1. General description
The 74HC4017; 74HCT4017 is a high-speed Si-gate CMOS device and is pin compatible
with the HEF4017.
The 74HC4017; 74HCT4017 is a 5-stage Johnson decade counter with 10 decoded active
HIGH outputs (Q0 to Q9), an active LOW output from the most significant flip-flop (Q5-9),
active HIGH and active LOW clock inputs (CP0 and CP1) and an overriding asynchronous
master reset input (MR).
The counter is advanced by either a LOW-to-HIGH transition at CP0 while CP1 is LOW or
a HIGH-to-LOW transition at CP1 while CP0 is HIGH (see Table 3).
When cascading counters, the Q5-9 output, which is LOW while the counter is in states 5,
6, 7, 8 and 9, can be used to drive the CP0 input of the next counter.
A HIGH on MR resets the counter to zero (Q0 = Q5-9 = HIGH; Q1 to Q9 = LOW)
independent of the clock inputs (CP0 and CP1).
Automatic code correction of the counter is provided by an internal circuit: following any
illegal code the counter returns to a proper counting mode within 11 clock pulses.
2. Features
Multiple package options
Complies with JEDEC standard no. 7 A
ESD protection:
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Specified from 40 °Cto+85°C and from 40 °C to +125 °C
74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Rev. 03 — 8 January 2008 Product data sheet
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 2 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
3. Ordering information
4. Functional diagram
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC4017
74HC4017N 40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
74HC4017D 40 °C to +125 °C SO16 plastic small outline package; 16 leads;
body width 3.9 mm SOT109-1
74HC4017DB 40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads;
body width 5.3 mm SOT338-1
74HC4017PW 40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm SOT403-1
74HC4017BQ 40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal-enhanced
very thin quad flat package; no leads; 16 terminals;
body 2.5 ×3.5 × 0.85 mm
SOT763-1
74HCT4017
74HCT4017N 40 °C to +125 °C DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
74HCT4017D 40 °C to +125 °C SO16 plastic small outline package; 16 leads;
body width 3.9 mm SOT109-1
74HCT4017BQ 40 °C to +125 °C DHVQFN16 plastic dual in-line compatible thermal-enhanced
very thin quad flat package; no leads; 16 terminals;
body 2.5 ×3.5 × 0.85 mm
SOT763-1
Fig 1. Functional diagram
001aah242
DECODING AND OUTPUT CIRCUITRY
5-STAGE JOHNSON COUNTER
Q0
CP0
MR
15
14
13 CP1
3
Q1
2
Q2
4
Q3
7
Q4
10
Q5
1
Q6
5
Q7
6
Q8
9
Q9
Q5-9
11
12
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 3 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Fig 2. Logic symbol Fig 3. IEC logic symbol
Q9
Q5-9
11
12
Q8 9
MR15
14
13 CP0
CP1
Q7 6
Q6
Q5 1
5
Q4
Q3 7
10
Q2 4
Q1 2
Q0 3
001aah239
9
CT5
11
12
89
CT = 0
CTRDIV10/DEC
15
13
14
76
6
51
5
4
37
10
24
12
03
001aah240
&
Fig 4. Logic diagram
001aah243
FF
1
D
CP
RD
Q
Q
FF
2
D
CP
RD
Q
Q
FF
3
D
CP
RD
Q
Q
FF
4
D
CP
RD
Q
Q
FF
5
D
CP
RD
Q
Q
Q0
CP1
CP0
MR
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 Q5-9
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 4 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Fig 5. Timing diagram
001aah244
CP0 INPUT
CP1 INPUT
MR INPUT
Q0 OUTPUT
Q1 OUTPUT
Q2 OUTPUT
Q3 OUTPUT
Q4 OUTPUT
Q5 OUTPUT
Q6 OUTPUT
Q7 OUTPUT
Q8 OUTPUT
Q9 OUTPUT
Q5-9 OUTPUT
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 5 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
5. Pinning information
5.1 Pinning
5.2 Pin description
Fig 6. Pin configuration DIP16, SO16 and (T)SSOP16 Fig 7. Pin configuration DHVQFN16
74HC4017
74HCT4017
Q5 VCC
Q1 MR
Q0 CP0
Q2 CP1
Q6 Q5-9
Q7 Q9
Q3 Q4
GND Q8
001aah238
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
001aah241
74HC4017
74HCT4017
Q3 Q4
Q7 Q9
Q6 Q5-9
Q2 CP1
Q0 CP0
Q1 MR
GND
Q8
Q5
VCC
Transparent top view
7 10
6 11
5 12
4 13
3 14
2 15
8
9
1
16
terminal 1
index area
GND(1)
Table 2. Pin description
Symbol Pin Description
Q[0:9] 3, 2, 4, 7, 10, 1, 5, 6, 9, 11 decoded output
GND 8 ground (0 V)
Q5-9 12 carry output (active LOW)
CP1 13 clock input (HIGH-to-LOW edge-triggered)
CP0 14 clock input (LOW-to-HIGH edge-triggered)
MR 15 master reset input (active HIGH)
VCC 16 supply voltage
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 6 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
6. Functional description
[1] H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
= LOW-to-HIGH transition;
= HIGH-to-LOW transition;
7. Limiting values
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] Ptot derates linearly with 12 mW/K above 70 °C.
