June 2007
LM4946
Output Capacitor-Less Audio Subsystem with
Programmable National 3D
General Description
The LM4946 is an audio power amplifier capable of delivering
540mW of continuous average power into a mono 8Ω
bridged-tied load (BTL) with 1% THD+N, 35mW per channel
of continuous average power into stereo 32Ω single-ended
(SE) loads with 1% THD+N, or an output capacitor-less (OCL)
configuration with identical specifications as the SE configu-
ration, from a 3.3V power supply.
The LM4946 has three input channels: one pair for a two-
channel stereo signal and the third for a differential single-
channel mono input. The LM4946 features a 32-step digital
volume control and eight distinct output modes. The digital
volume control, 3D enhancement, and output modes (mono/
SE/OCL) are programmed through a two-wire I2C or a three-
wire SPI compatible interface that allows flexibility in routing
and mixing audio channels.
The LM4946 is designed for cellular phone, PDA, and other
portable handheld applications. It delivers high quality output
power from a surface-mount package and requires only sev-
en external components in the OCL mode (two additional
components in SE mode).
Key Specifications
■ THD+N at 1kHz, 540mW
into 8Ω BTL (3.3V) 1.0% (typ)
■ THD+N at 1kHz, 35mW
into 32Ω SE (3.3V) 1.0% (typ)
■ Single Supply Operation (VDD)2.7 to 5.5V
■ I2C/SPI Single Supply Operation
LLP 2.2 to 5.5V
micro SMD 1.7 to 5.5V
Features
■I2C/SPI Control Interface
■I2C/SPI programmable National 3D Audio
■I2C/SPI controlled 32 step digital volume control (-54dB to
+18dB)
■Three independent volume channels (Left, Right, Mono)
■Eight distinct output modes
■LLP and microSMD surface mount packaging
■“Click and Pop” suppression circuitry
■Thermal shutdown protection
■Low shutdown current (0.02uA, typ)
■RF immunity topology
Applications
■Mobile Phones
■PDAs
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2007 National Semiconductor Corporation 201628 www.national.com
LM4946 Output Capacitor-Less Audio Subsystem with Programmable National 3D
Typical Application
201628g1
FIGURE 1. Typical Audio Amplifier Application Circuit-Output Capacitor-less
201628n4
FIGURE 2. Typical Audio Amplifier Application Circuit-Single Ended
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LM4946
Connection Diagrams
24 Lead LLP Package
20162803
Top View
201628e8
Top View
U - Wafer Fab Code
Z - Assembly Plant Code
XY - Date Code
TT - Die Traceability
xxx - L4946SQ
25 Bump micro SMD Package
201628n2
Top View
201628n3
Top View
U - Wafer Fab Code
Z - Assembly Plant Code
XY - Date Code
TT - Die Traceability
G- Boomer
I9 - LM4946TM
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LM4946
Pin Descriptions
Pin Number (LLP) Bump (Mirco SMD) Name Description
1 B2 LHP3D2 Left Headphone 3D Input 1
2 A1 VOC Center Amplifier Output
3 A2 VDD Voltage Supply
4 A3 GND Ground
5 A4 ROUT Right Headphone Output
6 A5 LOUT Left Headphone Output
7 B4 I2CSPI_VDD I2C or SPI Interface Voltage Supply
8 B5 RIN Right Input Channel
9 B3 LIN Left Input Channel
10 C5 SDA Data
11 C4 SCL Clock
12 D5 GND Ground
13 D4 ID_ENB Address Identification/Enable Bar
14 E5 I2CSPI_SEL I2C or SPI Select
15 E4 MONO+ Loudspeaker Output Positive
16 D3 VDD Voltage Supply
17 E2 MONO- Loudspeaker Output Negative
18 E1 LHP3D1 Left Headphone 3D Input 2
19 D2 RHP3D1 Right Headphone 3D Input 1
20 D1 GND Ground
21 C3 BYPASS Half-Supply Bypass
22 C1 MONO_IN- Loudspeaker Negative Input
23 C2 MONO_IN+ Loudspeaker Positive Input
24 B1 RHP3D2 Right Headphone 3D Input 2
E3 VDD Voltage Supply
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LM4946
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3 to VDD +0.3
ESD Susceptibility (Note 3) 2.0kV
ESD Machine model (Note 6) 200V
Junction Temperature 150°C
Solder Information (Note 1)
Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
Thermal Resistance (Note 8)
θJA (typ) - SQA24A 46°C/W
θJA (typ) - TMD25A 49°C/W
Operating Ratings
Temperature Range −40°C to 85°C
Supply Voltage (VDD)2.7V ≤ VDD ≤ 5.5V
Supply Voltage (I2C/SPI) (Note 10) I2CSPI_VDD ≤ VDD
LLP 2.2V ≤ I2CSPI_VDD ≤ 5.5V
micro SMD 1.7V ≤ I2CSPI_VDD ≤ 5.5V
Electrical Characteristics 3.3V (Notes 2, 7)
The following specifications apply for VDD = 3.3V, TA = 25°C, all volume controls set to 0dB, unless otherwise specified.
