Voltage
200 to 1000 V Current
1 Amp. at 40 °C
Nov - 03
VF
Max. forward voltage drop at IF = 1 A
IR
Max. reverse current per
element VRRM d.c.
Rth(j-a)
(*) NOTE: Thermal Resistance from junction to ambient mounted on P.C. Board with 13 mm. sq. Copper Pads
and T = 125 °C
and T = 25 °C
Peak recurrent reverse voltage (V)
Maximum RMS voltage (V)
Forward current at Tamb = 40 °C
VRRM
VRMS
IF (AV)
Tj
Tstg
Operating temperature range
Storage temperature range – 65 to + 150 °C
IFSM
8.3 ms. peak forward surge current
(Jedec Method)
1.0 A
50 A
– 65 to + 150 °C
• Glass Passivated Junction
• Package: DUAL IN LINE
• Ideal for PCB
DF-M
Maximum Ratings, according to IEC publication No. 134
Electrical Characteristics at Tamb = 25 °C
1 Amp. Glass Passivated Bridge Rectifier
1.1 V
10 µA
500 µA
65 °C/W
• Lead and polarity identifications
Marking code
Maximum thermal resistance junction to ambient (*)
Dimensions in mm. DF-M
DF04M DF10M
400
280
DF04M
1000
700
DF10M
R
10 A
I2tI2t value for fusing (t = 8.3 ms)
10 A2sec
DF 06 M
1N
8.51
8.12 2.03
1.27
4.69
3.81
3.3
3.05
0.58
0.46
1.14
0.89
5.2
5
6.5
6.2
8
7.24
0.33
0.22
8.9
7.6
2.03
1.52
Recurrent peak forward current
IF RM
Recommended Input Voltage (V)
DF02M
200
140
DF02M
DF06M
600
420
DF06M
DF08M
800
560
DF08M
0.8 A
R Load
L Load
VR
125 50080 250 380