB = 0.79V Short-Circuit Source Current ISC 25 35 45 A VFB = 0V ISW_ -- -- 10 A -- -- -- 10 A -- Leakage SW, BST Leakage Current FREQ Leakage Current LEAKAGE IFREQ_ LEAK Power Good (PG) PG Threshold Voltage VPG_TH 85 90 95 % VOUT Sweep VFB from Low-to-High PG Hysteresis VPG_HYS -- 6 -- PG Delay Time tPG_DLY -- 100 -- % VOUT Sweep VFB from High-to-Low s Sweep VFB from Low-to-High PG Low Voltage VPG_LOW -- 70 200 mV VFB < 90% x VNOM, IPG = 1 mA Overtemperature Shutdown TSHD -- 160 -- C TJ rising Overtemperature Shutdown Hysteresis TSHD_ -- 15 -- C -- Thermal Protection Note 1: HYS Specification for packaged product only. DS20005798A-page 4 2017 Microchip Technology Inc. MIC45205 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TJ -40 -- +125 C -- Temperature Ranges Junction Operating Temperature Range Maximum Junction Temperature -- -- -- +150 C -- Storage Temperature Range TS -65 -- +150 C -- Lead Temperature -- -- -- +260 C Soldering, 10s Thermal Resistance QFN-52 JA -- 21.7 -- C/W Note 2 Thermal Resistance QFN-52 JC -- 5.0 -- C/W Note 2 Package Thermal Resistances Note 1: 2: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125C rating. Sustained junction temperatures above +125C can impact the device reliability. JA and JC were measured using the MIC45205 evaluation board. 2017 Microchip Technology Inc. DS20005798A-page 5 MIC45205 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: VIN Operating Supply Current vs. Temperature (MIC45205-1). FIGURE 2-4: Temperature. EN Bias Current vs. FIGURE 2-2: Temperature. VDD Supply Voltage vs. FIGURE 2-5: Temperature. Feedback Voltage vs. FIGURE 2-3: Temperature. Enable Threshold vs. FIGURE 2-6: Temperature. Output Voltage vs. DS20005798A-page 6 2017 Microchip Technology Inc. MIC45205 FIGURE 2-7: Temperature. Switching Frequency vs. FIGURE 2-10: Efficiency (VIN = 12V) vs. Output Current (MIC45205-1). FIGURE 2-8: vs. Temperature. Output Peak Current Limit FIGURE 2-11: Efficiency (VIN = 24V) vs. Output Current (MIC45205-1). FIGURE 2-9: Efficiency (VIN = 5V) vs. Output Current (MIC45205-1). 2017 Microchip Technology Inc. FIGURE 2-12: Efficiency (VIN = 5V) vs. Output Current (MIC45205-2). DS20005798A-page 7 MIC45205 FIGURE 2-13: Efficiency (VIN = 12V) vs. Output Current (MIC45205-2). FIGURE 2-16: Voltage. FIGURE 2-14: Efficiency (VIN = 24V) vs. Output Current (MIC45205-2). FIGURE 2-17: IC Power Dissipation (VIN = 5V) vs. Output Current. FIGURE 2-15: FIGURE 2-18: IC Power Dissipation (VIN = 12V) vs. Output Current. DS20005798A-page 8 Line Regulation. Output Voltage vs. Input 2017 Microchip Technology Inc. MIC45205 VEN (2V/div) VIN = 12V VOUT = 1.8V IOUT = 6A VOUT (1V/div) IIN (1A/div) Time (2ms/div) FIGURE 2-19: IC Power Dissipation (VIN = 24V) vs. Output Current. VIN (10V/div) VOUT (1V/div) FIGURE 2-22: Rise Time. VEN (2V/div) VIN = 12V VOUT = 1.8V IOUT = 6A VIN = 12V VOUT = 1.8V IOUT = 6A VOUT (1V/div) PGOOD (5V/div) IIN (1A/div) IIN (2A/div) Time (2ms/div) Time (2ms/div) FIGURE 2-20: Enable Turn-On Delay and VIN Soft Turn-On. VIN (10V/div) VIN = 12V VOUT = 1.8V IOUT = 6A VOUT (1V/div) FIGURE 2-23: Fall Time. Enable Turn-Off Delay and VIN (10V/div) VOUT (1V/div) PGOOD (5V/div) PGOOD (5V/div) VIN = 12V VOUT = 1.8V IOUT = 1A VPRE-BIAS = 0.5V IIN (2A/div) Time (2ms/div) FIGURE 2-21: VIN Soft Turn-Off. 2017 Microchip Technology Inc. Time (2ms/div) FIGURE 2-24: VIN Start-Up with Pre-Biased Output. DS20005798A-page 9 MIC45205 VEN (2V/div) VOUT (1V/div) VOUT (1V/div) VIN = 12V VOUT = 1.8V IOUT = 6A VIN = 12V VOUT = 1.8V IOUT (5A/div) IIN (1A/div) Time (8ms/div) FIGURE 2-25: VIN (10V/div) Enable Turn-On/Off. VIN = 12V, VOUT = 1.8V IOUT = SHORT CIRCUIT Time (2ms/div) FIGURE 2-28: VOUT (1V/div) VOUT (20mV/div) VIN = 12V VOUT = 1.8V IOUT (5A/div) IIN (500mA/div) Time (2ms/div) FIGURE 2-26: VEN (2V/div) Power-Up Into Short-Circuit. VIN = 12V VOUT = 1.8V IOUT = SHORT CIRCUIT VOUT (20mV/div) IIN (100mA/div) Time (8ms/div) FIGURE 2-29: Short-Circuit. DS20005798A-page 10 Output Recovery from VOUT (1V/div) VIN = 12V VOUT = 1.8V IPK_CL = 8.4A IOUT (5A/div) Time (400s/div) FIGURE 2-27: Short-Circuit. Enabled Into Short-Circuit. Time (4ms/div) FIGURE 2-30: Threshold. Peak Current-Limit 2017 Microchip Technology Inc. MIC45205 VIN = 12V VOUT = 1.8V IOUT = 6A VOUT (1V/div) VOUT (1V/div) VSW (5V/div) IIN (1A/div) PG (5V/div) Time (8ms/div) Time (2ms/div) FIGURE 2-31: Output Recovery from Thermal Shutdown. VIN = 12V VOUT = 1.8V IOUT = 6A FIGURE 2-34: Inrush with COUT = 3000 F. VOUT (100mV/div) VOUT (AC-COUPLED) (20mV/div) VSW (5V/div) IOUT (2A/div) IOUT (5A/div) Time (1s/div) FIGURE 2-32: = 6A). VIN = 12V VOUT = 1.8V IOUT = 6A VEN (2V/div) VIN = 12V VOUT = 1.8V IOUT = 3A TO 6A Time (100s/div) Switching Waveforms (IOUT FIGURE 2-35: Transient Response, MIC45205-1 (IOUT = 3A to 6A). VOUT (100mV/div) VOUT (AC-COUPLED) (20mV/div) VSW (5V/div) VIN = 12V VOUT = 1.8V IOUT = 0A IOUT (2A/div) Time (20ms/div) FIGURE 2-33: Switching Waveforms, MIC45205-1 (IOUT = 0A). 