LCC110 1-Form-C OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC Featurges * * * * * * * * * * * 3750Vrms Input/Output Isolation 1-Form-C Solid State Relay Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-pin Packages Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Versions Available Description LCC110P is a 350V, 120mA, 35 1-Form-C relay. This device is ideal for applications where a signal needs to be switched between two different lines. The small 8-lead package makes it an ideal space-saving replacement for a 1-Form-C electromechanical relay (EMR). Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # LCC110 Description 8-Pin DIP (50/Tube) LCC110P 8-Pin Flatpack (50/Tube) Applications LCC110PTR 8-Pin Flatpack Tape & Reel (1000/Reel) * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security * Aerospace * Industrial Controls LCC110S 8-Pin Surface Mount (50/Tube) LCC110STR 8-Pin Surfact Mount Tape & Reel (1000/Reel) Pin Configuration Do Not Use + Control - Control Do Not Use AC/DC Configuration 1 8 2 7 3 6 4 5 Normally Closed Pole Normally Open Pole Switching Characteristics for a 1-Form-C Device IF 90% 10% Form-A ILOAD t on Form-B ILOAD t off 90% 10% t off DS-LCC110-R07 www.ixysic.com t on 1 INTEGRATED CIRCUITS DIVISION LCC110 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operating Temperature Storage Temperature 1 2 Min 3750 -40 -40 Max 350 5 50 1 150 800 +85 +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Unit VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33mW / C. Derate linearly 6.67mW / C. Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous, AC/DC Configuration Peak On-Resistance, AC/DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output Conditions Symbol Min Typ Max Units t=10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 23 - 120 350 35 1 mArms / mADC mAP VL=50V, f=1MHz ton toff COUT - 25 4 4 - IL=120mA IF=10mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.35 - 8 1.56 10 mA mA V A - CI/O - 3 - pF IF=8mA, VL=10V A ms pF Note: If both poles operate simultaneously, then load current must be derated in order not to exceed package power dissipation value. 2 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LCC110 COMMON PERFORMANCE DATA* Typical LED Forward Voltage Drop vs. Temperature Typical LED Forward Voltage Drop (N=50) Device Count (N) 30 25 20 15 10 5 0 1.17 1.8 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) -20 0 20 40 60 80 Temperature (C) 100 120 Leakage (PA) LED Forward Voltage Drop (V) 35 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 0.020 0.018 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s FORM-A RELAY PERFORMANCE DATA* Form-A Typical Turn-On Time (N=50, IF=8mA, IL=120mADC) 25 15 10 5 0 15 10 5 5.2 20 25 15 10 5 0.14 0.23 0.32 0.41 Turn-Off Time (ms) 1.2 2.0 2.8 3.6 4.4 LED Current (mA) 5.2 15 10 0.50 19.5 20.5 21.5 22.5 23.5 24.5 On-Resistance (:) 25.5 Form-A Typical Blocking Voltage Distribution (N=50) Form-A Typical IF for Switch Dropout (N=50, IL=120mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0 20 0 0.05 Form-A Typical IF for Switch Operation (N=50, IL=120mADC) 25 5 Device Count (N) 2.8 3.6 4.4 Turn-On Time (ms) Device Count (N) Device Count (N) 2.0 Form-A Typical On-Resistance Distribution (N=50, IF=8mA, IL=120mADC) 30 20 0 1.2 25 35 Device Count (N) 20 Device Count (N) Device Count (N) 25 Form-A Typical Turn-Off Time (N=50, IF=8mA, IL=120mADC) 0 1.2 2.0 2.8 3.6 4.4 LED Current (mA) 5.2 400 420 440 460 480 500 Blocking Voltage (VP) 520 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCC110 FORM-A RELAY PERFORMANCE DATA* Form-A Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 