© Semiconductor Components Industries, LLC, 2008
November, 2008 Rev. 8
1Publication Order Number:
MC10EP17/D
MC10EP17, MC100EP17
3.3V / 5V ECL Quad
Differential Driver/Receiver
Description
The MC10/100EP17 is a 4-bit differential line receiver based on the
EP17 device. The >3.0 GHz maximum frequency provided by the
high frequency outputs makes the device ideal for buffering of very
high speed oscillators.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
The design incorporates two stages of gain, internal to the device,
making it an excellent choice for use in high bandwidth amplifier
applications.
Inputs of unused gates can be left open and will not affect the
operation of the rest of the device. All VCC and VEE pins must be
externally connected to power supply to guarantee proper operation.
The 100 Series contains temperature compensation.
Features
220 ps Typical Propagation Delay
Maximum Frequency >3.0 GHz Typical
PECL Mode Operating Range: VCC = 3.0 V to 5.5 V
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V
with VEE = 3.0 V to 5.5 V
Open Input Default State
Safety Clamp on Inputs
Q Output Will Default LOW with Inputs Open or at VEE
VBB Output
PbFree Packages are Available*
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
TSSOP20
DT SUFFIX
CASE 948E
MARKING
DIAGRAMS*
XXX = 10 or 100
A = Assembly Location
L, = Assembly Lot
WL = Wafer Lot
Y, YY = Year
W, WW = Work Week
G or G= PbFree Package
SO20
DW SUFFIX
CASE 751D
1
20
1
20
MCXXXEP17
AWLYYWWG
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*For additional marking information, refer to
Application Note AND8002/D.
(Note: Microdot may be in either loca-
tion)
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
XXXX
EP17
ALYWG
G
1
20
QFN20
MN SUFFIX
CASE 485E
MCXXX
EP17
ALYWG
G
1
20
MC10EP17, MC100EP17
http://onsemi.com
2
D1
Figure 1. 20Lead Pinout (Top View) and Logic Diagram
D1 D2 D3
1718 16 15 14 13 12
43 56789
Q0
11
10
Q1 Q1 Q2 Q2 Q3 Q3 VEE
D0
1920
21
VCC Q0
D0 D2VCC D3 VBB
PIN
D[0:3]*, D[0:3]*
Q[0:3], Q[0:3] ECL Differential Data Outputs
FUNCTION
ECL Differential Data Inputs
VBB
VCC Positive Supply
Reference Voltage Output
VEE Negative Supply
Table 1. PIN DESCRIPTION
* Pins will default LOW when left open.
EP Exposed Pad
1
2
3
4
5
15
14
13
12
11
678910
20 19 18 17 16
Figure 1. QFN20 Pinout (Top View)
Q0
Q1
Q1
VCC Q0VCC
Q2
Q2
Q3
Q3
VEE
D1
D1
D2
D0
D0
D2
D3 D3 VBB
Exposed Pad
NOTE: The Exposed Pad (EP) on package bottom must be attached to a heatsinking conduit.
The Exposed Pad may only be electrically connected to VEE.
MC10/100EP17
Table 2. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor 75 kW
Internal Input Pullup Resistor N/A
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 100 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg PbFree Pkg
SOIC20
TSSOP20
QFN20
Level 1
Level 1
N/A
Level 3
Level 3
Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 259 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
MC10EP17, MC100EP17
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3
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
VCC PECL Mode Power Supply VEE = 0 V 6 V
VEE NECL Mode Power Supply VCC = 0 V 6 V
VIPECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6
6
V
V
Iout Output Current Continuous
Surge
50
100
mA
mA
IBB VBB Sink/Source ± 0.5 mA
TAOperating Temperature Range 40 to +85 °C
Tstg Storage Temperature Range 65 to +150 °C
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
20 TSSOP
20 TSSOP
140
100
°C/W
°C/W
qJC Thermal Resistance (JunctiontoCase) Standard Board 20 TSSOP 23 to 41 °C/W
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
20 SOIC
20 SOIC
90
60
°C/W
°C/W
qJC Thermal Resistance (JunctiontoCase) Standard Board 20 SOIC 30 to 35 °C/W
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
QFN20
QFN20
47
33
°C/W
°C/W
qJC Thermal Resistance (JunctiontoCase) Standard Board QFN20 18 °C/W
Tsol Wave Solder Pb
PbFree
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 4. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 42 50 65 44 52 66 46 54 68 mA
VOH Output HIGH Voltage (Note 3) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV
VOL Output LOW Voltage (Note 3) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV
VIH Input HIGH Voltage (SingleEnded) 2090 2415 2155 2480 2215 2540 mV
VIL Input LOW Voltage (SingleEnded) 365 1690 1430 1755 1490 1815 mV
VBB Output Voltage Reference 1790 1890 1990 1855 1955 2055 1915 2015 2115 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential) (Note 4)
2.0 3.3 2.0 3.3 2.0 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to 2.2 V.