2017 Microchip Technology Inc. IOUT (2A/div) VIN = 12V VOUT = 1.8V IOUT = 0.5A TO 3.5A Time (100s/div) FIGURE 2-36: Transient Response, MIC45205-1 (IOUT = 0.5A to 3.5A). DS20005798A-page 11 MIC45205 42 BST 43 BST 44 BST 45 PGND 46 FB 47 PG 48 EN 49 VIN 50 FREQ 51 ILIM PIN DESCRIPTIONS 52 PGND 3.0 GND 1 41 ANODE 5VDD 2 40 ANODE 5VDD 3 39 RIB PVDD 4 38 RIA PGND 5 37 RIA PGND 6 36 RIA PGND 7 35 KEEPOUT PGND 8 34 SW PVDD 33 SW KEEPOUT 9 SW 32 SW SW 10 31 SW SW 11 30 KEEPOUT SW 12 KEEPOUT 13 FIGURE 3-1: PVIN ePAD 29 VOUT VOUT ePAD VOUT 26 VOUT 25 VOUT 24 VOUT 23 VOUT 22 VOUT 21 KEEPOUT 20 PVIN 19 PVIN 18 PVIN 15 PVIN 17 28 VOUT 27 VOUT PVIN 16 PVIN 14 MIC45205 Pin Configuration. The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name 1 GND Analog Ground. Connect bottom feedback resistor to GND. GND and PGND are internally connected. 2, 3 5VDD Internal +5V Linear Regulator Output. Powered by VIN, 5VDD is the internal supply bus for the device. In the applications with VIN < +5.5V, 5VDD should be tied to VIN to bypass the linear regulator. 4, 5 PVDD PVDD. Supply input for the internal low-side power MOSFET driver. PGND Power Ground. PGND is the return path for the step-down power module power stage. The PGND pin connects to the sources of internal low-side power MOSFET, the negative terminals of input capacitors, and the negative terminals of output capacitors. 6, 7, 8, 45, 52 Description 10, 11, 12, 31, 32, 33, 34 SW The SW pin connects directly to the switch node. Due to the high-speed switching on this pin, the SW pin should be routed away from sensitive nodes. The SW pin also senses the current by monitoring the voltage across the low-side MOSFET during OFF time. 14, 15, 16, 17, 18, 19 PVIN Power Input Voltage. Connection to the drain of the internal high-side power MOSFET. Connect an input capacitor from PVIN to PGND. 21, 22, 23, 24, 25, 26, 27, 28, 29 VOUT Output Voltage. Connected to the internal inductor, the output capacitor should be connected from this pin to PGND as close to the module as possible. 36, 37, 38 RIA DS20005798A-page 12 Ripple Injection Pin A. Leave floating, no connection. 2017 Microchip Technology Inc. MIC45205 TABLE 3-1: PIN FUNCTION TABLE (CONTINUED) Pin Number Pin Name Description 39 RIB 40, 41 ANODE 42, 43, 44 BST 46 FB Feedback. Input to the transconductance amplifier of the control loop. The FB pin is referenced to 0.8V. A resistor divider connecting the feedback to the output is used to set the desired output voltage. Connect the bottom resistor from FB to GND. 47 PG Power Good. Open-drain output. If used, connect to an external pull-up resistor of at least 10 k between PG and the external bias voltage. 48 EN Enable. A logic signal to enable or disable the step-down regulator module operation. The EN pin is TTL/CMOS compatible. Logic-high = enable, logic-low = disable or shutdown. EN pin has an internal 1 M (typical) pull-down resistor to GND. Do not leave floating. 49 VIN Internal 5V Linear Regulator Input. A 1 F ceramic capacitor from VIN to GND is required for decoupling. 50 FREQ Switching Frequency Adjust. Use a resistor divider from VIN to GND to program the switching frequency. Connecting FREQ to VIN sets frequency at 600 kHz. 51 ILIM Current Limit. Connect a resistor between ILIM and SW to program the current limit. Ripple Injection Pin B. Connect this pin to FB. Anode Bootstrap Diode. Anode connection of internal bootstrap diode, this pin should be connected to the PVDD pin. Connection to the internal bootstrap circuitry and high-side power MOSFET drive circuitry. Connect all three BST pins together. 9, 13, 20, 30, 35 KEEPOUT Depopulated pin positions. -- PVIN ePAD PVIN Exposed Pad. Internally connected to PVIN pins. Please see PCB Layout Guidelines section. -- VOUT ePAD VOUT Exposed Pad. Internally connected to VOUT pins. Please see PCB Layout Guidelines section. 2017 Microchip Technology Inc. DS20005798A-page 13 MIC45205 4.0 FUNCTIONAL DESCRIPTION The MIC45205 is an adaptive on-time synchronous buck regulator module built for high-input voltage to low-output voltage conversion applications. The MIC45205 is designed to operate over a wide input voltage range, from 4.5V to 26V, and the output is adjustable with an external resistor divider. An adaptive on-time control scheme is employed to obtain a constant switching frequency in steady state and to simplify the control compensation. Hiccup mode overcurrent protection is implemented by sensing low-side MOSFET's RDS(ON). The device features internal soft-start, enable, UVLO, and thermal shutdown. The module has integrated switching FETs, inductor, bootstrap diode, resistor, and capacitor. 