Z0103NN,135\"\" - NXP SEMICONDUCTORS

IMPORTANT NOTICE

10 December 2015

1. Global joint venture starts operations as WeEn Semiconductors

Dear customer,

As from November 9th, 2015 NXP Semiconductors N.V. and Beijing JianGuang Asset

Management Co. Ltd established Bipolar Power joint venture (JV), WeEn Semiconductors, which

will be used in future Bipolar Power documents together with new contact details.

In this document where the previous NXP references remain, please use the new links as shown

below.

WWW - For www.nxp.com use www.ween-semi.com

Email - For salesaddresses@nxp.com use salesaddresses@ween-semi.com

For the copyright notice at the bottom of each page (or elsewhere in the document, depending

If you have any questions related to this document, please contact our nearest sales office via e-

mail or phone (details via salesaddresses@ween-semi.com).

Thank you for your cooperation and understanding,

WeEn Semiconductors

OT2

Z0103NN

4Q Triac

26 August 2013 Product data sheet

Scan or click this QR code to view the latest information for this product

1. General description

Planar passivated very sensitive gate four quadrant triac in a SOT223 (SC-73) surface-

mountable plastic package intended for applications requiring direct interfacing to logic

level ICs and low power gate drivers.

2. Features and benefits

•Direct interfacing to logic level ICs

•Direct interfacing to low power gate drive circuits

•High blocking voltage capability

•Planar passivated for voltage ruggedness and reliability

•Surface-mountable package

•Triggering in all four quadrants

•Very sensitive gate in four quadrants

3. Applications

•General purpose low power motor control

•Home appliances

•Industrial process control

•Low power AC Fan controllers

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDRM repetitive peak off-

state voltage

- - 800 V

ITSM non-repetitive peak on-

state current

full sine wave; Tj(init) = 25 °C;

tp = 20 ms; Fig. 4; Fig. 5

- - 8 A

IT(RMS) RMS on-state current full sine wave; Tsp ≤ 105 °C; Fig. 1;

Fig. 2; Fig. 3

- - 1 A

Static characteristics

VD = 12 V; IT = 0.1 A; T2+ G+;

Tj = 25 °C; Fig. 9

- - 3 mAIGT gate trigger current

VD = 12 V; IT = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 9

- - 3 mA

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 2 / 15

Symbol Parameter Conditions Min Typ Max Unit

VD = 12 V; IT = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 9

- - 3 mA

VD = 12 V; IT = 0.1 A; T2- G+;

Tj = 25 °C; Fig. 9

- - 5 mA

5. Pinning information

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 T1 main terminal 1

2 T2 main terminal 2

3 G gate

4 T2 main terminal 2

1 32

SC-73 (SOT223)

sym051

6. Ordering information

Table 3. Ordering information

PackageType number

Name Description Version

Z0103NN SC-73 plastic surface-mounted package with increased heatsink; 4

leads

SOT223

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 3 / 15

7. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDRM repetitive peak off-state voltage - 800 V

IT(RMS) RMS on-state current full sine wave; Tsp ≤ 105 °C; Fig. 1;

Fig. 2; Fig. 3

- 1 A

full sine wave; Tj(init) = 25 °C;

tp = 20 ms; Fig. 4; Fig. 5

- 8 AITSM non-repetitive peak on-state

current

full sine wave; Tj(init) = 25 °C;

tp = 16.7 ms

- 8.5 A

I2tI2t for fusing tp = 10 ms; SIN - 0.32 A2s

IT = 1 A; IG = 20 mA; dIG/dt = 0.1 A/µs;

T2+ G+

- 50 A/µs

IT = 1 A; IG = 20 mA; dIG/dt = 0.1 A/µs;

T2+ G-

- 50 A/µs

IT = 1 A; IG = 20 mA; dIG/dt = 0.1 A/µs;

T2- G-

- 50 A/µs

dIT/dt rate of rise of on-state current

IT = 1 A; IG = 20 mA; dIG/dt = 0.1 A/µs;

T2- G+

- 20 A/µs

IGM peak gate current - 1 A

PGM peak gate power - 2 W

PG(AV) average gate power over any 20 ms period - 0.1 W

Tstg storage temperature -40 150 °C

Tjjunction temperature - 125 °C

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 4 / 15

003aac269

10-2 10-1 1 10

surge duration (s)

IT(RMS)

(A)

f = 50 Hz; Tsp = 105 °C

Fig. 1. RMS on-state current as a function of surge

duration; maximum values

(

)

(

)

Fig. 2. RMS on-state current as a function of solder

point temperature; maximum values

003aac259

4 0.

