INTEGRATED CIRCUITS DIVISION
LBB110
Dual Single-Pole, Normally Closed
OptoMOS® Relay
www.ixysic.com
DS-LBB110-R08 1
Part # Description
LBB110 8-Pin DIP (50/Tube)
LBB110P 8-Pin Flatpack (50/Tube)
LBB110PTR 8-Pin Flatpack (1000/Reel)
LBB110S 8-Pin Surface Mount (50/Tube)
LBB110STR 8-Pin Surface Mount (1000/Reel)
Parameter Ratings Units
Blocking Voltage 350 VP
Load Current 120 mArms / mADC
On-Resistance (max) 35
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount, Tape & Reel Version Available
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
e3
Pb
Switching Characteristics of
Normally Closed Devices
1
2
3
4
8
7
6
5
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Form-B
IF
10%
90%
ILOAD
ton
toff
LBB110 is a dual normally closed (1-Form-B) solid
state relay that has two independently controlled,
optically coupled MOSFET switches in an 8-pin SOIC
package that employs optically coupled MOSFET
technology to provide 3750Vrms of input to output
isolation.
Its optically coupled outputs, which use patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Dual single-pole OptoMOS relays provide a more
compact design solution than discrete single-pole
relays in a variety of applications by incorporating
both relays in a single 8-pin package.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R08
LBB110
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 120 mArms / mADC
Peak t=10ms ILPK - - ±350 AP
On-Resistance 2IL=120mA RON -2535
Off-State Leakage Current VL=350VPILEAK --1A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --3ms
Turn-Off toff --3
Output Capacitance VL=50V, f=1MHz COUT -25- pF
Input Characteristics
Input Control Current to Activate IL=120mA IF--5mA
Input Control Current to Deactivate - IF0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10A
Common Characteristics
Input to Output Capacitance - CI/O -3- pF
1 If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value.
2 Measurement taken within 1 second of on-time.
Parameter Ratings Units
Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION
LBB110
www.ixysic.com 3
R08
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
0.27 0.63 0.990.45 0.81
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
0.09
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
0.45 0.81 1.350.27 0.63 0.99
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
1.17
Typical IF for Switch Operation
(N=50, IL=120mADC)
0.33 0.77 1.21 1.650.55 0.99 1.43
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Dropout
(N=50, IL=120mADC)
25
20
15
10
5
0
0.11 0.55 0.99 1.430.33 0.77 1.21
LED Current (mA)
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=120mADC)
25
20
15
10
5
0
25.5 27.5 28.5 30.529.5 31.5
On-Resistance (:)
Device Count (N)
26.5
Typical Blocking Voltage Distribution
(N=50, IF=5mA)
25
20
15
10
5
0
357.5 372.5 387.5 402.5 417.5 432.5
Blocking Voltage (VP)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=10mA
I
F
=5mA
Typical Turn-On Time
vs. LED Forward Current
(IL=120mADC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.30
0.25
0.20
0.15
0.10
0.05
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R08
LBB110
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical IF for Switch Operation
vs. Temperature
(IL=120mADC)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=120mADC)
Temperature (ºC)
Turn-On Time (ms)
-40
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical On-Resistance vs. Temperature
(IL=120mADC)
Temperature (ºC)
On-Resistance (:)
-40
50
45
40
35
30
25
20
15
10
5
0
-20 0 20 40 60 80 100
Dual Pole
Single Pole
Instantaneous
Typical IF for Switch Dropout
vs. Temperature
(IL=120mADC)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Turn-Off Time
vs. Temperature
(IL=120mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0
-20 0 20 40 60 80 100
IF=10mA
IF=5mA
Typical Load Current vs. Load Voltage
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-4 -3 -2 -1 1 2 3
04
Maximum Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
Typical Blocking Voltage
vs. Temperature
(IF=5mA)
Temperature (ºC)
Blocking Voltage (VP)
-40
410
405
400
395
390
385
380
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
(Measured across Pins 5&6 or 7&8)
Temperature (ºC)
Leakage (PA)
-40
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 1ms 100ms 10s100Ps 10ms 1s 100s
INTEGRATED CIRCUITS DIVISION
LBB110
www.ixysic.com 5
R08
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LBB110 / LBB110S / LBB110P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LBB110 / LBB110S 250ºC for 30 seconds
LBB110P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e3
Pb
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R08
LBB110
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
LBB110
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
LBB110P
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
LBB110S
INTEGRATED CIRCUITS DIVISION
Specification: DS-LBB110-R08
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
For additional information please visit our website at: www.ixysic.com
7
LBB110
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
LBB110PTR Tape & Reel
LBB110STR Tape & Reel