4.1 As shown in Figure 4-1 (in association with Equation 4-1), the output voltage is sensed by the MIC45205 feedback pin (FB) via the voltage divider RFB1 and RFB2 and compared to a 0.8V reference voltage (VREF) at the error comparator through a low-gain transconductance (gm) amplifier. If the feedback voltage decreases, and the amplifier output falls below 0.8V, then the error comparator will trigger the control logic and generate an ON-time period. The ON-time period length is predetermined by the "Fixed tON Estimator" circuitry: VOUT COMPENSATION RFB1 FB COMP RFB2 VREF 0.8V FIGURE 4-1: FB Pin. Output Voltage Sense via EQUATION 4-1: V OUT t ON ESTIMATED = ---------------------V IN f SW Where: VOUT Output Voltage VIN Power Stage Input Voltage fSW Switching Frequency DS20005798A-page 14 The maximum duty cycle is obtained from the 200 ns tOFF(MIN): EQUATION 4-2: Theory of Operation gM EA At the end of the ON-time period, the internal high-side driver turns off the high-side MOSFET and the low-side driver turns on the low-side MOSFET. The OFF-time period length depends upon the feedback voltage in most cases. When the feedback voltage decreases and the output of the gm amplifier falls below 0.8V, the ON-time period is triggered and the OFF-time period ends. If the OFF-time period determined by the feedback voltage is less than the minimum OFF-time tOFF(MIN), which is about 200 ns, the MIC45205 control logic will apply the tOFF(MIN) instead. tOFF(MIN) is required to maintain enough energy in the boost capacitor (CBST) to drive the high-side MOSFET. t S - t OFF MIN D MAX = ---------------------------------- = 1 - 200ns --------------tS tS Where: tS 1/fSW It is not recommended to use MIC45205 with an OFF-time close to tOFF(MIN) during steady-state operation. The adaptive ON-time control scheme results in a constant switching frequency in the MIC45205 during steady state operation. The actual ON-time and resulting switching frequency will vary with the different rising and falling times of the MOSFETs. Also, the minimum tON results in a lower switching frequency in high VIN to VOUT applications. During load transients, the switching frequency is changed due to the varying OFF-time. To illustrate the control loop operation, we will analyze both the steady-state and load transient scenarios. For easy analysis, the gain of the gm amplifier is assumed to be 1. With this assumption, the inverting input of the error comparator is the same as the feedback voltage. Figure 4-2 shows the MIC45205 control loop timing during steady-state operation. During steady-state, the gm amplifier senses the feedback voltage ripple, which is proportional to the output voltage ripple plus injected voltage ripple, to trigger the ON-time period. The ON-time is predetermined by the tON estimator. The termination of the OFF-time is controlled by the feedback voltage. At the valley of the feedback voltage ripple, which occurs when VFB falls below VREF, the OFF period ends and the next ON-time period is triggered through the control logic circuitry. 2017 Microchip Technology Inc. MIC45205 Unlike true current-mode control, the MIC45205 uses the output voltage ripple to trigger an ON-time period. The output voltage ripple is proportional to the inductor current ripple if the ESR of the output capacitor is large enough. RFB2 VREF FIGURE 4-2: Timing. RFB1 + RFB2 MIC45205 Control Loop Figure 4-3 shows the operation of the MIC45205 during a load transient. The output voltage drops due to the sudden load increase, which causes the VFB to be less than VREF. This will cause the error comparator to trigger an ON-time period. At the end of the ON-time period, a minimum OFF-time tOFF(MIN) is generated to charge the bootstrap capacitor (CBST) because the feedback voltage is still below VREF. Then, the next ON-time period is triggered due to the low feedback voltage. Therefore, the switching frequency changes during the load transient, but returns to the nominal fixed frequency once the output has stabilized at the new load current level. With the varying duty cycle and switching frequency, the output recovery time is fast and the output voltage deviation is small. Note that the instantaneous switching frequency during load transient remains bounded and cannot increase arbitrarily. The minimum is limited by tON + tOFF(MIN). Because the variation in VOUT is relatively limited during load transient, tON stays virtually close to its steady-state value. In order to meet the stability requirements, the MIC45205 feedback voltage ripple should be in phase with the inductor current ripple and are large enough to be sensed by the gm amplifier and the error comparator. The recommended feedback voltage ripple is 20 mV~100 mV over full input voltage range. If a low ESR output capacitor is selected, then the feedback voltage ripple may be too small to be sensed by the gm amplifier and the error comparator. Also, the output voltage ripple and the feedback voltage ripple are not necessarily in phase with the inductor current ripple if the ESR of the output capacitor is very low. In these cases, ripple injection is required to ensure proper operation. Please refer to the Ripple Injection subsection in the Application Information section for more details about the ripple injection technique. 