1 1.

(

)

(

)

alpha

180

conduction

angle

(degrees)

form

factor

120

180

2.8

2.2

1.9

1.57

alpha

alpha = conduction angle

a = form factor = IT(RMS) / IT(AV)

Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 5 / 15

(

)

TSM

j(init)

= 25

C max

1/f

f = 50 Hz

Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum

values

(

)

(

)

(

)

TSM

j(init)

= 25

C max

tp ≤ 20 ms

(1) dIT/dt limit

(2) T2- G+ quadrant limit

Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 6 / 15

8. Thermal characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-sp) thermal resistance

from junction to solder

point

full cycle; Fig. 8 - - 15 K/W

full cycle; printed circuit board mounted:

minimum footprint; Fig. 6

- 156 - K/WRth(j-a) thermal resistance

from junction to

ambient full cycle; printed circuit board mounted:

pad area; Fig. 7

- 70 - K/W

001aab508

3.8 min

1.5

min

1.5

min

(3×)

2.3

4.6

6.3

1.5

min

All dimensions are in mm

Fig. 6. Minimum footprint SOT223

001aab509

4.6

4.5

All dimensions are in mm

Printed circuit board:

FR4 epoxy glass (1.6 mm thick), copper laminate

(35 um thick)

Fig. 7. Printed circuit board pad area: SOT223

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 7 / 15

(

)

(

)

(

)

Fig. 8. Transient thermal impedance from junction to solder point as a junction of pulse width

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 8 / 15

9. Characteristics

Table 6. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

VD = 12 V; IT = 0.1 A; T2+ G+;

Tj = 25 °C; Fig. 9

- - 3 mA

VD = 12 V; IT = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 9

- - 3 mA

VD = 12 V; IT = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 9

- - 3 mA

IGT gate trigger current

VD = 12 V; IT = 0.1 A; T2- G+;

Tj = 25 °C; Fig. 9

- - 5 mA

VD = 12 V; IG = 0.1 A; T2+ G+;

Tj = 25 °C; Fig. 10

- - 7 mA

VD = 12 V; IG = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 10

- - 15 mA

VD = 12 V; IG = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 10

- - 7 mA

ILlatching current

VD = 12 V; IG = 0.1 A; T2- G+;

Tj = 25 °C; Fig. 10

- - 7 mA

IHholding current VD = 12 V; Tj = 25 °C; Fig. 11 - - 7 mA

VTon-state voltage IT = 1.4 A; Tj = 25 °C; Fig. 12 - 1.3 1.6 V

VD = 12 V; IT = 0.1 A; Tj = 25 °C;

Fig. 13

- - 1 VVGT gate trigger voltage

VD = 800 V; IT = 0.1 A; Tj = 125 °C;

Fig. 13

0.2 - - V

IDoff-state current VD = 800 V; Tj = 125 °C - - 0.5 mA

Dynamic characteristics

dVD/dt rate of rise of off-state

voltage

VDM = 536 V; Tj = 110 °C; (VDM = 67%

of VDRM); exponential waveform; gate

open circuit; Fig. 14

10 - - V/µs

dVcom/dt rate of change of

commutating voltage

VD = 400 V; Tj = 110 °C; dIcom/

dt = 0.44 A/ms; gate open circuit

0.5 - - V/µs

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 9 / 15

Tj(°C)

-50 1501000 50

003aaa205

IGT(25°C)

IGT

(1)

(2)

(3)

(4)

(1) T2- G+

(2) T2- G-

(3) T2+ G-

(4) T2+ G+

Fig. 9. Normalized gate trigger current as a function of

junction temperature

Tj(°C)