Symbol Parameter Conditions LM4946 Units
(Limits)
Typical
(Note 4)
Limits
(Note 5)
IDD Supply Current
Output Modes 2, 4, 6
VIN = 0V; No load,
SE Headphone
3.25 mA
Output Modes 1, 3, 5, 7
VIN = 0V; No load,
SE Headphone
5.65 mA
Output Modes 2, 4, 6
VIN = 0V; No load,
OCL Headphone
4 6.5 mA (max)
Output Modes 1, 3, 5,
VIN = 0V; No load,
OCL Headphone
5 mA
Output Modes 7
VIN = 0V; No load,
OCL Headphone
6.5 10.5 mA (max)
ISD Shutdown Current Output Mode 0 0.02 1 µA (max)
VOS Output Offset Voltage
VIN = 0V, Mode 7
Mono 12 50
mV (max)
VIN = 0V, Mode 7
Headphones (Note 11) 3 15
POOutput Power
MONO OUT; RL = 8Ω
THD+N = 1%; f = 1kHz, BTL, Mode 1 540 500 mW (min)
ROUT and LOUT; RL = 32Ω
THD+N = 1%; f = 1kHz, SE, Mode 4 35 30 mW (min)
THD+N Total Harmonic Distortion + Noise
MONOOUT
f = 1kHz
POUT = 250mW; RL = 8Ω, BTL, Mode 1
0.05
%
ROUT and LOUT
f = 1kHz
POUT = 12mW; RL = 32Ω, SE, Mode 4
0.015
%
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LM4946
Symbol Parameter Conditions LM4946 Units
(Limits)
Typical
(Note 4)
Limits
(Note 5)
NOUT Output Noise
A-weighted,
inputs terminated to GND, output referred
Speaker; Mode 1 17 μV
Speaker; Mode 3, 7 27 μV
Speaker; Mode 5 33 μV
Headphone; SE, Mode 2 8 μV
Headphone; SE, Mode 4, 7 8 μV
Headphone; SE, Mode 6 12 μV
Headphone; OCL, Mode 2 8 μV
Headphone; OCL, Mode 4, 7 9 μV
Headphone; OCL, Mode 6 12 μV
PSRR
Power Supply Rejection Ratio
MONOOUT
VRIPPLE = 200mVPP; f = 217Hz, RL = 8Ω
CB = 2.2µF, BTL
All audio inputs terminated to GND;
output referred
BTL, Output Mode 1 76 dB
BTL, Output Mode 3, 7 65 dB
BTL, Output Mode 5 63 dB
Power Supply Rejection Ratio
ROUT and LOUT
VRIPPLE = 200mVPP; f = 217Hz, RL = 32Ω
CB = 2.2µF,
All audio inputs terminated to GND
output referred
SE, Output Mode 2 78 dB
SE, Output Mode 4,7 82 dB
SE, Output Mode 6 78 dB
OCL, Output Mode 2 84 dB
OCL, Output Mode 4, 7 78 dB
OCL, Output Mode 6 77 dB
Volume Control Step Size Error ±0.2 dB
Digital Volume Control Range
Maximum attenuation -54 –56
–52
dB (max)
dB (min)
Maximum gain 18 17.4
18.6
dB (min)
dB (max)
HP(SE) Mute Attenuation Output Mode 1, 3, 5 96 dB
MONO_IN Input Impedance
RIN and LIN Input Impedance
Maximum gain setting 12.5 10
15
kΩ (min)
kΩ (max)
Maximum attenuation setting 110 90
130
kΩ (min)
kΩ (max)
CMRR Common-Mode Rejection Ratio
f = 217Hz, VCM = 1Vpp,
Mode 1, BTL, RL = 8Ω 61
dB
f = 217Hz, VCM = 1Vpp,
Mode 2, RL = 32Ω 66
XTALK Crosstalk
Headphone; PO = 12mW
f = 1kHz, OCL, Mode 4 –54 dB
Headphone; PO = 12mW
f = 1kHz, SE, Mode 4 –72 dB
TWU Wake-Up Time from Shutdown CB = 2.2μF, OCL 100 ms
CB = 2.2μF, SE 135 ms
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LM4946
Electrical Characteristics 5.0V (Notes 2, 7)
The following specifications apply for VDD = 5.0V, TA = 25°C, all volume controls set to 0dB, unless otherwise specified.
Symbol Parameter Conditions LM4946 Units
(Limits)
Typical
(Note 4)
Limits
(Note 5)
IDD Supply Current
Output Modes 2, 4, 6
VIN = 0V; No load
SE Headphone
3.8 mA
Output Modes 1, 3, 5, 7
VIN = 0V; No Load,
SE Headphone
6.6 mA
Output Modes 2, 4, 6
VIN = 0V; No load,
OCL Headphone
4.6 mA
Output Modes 1, 3, 5
VIN = 0V; No Load,
OCL Headphone
6 mA
Output Modes 7
VIN = 0V; No Load,
OCL Headphone
7.4 mA
ISD Shutdown Current Output Mode 0 0.05 µA
VOS Output Offset Voltage
VIN = 0V, Mode 7
Mono 12
mV
VIN = 0V, Mode 7
Headphones
3
POOutput Power
MONOOUT; RL = 8Ω
THD+N = 1%; f = 1kHz, BTL, Mode 1 1.3 W
ROUT and LOUT; RL = 32Ω
THD+N = 1%; f = 1kHz, SE, Mode 4 85 mW
THD+N Total Harmonic Distortion + Noise
MONOOUT, f = 1kHz
POUT = 500mW; RL = 8Ω, BTL, Mode 1 0.05 %
ROUT and LOUT, f = 1kHz
POUT = 30mW; RL = 32Ω, SE, Mode 4 0.012 %
NOUT Output Noise
A-weighted,
inputs terminated to GND, output referred
Speaker; Mode 1 17 μV
Speaker; Mode 3, 7 27 μV
Speaker; Mode 5 33 μV
Headphone; SE, Mode 2 8 μV
Headphone; SE, Mode 4, 7 8 μV
Headphone; SE, Mode 6 12 μV
Headphone; OCL, Mode 2 8 μV
Headphone; OCL, Mode 4, 7 9 μV
Headphone; OCL, Mode 6 12 μV
PSRR Power Supply rejection Ratio
MONOOUT
VRIPPLE = 200mVPP; f = 217Hz, RL = 8Ω
CB = 2.2µF, BTL
All audio inputs terminated to GND;
