Junction Size: Square 180 mils
Wafer Size: 4"
VRRM Class: 1000 and 1200 V
Passivation Process: Glassivated MOAT
Reference IR Packaged Part: 20ETF Series
FAST RECOVERY DIODES
IR180LM..CS05CB SERIES
Major Ratings and Characteristics
Parameters Units Test Conditions
VFM Maximum Forward Voltage 1350 mV TJ = 25°C, IF = 20 A
VRRM Reverse Breakdown Voltage Range 1000 and 1200 V TJ = 25°C, IRRM = 100 µA (1)
Mechanical Characteristics
Nominal Back Metal Composition, Thickness Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
Nominal Front Metal Composition, Thickness 100% Al, (20 µm)
Chip Dimensions
180 x 180 mils (4.57x4.57 mm) - see drawing
Wafer Diameter 100 mm, with std. < 110 > flat
Wafer Thickness 260 µm
Maximum Width of Sawing Line 45 µm
Reject Ink Dot Size 0.25 mm diameter minimum
Ink Dot Location See drawing
Recommended Storage Environment Storage in original container, in dessicated
nitrogen, with no contamination
Bulletin I0125J 07/97
(1) Nitrogen flow on die edge.
Document Number: 93883
www.vishay.com
1
IR180LM..CS05CB Series
IR 180 L M 12 C S05 CB
1 2 3
1- International Rectifier Device
2- Chip Dimension in Mils
3- Type of Device: L = Wire Bondable Fast Recovery Diode
4- Passivation Process: M = Glassivated MOAT
5- Voltage code: Code x 100 = VRRM
6- Metallization: C = Aluminium (Anode) - Silver (Cathode)
7- Fast Recovery Type: S05 = 500 nsec
8- CB = Probed Uncut Die (wafer in box)
None = Probed Die in chip carrier
4
Device Code
Ordering Information Table
567
Outline Table
All dimensions are in microns
Available Class
10 = 1000 V
12 = 1200 V
8
Bulletin I0125J 07/97
Document Number: 93883
www.vishay.com
2
IR180LM..CS05CB Series
TOP VIEW
N° 293 Basic Cells
Wafer Layout
All dimensions are in millimeters
Bulletin I0125J 07/97
Document Number: 93883
www.vishay.com
3
Legal Disclaimer Notice
Vishay
Document Number: 99901 www.vishay.com
Revision: 12-Mar-07 1
Notice
The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of
International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the
products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or
anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
International Rectifier®, IR®, the IR logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, and POWIRTRAIN®
are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product
names noted herein may be trademarks of their respective owners.