[3] Ptot derates linearly with 8 mW/K above 70 °C.
[4] Ptot derates linearly with 5.5 mW/K above 60 °C.
[5] Ptot derates linearly with 4.5 mW/K above 60 °C.
Table 3. Function table[1]
MR CP0 CP1 Operation
H X X Q0 = Q5-9 = HIGH;
Q1 to Q9 = LOW
LHcounter advances
LL counter advances
L L X no change
L X H no change
LHno change
LL no change
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI>V
CC + 0.5 V [1] -±20 mA
IOK output clamping current VO<0.5 V or VO>V
CC + 0.5 V [1] -±20 mA
IOoutput current 0.5 V < VO < VCC + 0.5 V - ±25 mA
ICC supply current - 50 mA
IGND ground current 50 - mA
Tstg storage temperature 65 +150 °C
Ptot total power dissipation Tamb = 40 °C to +125 °C
DIP16 package [2] - 750 mW
SO16 package [3] - 500 mW
(T)SSOP16 package [4] - 500 mW
DHVQFN16 package [5] - 500 mW
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 7 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
8. Recommended operating conditions
9. Static characteristics
Table 5. Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
74HC4017
VCC supply voltage 2.0 5.0 6.0 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
t/V input transition rise and fall rate VCC = 2.0 V - - 625 ns/V
VCC = 4.5 V - 1.67 139 ns/V
VCC = 6.0 V - - 83 ns/V
Tamb ambient temperature 40 - +125 °C
74HCT4017
VCC supply voltage 4.5 5.0 5.5 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
t/V input transition rise and fall rate VCC = 4.5 V - 1.67 139 ns/V
Tamb ambient temperature 40 - +125 °C
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 °C40 °C to +85 °C40 °C to +125 °C Unit
Min Typ Max Min Max Min Max
74HC4017
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level
input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL
IO=20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO=20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO=20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO=4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO=5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 8 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
VOL LOW-level
output voltage VI=V
IH or VIL
IO=20µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO=20µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO=20µA; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO= 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO= 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND;
VCC = 6.0 V --±0.1 - ±1.0 - ±1.0 µA
ICC supply current VI=V
CC or GND; IO=0A;
VCC = 6.0 V - - 8.0 - 80 - 160 µA
CIinput
capacitance - 3.5 - - - - - pF
74HCT4017
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL; VCC = 4.5 V
IO=20 µA 4.4 4.5 - 4.4 - 4.4 - V
IO=4 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level
output voltage VI=V
IH or VIL; VCC = 4.5 V
IO=20µA - 0 0.1 - 0.1 - 0.1 V
IO= 4.0 mA - 0.15 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND;
VCC = 5.5 V --±0.1 - ±1.0 - ±1.0 µA
ICC supply current VI=V
CC or GND;
VCC = 5.5 V; IO=0A - - 8.0 - 80 - 160 µA
ICC additional
supply current per input pin;
VI=V
CC 2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V;
IO=0A
CP0 input - 25 90 - 113 - 123 µA
CP1 input - 40 144 - 180 - 196 µA
MR input - 50 180 - 225 - 245 µA
CIinput
capacitance - 3.5 - - - - - pF
Table 6. Static characteristics
…continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 °C40 °C to +85 °C40 °C to +125 °C Unit
Min Typ Max Min Max Min Max
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 9 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
10. Dynamic characteristics
Table 7. Dynamic characteristics
GND = 0 V; t
r
= t
f
= 6 ns; C
L
= 50 pF; see Figure 11.