output referred
BTL, Output Mode 1 69 dB
BTL, Output Mode 3, 7 60 dB
BTL, Output Mode 5 58 dB
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LM4946
Symbol Parameter Conditions LM4946 Units
(Limits)
Typical
(Note 4)
Limits
(Note 5)
PSRR Power Supply Rejection Ratio
ROUT and LOUT
VRIPPLE = 200mVPP; f = 217Hz, RL = 32Ω
CB = 2.2µF, BTL
All audio inputs terminated to GND;
output referred
SE, Output Mode 2 75 dB
SE, Output Mode 4,7 75 dB
SE, Output Mode 6 72 dB
OCL, Output Mode 2 75 dB
OCL, Output Mode 4, 7 79 dB
OCL, Output Mode 6 72 dB
Digital Volume Control Range
Maximum attenuation -54 -56
-52
dB (max)
dB (min)
Maximum gain 18 17.4
18.6
dB (min)
dB (max)
HP(SE) Mute Attenuation Output Mode 1, 3, 5 96 dB
MONO_IN Input Impedance
RIN and LIN Input Impedance
Maximum attenuation 12.5 10
15
kΩ (min)
kΩ (max)
Maximum gain 110 90
130
kΩ (min)
kΩ (max)
CMRR Common-Mode Rejection Ratio
f = 217Hz, VCM = 1Vpp, 0dB gain
Mode 1, BTL, RL = 8Ω 61
dB
f = 217Hz, VCM = 1Vpp, 0dB gain
Mode 2, RL = 32Ω 66
XTALK Crosstalk Headphone; PO = 30mW, OCL, Mode 4 –55 dB
Headphone; PO = 30mW, SE, Mode 4 –72 dB
TWU Wake-Up Time from Shutdown CB = 2.2μF, OCL 135 ms
CB = 2.2μF, SE 180 ms
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LM4946
I2C/SPI LLP/micro SMD (Notes 2, 7)
The following specifications apply for VDD = 5.0V and 3.3V, TA = 25°C, 2.2V ≤ I2CSPI_VDD ≤ 5.5V, unless otherwise specified.
Symbol Parameter Conditions LM4946 Units
(Limits)
Typical
(Note 4)
Limits (Notes 5,
7)
t1I2C Clock Period 2.5 µs (min)
t2I2C Data Setup Time 100 ns (min)
t3I2C Data Stable Time 0 ns (min)
t4Start Condition Time 100 ns (min)
t5Stop Condition Time 100 ns (min)
t6I2C Data Hold Time 100 ns (min)
fSPI Maximum SPI Frequency 1000 kHz (max)
tEL SPI ENB High Time 100 ns (min)
tDS SPI Data Setup Time 100 ns (min)
tES SPI ENB Setup Time 100 ns (min)
tDH SPI Data Hold Time 100 ns (min)
tEH SPI Enable Hold Time 100 ns (min)
tCL SPI Clock Low Time 500 ns (min)
tCH SPI Clock High Time 500 ns (min)
VIH I2C/SPI Input Voltage High 0.7xI2CSPI
VDD
V (min)
VIL I2C/SPI Input Voltage Low 0.3xI2CSPI
VDD
V (max)
I2C/SPI micro SMD only (Notes 2, 7)
The following specifications apply for VDD = 5.0V and 3.3V, TA = 25°C, 1.7V ≤ I2CSPI_VDD ≤ 2.2V, unless otherwise specified.
Symbol Parameter Conditions LM4946 Units
(Limits)
Typical
(Note 4)
Limits (Notes
5, 7)
t1I2C Clock Period 2.5 µs (min)
t2I2C Data Setup Time 250 ns (min)
t3I2C Data Stable Time 0 ns (min)
t4Start Condition Time 250 ns (min)
t5Stop Condition Time 250 ns (min)
t6I2C Data Hold Time 250 ns (min)
fSPI Maximum SPI Frequency 250 kHz (max)
tEL SPI ENB High Time 250 ns (min)
tDS SPI Data Setup Time 250 ns (min)
tES SPI ENB Setup Time 250 ns (min)
tDH SPI Data Hold Time 250 ns (min)
tEH SPI Enable Hold Time 250 ns (min)
tCL SPI Clock Low Time 500 ns (min)
tCH SPI Clock High Time 500 ns (min)
VIH I2C/SPI Input Voltage High 0.7xI2CSPI
VDD
V (min)
VIL I2C/SPI Input Voltage Low 0.25 xI2CSPI
VDD
V (max)
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LM4946
Note 1: See AN-450 "Surface Mounting and their effects on Product Reliability" for other methods of soldering surface mount devices.
Note 2: Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications
and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
Note 3: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 4: Typical specifications are specified at +25°C and represent the most likely parametric norm.
Note 5: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 6: Machine Model ESD test is covered by specification EIAJ IC-121-1981. A 200pF cap is charged to the specified voltage, then discharged directly into
the IC with no external series resistor (resistance of discharge path must be under 50Ω).
Note 7: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 8: The given θJA for an LM4946SQ mounted on a demonstration board with a 9in2 area of 1oz printed circuit board copper ground plane.
Note 9: Datasheet min/max specifications are guaranteed by design, test, or statistical analysis.
Note 10: Refer to table on page 9.
