1. General description
The 74HC164; 74HCT164 ar e hig h-sp eed Si-g ate CMOS d evices and ar e pin compatible
with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC
standard no. 7A.
The 74HC164; 74HCT164 are 8-bit edge-triggered shift registers with serial data entry
and an output from each of the eight stages. Data is entered serially through one of two
inputs (DSA or DSB); either input can be used as an active HIGH enable for data entry
through the other input. Both inputs must be connected togethe r or an unu se d inpu t must
be tied HIGH.
Data shifts one place to the right on each LOW-to-HIGH transition of the clock (CP) input
and enters into Q0, which is the logical AND of the two data inputs (DSA and DSB) that
existed one set-up time prior to the rising clock edge.
A LOW level on the master reset (MR) input overrides all other inputs and clears the
register asynchronously, forcing all outputs LOW.
2. Features and benefits
Input levels:
For 74HC164: CMOS level
For 74HCT164: TTL level
Gated serial data inputs
Asynchronous master reset
Complies with JEDEC standard no. 7A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD2 2 -A115-A exceeds 2 0 0 V.
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C.
74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
Rev. 6 — 12 December 2011 Product data sheet
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 2 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
3. Ordering information
4. Functional diagram
Table 1. Ordering information
Type number Package
Temperatur e range Name Description Version
74HC164N 40 C to +125 C DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
74HCT164N
74HC164D 40 C to +125 C SO14 plastic small outline package; 14 leads; body width
3.9 mm SOT108-1
74HCT164D
74HC164DB 40 C to +125 C SSOP14 plastic shrink small outline package; 14 leads; body
width 5.3 mm SOT337-1
74HCT164DB
74HC164PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package; 14 leads;
body width 4.4 mm SOT402-1
74HCT164PW
74HC164BQ 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5 30.85 mm
SOT762-1
74HCT164BQ
Fig 1. Logic symbol Fig 2. IEC logic symbol
001aac423
3
1
24
5
6
10
11
12
13
8
9
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
CP
DSB
DSA
MR
001aac424
9
8
&3
1
2
4
5
6
10
11
13
12
R
C1/
1D
SRG8
Fig 3. Logic diagra m
001aac425
1
2
310136412511
8
9
Q0 Q1 Q2
8-BIT SERIALIN/PARALLELOUT
SHIFT REGISTER
Q3 Q4 Q5 Q6 Q7
DSB
CP
MR
DSA
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 3 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
5. Pinning information
5.1 Pinning
Fig 4. Functional diagram
001aac616
Q0
D
FF1
Q
CP
RD
CP
DSB
DSA
MR
Q1
D
FF2
Q
CP
RD
Q2
D
FF3
Q
CP
RD
Q3
D
FF4
Q
CP
RD
Q4
D
FF5
Q
CP
RD
Q5
D
FF6
Q
CP
RD
Q6
D
FF7
Q
CP
RD
Q7
D
FF8
Q
CP
RD
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land sho uld remain
floating or be connected to GND.
Fig 5. Pin configuration DIP14, SO14, (T)SSOP14 Fig 6. Pin configuration DHVQFN14
74HC164
74HCT164
DSA V
CC
DSB Q7
Q0 Q6
Q1 Q5
Q2 Q4
Q3 MR
GND CP
001aal390
1
2
3
4
5
6
78
10
9
12
11
14
13
001aal391
74HC164
74HCT164
GND
(1)
Transparent top view
Q3 MR
Q2 Q4
Q1 Q5
Q0 Q6
DSB Q7
GND
CP
DSA
V
CC
6 9
5 10
4 11
3 12
2 13
7
8
1
14
terminal 1
index area
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 4 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
5.2 Pin description
6. Functional description
[1] H = HIGH voltage level
h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition
L = LOW voltage level
I = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition
q = lower case letters indicate the state of the referenced input one set-up time prior to the LOW-to-HIGH clock transition
= LOW-to-HIGH clock transition
7. Limiting values
Table 2. Pin description
Symbol Pin Description
DSA 1 data input
DSB 2 data input
Q0 to Q7 3, 4, 5, 6, 10, 11, 12, 13 output
GND 7 ground (0 V)
CP 8 clock input (LOW-to-HIGH, edge-triggered)
MR 9 master reset input (active LOW)
VCC 14 positive supply voltage
Table 3. Function table[1]
Operating
modes Input Output
MR CP DSA DSB Q0 Q1 to Q7
Reset (clear)LXXXLLtoL
Shift H llLq0to q6
HlhLq0to q6
Hhl Lq0to q6
HhhHq0to q6
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI>V
CC +0.5 V [1] -20 mA
IOK output clamping current VO<0.5 V or VO>V
CC +0.5V [1] -20 mA
IOoutput curren t 0.5 V < VO < VCC +0.5V - 25 mA
ICC supply current - 50 mA
IGND ground current 50 - mA
Tstg storage temperature 65 +150 C
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 5 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For DIP14 package: Ptot derates linearly with 12 mW/K above 70 C.
