2003 Microchip Technology Inc. DS80154A-page 1
PIC16C710/711
The PIC16C710/711 parts you have received conform
functionally to the Device Data Sheet (DS40032B),
except for the anomalies described below.
None.
PIC16C71 → PIC16C710/711 Data Sheet Errata
PIC16C710/711
DS80154A-page 2 2003 Microchip Technology Inc.
Clarifications/Corrections to the Data
Sheet:
1. Module: Packaging
The package information contained in the data
sheet is incorrect. Please refer to the following
tables for correct package data.
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom
1510515105
α
Mold Draft Angle Top
10.929.407.87.430.370.310
eB
Overall Row Spacing §
0.560.460.36.022.018.014BLower Lead Width
1.781.461.14.070.058.045B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.18.135.130.125LTip to Seating Plane
22.9922.8022.61.905.898.890DOverall Length
6.606.356.10.260.250.240E1Molded Package Width
8.267.947.62.325.313.300EShoulder to Shoulder Width
0.38.015A1Base to Seating Plane
3.683.302.92.145.130.115A2Molded Package Thickness
4.323.943.56.170.155.140ATop to Seating Plane
2.54.100
p
Pitch
1818
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
2
D
n
E1
c
eB
β
E
α
p
A2
L
B1
B
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
§ Significant Characteristic
2003 Microchip Technology Inc. DS80154A-page 3
PIC16C710/711
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
Foot Angle φ048048
1512015120
β
Mold Draft Angle Bottom
1512015120
α
Mold Draft Angle Top
0.510.420.36.020.017.014BLead Width
0.300.270.23.012.011.009
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length
0.740.500.25.029.020.010hChamfer Distance
11.7311.5311.33.462.454.446DOverall Length
7.597.497.39.299.295.291E1Molded Package Width
10.6710.3410.01.420.407.394EOverall Width
0.300.200.10.012.008.004A1Standoff §
2.392.312.24.094.091.088
A2
Molded Package Thickness
2.642.502.36.104.099.093AOverall Height
1.27.050
p
Pitch
1818
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
L
β
c
φ
h
45°
1
2
D
p
n
B
E1
E
α
A2
A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
§ Significant Characteristic
PIC16C710/711
DS80154A-page 4 2003 Microchip Technology Inc.
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
3.30 3.56 3.81
5.335.084.83.210.200.190
W2
Window Length
.150.140.130W1Window Width
10.809.788.76.425.385.345
eB
Overall Row Spacing §
0.530.470.41.021.019.016BLower Lead Width
1.521.401.27.060.055.050B1Upper Lead Width
0.300.250.20.012.010.008
c
Lead Thickness
3.813.493.18.150.138.125LTip to Seating Plane
23.3722.8622.35.920.900.880DOverall Length
7.497.377.24.295.290.285E1Ceramic Pkg. Width
8.267.947.62.325.313.300EShoulder to Shoulder Width
0.760.570.38.030.023.015A1Standoff
4.194.063.94.165.160.155
A2
Ceramic Package Height
4.954.644.32.195.183.170ATop to Seating Plane
2.54.100
p
Pitch
1818
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
2
D
n
W2
E1
W1
c
eB
E
p
L
A2
B
B1
A
A1
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
2003 Microchip Technology Inc. DS80154A-page 5
PIC16C710/711
APPENDIX A: REVISION HISTORY
Rev. A Document (3/2003)
Under Clarifications/Corrections to the Data Sheet,
Item 1, Packaging: correct package data was added.
PIC16C710/711
DS80154A-page 6 2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc. DS80154A - page 7
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications. No
representation or warranty is given and no liability is assumed by
Microchip Technology Incorporated with respect to the accuracy
or use of such information, or infringement of patents or other
intellectual property rights arising from such use or otherwise.
Use of Microchip’s products as critical components in life
support systems is not authorized except with express written
approval by Microchip. No licenses are conveyed, implicitly or
otherwise, under any intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Accuron, Application Maestro, dsPIC, dsPICDEM,
dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark of
Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
DS80154A-page 8 2003 Microchip Technology Inc.
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