MMBT4126
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary NPN Type Available (MMBT4124)
• Ideal for Low Power Amplification and Switching
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 2 and 4)
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
• Marking (See Page 3): K2B
• Ordering & Date Code Information: See Page 3
• Weight: 0.008 grams (approximate)
SOT-23
Dim Min Max
A 0.37 0.51
B 1.20 1.40
C 2.30 2.50
D 0.89 1.03
E 0.45 0.60
G 1.78 2.05
H 2.80 3.00
J 0.013 0.10
K 0.903 1.10
L 0.45 0.61
M 0.085 0.180
α 0° 8°
All Dimensions in mm
E
B
C
A
E
JL
TOP VIEW
M
BC
C
BE
H
GD
K
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage VCBO -25 V
Collector-Emitter Voltage VCEO -25 V
Emitter-Base Voltage VEBO -4.0 V
Collector Current - Continuous (Note 1) IC -200 mA
Power Dissipation (Note 1) PD 300 mW
Thermal Resistance, Junction to Ambient (Note 1) RθJA 417 °C/W
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS (Note 3)
Collector-Base Breakdown Voltage V(BR)CBO -25 ⎯ V IC = -10μA, IE = 0
Collector-Emitter Breakdown Voltage V(BR)CEO -25 ⎯ V IC = -1.0mA, IB = 0
Emitter-Base Breakdown Voltage V(BR)EBO -4.0 ⎯ V IE = -10μA, IC = 0
Collector Cutoff Current ICBO ⎯ -50 nA VCB = -20V, IE = 0V
Emitter Cutoff Current IEBO ⎯ -50 nA VEB = -3.0V, IC = 0V
ON CHARACTERISTICS (Note 3)
DC Current Gain hFE 120
60 360
⎯ ⎯ IC = -2.0mA, VCE = -1.0V
IC = -50mA, VCE = -1.0V
Collector-Emitter Saturation Voltage VCE(SAT) ⎯ -0.40 V IC = -50mA, IB = -5.0mA
Base-Emitter Saturation Voltage VBE(SAT) ⎯ -0.95 V IC = -50mA, IB = -5.0mA
SMALL SIGNAL CHARACTERISTICS
Output Capacitance Cobo ⎯ 4.5 pF VCB = -5.0V, f = 1.0MHz, IE = 0
Input Capacitance Cibo ⎯ 10 pF VEB = -0.5V, f = 1.0MHz, IC = 0
Small Signal Current Gain hfe 120 480 ⎯ VCE = 1.0V, IC = -2.0mA,
f = 1.0kHz
Current Gain-Bandwidth Product fT 250 ⎯ MHz VCE = -20V, IC = -10mA,
f = 100MHz
Noise Figure NF ⎯ 4.0 dB VCE = -5.0V, IC = -100μA,
RS = 1.0kΩ, f = 1.0kHz
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead. Halogen and Antimony Free.
3. Short duration pulse test used to minimize self-heating effect.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30106 Rev. 8 - 2 1 of 3
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