-50 1501000 50

003aaa203

IL(25°C)

Fig. 10. Normalized latching current as a function of

junction temperature

Tj(°C)

-50 1501000 50

003aaa204

IH(25°C)

Fig. 11. Normalized holding current as a function of

junction temperature

003aac258

0.4

0.8

1.2

1.6

0 0.4 0.8 1.2 1.6 2

(V)

(A)

(1) (2) (3)

Vo = 1.13 V

Rs = 0.31 Ω

(1) Tj = 125 °C; typical values

(2) Tj = 125 °C; maximum values

(3) Tj = 25 °C; maximum values

Fig. 12. On-state current as a function of on-state

voltage

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 10 / 15

Tj (°C)

-50 1501000 50

003aaa209

0.8

0.4

1.2

1.6

VGT(25°C)

VGT

Fig. 13. Normalized gate trigger voltage as a function of

junction temperature

1.6

1.2

0.8

0.4

0 50 100 150

Tj(°C)

003aaa208

Fig. 14. Normalized critical rate of rise of off-state

voltage as a function of junction temperature;

typical values

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 11 / 15

10. Package outline

UNIT A1bpc D E e1HELpQ ywv

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.10

0.01

1.8

1.5

0.80

0.60

3.1

2.9

0.32

0.22

6.7

6.3

3.7

3.3 2.3

4.6 7.3

6.7

1.1

0.7

0.95

0.85 0.1 0.10.2

DIMENSIONS (mm are the original dimensions)

SOT223 SC-73 04-11-10

06-03-16

detail X

vMA

0 2 4 mm

scale

1 32

Plastic surface-mounted package with increased heatsink; 4 leads SOT223

Fig. 15. Package outline SC-73 (SOT223)

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 12 / 15

11. Soldering

sot223_fr

1.2

(4×)

1.2

(3×)

1.3

(4×)

1.3

(3×)

6.15

3.85

3.6

3.5

0.3

3.9 7.65

2.3 2.3

6.1

2 31

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

Fig. 16. Reflow soldering footprint for SC-73 (SOT223)

sot223_fw

1.9

6.7

8.9

8.7

1.9

(3×)

1.9

(2×)

1.1

6.2

2.7 2.7

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Fig. 17. Wave soldering footprint for SC-73 (SOT223)

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 13 / 15

12. Legal information

12.1 Data sheet status

Document

status [1][2]

Product

status [3]

Definition

Objective

[short] data

sheet

Development This document contains data from

the objective specification for product

development.

Preliminary

[short] data

sheet

Qualification This document contains data from the

preliminary specification.

Product

[short] data

sheet

Production This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nxp.com.

12.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of information included herein and shall have

no liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product

is deemed to offer functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give

any representations or warranties, expressed or implied, as to the accuracy

or completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -

lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their

applications and products using NXP Semiconductors products, and NXP

Semiconductors accepts no liability for any assistance with applications or

customer product design. It is customer’s sole responsibility to determine

whether the NXP Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should

provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default

in the customer’s applications or products, or the application or use by

customer’s third party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications

and the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 14 / 15

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor

tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards,

customer (a) shall use the product without NXP Semiconductors’ warranty

of the product for such automotive applications, use and specifications, and

(b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

NXP Semiconductors Z0103NN

4Q Triac

Product data sheet 26 August 2013 15 / 15

13. Contents

1 General description ............................................... 1

2 Features and benefits ............................................1

3 Applications ........................................................... 1

4 Quick reference data ............................................. 1

5 Pinning information ............................................... 2

6 Ordering information ............................................. 2

7 Limiting values .......................................................3

8 Thermal characteristics .........................................6

9 Characteristics ....................................................... 8

10 Package outline ................................................... 11

11 Soldering .............................................................. 12

12 Legal information .................................................13

12.1 Data sheet status ............................................... 13

12.2 Definitions ...........................................................13

12.3 Disclaimers ......................................................... 13

12.4 Trademarks ........................................................ 14

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 26 August 2013