4.2 Discontinuous Mode (MIC45205-1 Only) In continuous mode, the inductor current is always greater than zero. However, at light loads, the MIC45205-1 is able to force the inductor current to operate in discontinuous mode. Discontinuous mode is where the inductor current falls to zero, as indicated by trace (IL) shown in Figure 4-4. During this period, the efficiency is optimized by shutting down all the non-essential circuits and minimizing the supply current as the switching frequency is reduced. The MIC45205-1 wakes up and turns on the high-side MOSFET when the feedback voltage VFB drops below 0.8V. The MIC45205-1 has a zero crossing comparator (ZC) that monitors the inductor current by sensing the voltage drop across the low-side MOSFET during its ON-time. If the VFB > 0.8V and the inductor current goes slightly negative, then the MIC45205-1 automatically powers down most of the IC circuitry and goes into a low-power mode. FIGURE 4-3: Response. MIC45205 Load Transient 2017 Microchip Technology Inc. Once the MIC45205-1 goes into discontinuous mode, both DL and DH are low, which turns off the high-side and low-side MOSFETs. The load current is supplied by the output capacitors and VOUT drops. If the drop of VOUT causes VFB to go below VREF, then all the circuits will wake up into normal continuous mode. First, the bias currents of most circuits reduced during the discontinuous mode are restored, and then a tON pulse is triggered before the drivers are turned on to avoid any possible glitches. Finally, the high-side driver is turned on. Figure 4-4 shows the control loop timing in discontinuous mode. DS20005798A-page 15 MIC45205 MIC45205 < VIN BST SW CIN SW CS R15 ILIM C15 FB PGND FIGURE 4-5: Circuit. FIGURE 4-4: MIC45205-1 Control Loop Timing (Discontinuous Mode). During discontinuous mode, the bias current of most circuits is substantially reduced. As a result, the total power supply current during discontinuous mode is only about 350 A, allowing the MIC45205-1 to achieve high efficiency in light load applications. 4.3 Soft-Start Soft-start reduces the input power supply surge current at startup by controlling the output voltage rise time. The input surge appears while the output capacitor is charged up. The MIC45205 implements an internal digital soft-start by making the 0.8V reference voltage VREF ramp from 0 to 100% in about 5 ms with 9.7 mV steps. Therefore, the output voltage is controlled to increase slowly by a stair-case VFB ramp. Once the soft-start cycle ends, the related circuitry is disabled to reduce current consumption. PVDD must be powered up at the same time or after VIN to make the soft-start function correctly. 4.4 Current-Limit The MIC45205 uses the RDS(ON) of the low-side MOSFET and external resistor connected from ILIM pin to SW node to set the current limit. MIC45205 Current-Limiting In each switching cycle of the MIC45205, the inductor current is sensed by monitoring the low-side MOSFET in the OFF period. The sensed voltage VILIM is compared with the power ground (PGND) after a blanking time of 150 ns. In this way the drop voltage over the resistor R15 (VCL) is compared with the drop over the bottom FET generating the short current limit. The small capacitor (C15) connected from ILIM pin to PGND filters the switching node ringing during the off-time allowing a better short-limit measurement. The time constant created by R15 and C15 should be much less than the minimum off time. The VCL drop allows programming of short limit through the value of the resistor (R15). If the absolute value of the voltage drop on the bottom FET becomes greater than VCL, and the VILIM falls below PGND, an overcurrent is triggered causing the IC to enter hiccup mode. The hiccup sequence including the soft-start reduces the stress on the switching FETs and protects the load and supply for severe short conditions. The short-circuit current-limit can be programmed by using Equation 4-3. EQUATION 4-3: I CLIM - I L PP 0.5 R DS ON + V CL_OFFSET R15 = -----------------------------------------------------------------------------------------------------------------------I CL Where: ICLIM RDS(ON) VCL_ Desired current limit. On-resistance of low-side power MOSFET, 16 m typically. Current-limit threshold (typ. 14 mV). OFFSET ICL IL(PP) DS20005798A-page 16 Current-limit source current (typ. 70 A). Inductor current peak-to-peak. 2017 Microchip Technology Inc. MIC45205 Because the inductor is integrated, use Equation 4-4 to calculate the inductor ripple current. EQUATION 4-4: V OUT V IN MAX - V OUT I L PP = ------------------------------------------------------------------V IN MAX f SW L The MIC45205 has a 1.0 H inductor integrated into the module. In case of a hard short, the short limit is folded down to allow an indefinite hard short on the output without any destructive effect. It is mandatory to make sure that the inductor current used to charge the output capacitance during soft-start is under the folded short limit; otherwise the supply will go in hiccup mode and may not finish the soft-start successfully. The MOSFET RDS(ON) varies 30% to 40% with