© 2010 IXYS CORPORATION, All Rights Reserved DS100251(03/10)
VCES = 1400V
IC100 = 20A
VCE(sat)
5.0V
tfi(typ) = 32ns
GenX3TM 1400V IGBTs
w/ Diode
High-Speed PT IGBTs
for 20 - 50 kHz Switching
Symbol Test Conditions Maximum Ratings
VCES TJ= 25°C to 150°C 1400 V
VCGR TJ= 25°C to 150°C, RGE = 1MΩ1400 V
VGES Continuous ±20 V
VGEM Transient ±30 V
IC25 TC= 25°C 42 A
IC100 TC= 100°C 20 A
ICM TC= 25°C, 1ms 108 A
IATC= 25°C 20 A
EAS TC= 25°C 400 mJ
SSOA VGE = 15V, TJ = 125°C, RG = 5Ω ICM = 40 A
(RBSOA) Clamped Inductive Load VCE
VCES
PCTC= 25°C 250 W
TJ-55 ... +150 °C
TJM 150 °C
Tstg -55 ... +150 °C
TL1.6mm (0.062 in.) from Case for 10s 300 °C
TSOLD Plastic Body for 10 seconds 260 °C
MdMounting Torque (TO-247) 1.13/10 Nm/lb.in.
Weight TO-247 6 g
TO-268 4 g
Advance Technical Information
Features
zOptimized for Low Switching Losses
zSquare RBSOA
zHigh Avalanche Capability
zAnti-Parallel Ultra Fast Diode
zInternational Standard Packages
Advantages
zHigh Power Density
zLow Gate Drive Requirement
Applications
zHigh Frequency Power Inverters
zUPS
zMotor Drives
zSMPS
zPFC Circuits
zBattery Chargers
zWelding Machines
zLamp Ballasts
IXGH20N140C3H1
IXGT20N140C3H1
Symbol Test Conditions Characteristic Values
(TJ = 25°C, Unless Otherwise Specified) Min. Typ. Max.
VGE(th) IC= 250μA, VCE = VGE 3.0 5.0 V
ICES VCE = VCES, VGE= 0V 100 μA
TJ = 125°C, Note 1 2.0 mA
IGES VCE = 0V, VGE = ±20V ±100 nA
VCE(sat) IC = IC100, VGE = 15V, Note 1 4.0 5.0 V
TJ = 125°C 3.5 V
G = Gate C = Collector
E = Emitter Tab = Collector
TO-247 (IXGH)
TO-268 (IXGT)
GCEC (Tab)
E
G
C (Tab)
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXGH20N140C3H1
IXGT20N140C3H1
Symbol Test Conditions Characteristic Values
(TJ = 25°C, Unless Otherwise Specified) Min. Typ. Max.
gfs IC = IC100, VCE = 10V, Note 1 10 17 S
Cies 1790 pF
Coes VCE = 25V, VGE = 0V, f = 1MHz 145 pF
Cres 50 pF
Qg 88 nC
Qge IC = IC100, VGE = 15V, VCE = 0.5 VCES 18 nC
Qgc 30 nC
td(on) 19 ns
tri 12 ns
Eon 1.35 mJ
td(off) 110 ns
tfi 32 ns
Eoff 0.44 0.80 mJ
td(on) 22 ns
tri 13 ns
Eon 2.33 mJ
td(off) 144 ns
tfi 380 ns
Eoff 1.64 mJ
RthJC 0.50 °C/W
RthCK TO-247 0.21 °C/W
Inductive load, TJ = 25°C
IC = IC100, VGE = 15V
VCE = 0.5 VCES, RG = 5Ω
Note 2
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
Reverse Diode (FRED)
Symbol Test Conditions Characteristic Values
(TJ = 25°C, Unless Otherwise Specified) Min. Typ. Max.
VF IF = 20A, VGE = 0V, Note 1 3.0 V
TJ = 125°C 2.8 V
IRM 19 A
trr 70 ns
RthJC 0.9 °C/W
IF = 20A, VGE = 0V,
-diF/dt = 750A/μs, VR = 800V
Notes:
1. Pulse test, t 300μs, duty cycle, d 2%.
2. Switching times & energy losses may increase for higher VCE(Clamp), TJ or RG.
TO-247 Outline
TO-268 Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.7 5.3 .185 .209
A12.2 2.54 .087 .102
A22.2 2.6 .059 .098
b 1.0 1.4 .040 .055
b11.65 2.13 .065 .084
b22.87 3.12 .113 .123
C .4 .8 .016 .031
D 20.80 21.46 .819 .845
E 15.75 16.26 .610 .640
e 5.20 5.72 0.205 0.225
L 19.81 20.32 .780 .800
L1 4.50 .177
P 3.55 3.65 .140 .144
Q 5.89 6.40 0.232 0.252
R 4.32 5.49 .170 .216
S 6.15 BSC 242 BSC
Terminals: 1 - Gate 2 - Collector
3 - Emitter
Terminals: 1 - Gate 2 & 4 - Collector
3 - Emitter
Inductive load, TJ = 125°C
IC = IC100, VGE = 15V
VCE = 0.5 VCES, RG = 5Ω
Note 2
P
1 2 3