VOIDLESS-HERMETICALLY SEALED
SURFACE MOUNT FAST RECOVERY
G
LA
SS
RE
C
TIFIER
S
SCOTTSDALE DIVISION
1N5186US thru 1N5190US
WWW.Microsemi .COM 1N5186 thru 1N5190
DESCRIPTION APPEARANCE
This “fast recovery” rectifier diode series is ideal for high-reliability applications
where a failure cannot be tolerated. These industry-recognized 3.0 Amp rated
rectifiers for working peak reverse voltages from 100 to 600 volts are hermetically
sealed with voidless-glass construction using an internal “Category I” metallurgical
bond. These devices are also available in military qualified axial-leaded packages
by deleting the “US” suffix. Microsemi also offers numerous other rectifier products
to meet higher and lower current ratings with various recovery time speed
requirements including fast and ultrafast device types in both through-hole and
surface mount packages.
Package “E”
or D-5B
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLICATIONS / BENEFITS
• Surface mount equivalent to the popular JEDEC
registered 1N5186 to 1N5190 series
• Voidless hermetically sealed glass package
• Triple-Layer Passivation
• Internal “Category I” Metallurgical bonds
• Working Peak Reverse Voltage 100 to 600 Volts.
• Further options in screening in accordance with MIL-
PRF-19500/424 for JAN, JANTX, and JANTXV by adding
a MQ, MX, or MV prefix respectively, e.g. MX1N5186US,
MV1N5187US, etc.
• Axial-leaded package equivalents also available (see
separate data sheet for 1N5186 thru 1N5190)
• Fast recovery 3 Amp rectifiers 100 to 600 V
• Military and other high-reliability applications
• General rectifier applications including bridges,
half-bridges, catch diodes, etc.
• High forward surge current capability
• Extremely robust construction
• Low thermal resistance
• Controlled avalanche with peak reverse power
capability
• Inherently radiation hard as described in
Microsemi MicroNote 050
MAXIMUM RATINGS MECHANICAL AND PACKAGING
• Junction & Storage Temperature: -65oC to +175oC
• Thermal Resistance: 10oC/W junction to end cap
• Thermal Impedance: 1.5oC/W @ 10 ms heating time
• Average Rectified Forward Current (IO): 3.0 Amps @ TA =
25ºC and 0.700 Amps at TA = 150ºC
• Forward Surge Current: 80 Amps @ 8.3 ms half-sine
• Solder Temperatures: 260ºC for 10 s (maximum)
• CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
• TERMINATIONS: End caps are solid silver with
Tin/Lead (Sn/Pb) finish
• MARKING: Cathode band only
• POLARITY: Cathode indicated by band
• TAPE & REEL option: Standard per EIA-481-B
• WEIGHT: 539 mg
• See package dimensions on last page
ELECTRICAL CHARACTERISTICS
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
MINIMUM
BREAKDOWN
VOLTAGE
VBR @ 50µA
FORWARD
VOLTAGE
VF
@ 9A (pulsed)
MAXIMUM
REVERSE
CURRENT
IR @ VRWM
MAXIMUM
REVERSE
RECOVERY
TIME
trr
AVERAGE
RECTIFIED
CURRENT AMPS
IO
25oC 100oC 25oC 150oC
TYPE
VOLTS VOLTS
MIN
VOLTS
MAX
VOLTS µA µA
ns AMPS AMPS
1N5186US
1N5187US
1N5188US
1N5189US
1N5190US
100V
200V
400V
500V
600V
120V
240V
480V
550V
660V
0.9V
1.5V
2.0
100
150
200
250
300
400
3.0
3.0
3.0
3.0
3.0
0.7
0.7
0.7
0.7
0.7
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright 2004
12-10-2004 REV A
VOIDLESS-HERMETICALLY SEALED
SURFACE MOUNT FAST RECOVERY
G
LA
SS
RE
C
TIFIER
S
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2
Copyright 2004
12-10-2004 REV A
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N5186US thru 1N5190US
1N5186 thru 1N5190
SYMBOLS & DEFINITIONS
Symbol Definition
VBR Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VRWM Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating
temperature range.
VF Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
IR Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and
temperature.
trr
Reverse Recovery Time: The time interval between the instant the current passes through zero when
changing from the forward direction to the reverse direction and a specified decay point after a peak reverse
current occurs.
PACKAGE DIMENSIONS
NOTE: This Package Outline has also previously PAD LAYOUT
been identified as “D-5B”
INCHES mm
A 0.288 7.32
B 0.070 1.78
C 0.155 3.94
Note: If mounting requires adhesive
separate from the solder, an additional
0.080 inch diameter contact may be
placed in the center between the pads
as an optional spot for cement.
INCHES mm
MIN MAX MIN MAX
BL .205 .225 5.21 5.72
BD .137 .142 3.48 3.61
ECT .019 .028 0.48 0.711
S .003 --- 0.08 ---
