Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Array
E
1
X
2
B
3
V
4
8
5
V
6
4
7
7
8
2
9
J
10
V
11
Thick Film
Chip Resistor
Networks
Chip Resistor Array
Type: inches
Product Code
0201 Array
0402 Array
0603 Array
0402 Array
0603 Array
0805 Array
1
2
3
N
V
S
4
8
H
4 Terminal
8 Terminal
16 Terminal
No. of Terminal Schematics
VIsolated
type
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following. Jumper is
expressed by R00
Resistance Value
Example: 222: 2.2 k
Resistance
Tolerance
J
0
±5%
Jumper
Convex
Terminal
Concave
Terminal
Packaging Methods
Code
Nil
X
V
Packaging Type
Embossed Carrier Taping
4mmpitch
Punched Carrier Taping
2mmpitch
Punched Carrier Taping
4mmpitch
EXBS8V
EXB14V, 18V,
24V, 28V, N8V
EXB2HV, 34V,
38V, V4V, V8V
Protective coating
Thick film
resistive element
Electrode (Inner)
Electrode (Between)
Electrode (Outer)
Alumina substrate
43
12
8
1
7
2
6
3
5
4
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
■Construction (Example : Concave Terminal) ■Schematics
● Isolated type
14V, 24V, 34V, V4V
18V, 28V, N8V, 38V, V8V, S8V
2 resistors 4 resistors
2HV
8 resistors
■Features
● High density
2 resistors in 0.8 mm0.6 mm size (EXB14V)
4 resistors in 1.4 mm0.6 mm size (EXB18V)
2 resistors in 1.0 mm1.0 mm size (EXB24V)
4 resistors in 2.0 mm1.0 mm size (EXB28V, N8V)
8 resistors in 3.8 mm1.6 mm size (EXB2HV)
2 resistors in 1.6 mm1.6 mm size (EXB34V, V4V)
4 resistors in 3.2 mm1.6 mm size (EXB38V, V8V)
4 resistors in 5.1 mm2.2 mm size (EXBS8V)
● Improvement of placement effi ciency
Placement effi ciency of Chip Resistor Array is two, four or eight times of the fl at type chip resistor
Type: EXB1 : 0201 Array
EXB2 : 0402 Array
EXB3 : 0603 Array
EXBN : 0402 Array
EXBV : 0603 Array
EXBS : 0805 Array
■Explanation of Part Numbers
Chip Resistor Array
Mar. 2008
Chip Resistor Array
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
PP
LL
GG
G
W
G
BB
W
BB
A1 A1 A2
EXBV4V EXBN8V, V8V, S8V
TT
PLT
G
W
G
BB
A1 A2 EXB18V
A1
PTP
L
T
L
BB
G
BB
GG
W
W
G
A1 A2
EXB14V, 24V, 34V EXB28V, 38V
PT
L
G
W
G
BB
A1 A2 EXB2HV
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWTA1A2BPG
EXBN8V (04024) 2.00
±0.10 1.00±0.10 0.45±0.10 0.30
±0.10 0.30
±0.10 0.20±0.15 (0.50) 0.30±0.15 3.0
EXBV4V (06032) 1.60+0.20 1.60+0.20 0.60±0.10 0.60
±0.10 —0.30
±0.15 (0.80) 0.45±0.15 5.0
EXBV8V (06034) 3.20+0.20 1.60+0.20 0.60±0.10 0.60
±0.10 0.60
±0.10 0.30±0.15 (0.80) 0.45±0.15 10
EXBS8V (08054) 5.08+0.20 2.20+0.20 0.70±0.20 0.80±0.15 0.80±0.15 0.50±0.15 (1.27) 0.55±0.15 30
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWTA1A2BPG
EXB14V (02012) 0.80
±0.10 0.60±0.10 0.35±0.10 0.35±0.10 —0.15
±0.10 (0.50) 0.15±0.10 0.5
EXB24V (04022) 1.00±0.10 1.00±0.10 0.35±0.10 0.40±0.10 —0.18
±0.10 (0.65) 0.25±0.10 1.2
EXB28V (04024) 2.00±0.10 1.00±0.10 0.35±0.10 0.45±0.10 0.35±0.10 0.20±0.10 (0.50) 0.25±0.10 2.0
EXB2HV (04028) 3.80±0.10 1.60±0.10 0.45±0.10 0.35±0.10 0.35±0.10 0.30±0.10 (0.50) 0.30±0.10 9.0
EXB34V (06032) 1.60±0.20 1.60±0.15 0.50±0.10 0.65±0.15 —0.30
±0.20 (0.80) 0.30±0.20 3.5
EXB38V (06034) 3.20±0.20 1.60±0.15 0.50±0.10 0.65±0.15 0.45±0.15 0.30±0.20 (0.80) 0.35±0.20 7. 0
–0.10
–0.10
–0.10
–0.10
–0.10
–0.10
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWTA1A2BPG
EXB18V (02014) 1.40±0.10 0.60±0.10 0.35±0.10 0.20±0.10 0.20±0.10 0.10±0.10 (0.40) 0.20±0.10 1.0
( ) Reference
■Dimensions in mm (not to scale)
(1) Convex Terminal type
(2) Concave Terminal type
(3) Flat Terminal type ( ) Reference
( ) Reference
Feb. 2006
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Array
–60 –40 –20 0 20 40 60 80 100 120 140 160 180
0
20
40
60
80
100
70 °C–55 °C
125 °C
Ambient Temperature (°C)
Rated Load (%)
Item Specifi cations
Resistance Range
10 to 1 M:E24 series
Resistance Tolerance J: ±5 %
Number of Terminals
14V,24V,V4V,34V
4 terminal
18V,28V,N8V,38V,V8V,S8V
8 terminal
2HV
16 terminal
Number of Resistors
14V,24V,V4V,34V
2 terminal
18V,28V,N8V,38V,V8V,S8V
4 terminal
2HV
8 terminal
Power Rating at 70 °C
14V,28V,N8V
0.031 W/element
18V
0.031 W/element
(0.1 W/package)
24V,V4V,34V,V8V,38V
0.063 W/element
S8V
0.1 W/element
2HV
0.063 W/element
(0.25 W/package)
Type Kind of Taping Pitch (P1)Quantity
EXB14V, 18V
Punched Carrier Taping
2 mm 10000 pcs./reel
EXB24V, 28V
EXBN8V
EXB2HV
4 mm 5000 pcs./reel
EXB34V, 38V
EXBV4V, V8V
EXBS8V Embossed Carrier Taping 2500 pcs./reel
■Ratings
(1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=Power Rating Resistance Value, or Limiting Element Voltage (max.
RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload (Voltage) list ed above whichever less.
Power Derating Curve
For resistors operated in ambient temperature above
70 °C, power rating shall be derated in accordance
with the fi gure on the right.
■Packaging Methods (Taping)
● Standard Quantity
Item Specifi cations
Limiting Element Voltage(1)
Max. Rated Continuous
Working Voltage
14V,18V
12.5 V
2HV
25 V
24V,28V,N8V,38V,34V,V4V,V8V
50 V
S8V
100 V
Max. Over-load Voltage (2)
14V,18V
25 V
2HV
50 V
24V,28V,N8V,38V,34V,V4V,V8V
100 V
S8V
200 V
T.C.R.
±20010-6/°C(ppm/°C)
Category Temperature Range
(Operating Temperature Range)
–55 °C to 125 °C
Jumper Array
Rated Current
14V,18V
0.5 A
2HV,24V,28V,N8V,38V,34V,V4V,V8V
1 A
S8V
2 A
Max, Overload Current
14V,18V
1 A
2HV,24V,28V,N8V,38V,34V,V4V,V8V
2 A
S8V
4 A
( )
Feb. 2006
Chip Resistor Array
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
TTA
P0
P2
P1
P1
φD0
B
F
W
E
φD1(Only Emboss)
(2 mm pitch)
φB
W
T
φA
φC
fa
bc
a
d
cb
Conductor
Solder Resist
Type A B W F E P1P2P0φD0TφD1
EXB14V 0.70+0.10 0.95+0.05
8.00±0.20 3.50±0.05
1.75±0.10
2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.52±0.05
_
EXB18V 1.60±0.10
EXB24V
1.20±0.10
1.20±0.10
EXB28V 2.20±0.10
EXBN8V
0.70±0.05
EXB2HV
1.95±0.15
4.10±0.15
4.00±0.10
EXB34V 1.95±0.20
EXB38V 3.60±0.20
EXBV4V 1.95±0.20
0.84±0.05
EXBV8V 3.60±0.20
EXBS8V 2.80±0.20 5.70±0.20 12.00±0.30 5.50±0.20 1.60 max. 1.50+0.10
Type φAφBφCWT
EXB14V,18V
180.0+0 60 min. 13.0±1.0 9.0±1.0 11.4±1.0
EXB24V,28V
EXBN8V
EXB
2HV
EXB34V,38V
EXBV4V,V8V
EXBS8V
13.0±1.0 15.4±2.0
–
3.0
–0
–0
–0.05
–0.10
Type Dimensions Unit (mm)
abc f
18V
0.20 to 0.30 0.15 to 0.20 0.15 to 0.20 0.80 to 0.90
V4V,V8V
0.7 to 0.9 0.4 to 0.45 0.4 to 0.45 2 to 2.4
34V,38V
0.7 to 0.9 0.4 to 0.5 0.4 to 0.5 2.2 to 2.6
S8V
1 to 1.2 0.5 to 0.75 0.5 to 0.75 3.2 to 3.8
Punched Carrier Embossed Carrier
● Carrier Tape
● Taping Reel
■Land pattern design
Recommended land pattern design for Network chip is shown below.
Unit (mm)
Unit (mm)
(Not to scale)
Type Dimensions Unit (mm)
abcd
14V
0.30 0.30 0.30 0.80 to 0.90
24V
0.5 0.35 to 0.40 0.30 1.4 to 1.5
(Not to scale)
Jun. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Array
Preheating
Peak
Heating
Temperature
Time
b bdd dddddcccccc
af
fa
bdb
ccdd
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
Safety Precautions
· We do not recommend fl ow soldering, because a solder bridge may form.
●Flow soldering
Type Dimensions Unit (mm)
abcd f
28V 0.40 0.525 0.25 0.25 1.40
N8V
0.45 to 0.50 0.35 to 0.38
0.25 0.25
1.40 to 2.00
Type Dimensions Unit (mm)
abcd f
2HV 1.00 0.425 0.25 0.25 2.00
(Not to scale) (Not to scale)
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip Resistor Array (hereafter called the
resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and eval u ate the op er a tions
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avo id exces si ve be nd ing of printed circuit boards in order to protect the resistors from abnormal stress.
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Feb. 2006
– ER3 –
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion
equipment)
• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. S ealin g o r coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their
elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)
may be de formed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007