Symbol Parameter Conditions 25 °C40 °C to +85 °C40 °C to +125 °C Unit
Min Typ Max Min Max Min Max
74HC4017
tpd propagation
delay CP0 to Qn; CP0 to Q5-9;
see Figure 10 [1]
VCC = 2.0 V - 63 230 - 290 - 345 ns
VCC = 4.5 V - 23 46 - 58 - 69 ns
VCC = 5.0 V;
CL=15pF -20- - - - -ns
VCC = 6.0 V - 18 39 - 49 - 59 ns
CP1 to Qn; CP1 to Q5-9;
see Figure 10
VCC = 2.0 V - 61 250 - 315 - 375 ns
VCC = 4.5 V - 22 50 - 63 - 75 ns
VCC = 5.0 V;
CL=15pF -20- - - - -ns
VCC = 6.0 V - 18 43 - 54 - 64 ns
tPHL HIGH to LOW
propagation
delay
MR to Q[1:9];
see Figure 10
VCC = 2.0 V - 52 230 - 290 - 345 ns
VCC = 4.5 V - 19 46 - 58 - 69 ns
VCC = 6.0 V - 15 39 - 49 - 59 ns
tPLH LOW to HIGH
propagation
delay
MR to Q5-9, Q0;
see Figure 10
VCC = 2.0 V - 55 230 - 290 - 345 ns
VCC = 4.5 V - 20 46 - 58 - 69 ns
VCC = 6.0 V - 16 39 - 49 - 59 ns
tttransition time see Figure 10 [2]
VCC = 2.0 V - 19 75 - 95 - 110 ns
VCC = 4.5 V - 7 15 - 19 - 22 ns
VCC = 6.0 V - 6 13 - 16 - 19 ns
tWpulse width CP0 and CP1 (HIGH or
LOW); see Figure 9
VCC = 2.0 V 80 17 - 100 - 120 - ns
VCC = 4.5 V 16 6 - 20 - 24 - ns
VCC = 6.0 V 14 5 - 17 - 20 - ns
MR (HIGH); see Figure 9
VCC = 2.0 V 80 19 - 100 - 120 - ns
VCC = 4.5 V 16 7 - 20 - 24 - ns
VCC = 6.0 V 14 6 - 17 - 20 - ns
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 10 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
tsu set-up time CP1 to CP0; CP0 to CP1;
see Figure 8
VCC = 2.0 V 50 8 - 65 - 75 - ns
VCC = 4.5 V 10 3 - 13 - 15 - ns
VCC = 6.0 V 9 2 - 11 - 13 - ns
thhold time CP1 to CP0; CP0 to CP1;
see Figure 8
VCC = 2.0 V 50 17 - 65 - 75 - ns
VCC = 4.5 V 10 6 - 13 - 15 - ns
VCC = 6.0 V 9 5 - 11 - 13 - ns
trec recovery time MR to CP0 and
MR to CP1; see Figure 9
VCC = 2.0 V 5 17 - 5 - 5 - ns
VCC = 4.5 V 5 6- 5 - 5 -ns
VCC = 6.0 V 5 5- 5 - 5 -ns
fmax maximum
frequency CP0 or CP1; see Figure 9
VCC = 2.0 V 6.0 23 - 4.8 - 4.0 - MHz
VCC = 4.5 V 30 70 - 24 - 20 - MHz
VCC = 5.0 V;
CL=15pF - 77 - - - - - MHz
VCC = 6.0 V 25 83 - 28 - 24 - MHz
CPD power
dissipation
capacitance
VI = GND to VCC;
VCC =5V; f
i= 1 MHz [3] -35- - - - -pF
74HCT4017
tpd propagation
delay CP0 to Qn; CP0 to Q5-9;
see Figure 10 [1]
VCC = 4.5 V - 25 46 - 58 - 69 ns
VCC = 5.0 V;
CL=15pF -21- - - - -ns
CP1 to Qn; CP1 to Q5-9;
see Figure 10
VCC = 4.5 V - 25 50 - 63 - 75 ns
VCC = 5.0 V;
CL=15pF -21- - - - -ns
tPHL HIGH to LOW
propagation
delay
MR to Q[1:9];
see Figure 10
VCC = 4.5 V - 22 46 - 58 - 69 ns
tPLH LOW to HIGH
propagation
delay
MR to Q5-9, Q0;
see Figure 10
VCC = 4.5 V - 20 46 - 58 - 69 ns
Table 7. Dynamic characteristics
…continued
GND = 0 V; t
r
= t
f
= 6 ns; C
L
= 50 pF; see Figure 11.