temperature; therefore, it is recommended to add a 50% margin to ICLIM in Equation 4-3 to avoid false current limiting due to increased MOSFET junction temperature rise. With R15 = 1.37 k and C15 = 15 pF, the typical output current-limit is 8A. 2017 Microchip Technology Inc. DS20005798A-page 17 MIC45205 5.0 APPLICATION INFORMATION 5.1 Setting the Switching Frequency The MIC45205 switching frequency can be adjusted by changing the value of resistors R1 and R2. MIC45205 VIN BST 5.2 Output Capacitor Selection The type of the output capacitor is usually determined by the application and its equivalent series resistance (ESR). Voltage and RMS current capability are two other important factors for selecting the output capacitor. Recommended capacitor types are MLCC, OS-CON and POSCAP. The output capacitor's ESR is usually the main cause of the output ripple. The MIC45205 requires ripple injection and the output capacitor ESR affects the control loop from a stability point of view. The maximum value of ESR is calculated as in Equation 5-2: SW CS EQUATION 5-2: R1 CIN FREQ R2 V OUT PP ESR COUT --------------------------I L PP FB PGND Where: FIGURE 5-1: Adjustment. Switching Frequency Equation 5-1 gives the estimated switching frequency: EQUATION 5-1: VOUT(PP) IL(PP) Peak-to-peak output voltage ripple Peak-to-peak inductor current ripple The total output ripple is a combination of the ESR and output capacitance. The total ripple is calculated in Equation 5-3: R2 f SW = f O -------------------R1 + R2 EQUATION 5-3: Where: fO 600 kHz (typical per the Electrical Characteristics table). R1 100 k is recommended. R2 Needs to be selected in order to set the required switching frequency. V OUT PP = 2 I L PP ------------------------------------- + I L PP ESR COUT 2 C OUT f SW 8 Where: 800 COUT 700 fSW VOUT = 5V VIN = 12V SW FREQ (kHz) 600 500 400 300 200 R1 = 100k 100 0 10.00 100.00 1000.00 10000.00 R2 (k) FIGURE 5-2: DS20005798A-page 18 Switching Frequency vs. R2. Output Capacitance Value Switching Frequency As described in the Theory of Operation subsection in the Functional Description, the MIC45205 requires at least 20 mV peak-to-peak ripple at the FB pin to make the gm amplifier and the error comparator behave properly. Also, the output voltage ripple should be in phase with the inductor current. Therefore, the output voltage ripple caused by the output capacitors value should be much smaller than the ripple caused by the output capacitor ESR. If low-ESR capacitors, such as ceramic capacitors, are selected as the output capacitors, a ripple injection method should be applied to provide enough feedback voltage ripple. Please refer to the Ripple Injection subsection in the Application Information section for more details. 2017 Microchip Technology Inc. MIC45205 The output capacitor RMS current is calculated in Equation 5-4: The power dissipated in the input capacitor is: EQUATION 5-8: EQUATION 5-4: I COUT RMS 2 P DISS CIN = I CIN RMS ESR CIN I L PP = ----------------12 The power dissipated in the output capacitor is: EQUATION 5-5: The general rule is to pick the capacitor with a ripple current rating equal to or greater than the calculated worst-case RMS capacitor current. Equation 5-9 should be used to calculate the input capacitor. Also it is recommended to keep some margin on the calculated value: 2 P DISS COUT = I COUT RMS ESR COUT 5.3 EQUATION 5-9: I OUT MAX 1 - D C IN --------------------------------------------------f SW dV Input Capacitor Selection The input capacitor for the power stage input PVIN should be selected for ripple current rating and voltage rating. The input voltage ripple will primarily depend on the input capacitor's ESR. The peak input current is equal to the peak inductor current, so: EQUATION 5-6: V IN = I L PK ESR CIN Where: 5.4 dV Input ripple fSW Switching frequency Output Voltage Setting Components The MIC45205 requires two resistors to set the output voltage as shown in Figure 5-3: The input capacitor must be rated for the input current ripple. The RMS value of input capacitor current is determined at the maximum output current. Assuming the peak-to-peak inductor current ripple is low: RFB1 gM AMP FB RFB2 EQUATION 5-7: VREF I CIN RMS I OUT MAX D 1 - D Where: D Duty cycle FIGURE 5-3: Configuration. Voltage-Divider The output voltage is determined by Equation 5-10: 2017 Microchip Technology Inc. DS20005798A-page 19 MIC45205 1. EQUATION 5-10: V OUT R FB1 = V FB 1 + ---------- R Enough ripple at the feedback voltage due to the large ESR of the output capacitors: As shown in Figure 5-4, the converter is stable without any ripple injection. FB2 Where: VFB VOUT 0.8V RFB1 MIC45205 FB COUT A typical value of RFB1 used on the standard evaluation board is 10 k. If R1 is too large, it may allow noise to be introduced into the voltage feedback loop. If RFB1 is too small in value, it will decrease the efficiency of the power supply, especially at light loads. Once RFB1 is selected, RFB2 can be calculated using Equation 5-11: FIGURE 5-4: ESR. EQUATION 5-11: The feedback voltage ripple is: R FB2 5.5 RFB2 Enough Ripple at FB from EQUATION 5-12: V FB R FB1 = ----------------------------V OUT - V FB R FB2 V FB PP = ------------------------------- ESR COUT I L PP R FB1 + R FB2 For fixed RFB1 = 10 k, output voltage can be selected by RFB2. Table 5-1 provides RFB2 values for some common output voltages. TABLE 5-1: ESR VOUT PROGRAMMING RESISTOR LOOK-UP RFB2 VOUT OPEN 0.8V 40.2 k 1.0V 20 k 1.2V 11.5 k 1.5V 8.06 k 1.8V 4.75 k 2.5V 3.24 k 3.3V 1.91 k 5.0V Where: IL(PP) The peak-to-peak value of the inductor current ripple 2. Virtually no or inadequate ripple at the FB pin voltage due to the very-low ESR of the output capacitors, such is the case with ceramic output capacitor. In this case, the VFB ripple waveform needs to be generated by injecting suitable signal. MIC45205 has provisions to enable an internal series RC injection network, RINJ and CINJ as shown in Figure 5-5 by connecting RIB to the FB pin. This network injects a square-wave current waveform into the FB pin, which, by means of integration across the capacitor (C14), generates an appropriate sawtooth FB ripple waveform. Ripple Injection The VFB ripple required for proper operation of the MIC45205 gm amplifier and error comparator is 20 mV to 100 mV. However, the output voltage ripple is generally too small to provide enough ripple amplitude at the FB pin and this issue is more visible in lower output voltage applications. If the feedback voltage ripple is so small that the gm amplifier and error comparator cannot sense it, then the MIC45205 will lose control and the output voltage is not regulated. In order to have some amount of VFB ripple, a ripple injection method is applied for low output voltage ripple applications. VOUT MIC45205 FB RFB1 C14 COUT RIB RINJ CINJ RIA RFB2 ESR SW FIGURE 5-5: FB via RIB Pin. Internal Ripple Injection at The applications are divided into two situations according to the amount of the feedback voltage ripple: DS20005798A-page 20 2017 Microchip Technology Inc. MIC45205 EQUATION 5-13: 1 V FB PP = V IN K div D 1 - D ----------------f SW Where: VIN D fSW Power stage input voltage Duty cycle Switching frequency (RFB1//RFB2//RINJ) x C14 RINJ = 10 k, CINJ = 0.1 F EQUATION 5-14: R FB1 //R FB2 K div = ---------------------------------------------R INJ + R FB1 //R FB2 Where: RINJ 10 k In Equation 5-14 and Equation 5-15, it is assumed that the time constant associated with C14 must be much greater than the switching period: EQUATION 5-15: 1 -=T ------------------ 1 f SW If the voltage divider resistors RFB1 and RFB2 are in the k range, then a C14 of 1 nF to 100 nF can easily satisfy the large time constant requirements. addition, the thermal couple tip must be covered in either thermal grease or thermal glue to make sure that the thermal couple junction is making good contact with the case of the IC. Omega brand thermal couple (5SC-TT-K-36-36) is adequate for most applications. Wherever possible, an infrared thermometer is recommended. The measurement spot size of most infrared thermometers is too large for an accurate reading on a small form factor ICs. However, an IR thermometer from Optris has a 1 mm spot size, which makes it a good choice for measuring the hottest point on the case. An optional stand makes it easy to hold the beam on the IC for long periods of time. The safe operating area (SOA) of the MIC45205 is shown in Figure 5-6 through Figure 5-10. These thermal measurements were taken on MIC45205 evaluation board. Since the MIC45205 is an entire system comprised of switching regulator controller, MOSFETs and inductor, the part needs to be considered as a system. The SOA curves will give guidance to reasonable use of the MIC45205. SOA curves should only be used as a point of reference. SOA data was acquired using the MIC45205 evaluation board. Thermal performance depends on the PCB layout, board size, copper thickness, number of thermal vias, and actual airflow. 7 MAXIMUM OUTPUT CURRENT (A) The injected ripple is: 6 5 0 LFM 200 LFM 400 LFM 4 3 85 90 95 100 105 110 115 120 125 AMBIENT TEMPERATURE(qC) 5.6 Thermal Measurements and Safe Operating Area (SOA) Measuring the IC's case temperature is recommended to ensure it is within its operating limits. Although this might seem like a very elementary task, it is easy to get erroneous results. The most common mistake is to use the standard thermal couple that comes with a thermal meter. This thermal couple wire gauge is large, typically 22 gauge, and behaves like a heatsink, resulting in a lower case measurement. FIGURE 5-6: MIC45205 Power Derating vs. Airflow (5VIN to 1.5VOUT). Two methods of temperature measurement are using a smaller thermal couple wire or an infrared thermometer. If a thermal couple wire is used, it must be constructed of 36-gauge wire or higher (smaller wire size) to minimize the wire heat-sinking effect. In 2017 Microchip Technology Inc. DS20005798A-page 21 MIC45205 7 MAXIMUM OUTPUT CURRENT (A) MAXIMUM