3. All loading with 50 W to VCC 2.0 V.
4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP17, MC100EP17
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4
Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 5)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 42 50 65 44 52 66 46 54 68 mA
VOH Output HIGH Voltage (Note 6) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mV
VOL Output LOW Voltage (Note 6) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV
VIH Input HIGH Voltage (SingleEnded) 3790 4115 3855 4180 3915 4240 mV
VIL Input LOW Voltage (SingleEnded) 3065 3390 3130 3455 3190 3515 mV
VBB Output Voltage Reference 3490 3590 3690 3555 3655 3755 3615 3715 3815 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential) (Note 7)
2.0 5.0 2.0 5.0 2.0 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to 0.5 V.
6. All loading with 50 W to VCC 2.0 V.
7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 6. 10EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = 5.5 V to 3.0 V (Note 8)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 42 50 65 44 52 66 46 54 68 mA
VOH Output HIGH Voltage (Note 9) 1135 1010 885 1070 945 820 1010 885 760 mV
VOL Output LOW Voltage (Note 9) 1935 1810 1685 1870 1745 1620 1810 1685 1560 mV
VIH Input HIGH Voltage (SingleEnded) 1210 885 1145 820 1085 760 mV
VIL Input LOW Voltage (SingleEnded) 1935 1610 1870 1545 1810 1485 mV
VBB Output Voltage Reference 1510 1410 1310 1445 1345 1245 1385 1285 1185 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential) (Note 10)
VEE + 2.0 0.0 VEE + 2.0 0.0 VEE + 2.0 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Input and output parameters vary 1:1 with VCC.
9. All loading with 50 W to VCC 2.0 V.
10.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP17, MC100EP17
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5
Table 7. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 11)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 47 55 63 50 58 66 54 62 70 mA
VOH Output HIGH Voltage (Note 12) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV
VOL Output LOW Voltage (Note 12) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV
VIH Input HIGH Voltage (SingleEnded) 2075 2420 2075 2420 2075 2420 mV
VIL Input LOW Voltage (SingleEnded) 1355 1675 1355 1675 1355 1675 mV
VBB Output Voltage Reference 1775 1875 1975 1775 1875 1975 1775 1875 1975 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential) (Note 13)
2.0 3.3 2.0 3.3 2.0 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to 2.2 V.
12.All loading with 50 W to VCC 2.0 V.
13.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 8. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 14)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 47 55 63 50 58 66 54 62 70 mA
VOH Output HIGH Voltage (Note 15) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV
VOL Output LOW Voltage (Note 15) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV
VIH Input HIGH Voltage (SingleEnded) 3775 4120 3775 4120 3775 4120 mV
VIL Input LOW Voltage (SingleEnded) 3055 3375 3055 3375 3055 3375 mV
VBB Output Voltage Reference 3475 3575 3675 3475 3575 3675 3475 3575 3675 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential) (Note 16)
2.0 5.0 2.0 5.0 2.0 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
14.Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to 0.5 V.
15.All loading with 50 W to VCC 2.0 V.
16.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP17, MC100EP17
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6
Table 9. 100EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = 5.5 V to 3.0 V (Note 17)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 47 55 63 50 58 66 54 62 70 mA
VOH Output HIGH Voltage (Note 18) 1145 1020 895 1145 1020 895 1145 1020 895 mV
VOL Output LOW Voltage (Note 18) 1945 1820 1695 1945 1820 1695 1945 1820 1695 mV
VIH Input HIGH Voltage (SingleEnded) 1225 880 1225 880 1225 880 mV
VIL Input LOW Voltage (SingleEnded) 1945 1625 1945 1625 1945 1625 mV
VBB Output Voltage Reference 1525 1425 1325 1525 1425 1325 1525 1425 1325 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential) (Note 19)
VEE + 2.0 0.0 VEE + 2.0 0.0 VEE + 2.0 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.5 0.5 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
17.Input and output parameters vary 1:1 with VCC.
18.All loading with 50 W to VCC 2.0 V.
19.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 10. AC CHARACTERISTICS VCC = 0 V; VEE = 3.0 V to 5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 20)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
fmax Maximum Frequency (Figure 2) > 3 > 3 > 3 GHz
tPLH,
tPHL
Propagation Delay to Output Differential
10 Series
100 Series
125
150
200
220
275
300
150
180
220
250
300
320
200
200
260
290
350
360
ps
tJITTER CLOCK Random Jitter (RMS)
@ v 1.0 GHz
@ v 1.5 GHz
@ v 2.0 GHz
@ v 2.5 GHz
@ v 3.0 GHz
0.132
0.143
0.148
0.129
0.129
0.2
0.3
0.3
0.3
0.3
0.147
0.159
0.146
0.131
0.142
0.2
0.3
0.3
0.3
0.3
0.154
0.156
0.169
0.147
0.168
0.3
0.3
0.3
0.3
0.3
ps
VPP Input Voltage Swing
(Differential Configuration)
150 800 1200 150 800 1200 150 800 1200 mV
tr
tf
Output Rise/Fall Times Q, Q
(20% 80%)
100 160 220 100 170 230 120 190 250 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
20.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC 2.0 V.
