DESIGNED & DIMENSIONED
IN MILLIMETERS[INCHES]
DO NOT
SCALE FROM
THIS PRINT
SMP-J-B-XX-ST-XXXX
GENDER
-J: JACK
TYPE
-B: BULLET
PLATING SPECIFICATION
(VALUES GIVEN ARE IN MICRO-INCHES)
-HG: HEAVY GOLD / GOLD
30 Au / 50 Ni MIN ON PIN
10 Au / 50 Ni MIN ON OUTER CONTACT
-GF: GOLD / FLASH GOLD
10 Au / 50 Ni MIN ON PIN
3 Au / 50 Ni MIN ON OUTER CONTACT
(SEE TABLE 1)
ORIENTATION
-ST: STRAIGHT
LENGTH
-0645: 6.45MM
*-0700: 7.00MM
*-1000: 10.00MM
-1450: 14.50MM
3.40 .134
REF
"A"
REF
"B"
0.00
+
0.25
"B"
-
.000
+
.010
(RECOMMENDED
PLUG TO PLUG SPACING)
"A" "A"
0.05
-
0.05
+
0.12 .002
-
.002
+
.005
(FROM SHELL TO CONTACT)
0.05
-
0.05
+
0.12 .002
-
.002
+
.005
(FROM SHELL TO INSULATOR,
SEE NOTE 4)
0.05
-
0.05
+
0.12 .002
-
.002
+
.005
(FROM SHELL TO INSULATOR)
B
B
B
SECTION "A"-"A"
C
C
12 3
C
* = NOT TOOLED
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES ARE:
DECIMALS ANGLES
X.X:
0.3 [.01] 5
X.XX:
0.13 [.005]
X.XXX:
0.051 [.0020]
MATERIAL:
SMP BULLET - 50 OHM
BY:
SMP-J-B-XX-ST-XXXX
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
T MEEK
12/3/2010
2
1
SHEET SCALE: 8:1
F:\DWG\MISC\MKTG\SMP-J-B-XX-ST-XXXX-MKT.SLDDRW
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSHOUT FORCE FOR CENTER CONTACT: 6.67 N [1.5 LB].
INSULATOR: 6.67 N [1.5 LB].
3. PRODUCT TO BE PACKAGED PER PACKING STANDARD CO-HD-WI-3040-M.
TRAY: TY-SMA001-1
COVER: TY-SMA001-2
-0645: 500 PARTS PER TRAY(5 PARTS PER POCKET),
-0700, -1000 & -1450: 300 PARTS PER TRAY(3 PARTS PER POCKET)
4. APPLICABLE ON -1450 LENGTH ONLY.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail info@SAMTEC.com code 55322
PIN, SHELL: BeCu
INSULATOR: PTFE
REVISION B