OUTPUT CURRENT (A) 7 6 5 0 LFM 200 LFM 400 LFM 4 3 80 85 90 95 100 105 110 115 120 AMBIENT TEMPERATURE (qC) 6 5 4 0 LFM 200 LFM 400 LFM 3 60 65 70 75 80 85 90 95 100 105 110 AMBIENT TEMPERATURE (qC) FIGURE 5-7: MIC45205 Power Derating vs. Airflow (12VIN to 1.5VOUT). FIGURE 5-10: MIC45205 Power Derating vs. Airflow (24VIN to 3.3VOUT). MAXIMUM OUTPUT CURRENT (A) 7 6 5 0 LFM 200 LFM 400 LFM 4 3 80 85 90 95 100 105 110 115 120 AMBIENT TEMPERATURE (qC) FIGURE 5-8: MIC45205 Power Derating vs. Airflow (12VIN to 3.3VOUT). MAXIMUM OUTPUT CURRENT (A) 7 6 5 4 0 LFM 200 LFM 400 LFM 3 70 75 80 85 90 95 100 105 110 115 120 AMBIENT TEMPERATURE (qC) FIGURE 5-9: MIC45205 Power Derating vs. Airflow (24VIN to 1.5VOUT). DS20005798A-page 22 2017 Microchip Technology Inc. MIC45205 6.0 PCB LAYOUT GUIDELINES To minimize EMI and output noise, follow these layout recommendations. PCB layout is critical to achieve reliable, stable and efficient performance. A ground plane is required to control EMI and minimize the inductance in power, signal and return paths. Figure 6-1 is optimized from a small form factor point of view shows top and bottom layer of a four layer PCB. It is recommended to use mid layer 1 as a continuous ground plane. Do not use Y5V or Z5U type capacitors. * Do not replace the ceramic input capacitor with any other type of capacitor. Any type of capacitor can be placed in parallel with the ceramic input capacitor. * If a non-ceramic input capacitor is placed in parallel with the input capacitor, it must be recommended for switching regulator applications and the operating voltage. * In "Hot-Plug" applications, an Electrolytic bypass capacitor must be used to limit the over-voltage spike seen on the input supply with power is suddenly applied. If hot-plugging is the normal operation of the system, using an appropriate hot-swap IC is recommended. 6.3 RC Snubber (Optional) * Depending on the operating conditions, a RC snubber on the same side of the board can be used. Place the RC and as close to the SW pin as possible if needed. 6.4 SW Node * Do not route any digital lines underneath or close to the SW node. * Keep the switch node (SW) away from the feedback (FB) pin. 6.5 FIGURE 6-1: Top And Bottom Layer of a Four-Layer Board. The following guidelines should be followed to insure proper operation of the MIC45205 module: 6.1 IC Output Capacitor * Use a wide trace to connect the output capacitor ground terminal to the input capacitor ground terminal. * Phase margin will change as the output capacitor value and ESR changes. * The feedback trace should be separate from the power trace and connected as close as possible to the output capacitor. Sensing a long high-current load trace can degrade the DC load regulation. * The analog ground pin (GND) must be connected directly to the ground planes. Place the IC close to the point-of-load (POL). * Use thick traces to route the input and output power lines. * Analog and power grounds should be kept separate and the analog ground (GND) and power ground (PGND) are internally connected. 6.2 Input Capacitor * Place the input capacitors on the same side of the board and as close to the IC as possible. * Place several vias to the ground plane close to the input capacitor ground terminal. * Use either X7R or X5R dielectric input capacitors. 2017 Microchip Technology Inc. DS20005798A-page 23 MIC45205 6.6 PCB Layout Recommendations FIGURE 6-2: Top Copper Layer 1. FIGURE 6-3: Copper Layer2. DS20005798A-page 24 2017 Microchip Technology Inc. MIC45205 FIGURE 6-4: Copper Layer 3. FIGURE 6-5: Bottom Copper Layer 4. 2017 Microchip Technology Inc. DS20005798A-page 25 MIC45205 7.0 7.1 SIMPLIFIED PCB DESIGN RECOMMENDATIONS Periphery I/O Pad Layout and Large Pad for Exposed Heatsink The board design should begin with copper/metal pads that sit beneath the periphery leads of a mounted QFN. The board pads should extend outside the QFN package edge a distance of approximately 0.20 mm per side: FIGURE 7-1: Total pad length = 8.00 mm + (0.20 mm per side x 2 sides) = 8.40 mm. After completion of the periphery pad design, the larger exposed pads will be designed to create the mounting surface of the QFN exposed heatsink. The primary transfer of heat out of the QFN will be directly through the bottom surface of the exposed heatsink. To aid in the transfer of generated heat into the PCB, the use of an array of plated through-hole vias beneath the mounted part is recommended. The typical via hole diameter is 0.30 mm to 0.35 mm, with center-to-center pitch of 0.80 mm to 1.20 mm. Package Bottom View vs. PCB Recommended Exposed Metal Trace. Please note that the exposed metal trace is a "mirror image" of the package bottom view. DS20005798A-page 26 2017 Microchip Technology Inc. MIC45205 7.2 Solder Paste Stencil Design (Recommend Stencil Thickness = 112.5 m 12.5 m) The solder stencil aperture openings should be smaller than the periphery or large PCB exposed pads to reduce any chance of build-up of excess solder at the large exposed pad