Note 11: For LM4946 LLP package, revised specification goes into effect starting with date code 79. Existing specification is per datasheet rev 1.0
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LM4946
Typical Performance Characteristics
THD+N vs Frequency
VDD = 3.3V, RL = 8Ω, PO = 250mW
Mode 1, BTL, BW = 80kHz
20162826
THD+N vs Frequency
VDD = 3.3V, RL = 32Ω, PO = 12mW
Mode 4, 7, OCL, BW = 80kHz
201628e3
THD+N vs Frequency
VDD = 3.3V, RL = 32Ω, PO = 12mW
Mode 6, OCL, BW = 80kHz
201628e4
THD+N vs Frequency
VDD = 3.3V, RL = 32Ω, PO = 12mW
Mode 4, 7, SE, BW = 80kHz
20162832
THD+N vs Frequency
VDD = 3.3V, RL = 32Ω, PO = 12mW
Mode 6, SE, BW = 80kHz
20162834
THD+N vs Frequency
VDD = 3.3V, RL = 8Ω, PO = 250mW
Mode 5, BTL, BW = 80kHz
20162827
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LM4946
THD+N vs Frequency
VDD = 5V, RL = 8Ω, PO = 500mW
Mode 1, BTL, BW = 80kHz
20162835
THD+N vs Frequency
VDD = 5V, RL = 32Ω, PO = 30mW
Mode 4, 7, OCL, BW = 80kHz
20162873
THD+N vs Frequency
VDD = 5V, RL = 32Ω, PO = 30mW
Mode 4, 7, SE, BW = 80kHz
20162874
THD+N vs Frequency
VDD = 5V, RL = 32Ω, PO = 30mW
Mode 6, OCL, BW = 80kHz
20162875
THD+N vs Frequency
VDD = 5V, RL = 32Ω, PO = 30mW
Mode 6, SE, BW = 80kHz
20162876
THD+N vs Frequency
VDD = 5V, RL = 8Ω, PO = 500mW
Mode 5, BTL
20162836
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LM4946
THD+N vs Frequency
VDD = 3.3V, RL = 32Ω, PO = 12mW
Mode 2, OCL
201628m3
THD+N vs Frequency
VDD = 3.3V, RL = 32Ω, PO = 12mW
Mode 2, SE, BW = 80kHz
201628m4
THD+N vs Frequency
VDD = 3.3V, RL = 8Ω, PO = 250mW
Mode 3, BTL
201628m5
THD+N vs Output Power
VDD = 3.3V, RL = 8Ω, f = 1kHz
Mode 1, BTL
201628b0
THD+N vs Output Power
VDD = 3.3V, RL = 8Ω, f = 1kHz
Mode 5, BTL
201628b4
THD+N vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz
Mode 4, 7, OCL
201628e6
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LM4946
THD+N vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz
Mode 4, 7, SE
201628b1
THD+N vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz
Mode 6, SE
201628e7
THD+N vs Output Power
VDD = 5V, RL = 8Ω, f = 1kHz
Mode 1, BTL
201628b2
THD+N vs Output Power
VDD = 5V, RL = 8Ω, f = 1kHz
Mode 5, BTL
201628b6
THD+N vs Output Power
VDD = 5V, RL = 32Ω, f = 1kHz
Mode 4, 7, OCL
201628c0
THD+N vs Output Power
VDD = 5V, RL = 32Ω, f = 1kHz
Mode 4, 7, SE
201628b3
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LM4946
THD+N vs Output Power
VDD = 5V, RL = 32Ω, f = 1kHz
Mode 6, SE
201628c1
THD+N vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz
Mode 6, Mono Input, OCL
201628m1
THD+N vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz
Mode 6, Stereo Input, OCL
201628m2
THD+N vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz
Mode 2, OCL
201628m6
THD+N vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz
Mode 2, SE
201628m7
THD+N vs Output Power
VDD = 3.3V, RL = 8Ω, f = 1kHz
Mode 3, BTL
201628m8
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LM4946
PSRR vs Frequency
VDD = 3.3V, 0dB
Mode 4, 7, OCL
20162819
PSRR vs Frequency
VDD = 3.3V, 0dB
Mode 4, 7, SE
20162820
PSRR vs Frequency
VDD = 3.3V, 0dB
Mode 6, OCL
20162821
PSRR vs Frequency
VDD = 3.3V, 0dB
Mode 6, SE
20162822
PSRR vs Frequency
VDD = 3.3V, 6dB
Mode 1, BTL
20162823
PSRR vs Frequency
VDD = 3.3V, RL = 8Ω
Mode 3, 7, BTL
20162877
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LM4946
PSRR vs Frequency
VDD = 3.3V, RL = 32Ω
Mode 2, OCL
201628l6
PSRR vs Frequency
VDD = 3.3V, RL = 8Ω
Mode 2, SE
201628l7
PSRR vs Frequency
VDD = 3.3V, 6dB
Mode 5, BTL
20162825
PSRR vs Supply Voltage
RL = 8Ω, 217Hz
Mode 1, BTL
201628l8
PSRR vs Supply Voltage
RL = 32Ω, 217Hz
Mode 4, OCL
201628l9
PSRR vs Supply Voltage
RL = 32Ω, 217Hz
Mode 4, SE
201628m0
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LM4946
Power Dissipation vs Output Power
VDD = 3.3V, RL = 32Ω
f = 1kHz, Mode 2, 4, 6, SE
201628g0
Power Dissipation vs Output Power
VDD = 5V, RL = 8Ω
f = 1kHz, Mode 1, 3, 5, BTL
201628c5
Power Dissipation vs Output Power
VDD = 5V, RL = 32Ω
f = 1kHz, Mode 2, 4, 6, OCL
201628c6
Power Dissipation vs Output Power
VDD = 3.3V, RL = 8Ω, f = 1kHz,
Modes 1, 3, 5, BTL
201628k5
Power Dissipation vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz,
Modes 2, 4, 6, OCL
201628k6
Power Dissipation vs Output Power
VDD = 3.3V, RL = 8Ω, f = 1kHz,
Mode 7, OCL
201628k7
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LM4946
Power Dissipation vs Output Power
VDD = 3.3V, RL = 32Ω, f = 1kHz,
Mode 7, SE
201628k9
Crosstalk vs Frequency
VDD = 3.3V, RL = 32Ω, PO = 12mW
Right-Left, Mode 4, OCL
201628e9
Crosstalk vs Frequency
VDD = 5V, RL = 32Ω, PO = 30mW
Left-Right, Mode 4, OCL
201628f1
Crosstalk vs Frequency
VDD = 3.3V, RL = 32Ω, PO = 12mW
Mode 4, SE
201628f0
Crosstalk vs Frequency
VDD = 5V, RL = 32Ω, PO = 30mW
Mode 4, SE
201628f2
Supply Current vs Supply Voltage
No Load, Mode 7
201628k2
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LM4946
Supply Current vs Supply Voltage
VDD = 3.3V, No Load, Modes 1, 3, 5
201628k3
Supply Current vs Supply Voltage
No Load, Modes 2, 4, 6
201628k4
Output Power vs Supply Voltage
RL = 8Ω, f = 1kHz, Mono, Mode 1
201628n0
Output Power vs Supply Voltage
RL = 32Ω, f = 1kHz, OCL, Mode 4
201628n1
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LM4946
Application Information
I2C PIN DESCRIPTION
SDA: This is the serial data input pin.
