ULN2803APG(O,N,HZN) - Toshiba

ULN2803,04APG/AFWG

2010-12-03

TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic

ULN2803APG,ULN2803AFWG,ULN2804APG,ULN2804AFWG

(Manufactured by Toshiba Malaysia)

8ch Darlington Sink Driver

The ULN2803APG / AFWG Series are high−voltage,

high−current darlington drivers comprised of eight NPN

darlington pairs.

All units feature integral clamp diodes for switching inductive

loads.

Applications include relay, hammer, lamp and display (LED)

drivers.

Features

z Output current (single output)

500 mA (max)

z High sustaining voltage output

50 V (min)

z Output clamp diodes

z Inputs compatible with various types of logic.

z Package Type−APG : DIP−18pin

z Package Type−AFWG : SOL−18pin

Pin Connection (top view)

Type Input Base

Resistor Designation

ULN2803APG / AFWG 2.7 kΩ TTL, 5 V CMOS

ULN2804APG / AFWG 10.5 kΩ 6~15 V PMOS, CMOS

ULN2803APG

ULN2804APG

ULN2803AFWG

ULN2804AFWG

Weight

DIP18−P−300−2.54F : 1.478 g (Typ.)

SOL18−P−300−1.27 : 0.48 g (Typ.)

ULN2803,04APG/AFWG

2010-12-03

Schematics (each driver)

ULN2803APG / AFWG ULN2804APG / AFWG

Note: The input and output parasitic diodes cannot be used as clamp diodes.

Absolute Maximum Ratings (Ta = 25°C)

Characteristic Symbol Rating Unit

Output sustaining voltage VCE (SUS) −0.5 to 50 V

Output current IOUT 500 mA / ch

Input voltage VIN −0.5 to 30 V

Clamp diode reverse voltage VR 50 V

Clamp diode forward current IF 500 mA

APG 1.47

Power dissipation

AFWG

0.92 / 1.31 (Note)

Operating temperature Topr −40 to 85 °C

Storage temperature Tstg −55 to 150 °C

Note: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%)

ULN2803,04APG/AFWG

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Recommended Operating Conditions (Ta = −40~85°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

Output sustaining voltage VCE (SUS) 0 ― 50 V

tpw = 25 ms, Duty = 10%,

8 Circuits 0 ― 347

APG

tpw = 25 ms, Duty = 50%,

8 Circuits 0 ― 123

tpw = 25 ms, Duty = 10%,

8 Circuits 0 ― 268

Output current

AFWG

IOUT

tpw = 25 ms, Duty = 50%,

8 Circuits 0 ― 90

mA /

Input voltage VIN 0 ― 30 V

ULN2803A 3.5 ― 30

Input voltage

(Output on) ULN2804A

VIN (ON)

8 ― 30

Clamp diode reverse voltage VR ― ― 50 V

Clamp diode forward current IF ― ― 400 mA

APG Ta = 85°C ― ― 0.76

Power dissipation

AFWG

Ta = 85°C (Note) ― ― 0.48

Note: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%)

ULN2803,04APG/AFWG

2010-12-03

Electrical Characteristics (Ta = 25°C)

Characteristic Symbol

Test

Cir−

Cuit

Test Condition Min Typ. Max Unit

VCE = 50 V Ta = 25°C ― ― 50

Output leakage current

VCE = 50 V Ta = 85°C ― ― 100

ULN2804A

ICEX 1

VCE = 50 V VIN = 1 V ― ― 500

μA

IOUT = 350 mA, IIN = 500 μA ― 1.3 1.6

IOUT = 200 mA, IIN = 350 μA ― 1.1 1.3

Collector−emitter saturation voltage VCE (sat) 2

IOUT = 100 mA, IIN = 250 μA ― 0.9 1.1

ULN2803A VIN = 3.85 V ― 0.93 1.35

VIN = 5 V ― 0.35 0.5

ULN2804A

IIN (ON) 2

VIN = 12 V ― 1.0 1.45

Input current

IN (OFF) 4 IOUT = 500 μA, Ta = 85°C 50 65 ― μA

VCE = 2 V, IOUT = 200 mA ― ― 2.4

VCE = 2 V, IOUT = 250 mA ― ― 2.7

ULN2803A

VCE = 2 V, IOUT = 300 mA ― ― 3.0

VCE = 2 V, IOUT = 125 mA ― ― 5.0

VCE = 2 V, IOUT = 200 mA ― ― 6.0

VCE = 2 V, IOUT = 275 mA ― ― 7.0

Input voltage

(Output on)

ULN2804A

VIN (ON) 5

VCE = 2 V, IOUT = 350 mA ― ― 8.0

DC current transfer ratio hFE 2 VCE = 2 V, IOUT = 350 mA 1000 ― ―

Ta = 25°C (Note) ― ― 50

Clamp diode reverse current IR 6

Ta = 85°C (Note) ― ― 100

μA

Clamp diode forward voltage VF 7 IF = 350 mA ― ― 2.0 V

Input capacitance CIN ― ― 15 ― pF

Turn−on delay tON RL = 125 Ω, VOUT = 50 V ― 0.1 ―

Turn−off delay tOFF

RL = 125 Ω, VOUT = 50 V ― 0.2 ―

μs

Note: VR = VR (max)

ULN2803,04APG/AFWG

2010-12-03

Test Circuit

1. ICEX 2. VCE (sat), hFE 3. IIN (ON)

4. IIN (OFF) 5. VIN (ON) 6. IR

7. VF

ULN2803,04APG/AFWG

2010-12-03

8. tON, tOFF

Note 1: Pulse Width 50 μs, Duty Cycle 10%

Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns

Note 2: See below.

Input Condition

Type Number R1 VIH

ULN2803A 0Ω 3 V

ULN2804A 0Ω 8 V

Note 3: CL includes probe and jig capacitance

Precautions for Using

This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.

Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that

excess current or voltage will not be applied to the IC.

Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed

due to short−circuit between outputs, air contamination fault, or fault by improper grounding.

ULN2803,04APG/AFWG

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ULN2803,04APG/AFWG

2010-12-03

ULN2803,04APG/AFWG

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Package Dimensions

DIP18−P−300−2.54F Unit: mm

Weight: 1.478 g (Typ.)

ULN2803,04APG/AFWG

2010-12-03

Package Dimensions

SOL18−P−300−1.27 Unit: mm

Weight: 0.48 g (Typ.)

ULN2803,04APG/AFWG

2010-12-03

Notes on Contents

1. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

2. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerations

Notes on Handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load, causing a large current to continuously flow and the

breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of

breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are

required.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush

current at power ON or the negative current resulting from the back electromotive force at power OFF.

IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,

the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,

smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation

or incorrectly even just one time.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load

components (such as speakers), for example, power amp and regulator.

If there is a large amount of leakage current such as input or negative feedback condenser, the IC

output DC voltage will increase. If this output voltage is connected to a speaker with low input

withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause

smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied

Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

ULN2803,04APG/AFWG

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Points to Remember on Handling of ICs

(1) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the

device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at

any time and condition. These ICs generate heat even during normal use. An inadequate IC heat

radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In

addition, please design the device taking into considerate the effect of IC heat radiation with

peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to

the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power

supply is small, the device’s motor power supply and output pins might be exposed to conditions

beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into

consideration in system design.

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

ULN2803,04APG/AFWG

2010-12-03

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