For SO14 package: Ptot derates linearly with 8 mW/K above 70 C.
For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
For DHVQFN14 packages: Ptot derates linearly with 4.5 mW/K above 60 C.
8. Recommended operating conditions
9. Static characteristics
Ptot total power dissipation [2]
DIP14 package - 750 mW
SO14, (T)SSOP14 and
DHVQFN14 packages - 500 mW
Table 4. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
Table 5. Recommended operating con ditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions 74HC164 74HCT164 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
VIinput voltage 0 - VCC 0- V
CC V
VOoutput voltage 0 - VCC 0- V
CC V
Tamb ambient temperature 40 +25 +125 40 +25 +125 C
t/V i nput transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V
VCC = 6.0 V--83---ns/V
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC164
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level
input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 6 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
VOH HIGH-level
output voltage VI = VIH or VIL
IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO = 4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO = 5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level
output voltage VI = VIH or VIL
IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI = VCC or GND;
VCC =6.0V --0.1 - 1-1A
ICC supply current VI = VCC or GND; IO=0A;
VCC =6.0V - - 8.0 - 80 - 160 A
CIinput
capacitance -3.5- - - - -pF
74HCT164
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2 .0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI = VIH or VIL; VCC = 4.5 V
IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V
IO = 4.0 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level
output voltage VI = VIH or VIL; VCC = 4.5 V
IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO = 5.2 mA; VCC = 6.0 V - 0.15 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI = VCC or GND;
VCC =6.0V --0.1 - 1-1A
ICC supply current VI = VCC or GND; IO=0A;
VCC =6.0V --8 - 80 - 160A
ICC additional
supply current per input pin;
VI=V
CC 2.1 V; IO=0A;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V
- 100 360 - 450 - 490 A
CIinput
capacitance -3.5- - - - -pF
Table 6. Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 7 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
10. Dynamic characteristics
Table 7. Dynamic characteristics
GND = 0 V; tr= tf= 6 ns; CL= 50 pF; test circuit see Figure 10; unless otherwise specifi ed
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC164
tpd propagation
delay CP to Qn; see Figure 7 [1]
VCC = 2.0 V - 41 170 - 215 - 255 ns
VCC = 4.5 V - 15 34 - 43 - 51 ns
VCC = 5.0 V; CL=15pF - 12 - - - - - ns
VCC = 6.0 V - 12 29 - 37 - 43 ns
tPHL HIGH to LOW
propagation
delay
MR to Qn; see Figure 8
VCC = 2.0 V - 39 140 - 175 - 210 ns
VCC = 4.5 V - 14 28 - 35 - 42 ns
VCC = 5.0 V; CL=15pF - 11 - - - - - ns
VCC = 6.0 V - 11 24 - 30 - 36 ns
tttransition time see Figure 7 [2]
VCC = 2.0 V - 19 75 - 95 - 110 ns
VCC = 4.5 V - 7 15 - 19 - 22 ns
VCC = 6.0 V - 6 13 - 16 - 19 ns
tWpulse width CP HIGH or LOW;
see Figure 7
VCC = 2.0 V 80 14 - 100 - 120 - ns
VCC = 4.5 V 16 5 - 20 - 24 - ns
VCC = 6.0 V 14 4 - 17 - 20 - ns
MR LOW; see Figure 8
VCC = 2.0 V 60 17 - 75 - 90 - ns
VCC = 4.5 V 12 6 - 15 - 18 - ns
VCC = 6.0 V 10 5 - 13 - 15 - ns