SCL: This is the clock input pin.
ID_ENB: This is the address select input pin.
I2CSPI_SEL: This is tied LOW for I2C mode.
I2C COMPATIBLE INTERFACE
The LM4946 uses a serial bus which conforms to the I2C pro-
tocol to control the chip's functions with two wires: clock (SCL)
and data (SDA). The clock line is uni-directional. The data line
is bi-directional (open-collector). The maximum clock fre-
quency specified by the I2C standard is 400kHz. In this dis-
cussion, the master is the controlling microcontroller and the
slave is the LM4946.
The I2C address for the LM4946 is determined using the
ID_ENB pin. The LM4946's two possible I2C chip addresses
are of the form 111110X10 (binary), where X1 = 0, if ID_ENB
is logic LOW; and X1 = 1, if ID_ENB is logic HIGH. If the I2C
interface is used to address a number of chips in a system,
the LM4946's chip address can be changed to avoid any pos-
sible address conflicts.
The bus format for the I2C interface is shown in Figure 3. The
bus format diagram is broken up into six major sections:
The "start" signal is generated by lowering the data signal
while the clock signal is HIGH. The start signal will alert all
devices attached to the I2C bus to check the incoming address
against their own address.
The 8-bit chip address is sent next, most significant bit first.
The data is latched in on the rising edge of the clock. Each
address bit must be stable while the clock level is HIGH.
For I2C interface operation, the I2CSPI_SEL pin needs to be
tied LOW (and tied high for SPI operation).
After the last bit of the address bit is sent, the master releases
the data line HIGH (through a pull-up resistor). Then the mas-
ter sends an acknowledge clock pulse. If the LM4946 has
received the address correctly, then it holds the data line LOW
during the clock pulse. If the data line is not held LOW during
the acknowledge clock pulse, then the master should abort
the rest of the data transfer to the LM4946.
The 8 bits of data are sent next, most significant bit first. Each
data bit should be valid while the clock level is stable HIGH.
After the data byte is sent, the master must check for another
acknowledge to see if the LM4946 received the data.
If the master has more data bytes to send to the LM4946, then
the master can repeat the previous two steps until all data
bytes have been sent.
The "stop" signal ends the transfer. To signal "stop", the data
signal goes HIGH while the clock signal is HIGH. The data
line should be held HIGH when not in use.
I2C INTERFACE POWER SUPPLY PIN (I2CSPI_VDD)
The LM4946's I2C interface is powered up through the
I2CSPI_VDD pin. The LM4946's I2C interface operates at a
voltage level set by the I2CVDD pin which can be set indepen-
dent to that of the main power supply pin VDD. This is ideal
whenever logic levels for the I2C interface are dictated by a
microcontroller or microprocessor that is operating at a lower
supply voltage than the main battery of a portable system.
201628f5
FIGURE 3. I2C Bus Format
21 www.national.com
LM4946
201628f4
FIGURE 4. I2C Timing Diagram
SPI DESCRIPTION
(For 2.2V ≤ I2CSPI_VDD ≤ 5.5V, see page 9 for more infor-
mation).
0. I2CSPI_SEL: This pin is tied HIGH for SPI mode.
1. The data bits are transmitted with the MSB first.
2. The maximum clock rate is 1MHz for the CLK pin.
3. CLK must remain HIGH for at least 500ns (tCH ) after the
rising edge of CLK, and CLK must remain LOW for at least
500ns (tCL) after the falling edge of CLK.
4. The serial data bits are sampled at the rising edge of CLK.
Any transition on DATA must occur at least 100ns (tDS) before
the rising edge of CLK. Also, any transition on DATA must
occur at least 100ns (tDH) after the rising edge of CLK and
stabilize before the next rising edge of CLK.
5.ID_ENB should be LOW only during serial data transmis-
sion.
6. ID_ENB must be LOW at least 100ns (tES ) before the first
rising edge of CLK, and ID_ENB has to remain LOW at least
100ns (tEH) after the eighth rising edge of CLK.
7. If ID_ENB remains HIGH for more than 100ns before all 8
bits are transmitted then the data latch will be aborted.
