SCLS381L − AUGUST 1997 − REVISED APRIL 2005
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D2-V to 5.5-V VCC Operation
DMax tpd of 8.5 ns at 5 V
DTypical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
DTypical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
DSupport Mixed-Mode Voltage Operation on
All Ports
DIoff Supports Partial-Power-Down Mode
Operation
DLatch-Up Performance Exceeds 250 mA Per
JESD 17
DESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1CLR
1D
1CLK
1PRE
1Q
1Q
GND
VCC
2CLR
2D
2CLK
2PRE
2Q
2Q
SN54LV74A ...J OR W PACKAGE
SN74LV74A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
2D
NC
2CLK
NC
2PRE
1CLK
NC
1PRE
NC
1Q
1D
1CLR
NC
2Q
2Q V
2CLR
1Q
GND
NC
SN54LV74A . . . FK PACKAGE
(TOP VIEW)
CC
NC − No internal connection
SN74LV74A . . . RGY PACKAGE
(TOP VIEW)
114
78
2
3
4
5
6
13
12
11
10
9
2CLR
2D
2CLK
2PRE
2Q
1D
1CLK
1PRE
1Q
1Q
1CLR
2Q V
GND
CC
description/ordering information
These dual positive-edge-triggered D-type flip-flops are designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
QFN − RGY Reel of 1000 SN74LV74ARGYR LV74A
SOIC − D
Tube of 50 SN74LV74AD
LV74A
SOIC − D Reel of 2500 SN74LV74ADR LV74A
SOP − NS Reel of 2000 SN74LV74ANSR 74LV74A
−40°C to 85°CSSOP − DB Reel of 2000 SN74LV74ADBR LV74A
−40 C to 85 C
Tube of 90 SN74LV74APW
TSSOP − PW Reel of 2000 SN74LV74APWR LV74A
TSSOP − PW
Reel of 250 SN74LV74APWT
LV74A
TVSOP − DGV Reel of 2000 SN74LV74ADGVR LV74A
CDIP − J Tube of 25 SNJ54LV74AJ SNJ54LV74AJ
−55°C to 125°CCFP − W Tube of 150 SNJ54LV74AW SNJ54LV74AW
−55 C to 125 C
LCCC − FK T ube of 55 SNJ54LV74AFK SNJ54LV74AFK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Copyright 2005, Texas Instruments Incorporated
!"# #$# %
#&'!$# ''"# $ & ()*$# $"+ ' #&'!
("&$# ("' " "'! & ",$ #'!"# $#$' -$''$#.+
'# ('"#/ " # #""$'*. #*" "#/ & $**
($'$!""'+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SCLS381L − AUGUST 1997 − REVISED APRIL 2005
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive (high), data at the data (D) inputs meeting the setup-time
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs
at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval,
data at the D input can be changed without affecting the levels at the outputs.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
FUNCTION TABLE
INPUTS OUTPUTS
PRE CLR CLK D Q Q
L H X X H L
HLXXLH
LLXXH
†H†
H H ↑HHL
H H ↑LLH
H H L X Q0Q0
†This configuration is nonstable; that is, it does not
persist when PRE or CLR returns to its inactive
(high) level.
logic diagram, each flip-flop (positive logic)
TG
C
C
TG
C
TG
C
C
C
C
TG
C
C
PRE
CLK
D
CLR
Q
Q
C
SCLS381L − AUGUST 1997 − REVISED APRIL 2005
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Notes 1 and 2) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) −20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 3): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): DGV package 127°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 4): RGY package 47°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
SCLS381L − AUGUST 1997 − REVISED APRIL 2005
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 5)
SN54LV74A SN74LV74A
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 2 5.5 2 5.5 V
VCC = 2 V 1.5 1.5
VIH
High-level input voltage
VCC = 2.3 V to 2.7 V VCC ×0.7 VCC ×0.7
V
VIH High-level input voltage VCC = 3 V to 3.6 V VCC ×0.7 VCC ×0.7 V
VCC = 4.5 V to 5.5 V VCC ×0.7 VCC ×0.7
VCC = 2 V 0.5 0.5
VIL
Low-level input voltage
VCC = 2.3 V to 2.7 V VCC ×0.3 VCC ×0.3
V
VIL Low-level input voltage VCC = 3 V to 3.6 V VCC ×0.3 VCC ×0.3 V
VCC = 4.5 V to 5.5 V VCC ×0.3 VCC ×0.3
VIInput voltage 0 5.5 0 5.5 V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V −50 −50 µA