trec recovery time MR to CP; see Figure 8
VCC = 2.0 V 60 17 - 75 - 90 - ns
VCC = 4.5 V 12 6 - 15 - 18 - ns
VCC = 6.0 V 10 5 - 13 - 15 - ns
tsu set-up time DSA, and DSB to CP;
see Figure 9
VCC = 2.0 V 60 8 - 75 - 90 - ns
VCC = 4.5 V 12 3 - 15 - 18 - ns
VCC = 6.0 V 10 2 - 13 - 15 - ns
thhold time DSA, and DSB to CP;
see Figure 9
VCC = 2.0 V +4 6- 4 - 4 - ns
VCC = 4.5 V +4 2- 4 - 4 - ns
VCC = 6.0 V +4 2- 4 - 4 - ns
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 8 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
fmax maximum
frequency for Cp, see Figure 7
VCC = 2.0 V 6 23 - 5 - 4 - MHz
VCC = 4.5 V 30 71 - 24 - 20 - MHz
VCC = 5.0 V; CL=15pF - 78 - - - - - MHz
VCC = 6.0 V 35 85 - 28 - 24 - MHz
CPD power
dissipation
capacitance
per package;
VI=GNDtoV
CC
[3] -40- - - - - pF
74HCT164
tpd propagation
delay CP to Qn; see Figure 7 [1]
VCC = 4.5 V - 17 36 - 45 - 54 ns
VCC = 5.0 V; CL=15pF - 14 - - - - - ns
tPHL HIGH to LOW
propagation
delay
MR to Qn; see Figure 8
VCC = 4.5 V - 19 38 - 48 - 57 ns
VCC = 5.0 V; CL=15pF - 16 - - - - - ns
tttransition time see Figure 7 [2]
VCC = 4.5 V - 7 15 - 19 - 22 ns
tWpulse width CP HIGH or LOW;
see Figure 7
VCC = 4.5 V 18 7 - 23 - 27 - ns
MR LOW; see Figure 8
VCC = 4.5 V 18 10 - 23 - 27 - ns
trec recovery time MR to CP; see Figure 8
VCC = 4.5 V 16 7 - 20 - 24 - ns
tsu set-up time DSA, and DSB to CP;
see Figure 9
VCC = 4.5 V 12 6 - 15 - 18 - ns
thhold time DSA, and DSB to CP;
see Figure 9
VCC = 4.5 V +4 2- 4 - 4 - ns
fmax maximum
frequency for Cp, see Figure 7
VCC = 4.5 V 27 55 - 22 - 18 - MHz
VCC = 5.0 V; CL=15pF - 61 - - - - - MHz
Table 7. Dynamic characteristics …continued
GND = 0 V; tr= tf= 6 ns; CL= 50 pF; test circuit see Figure 10; unless otherwise specifi ed
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 9 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
[1] tpd is the same as tPHL and tPLH.
[2] tt is the same as tTHL and tTLH.
[3] CPD is used to determine the dynamic power dissipation (PD in W):
PD=C
PD VCC2fiN+ (CLVCC2fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CLVCC2fo) = sum of outputs.
CPD power
dissipation
capacitance
per package;
VI=GNDtoV
CC 1.5 V [3] -40- - - - - pF
Table 7. Dynamic characteristics …continu ed
GND = 0 V; tr= tf= 6 ns; CL= 50 pF; test circuit see Figure 10; unless otherwise specifi ed
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
(1) Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. Waveforms showing the clock (CP) to output (Qn) propagation delays, the clock pulse width, the output
transition times and the maximum clock frequency
001aal392
CP input
Qn output
tPHL tPLH
tTHL tTLH
tW
VOH
VI
GND
VOL
VM
VM
VX
VY
1/fmax
Table 8. Measurement points
Type Input Output
VMVMVXVY
74HC164 0.5VCC 0.5VCC 0.1VCC 0.9VCC
74HCT164 1.3 V 1.3 V 0.1VCC 0.9VCC
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 10 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
(1) Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8. Waveforms showing the master re set (MR) pulse width, the master reset to output (Qn) propagation
delays and the master reset to clock (CP) re moval time
001aac427
MR input
CP input
Qn output
tPHL
tWfrec
VM
VI
GND
VI
VOH
VOL
GND
VM
VM
(1) Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
The shaded areas indicate when the input is permitted to change for predictable output performance.