8. If ID_ENB is LOW for more than 8 CLK pulses then only
the first 8 data bits will be latched and activated when ID_ENB
transitions to logic-high.
9. ID_ENB must remain HIGH for at least 100ns (tEL ) to latch
in the data.
10. Coincidental rising or falling edges of CLK and ID_ENB
are not allowed. If CLK is to be held HIGH after the data
transmission, the falling edge of CLK must occur at least
100ns (tCS) before ID_ENB transitions to LOW for the next set
of data.
20162824
FIGURE 5. SPI Timing Diagram
www.national.com 22
LM4946
TABLE 1. Chip Address
A7 A6 A5 A4 A3 A2 A1 A0
Chip
Address 111110EC0
ID_ENB = 0 1 1 1 1 1 0 0 0
ID_ENB = 1 1 1 1 1 1 0 1 0
EC — Externally Controlled
TABLE 2. Control Registers
D7 D6 D5 D4 D3 D2 D1 D0
Mode Control 0 0 0 0 OCL MC2 MC1 MC0
Programmable 3D 0 1 0 0 N3D3 N3D2 N3D1 N3D0
Mono Volume Control 1 0 0 MVC4 MVC3 MVC2 MVC1 MVC0
Left Volume Control 1 1 0 LVC4 LVC3 LVC2 LVC1 LVC0
Right Volume Control 1 1 1 RVC4 RVC3 RVC2 RVC1 RVC0
1. Bits MVC0 — MVC4 control 32 step volume control for MONO input
2. Bits LVC0 — LVC4 control 32 step volume control for LEFT input
3. Bits RVC0 — RVC4 control 32 step volume control for RIGHT input
4. Bits MC0 — MC2 control 8 distinct modes
5. Bits N3D3, N3D2, N3D1, N3D0 control programmable 3D function
6. N3D0 turns the 3D function ON (N3D0 = 1) or OFF (N3D0 = 0), and N3D1 = 0 provides a “wider” aural effect or N3D1 = 1 a “narrower” aural effect
7. Bit OCL selects between SE with output capacitor (OCL = 0) or SE without output capacitors (OCL = 1). Default is OCL = 0
TABLE 3. Programmable National 3D Audio
N3D3 N3D2
Low 0 0
Medium 0 1
High 1 0
Maximum 1 1
TABLE 4. Output Mode Selection
Output Mode
Number
MC2 MC1 MC0 Handsfree Speaker
Output
Right HP Output Left HP Output
0 0 0 0 SD SD SD
1 0 0 1 GP X P MUTE MUTE
2 0 1 0 SD GP X P/2 GP X P/2
3 0 1 1 2 X (GL X L + GR X R) MUTE MUTE
4 1 0 0 SD GR X R GL X L
5 1 0 1 2 X (GL X L + GR X R) +
GP X P
MUTE MUTE
6 1 1 0 SD GR X R + GP X P/2 GL X L + GP X P/2
7 1 1 1 2 X (GR X R + GL X L) GR X R GL X L
On initial POWER ON, the default mode is 000
P = Phone-in (Mono)
R = RIN
L = LIN
SD = Shutdown
MUTE = Mute Mode
GP = Phone In (Mono) volume control gain
GR = Right stereo volume control gain
GL = Left stereo volume control gain
23 www.national.com
LM4946
TABLE 5. Volume Control Table
Volume Step xVC4 xVC3 xVC2 xVC1 xVC0 Gain,dB
1 0 0 0 0 0 –54.00
2 0 0 0 0 1 –46.50
3 0 0 0 1 0 –40.50
4 0 0 0 1 1 –34.50
5 0 0 1 0 0 –30.00
6 0 0 1 0 1 –27.00
7 0 0 1 1 0 –24.00
8 0 0 1 1 1 –21.00
9 0 1 0 0 0 –18.00
10 0 1 0 0 1 –15.00
11 0 1 0 1 0 –13.50
12 0 1 0 1 1 –12.00
13 0 1 1 0 0 –10.50
14 0 1 1 0 1 –9.00
15 0 1 1 1 0 –7.50
16 0 1 1 1 1 –6.00
17 1 0 0 0 0 –4.50
18 1 0 0 0 1 –3.00
19 1 0 0 1 0 –1.50
20 1 0 0 1 1 0.00
21 1 0 1 0 0 1.50
22 1 0 1 0 1 3.00
23 1 0 1 1 0 4.50
24 1 0 1 1 1 6.00
25 1 1 0 0 0 7.50
26 1 1 0 0 1 9.00
27 1 1 0 1 0 10.50
28 1 1 0 1 1 12.00
29 1 1 1 0 0 13.50
30 1 1 1 0 1 15.00
31 1 1 1 1 0 16.50
32 1 1 1 1 1 18.00
1. x = M, L, or R
2. Gain / Attenuation is from input to output
www.national.com 24
LM4946
NATIONAL 3D ENHANCEMENT
The LM4946 features a stereo headphone, 3D audio en-
hancement effect that widens the perceived soundstage from
a stereo audio signal. The 3D audio enhancement creates a
perceived spatial effect optimized for stereo headphone lis-
tening. The LM4946 can be programmed for a “narrow” or
“wide” soundstage perception. The narrow soundstage has a
more focused approaching sound direction, while the wide
soundstage has a spatial, theater-like effect. Within each of
these two modes, four discrete levels of 3D effect that can be
programmed: low, medium, high, and maximum (Table 2, 3),
each level with an ever increasing aural effect, respectively.
The difference between each level is 3dB.
The external capacitors, shown in Figure 6, are required to
enable the 3D effect. The value of the capacitors set the cutoff
frequency of the 3D effect, as shown by Equations 1 and 2.
Note that the internal 20kΩ resistor is nominal.