MC10EP17, MC100EP17
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7
0
100
200
300
400
500
600
700
800
0 1000 2000 3000 4000 5000 6000
Figure 2. Fmax/Jitter
FREQUENCY (MHz)
1
2
3
4
5
6
7
8
(JITTER)
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
VOUTpp (mV)
JITTEROUT ps (RMS)
ÉÉ
ÉÉ
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Zo = 50 W
Zo = 50 W
50 W50 W
VTT
VTT = VCC 2.0 V
MC10EP17, MC100EP17
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8
ORDERING INFORMATION
Device Package Shipping
MC10EP17DT TSSOP20 75 Units / Rail
MC10EP17DTG TSSOP20
(PbFree)
75 Units / Rail
MC10EP17DTR2 TSSOP20 2500 / Tape & Reel
MC10EP17DTR2G TSSOP20
(PbFree)
2500 / Tape & Reel
MC10EP17DW SOIC20 38 Units / Rail
MC10EP17DWG SOIC20
(PbFree)
38 Units / Rail
MC10EP17DWR2 SOIC20 1000 / Tape & Reel
MC10EP17DWR2G SOIC20
(PbFree)
1000 / Tape & Reel
MC10EP17MNG QFN20
(PbFree)
92 Units / Rail
MC10EP17MNTXG QFN20
(PbFree)
3000 / Tape & Reel
MC100EP17DT TSSOP20 75 Units / Rail
MC100EP17DTG TSSOP20
(PbFree)
75 Units / Rail
MC100EP17DTR2 TSSOP20 2500 / Tape & Reel
MC100EP17DTR2G TSSOP20
(PbFree)
2500 / Tape & Reel
MC100EP17DW SOIC20 38 Units / Rail
MC100EP17DWG SOIC20
(PbFree)
38 Units / Rail
MC100EP17DWR2 SOIC20 1000 / Tape & Reel
MC100EP17DWR2G SOIC20
(PbFree)
1000 / Tape & Reel
MC100EP17MNG QFN20
(PbFree)
92 Units / Rail
MC100EP17MNTXG QFN20
(PbFree)
3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
MC10EP17, MC100EP17
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9
PACKAGE DIMENSIONS
TSSOP20
CASE 948E02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B4.30 4.50 0.169 0.177
C1.20 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.27 0.37 0.011 0.015
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
110
1120
PIN 1
IDENT
A
B
T
0.100 (0.004)
C
DGH
SECTION NN
K
K1
JJ1
N
N
M
F
W
SEATING
PLANE
V
U
S
U
M
0.10 (0.004) V S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36 16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC10EP17, MC100EP17
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10
PACKAGE DIMENSIONS
20
1
11
10
B20X
H10X
C
L
18X A1
A
SEATING
PLANE
q
hX 45_
E
D
M
0.25 M
B
M
0.25 S
AS
B
T
eT
B
A
DIM MIN MAX
MILLIMETERS
A2.35 2.65
A1 0.10 0.25
B0.35 0.49
C0.23 0.32
D12.65 12.95
E7.40 7.60
e1.27 BSC
H10.05 10.55
h0.25 0.75
L0.50 0.90
q0 7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
__
SO20 WB
CASE 751D05
ISSUE G
MC10EP17, MC100EP17
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11
PACKAGE DIMENSIONS
X
M
0.10 (0.004) T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.00 BSC 0.157 BSC
B4.00 BSC 0.157 BSC
C0.80 1.00 0.031 0.039
D0.23 0.35 0.009 0.014
G0.50 BSC 0.020 BSC
H1.38 1.43 0.054 0.056
J0.20 REF 0.008 REF
K0.00 0.05 0.000 0.002
L0.35 0.45 0.014 0.018
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION D APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
T
X
NOTE 3
SEATING
PLANE
L
A
M
Y
B
N
0.25 (0.010) T
0.25 (0.010) T
J
C
K
R
0.08 (0.003) T
E
H
F
P
D
Y
1
5
6
15
11
20 16
E2.75 2.85 0.108 0.112
F2.75 2.85 0.108 0.112
M2.00 BSC 0.079 BSC
N2.00 BSC 0.079 BSC
P1.38 1.43 0.054 0.056
R0.60 0.80 0.024 0.031
G
10
QFN20
CASE 485E01
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