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1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
General Purpose Transistor
NPN Silicon
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage VCEO 90 Vdc
CollectorEmitter Voltage VCER 140 Vdc
Collector–Base Voltage VCBO 140 Vdc
Emitter–Base Voltage VEBO 7.0 Vdc
Collector Current — Continuous IC1.0 Adc
Total Device Dissipation @ TA = 25°C
Derate above 25°CPD0.5
2.86 Watts
mW/°C
Total Device Dissipation @ TC = 25°C
Derate above 25°CPD1.8
10.3 Watts
mW/°C
Operating and Storage Junction
Temperature Range TJ, Tstg 65 to +200 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient R
q
JA 350 °C/W
Thermal Resistance, Junction to Case R
q
JC 97 °C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (IC = 100 mAdc, RBE = 10 )(1) V(BR)CER 140 Vdc
CollectorEmitter Sustaining V oltage (IC = 100 mAdc, IB = 0)(1) VCEO(sus) 90 Vdc
Collector –Base Breakdown Voltage (IC = 0.1 mAdc, IE = 0) V(BR)CBO 120 Vdc
EmitterBase Breakdown Voltage (IE = 0.1 mAdc, IC = 0) V(BR)EBO 7.0 Vdc
Collector Cutof f Current (VCB = 60 Vdc, IC = 0)
Collector Cutoff Current (VCB = 90 Vdc, IE = 0)
Collector Cutoff Current (VCB = 90 Vdc, IE = 0, TA = +150°C)
ICBO
0.01
0.01
10
m
Adc
Emitter Cutof f Current (VEB = 5.0 Vdc, I C = 0) IEBO 0.01
m
Adc
ON CHARACTERISTICS
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc, TA = –55°C)
(IC = 150 mAdc, VCE = 10 Vdc)(1)
hFE 35
20
60
200
CollectorEmitter Saturation V oltage (IC = 150 mAdc, IB = 15 mAdc)(1) VCE(sat) 0.6 Vdc
Base–Emitter Saturation Voltage (IC = 150 mAdc, IB = 15 Adc)(1) VBE(sat) 1.2 Vdc
1. Pulse Test: Pulse Width
v
300
m
s, Duty Cycle
v
1.8%.
Order this document
by 2N2896/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
2N2896
CASE 22–03, STYLE 1
TO–18 (TO–206AA)
1
2
3
Motorola, Inc. 1996
COLLECTOR
3
2
BASE
1
EMITTER
(Replaces 2N2895/D)
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2N2896
2 Motorola Small–Signal Transistors, FETs and Diodes Device Data
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued)
Characteristic Symbol Min Max Unit
SMALL–SIGNAL CHARACTERISTICS
CurrentGain — Bandwidth Product
(IC = 50 mAdc, VCE = 10 Vdc, f = 100 MHz) fT120 MHz
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Cobo 15 pF
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) Cibo 80 pF
Small–Signal Current Gain
(IC = 5.0 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz) hfe 50 275
Noise Figure
(IC = 0.3 mAdc, VCE = 10 Vdc, RS = 500 , f = 1.0 kHz) NF 8.0 dB
1.0
0.1
0.5
1000100101.00.5 IC, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain
h
FE
,
N
ORMALI
Z
E
D D
C
C
U
RRE
N
T
G
AI
N
C, CAPACITANCE (pF)
101.00.1
100
1.0
5.0
10
50
VR, REVERSE VOLTAGE (V)
Figure 2. Capacitance
1.4
1.2
1.0
0.8
0.6
0.4
0.2
01000100101.00.1 IC, COLLECTOR CURRENT (mA)
Figure 3. “On” Voltages
V, VOLTAGE (VOLTS)
Cob
Cib
TJ = 150°C
TJ = 25°C
TJ = –55°C
VBE(on) for VCE = 1.0 V
VBE(sat) IC
IB
+
10
VCE(sat) IC
IB
+
10
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2N2896
3
Motorola Small–Signal Transistors, FETs and Diodes Device Data
V
,
TEM
P
ERAT
U
RE
COEFFICIE
N
T
(m
V
/
C
)°θ
hfe, CURRENT GAIN
1.6
0.8
0
0.8
1.6
100050101.00.5 IC, COLLECTOR CURRENT (mA)
Figure 4. Temperature Coefficients
100 500 0
2.0
4.0
6.0
101.00.1 100
f, FREQUENCY (kHz)
Figure 5. Frequency Effects
14
12
10
8.0
6.0
4.0
2.0
00.1 1.0 10 100 1000
RS, SOURCE RESISTANCE (k OHMS)
Figure 6. Source Resistance Effects
0
100
0.1 1.0 10
IC, COLLECTOR CURRENT (mAdc)
Figure 7. Current Gain Bandwidth Product
versus Collector Current — 1.0 kHz hfe
NF, NOISE FIGURE (dB)
N
F,
N
OISE
FI
GU
RE
(d
B
)
RS = 4.3 k
IC = 10 µA
Re = 1.0 k
IC = 100 µA
f = 1.0 kHz
VCE = 10 V
TA = 25°C
IC = 100 µA
IC = 10 µA
+25°C to +150°C
(–55°C to 25°C)
θVC for VCE(sat)
–55°C to +25°C
+25°C to +150°C
θVBB for VBE
fτ(MHz)
1000
200
40
10
1.0 0.1 1.0 10 100
IC, COLLECTOR CURRENT (mAdc)
Figure 8. Current Gain — Bandwidth Product
0.01
0.1
1.0 10 100
VCE, COLLECTOR–EMITTER VOLTAGE (V)
Figure 9. Active Region Safe Operating Area
VCE = 20 V
IC, COLLECTOR CURRENT (A)
500 µs
1.0 ms5.0 ms
dc TO–39 dc TO–18
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2N2896
4 Motorola Small–Signal Transistors, FETs and Diodes Device Data
PACKAGE DIMENSIONS
CASE 22–03
(TO–206AA)
ISSUE R
SEATING
PLANE
E
F
B
C
K
L
P
D3 PL
–T–
–H–
MJ
G
2
31
M
A
M
0.36 (0.014) H M
T
NN
–A–
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.209 0.230 5.31 5.84
B0.178 0.195 4.52 4.95
C0.170 0.210 4.32 5.33
D0.016 0.021 0.406 0.533
E––– 0.030 ––– 0.762
F0.016 0.019 0.406 0.483
G0.100 BSC 2.54 BSC
H0.036 0.046 0.914 1.17
J0.028 0.048 0.711 1.22
K0.500 ––– 12.70 –––
L0.250 ––– 6.35 –––
M45 BSC 45 BSC
N0.050 BSC 1.27 BSC
P––– 0.050 ––– 1.27
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION J MEASURED FROM DIMENSION A
MAXIMUM.
4. DIMENSION F APPLIES BETWEEN DIMENSION P
AND L. DIMENSION D APPLIES BETWEEN
DIMENSION L AND K MINIMUM. LEAD DIAMETER
IS UNCONTROLLED IN DIMENSION P AND
BEYOND DIMENSION K MINIMUM.
5. DIMENSION E INCLUDES THE TAB THICKNESS.
(TAB THICKNESS IS 0.51(0.002) MAXIMUM).
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
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*2N2896/D*