20162895
FIGURE 6. External 3D Effect Capacitors
f3DL(-3dB) = 1 / 2π * 20kΩ * C3DL (1)
f3DR(-3dB) = 1 / 2π * 20kΩ * C3DR (2)
Optional resistors R3DL and R3DR can also be added (Figure
7) to affect the -3dB frequency and 3D magnitude.
20162894
FIGURE 7. External RC Network with Optional R3DL and
R3DR Resistors
f3DL(-3dB) = 1 / 2π * (20kΩ + R3DL) * C3DL (3)
f3DR(-3dB) = 1 / 2π * 20kΩ + R3DR) * C3DR (4)
ΔAV (change in AC gain) = 1 / 1 + M, where M represents
some ratio of the nominal internal resistor, 20kΩ (see exam-
ple below).
f3dB (3D) = 1 / 2π (1 + M)(20kΩ * C3D) (5)
CEquivalent (new) = C3D / 1 + M (6)
TABLE 6. Pole Locations
R3D (kΩ)
(optional)
C3D (nF) M ΔAV (dB) f-3dB (3D)
(Hz)
Value of C3D
to keep same
pole location
(nF)
new Pole
Location
(Hz)
0 68 0 0 117
1 68 0.05 –0.4 111 64.8 117
5 68 0.25 –1.9 94 54.4 117
10 68 0.50 –3.5 78 45.3 117
20 68 1.00 –6.0 59 34.0 117
25 www.national.com
LM4946
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 8Ω LOAD
Power dissipated by a load is a function of the voltage swing
across the load and the load's impedance. As load impedance
decreases, load dissipation becomes increasingly dependent
on the interconnect (PCB trace and wire) resistance between
the amplifier output pins and the load's connections. Residual
trace resistance causes a voltage drop, which results in power
dissipated in the trace and not in the load as desired. For ex-
ample, 0.1Ω trace resistance reduces the output power dis-
sipated by an 8Ω load from 158.3mW to 156.4mW. The
problem of decreased load dissipation is exacerbated as load
impedance decreases. Therefore, to maintain the highest
load dissipation and widest output voltage swing, PCB traces
that connect the output pins to a load must be as wide as
possible.
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply's output voltage de-
creases with increasing load current. Reduced supply voltage
causes decreased headroom, output signal clipping, and re-
duced output power. Even with tightly regulated supplies,
trace resistance creates the same effects as poor supply reg-
ulation. Therefore, making the power supply traces as wide
as possible helps maintain full output voltage swing.
BRIDGE CONFIGURATION EXPLANATION
The LM4946 drives a load, such as a speaker, connected be-
tween outputs, MONO+ and MONO-.
This results in both amplifiers producing signals identical in
magnitude, but 180° out of phase. Taking advantage of this
phase difference, a load is placed between MONO- and
MONO+ and driven differentially (commonly referred to as
”bridge mode”). This results in a differential or BTL gain of:
AVD = 2(Rf / Ri) = 2 (7)
Bridge mode amplifiers are different from single-ended am-
plifiers that drive loads connected between a single amplifier's
output and ground. For a given supply voltage, bridge mode
has a distinct advantage over the single-ended configuration:
its differential output doubles the voltage swing across the
load. Theoretically, this produces four times the output power
when compared to a single-ended amplifier under the same
conditions. This increase in attainable output power assumes
that the amplifier is not current limited and that the output sig-
nal is not clipped.
Another advantage of the differential bridge output is no net
DC voltage across the load. This is accomplished by biasing
MONO- and MONO+ outputs at half-supply. This eliminates
the coupling capacitor that single supply, single-ended am-
plifiers require. Eliminating an output coupling capacitor in a
typical single-ended configuration forces a single-supply
amplifier's half-supply bias voltage across the load. This in-
creases internal IC power dissipation and may permanently
damage loads such as speakers.
POWER DISSIPATION
Power dissipation is a major concern when designing a suc-
cessful single-ended or bridged amplifier.
A direct consequence of the increased power delivered to the
load by a bridge amplifier is higher internal power dissipation.
The LM4946 has a pair of bridged-tied amplifiers driving a
handsfree speaker, MONO. The maximum internal power
dissipation operating in the bridge mode is twice that of a sin-
gle-ended amplifier. From Equation (8), assuming a 5V power
supply and an 8Ω load, the maximum MONO power dissipa-
tion is 634mW.
PDMAX-SPKROUT = 4(VDD)2 / (2π2 RL): Bridge Mode (8)
The LM4946 also has a pair of single-ended amplifiers driving
stereo headphones, ROUT and LOUT. The maximum internal
power dissipation for ROUT and LOUT is given by equation (9)
and (10). From Equations (9) and (10), assuming a 5V power
supply and a 32Ω load, the maximum power dissipation for
LOUT and ROUT is 40mW, or 80mW total.
PDMAX-LOUT = (VDD)2 / (2π2 RL): Single-ended Mode (9)
PDMAX-ROUT = (VDD)2 / (2π2 RL): Single-ended Mode (10)
The maximum internal power dissipation of the LM4946 oc-
curs when all three amplifiers pairs are simultaneously on;
and is given by Equation (11).
PDMAX-TOTAL =
PDMAX-SPKROUT + PDMAX-LOUT + PDMAX-ROUT (11)
The maximum power dissipation point given by Equation (11)
must not exceed the power dissipation given by Equation
(12):
PDMAX = (TJMAX - TA) / θJA (12)
The LM4946's TJMAX = 150°C. In the SQ package, the
LM4946's θJA is 46°C/W. At any given ambient temperature
TA, use Equation (12) to find the maximum internal power
dissipation supported by the IC packaging. Rearranging
Equation (12) and substituting PDMAX-TOTAL for PDMAX' results
in Equation (13). This equation gives the maximum ambient
temperature that still allows maximum stereo power dissipa-
tion without violating the LM4946's maximum junction tem-
perature.