IOH
High-level output current
VCC = 2.3 V to 2.7 V −2 −2
IOH High-level output current VCC = 3 V to 3.6 V −6 −6 mA
VCC = 4.5 V to 5.5 V −12 −12
mA
VCC = 2 V 50 50 µA
IOL
Low-level output current
VCC = 2.3 V to 2.7 V 2 2
IOL Low-level output current VCC = 3 V to 3.6 V 6 6 mA
VCC = 4.5 V to 5.5 V 12 12
mA
VCC = 2.3 V to 2.7 V 200 200
∆t/∆vInput transition rise or fall rate VCC = 3 V to 3.6 V 100 100 ns/V
∆t/∆v
Input transition rise or fall rate
VCC = 4.5 V to 5.5 V 20 20
ns/V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
SN54LV74A SN74LV74A
UNIT
PARAMETER
TEST CONDITIONS
VCC MIN TYP MAX MIN TYP MAX
UNIT
IOH = −50 µA2 V to 5.5 V VCC−0.1 VCC−0.1
VOH
IOH = −2 mA 2.3 V 2 2
V
VOH IOH = −6 mA 3 V 2.48 2.48 V
IOH = −12 mA 4.5 V 3.8 3.8
IOL = 50 µA2 V to 5.5 V 0.1 0.1
VOL
IOL = 2 mA 2.3 V 0.4 0.4
V
VOL IOL = 6 mA 3 V 0.44 0.44 V
IOL = 12 mA 4.5 V 0.55 0.55
IIVI = 5.5 V or GND 0 to 5.5 V ±1±1µA
ICC VI = VCC or GND, IO = 0 5.5 V 20 20 µA
Ioff VI or VO = 0 to 5.5 V 0 5 5 µA
Ci
VI = VCC or GND
3.3 V 2 2
pF
C
i
V
I
= V
CC
or GND
5 V 2 2
pF
% #&'!$# #"'# (' # " &'!$0" '
"/# ($" & "0"*(!"#+ %$'$"' $$ $# "'
("&$# $'" "/# /$*+ ",$ #'!"# '""'0" " '/
$#/" ' ##" "" (' - #"+
% #&'!$# #"'# (' # " &'!$0" '
"/# ($" & "0"*(!"#+ %$'$"' $$ $# "'
("&$# $'" "/# /$*+ ",$ #'!"# '""'0" " '/
$#/" ' ##" "" (' - #"+
SCLS381L − AUGUST 1997 − REVISED APRIL 2005
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
timing requirements over recommended operating free-air temperature range, VCC = 2.5 V ±0.2 V
(unless otherwise noted) (see Figure 1)
PARAMETER
TA = 25°C SN54LV74A SN74LV74A
UNIT
PARAMETER
MIN MAX MIN MAX MIN MAX
UNIT
tw
Pulse duration
PRE or CLR low 899
ns
twPulse duration CLK 899ns
tsu
Setup time before CLK↑
Data 8 9 9
ns
tsu
Setup time before CLK
↑PRE or CLR inactive 777ns
thHold time, data after CLK↑0.5 0.5 0.5 ns
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ±0.3 V
(unless otherwise noted) (see Figure 1)
PARAMETER
TA = 25°C SN54LV74A SN74LV74A
UNIT
PARAMETER
MIN MAX MIN MAX MIN MAX
UNIT
tw
Pulse duration
PRE or CLR low 677
ns
twPulse duration CLK 677ns
tsu
Setup time before CLK↑
Data 6 7 7
ns
tsu
Setup time before CLK
↑PRE or CLR inactive 555ns
thHold time, data after CLK↑0.5 0.5 0.5 ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ±0.5 V
(unless otherwise noted) (see Figure 1)
PARAMETER
TA = 25°C SN54LV74A SN74LV74A
UNIT
PARAMETER
MIN MAX MIN MAX MIN MAX
UNIT
tw
Pulse duration
PRE or CLR low 555
ns
twPulse duration CLK 555ns
tsu
Setup time before CLK↑
Data 5 5 5
ns
tsu
Setup time before CLK
↑PRE or CLR inactive 333ns
thHold time, data after CLK↑0.5 0.5 0.5 ns
switching characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
LOAD
TA = 25°C SN54LV74A SN74LV74A
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
fmax
CL = 15 pF 50* 100* 40* 40
MHz
fmax CL = 50 pF 30 70 25 25 MHz
tpd
PRE or CLR
Q or Q
CL = 15 pF
9.8* 14.8* 1* 17* 1 17
ns
tpd CLK Q or Q CL = 15 pF 11.1* 16.4* 1* 19* 1 19 ns
tpd
PRE or CLR
Q or Q
CL = 50 pF
13 17.4 1 20 1 20
ns
t
pd CLK
Q or Q
C
L
= 50 pF
14.2 20 1 23 1 23
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
% #&'!$# #"'# (' # " &'!$0" '
"/# ($" & "0"*(!"#+ %$'$"' $$ $# "'
("&$# $'" "/# /$*+ ",$ #'!"# '""'0" " '/
$#/" ' ##" "" (' - #"+
SCLS381L − AUGUST 1997 − REVISED APRIL 2005
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
LOAD
TA = 25°C SN54LV74A SN74LV74A
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
fmax
CL = 15 pF 80* 140* 70* 70
MHz
fmax CL = 50 pF 50 90 45 45 MHz
tpd
PRE or CLR
Q or Q
CL = 15 pF
6.9* 12.3* 1* 14.5* 1 14.5
ns
tpd CLK Q or Q CL = 15 pF 7.9* 11.9* 1* 14* 1 14 ns
tpd
PRE or CLR
Q or Q
CL = 50 pF
9.2 15.8 1 18 1 18
ns
t
pd CLK
Q or Q
C
L
= 50 pF