area which can result to solder bridging. The suggested reduction of the stencil aperture opening is typically 0.20 mm smaller than exposed metal trace. Please note that a critical requirement is to not duplicate land pattern of the exposed metal trace as solder stencil opening as the design and dimension values are different. FIGURE 7-2: Solder Stencil Opening. Note that the cyan-colored shaded pad indicates exposed trace keep out area. 2017 Microchip Technology Inc. FIGURE 7-3: Stack-Up of Pad Layout and Solder Paste Stencil. DS20005798A-page 27 MIC45205 8.0 EVALUATION BOARD SCHEMATIC AND BOM 10 FIGURE 8-1: TABLE 8-1: MIC45205YML Evaluation Board Schematic. BILL OF MATERIALS Item Part Number C1 EEE-FK1V221P C1X, C6, C9, -- C10, C7, C13 Manufacturer Description Panasonic -- Quantity 220 F/35V, ALE Capacitor (optional) 1 Open 6 10 F/50V, 1206, X5R, 10%, MLCC 1 C3 C3216X5R1H106M160AB TDK C2, C4, C8 GRM188R71H104KA93D Murata 0.1 F/50V, X7R, 0603, 10%, MLCC 3 C5 C3216X5R0J107M160AB TDK 100 F/6.3V, X5R, 1206, 20%, MLCC 1 C14 C1608C0G1H222JT C11 GRM1885C1H150JA01D CON1,CON2, 8174 CON3,CON4 TDK 2.2 nF/50V, NP0, 0603, 5%, MLCC 1 Murata 15 pF/50V, NP0, 0603, 5%, MLCC 3 Keystone 15A, 4-Prong Through-Hole Screw Terminal 4 J1 M50-3500742 Harwin Header 2x7 1 J2, J3, J4, TP3 - TP5 90120-0122 Molex Header 2 6 JPx1, JPx2 -- R1, R10 CRCW0603100K0FKEA R2, R12, R13, -- R16 -- Vishay Dale -- Open 2 100 k, 1%, 1/10W, 0603, Thick Film 2 Open 4 1 R3 CRCW060340K2FKEA Vishay Dale 40.2 k, 1%, 1/10W, 0603, Thick Film R4 CRCW060320K0FKEA Vishay Dale 20 k, 1%, 1/10W, 0603, Thick Film 1 R5 CRCW060311K5FKEA Vishay Dale 11.5 k, 1%, 1/10W, 0603, Thick Film 1 R6 CRCW06038K06FKEA Vishay Dale 8.06 k, 1%, 1/10W, 0603, Thick Film 1 R7 CRCW06034K75FKEA Vishay Dale 4.75 k, 1%, 1/10W, 0603, Thick Film 1 DS20005798A-page 28 2017 Microchip Technology Inc. MIC45205 TABLE 8-1: BILL OF MATERIALS (CONTINUED) Item Part Number R8 CRCW06033K24FKEA Manufacturer Description Vishay Dale Quantity 3.24 k, 1%, 1/10W, 0603, Thick Film 1 R9 CRCW06031K91FKEA Vishay Dale 1.91 k, 1%, 1/10W, 0603, Thick Film 1 R11 CRCW060349K9FKEA Vishay Dale 49.9 k, 1%, 1/10W, 0603, Thick Film 1 R14 CRCW060310K0FKEA Vishay Dale 10 k, 1%, 1/10W, 0603, Thick Film 1 R15 CRCW06031K37FKEA Vishay Dale 1.37 k, 1%, 1/10W, 0603, Thick Film 1 R17, R18, R19 RCG06030000Z0EA Vishay Dale 0 Resistor, 1%, 1/10W, 0603, Thick Film 3 TP6 - TP9, JPx3, JPx4 1502-2 Keystone Single-End, Through-Hole Terminal 6 Microchip 26V/6A DC/DC Power Module 1 U1 MIC45205-1YMP MIC45205-2YMP 2017 Microchip Technology Inc. DS20005798A-page 29 MIC45205 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 52-Pin QFN* XXX XXXXX-XXXX YYWW Legend: XX...X Y YY WW NNN e3 * Example MIC 45205-1YMP 1308 Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. , , Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar () symbol may not be to scale. DS20005798A-page 30 2017 Microchip Technology Inc. MIC45205 52-Lead 8 mm x 8 mm H3QFN Package Outline and Recommended Land Pattern 2017 Microchip Technology Inc. DS20005798A-page 31 MIC45205 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20005798A-page 32 2017 Microchip Technology Inc. MIC45205 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. 2017 Microchip Technology Inc. DS20005798A-page 33 MIC45205 Thermally Enhanced Land Pattern FIGURE 9-1: Exposed Metal Trace. FIGURE 9-3: Stack-Up of Pad Layout and Solder Paste Stencil and Notes. FIGURE 9-2: DS20005798A-page 34 Solder Stencil Opening. 2017 Microchip Technology Inc. MIC45205 APPENDIX A: REVISION HISTORY Revision A (June 2017) * Converted Micrel document MIC45205 to Microchip data sheet DS20005798A. * Minor text changes throughout. * Updated maximum output voltage from 5.5V to 0.85 x VIN in Features and General Description. 2017 Microchip Technology Inc. DS20005798A-page 35 MIC45205 NOTES: DS20005798A-page 36 2017 Microchip Technology Inc. MIC45205 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Examples: -X X XX -XX a) MIC45205-1YMP-T1: Device Features Temperature Package Media Type Device: MIC45205: Features: 1 2 = = HyperLight Load Hyper Speed Control Temperature: Y = -40C to +125C Package: MP = 52-Lead 8 mm x 8 mm x 3 mm QFN Media Type: T1 TR 100/Reel 1,500/Reel -40C to +125C, 52-Lead 8 mm x 8 mm x 3 mm QFN, 100/Reel 26V/6A DC/DC Power Module b) MIC45205-1YMP-TR: = = 26V/6A DC/DC Power Module, HyperLight Load, 26V/6A DC/DC Power Module, HyperLight Load, -40C to +125C, 52-Lead 8 mm x 8 mm x 3 mm QFN, 1,500/Reel c) MIC45205-2YMP-T1: 26V/6A DC/DC Power Module, Hyper Speed Control, -40C to +125C, 52-Lead 8 mm x 8 mm x 3 mm QFN, 100/Reel d) MIC45205-2YMP-TR: 26V/6A DC/DC Power Module, Hyper Speed Control, -40C to +125C, 52-Lead 8 mm x 8 mm x 3 mm QFN, 1,500/Reel Note 1: 2017 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005798A-page 37 MIC45205 NOTES: DS20005798A-page 38 2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-1845-0 == ISO/TS 16949 == 2017 Microchip Technology Inc. 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