TA = TJMAX - PDMAX-TOTAL θJA (13)
For a typical application with a 5V power supply and an 8Ω
load, the maximum ambient temperature that allows maxi-
mum mono power dissipation without exceeding the maxi-
mum junction temperature is approximately 121°C for the SQ
package.
TJMAX = PDMAX-TOTAL θJA + TA(14)
Equation (14) gives the maximum junction temperature
TJMAX. If the result violates the LM4946's 150°C, reduce the
maximum junction temperature by reducing the power supply
voltage or increasing the load resistance. Further allowance
should be made for increased ambient temperatures.
The above examples assume that a device is a surface mount
part operating around the maximum power dissipation point.
Since internal power dissipation is a function of output power,
higher ambient temperatures are allowed as output power or
duty cycle decreases. If the result of Equation (11) is greater
than that of Equation (12), then decrease the supply voltage,
increase the load impedance, or reduce the ambient temper-
ature. If these measures are insufficient, a heat sink can be
added to reduce θJA. The heat sink can be created using ad-
ditional copper area around the package, with connections to
www.national.com 26
LM4946
the ground pin(s), supply pin and amplifier output pins. Ex-
ternal, solder attached SMT heatsinks such as the Thermalloy
7106D can also improve power dissipation. When adding a
heat sink, the θJA is the sum of θJC, θCS, and θSA. (θJC is the
junction-to-case thermal impedance, θCS is the case-to-sink
thermal impedance, and θSA is the sink-to-ambient thermal
impedance). Refer to the Typical Performance Characteris-
tics curves for power dissipation information at lower output
power levels.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is crit-
ical for low noise performance and high power supply rejec-
tion. Applications that employ a 5V regulator typically use a
1µF in parallel with a 0.1µF filter capacitors to stabilize the
regulator's output, reduce noise on the supply line, and im-
prove the supply's transient response. However, their pres-
ence does not eliminate the need for a local 1.0µF tantalum
bypass capacitor and a parallel 0.1µF ceramic capacitor con-
nected between the LM4946's supply pin and ground. Keep
the length of leads and traces that connect capacitors be-
tween the LM4946's power supply pin and ground as short as
possible.
SELECTING EXTERNAL COMPONENTS
Input Capacitor Value Selection
Amplifying the lowest audio frequencies requires high value
input coupling capacitor (Ci in Figures 1 & 2). A high value
capacitor can be expensive and may compromise space ef-
ficiency in portable designs. In many cases, however, the
speakers used in portable systems, whether internal or ex-
ternal, have little ability to reproduce signals below 150Hz.
Applications using speakers with this limited frequency re-
sponse reap little improvement by using large input capacitor.
The internal input resistor (Ri), minimum 10kΩ, and the input
capacitor (Ci) produce a high pass filter cutoff frequency that
is found using Equation (15).
fc = 1 / (2πRiCi) (15)
As an example when using a speaker with a low frequency
limit of 150Hz, Ci, using Equation (15) is 0.106µF. The 0.22µF
Ci shown in Figure 1 allows the LM4946 to drive high effi-
ciency, full range speaker whose response extends below
40Hz.
Bypass Capacitor Value Selection
Besides minimizing the input capacitor size, careful consid-
eration should be paid to value of CB, the capacitor connected
to the BYPASS pin. Since CB determines how fast the
LM4946 settles to quiescent operation, its value is critical
when minimizing turn-on pops. The slower the LM4946's out-
puts ramp to their quiescent DC voltage (nominally VDD/2),
the smaller the turn-on pop. Choosing CB equal to 2.2µF along
with a small value of Ci (in the range of 0.1µF to 0.33µF), pro-
duces a click-less and pop-less shutdown function. As dis-
cussed above, choosing Ci no larger than necessary for the
desired bandwidth helps minimize clicks and pops. CB's value
should be in the range of 7 to 10 times the value of Ci. This
ensures that output transients are eliminated when power is
first applied or the LM4946 resumes operation after shut-
down.
27 www.national.com
LM4946
Demo Board Schematic Diagram
201628l2
www.national.com 28
LM4946
201628n5
29 www.national.com
LM4946
Revision History
Rev Date Description
1.0 01/23/06 Initial release.
1.1 03/05/07 Added the TMD25XXX package.
1.2 03/13/07 Edited the 25–pin micro SMD
connection diagram.
1.3 04/24/07 Added the I2C/SPI (1.7V 2.2V ) table.
1.4 04/26/07 Added the numerical values for the
X1, X2, and X3 in the Physical
Dimension section.
1.5 05/02/07 Text edits. Added the TM package.
1.6 05/15/07 Added the TM board schematic and
input some text edits.
1.7 05/16/07 More text edits.
1.8 06/06/07 Added Note 11 and more text edits.
www.national.com 30
LM4946
Physical Dimensions inches (millimeters) unless otherwise noted
24 Lead LLP Package
Order Number LM4946SQ
NS Package Number SQA24A
Dimensions are in millimeters
X1 = 4 ± 0.1 X2 = 4 ± 0.1 X3 = 0.8 ± 0.1
31 www.national.com
LM4946
25 Bump micro SMD Package
Order Number LM4946TM
NS Package Number TMD25ABA
X1 = 2015μm, X2 = 2047μm, X3 = 600μm
www.national.com 32
LM4946
Notes
33 www.national.com
LM4946
Notes
LM4946 Output Capacitor-Less Audio Subsystem with Programmable National 3D
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