Symbol Parameter Conditions 25 °C40 °C to +85 °C40 °C to +125 °C Unit
Min Typ Max Min Max Min Max
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 11 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
[1] tpd is the same as tPHL and tPLH.
[2] tt is the same as tTHL and tTLH.
[3] CPD is used to determine the dynamic power dissipation (PD in µW):
PD=C
PD ×VCC2×fi×N+(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL×VCC2×fo) = sum of outputs.
tttransition time see Figure 10 [2]
VCC = 4.5 V - 7 15 - 19 - 22 ns
tWpulse width CP0 and CP1 (HIGH or
LOW); see Figure 9
VCC = 4.5 V 16 7 - 20 - 24 - ns
MR (HIGH); see Figure 9
VCC = 4.5 V 16 4 - 20 - 24 - ns
tsu set-up time CP1 to CP0; CP0 to CP1;
see Figure 8
VCC = 4.5 V 10 3 - 13 - 15 - ns
thhold time CP1 to CP0; CP0 to CP1;
see Figure 8
VCC = 4.5 V 10 6 - 13 - 15 - ns
trec recovery time MR to CP0 and
MR to CP1; see Figure 9
VCC = 4.5 V 5 5- 5 - 5 -ns
fmax maximum
frequency CP0 or CP1; see Figure 9
VCC = 4.5 V 30 61 - 24 - 20 - MHz
VCC = 5.0 V;
CL=15pF - 67 - - - - - MHz
CPD power
dissipation
capacitance
VI = GND to VCC 1.5 V;
VCC =5V; f
i= 1 MHz [3] -36- - - - -pF
Table 7. Dynamic characteristics
…continued
GND = 0 V; t
r
= t
f
= 6 ns; C
L
= 50 pF; see Figure 11.
Symbol Parameter Conditions 25 °C40 °C to +85 °C40 °C to +125 °C Unit
Min Typ Max Min Max Min Max
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 12 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
11. Waveforms
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8. Waveforms showing the set-up and hold times for CP0 to CP1 and CP1 to CP0
th
tsu
CP0 input
GND
GND
CP1 input
VM
VI
VI
th
tsu
VM
001aah245
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 9. Waveforms showing the minimum pulse width for CP0, CP1 and MR input; the maximum frequency for
CP0 and CP1 input; the recovery time for MR and the MR input to Qn and Q5-9 output propagation delays
CP0 input
VI
GND
VI
GND
VI
GND
VOH
VOL
VOH
VOL
Q1 - Q9
output
MR input
CP1 input
VM
VM
1/f max tW
tWtrec
VM
1/f max
tW
tPLH
tPHL
VM
VM
001aah246
Q0, Q5 - Q9
output
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 13 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Conditions: CP1 = LOW while CP0 is triggered on a LOW-to-HIGH transition and CP0 = HIGH, while CP1 is triggered on a
HIGH-to-LOW transition.
Fig 10. Waveforms showing the propagation delays for CP0, CP1 to Qn, Q5-9 outputs and the output transition
times
CP0 input
VI
GND
VI
GND
VOH
VOL
VOH
VOL
Q1 - Q9
output
CP1 input
VM
VM
tPLH
tPHL tPLH
tPHL
VM
tTLH tTHL
VM
001aah247
Q0, Q5 - Q9
output
Table 8. Measurement points
Type Input Output
VMVM
74HC4017 0.5 ×VCC 0.5 ×VCC
74HCT4017 1.3 V 1.3 V
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 14 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
12. Application information
Some examples of applications for the 74HC4017; 74HCT4017 are:
Decade counter with decimal decoding
1 out of n decoding counter (when cascaded)
Sequential controller
Timer
Figure 12 shows a technique for extending the number of decoded output states for the
74HC4017; 74HCT4017. Decoded outputs are sequential within each stage and from
stage to stage, with no dead time (except propagation delay).