Fig 9. Waveforms showing the data set-up and hold times for Dn inputs
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 11 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
Test data is given in Table 9.
Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
Fig 10. Test circuit for measuring switching times
001aah768
tW
tW
tr
tr
tf
VM
VI
negative
pulse
GND
VI
positive
pulse
GND
10 %
90 %
90 %
10 % VMVM
VM
tf
VCC
DUT
RT
VIVO
CL
G
Table 9. Test data
Type Input Load Test
VItr, tfCL
74HC164 VCC 6.0 ns 15 pF, 50 pF tPLH, tPHL
74HCT164 3.0 V 6.0 ns 15 pF, 50 pF tPLH, tPHL
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 12 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
11. Package outline
Fig 11. Package outline SOT27-1 (DIP14)
UNIT A
max. 1 2 (1) (1)
b1cD (1)
Z
Ee M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT27-1 99-12-27
03-02-13
A
min. A
max. bmax.
w
ME
e1
1.73
1.13 0.53
0.38 0.36
0.23 19.50
18.55 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 2.24.2 0.51 3.2
0.068
0.044 0.021
0.015 0.77
0.73
0.014
0.009 0.26
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.0870.17 0.02 0.13
050G04 MO-001 SC-501-14
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
14
1
8
7
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 13 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
Fig 12. Package outline SOT108-1 (SO14)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.05
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
99-12-27
03-02-19
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 14 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
Fig 13. Package outline SOT337-1 (SSOP14)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.25 0.38
0.25 0.20
0.09 6.4
6.0 5.4
5.2 0.65 1.25 0.2
7.9
7.6 1.03
0.63 0.9
0.7 1.4
0.9 8
0
o
o
0.13 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT337-1 99-12-27
03-02-19
(1)
wM
bp
D
HE
E
Z
e
c
vMA
X
A
y
17
14 8
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
MO-150
pin 1 index
0 2.5 5 mm
scale
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
A
max.
2
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 15 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
Fig 14. Package outline SOT402-1 (TSSOP14)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.72
0.38 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1 MO-153 99-12-27
03-02-18
wM
bp
D
Z
e
0.25
17
14 8
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
A
max.
1.1
pin 1 index
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 16 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
Fig 15. Package outline SOT762-1 (DHVQFN14)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.1
2.9
Dh
1.65
1.35
y1
2.6
2.4 1.15
0.85
e1
2
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT762-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT762-1
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
26
13 9
8
7
1
14
X
D
E
C
BA
02-10-17
03-01-27
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 17 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
12. Abbreviations
13. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
LSTTL Low-power Schottky Transistor-Transistor Logic
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT164 v.6 20111212 Product data sheet - 74HC_HCT 164 v.5
Modifications: Legal pages updated.
74HC_HCT164 v.5 20101125 Product data sheet - 74HC_HCT164 v.4
74HC_HCT164 v.4 20100202 Product data sheet - 74HC_HCT164 v.3
74HC_HCT164 v.3 20050404 Product data sheet - 74HC_HCT164_ CNV v.2
74HC_HCT164_CNV v.2 19901201 Product specification - -
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 18 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device (s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ionThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be lia ble for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulat ive liability t owards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or cust omer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
74HC_HCT164 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 12 December 2011 19 of 20
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equ ipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting f rom customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
14.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors 74HC164; 74HCT164
8-bit serial-in, parallel-out shift register
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 December 2011
Document identifier: 74HC_HCT164
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Recommended operating conditions. . . . . . . . 5
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
12 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 17
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
14.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
14.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
15 Contact information. . . . . . . . . . . . . . . . . . . . . 19
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20