10.2 15.4 1 17.5 1 17.5
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
LOAD
TA = 25°C SN54LV74A SN74LV74A
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE MIN TYP MAX MIN MAX MIN MAX
UNIT
fmax
CL = 15 pF 130* 180* 110* 110
MHz
fmax CL = 50 pF 90 140 75 75 MHz
tpd
PRE or CLR
Q or Q
CL = 15 pF
5* 7.7* 1* 9* 1 9
ns
tpd CLK Q or Q CL = 15 pF 5.6* 7.3* 1* 8.5* 1 8.5 ns
tpd
PRE or CLR
Q or Q
CL = 50 pF
6.6 9.7 1 11 111
ns
t
pd CLK
Q or Q
C
L
= 50 pF
7.2 9.3 1 10.5 1 10.5
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
PARAMETER
SN74LV74A
UNIT
PARAMETER
MIN TYP MAX
UNIT
VOL(P) Quiet output, maximum dynamic VOL 0.1 0.8 V
VOL(V) Quiet output, minimum dynamic VOL 0 −0.8 V
VOH(V) Quiet output, minimum dynamic VOH 3.2 V
VIH(D) High-level dynamic input voltage 2.31 V
VIL(D) Low-level dynamic input voltage 0.99 V
NOTE 6: Characteristics are for surface-mount packages only.
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd
Power dissipation capacitance
CL = 50 pF,
f = 10 MHz
3.3 V 21
pF
C
pd
Power dissipation capacitance
C
L
= 50 pF,
f = 10 MHz
5 V 23
pF
SCLS381L − AUGUST 1997 − REVISED APRIL 2005
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50% VCC
VCC
VCC
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
≈VCC
0 V
50% VCC VOL + 0.3 V
50% VCC ≈0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
TEST S1
VCC
0 V
50% VCC
tw
VOLTAGE WAVEFORMS
PULSE DURATION
Input
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
From Output
Under Test CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
S1
V
CC
RL = 1 kΩ
GND
From Output
Under Test CL
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
50% VCC
50% VCC 50% VCC
50% VCC
50% VCC 50% VCC
50% VCC 50% VCC
VOH − 0.3 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LV74AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74LV74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ANSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74LV74APWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APWT ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LV74ARGYR ACTIVE VQFN RGY 14 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN74LV74ARGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LV74A :
•Automotive: SN74LV74A-Q1
•Enhanced Product: SN74LV74A-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LV74ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LV74ADGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74LV74ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LV74ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LV74APWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74LV74ARGYR VQFN RGY 14 3000 180.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Dec-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LV74ADBR SSOP DB 14 2000 346.0 346.0 33.0
SN74LV74ADGVR TVSOP DGV 14 2000 346.0 346.0 29.0
SN74LV74ADR SOIC D 14 2500 346.0 346.0 33.0
SN74LV74ANSR SO NS 14 2000 346.0 346.0 33.0
SN74LV74APWR TSSOP PW 14 2000 346.0 346.0 29.0
SN74LV74ARGYR VQFN RGY 14 3000 190.5 212.7 31.8
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Dec-2009
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DLP® Products www.dlp.com Communications and www.ti.com/communications
Telecom
DSP dsp.ti.com Computers and www.ti.com/computers
Peripherals
Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps
Interface interface.ti.com Energy www.ti.com/energy
Logic logic.ti.com Industrial www.ti.com/industrial
Power Mgmt power.ti.com Medical www.ti.com/medical
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defense
Defense
RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video
Wireless www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