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 11. Load circuitry for measuring switching times
VMVM
tW
tW
10 %
90 %
0 V
VI
VI
negative
pulse
positive
pulse
0 V
VMVM
90 %
10 %
tf
tr
tr
tf
001aad983
DUT
VCC VCC
VIVO
RT
RLS1
CL
open
PULSE
GENERATOR
Table 9. Test data
Type Input Load S1 position
VItr, tfCLRLtPHL, tPLH tPZH, tPHZ tPZL, tPLZ
74HC4017 VCC 6 ns 15 pF, 50 pF 1 kopen GND VCC
74HCT4017 3 V 6 ns 15 pF, 50 pF 1 kopen GND VCC
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 15 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Remark: It is essential not to enable the counter on CP1 when CP0 is HIGH, or on CP0
when CP1 is LOW, as this would cause an extra count.
Figure 13 shows an example of a divide-by 2 through divide-by 10 circuit using one
74HC4017; 74HCT4017. Since the 74HC4017; 74HCT4017 has an asynchronous reset,
the output pulse widths are narrow (minimum expected pulse width is 6 ns). The output
pulse widths can be enlarged by inserting an RC network at the MR input.
Fig 12. Counter expansion
Fig 13. Divide-by 2 through divide-by 10
001aah248
8 decoded
outputs
8 decoded
outputs
CP0
CP1
Q0 Q1 Q8 Q9
74HC4017
74HCT4017 74HC4017
74HCT4017 74HC4017
74HCT4017
- - - -
CP0
CP1
Q0 Q1 Q8 Q9
- - - -
CP0
CP1
Q1 Q8 Q9
- - - - - -
MR
clock first stage last stageintermediate stages
MR MR
9 decoded
outputs
Q4
Q8GND
divide - by 4
divide - by 8
Q9 divide - by 9
Q3divide - by 3
Q7divide - by 7
Q6divide - by 6
Q2divide - by 2
Q0
Q1
Q5divide - by 5
Q5-9 divide - by 10
CP1
CP0 fin
fout
MR
VCC VCC
001aah249
74HC4017
74HCT4017
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 16 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
13. Package outline
Fig 14. Package outline SOT38-4 (DIP16)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT38-4 95-01-14
03-02-13
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 0.764.2 0.51 3.2
inches 0.068
0.051 0.021
0.015 0.014
0.009
1.25
0.85
0.049
0.033 0.77
0.73 0.26
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.030.17 0.02 0.13
DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 17 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Fig 15. Package outline SOT109-1 (SO16)
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 10.0
9.8 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1 99-12-27
03-02-19
076E07 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.39
0.38 0.16
0.15 0.05
1.05
0.041
0.244
0.228 0.028
0.020 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 18 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Fig 16. Package outline SOT338-1 (SSOP16)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.25 0.38
0.25 0.20
0.09 6.4
6.0 5.4
5.2 0.65 1.25
7.9
7.6 1.03
0.63 0.9
0.7 1.00
0.55 8
0
o
o
0.130.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT338-1 99-12-27
03-02-19
(1)
wM
bp
D
HE
E
Z
e
c
vMA
X
A
y
18
16 9
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
MO-150
pin 1 index
0 2.5 5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1
A
max.
2
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 19 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Fig 17. Package outline SOT403-1 (TSSOP16)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.40
0.06 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1 MO-153 99-12-27
03-02-18
wM
bp
D
Z
e
0.25
18
16 9
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
A
max.
1.1
pin 1 index
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 20 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
Fig 18. Package outline SOT763-1 (DHVQFN16)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.6
3.4
Dh
2.15
1.85
y1
2.6
2.4 1.15
0.85
e1
2.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT763-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT763-1
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
16 terminals; body 2.5 x 3.5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
27
15 10
9
8
1
16
X
D
E
C
BA
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
02-10-17
03-01-27
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 21 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
14. Abbreviations
15. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT4017_3 20080108 Product data sheet - 74HC_HCT4017_CNV_2
Modifications: The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Section 3: DHVQFN16 package added.
Section 7: derating values added for DHVQFN16 package.
Section 13: outline drawing added for DHVQFN16 package.
74HC_HCT4017_CNV_2 19970829 Product specification - -
74HC_HCT4017_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 8 January 2008 22 of 23
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors 74HC4017; 74HCT4017
Johnson decade counter with 10 decoded outputs
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 January 2008
Document identifier: 74HC_HCT4017_3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Functional description . . . . . . . . . . . . . . . . . . . 6
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Recommended operating conditions. . . . . . . . 7
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12 Application information. . . . . . . . . . . . . . . . . . 14
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 21
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
17 Contact information. . . . . . . . . . . . . . . . . . . . . 22
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23