1.0 6 0.7 0.6 0.5 0.4 2 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0.25 LED Current (mA) 0.15 0.10 0.05 -20 0 20 40 60 Temperature (C) 80 10 15 20 25 30 35 40 LED Forward Current (mA) 45 4 3 2 50 40 150 35 25 20 15 10 -20 0 20 40 60 Temperature (C) 80 -20 0 20 40 60 Temperature (C) 80 80 100 Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=120mADC) 0.25 0.20 0.15 0.10 50 0 -50 100 -20 0 20 40 60 Temperature (C) 180 160 140 120 100 IF=20mA IF=10mA IF=8mA 80 60 40 -150 -40 100 Form-A Maximum Load Current vs. Temperature Form-A Typical Load Current vs. Load Voltage (IF=8mA) -100 5 80 0.30 0 -40 100 100 Load Current (mA) 30 20 40 60 Temperature (C) 0.05 -40 Form-A Typical On-Resistance vs. Temperature (IF=8mA, IL=120mADC) 0 0.35 5 Load Current (mA) 5 -20 0.40 0 0 0.4 -40 1 0 0.6 100 Form-A Typical IF for Switch Dropout vs. Temperature (IL=120mADC) 6 0.20 0.8 0 -40 Form-A Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 1.0 0.2 Turn-Off Time (ms) 0 Turn-Off Time (ms) 3 0 0.2 On-Resistance (:) 4 1 0.3 IF=8mA IF=10mA IF=20mA 1.2 Turn-On Time (ms) 0.8 Form-A Typical Turn-On Time vs. Temperature (IL=120mADC) 1.4 5 LED Current (mA) Turn-On Time (ms) 0.9 0 Form-A Typical IF for Switch Operation vs. Temperature (IL=120mADC) -3 -2 -1 0 1 Load Voltage (V) 2 3 -40 -20 0 20 40 60 80 Temperature (C) 100 120 Form-A Typical Blocking Voltage vs. Temperature 420 Blocking Voltage (VP) 415 410 405 400 395 390 385 380 375 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LCC110 FORM-B RELAY PERFORMANCE DATA* Form-B Typical Turn-On Time (N=50, IF=8mA, IL=120mADC) 30 30 15 10 15 10 0.07 0.09 0.11 Turn-On Time (ms) 0.13 Form-B Typical IF for Switch Operation (N=50, IL=120mADC) 30 25 Device Count (N) 25 20 15 10 5 0.28 0.35 0.42 0.49 Turn-Off Time (ms) 1.2 2.0 4.4 2.8 3.6 LED Current (mA) 25.5 0.075 10 5 0.072 0.071 2.8 3.6 4.4 LED Current (mA) 365 Form-B Typical IF for Switch Operation vs. Temperature (IL=120mADC) 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 4 3 2 -40 50 Form-B Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.40 -20 0 20 40 60 Temperature (C) 80 LED Current (mA) 0.30 0.25 0.20 Turn-Off Time (ms) 5 0.35 4 3 2 1 0.15 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 -40 -20 0 20 40 60 Temperature (C) 80 100 385 395 405 415 Blocking Voltage (VP) 425 Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) 0.20 0.15 0.10 0.05 0 -40 100 Form-B Typical IF for Switch Dropout vs. Temperature (IL=120mADC) 6 375 0.25 0 0 10 5.2 1 0.070 15 0 2.0 Turn-On Time (ms) LED Current (mA) 0.073 20 5 5 0.074 31.5 30 15 6 27.5 28.5 29.5 30.5 On-Resistance (:) 25 1.2 Form-B Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 26.5 Form-B Typical Blocking Voltage Distribution (N=50) Form-B Typical IF for Switch Dropout (N=50, IL=120mADC) 20 5.2 10 0.56 0 0 15 0 0.21 Device Count (N) 0.05 20 5 0 0.03 Device Count (N) 20 5 0 Form-B Typical On-Resistance Distribution (N=50, IF=8mA, IL=120mADC) 25 Device Count (N) 20 5 Turn-On Time (ms) 30 25 Device Count (N) Device Count (N) 25 Turn-Off Time (ms) Form-B Typical Turn-Off Time (N=50, IF=8mA, IL=120mADC) -20 0 20 40 60 Temperature (C) 80 100 80 100 Form-B Typical Turn-Off Time vs. Temperature (IL=120mADC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 IF=8mA IF=10mA IF=20mA -40 -20 0 20 40 60 Temperature (C) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCC110 FORM-B RELAY PERFORMANCE DATA* Form-B Typical On-Resistance vs. Temperature (IF=8mA, IL=120mADC) 150 40 30 20 10 160 100 50 0 -50 -100 0 -20 0 20 40 60 Temperature (C) 80 100 140 120 100 80 60 40 -150 -40 Form-B Maximum Load Current vs. Temperature (IF=8mA) 180 Load Current (mA) 50 Load Current (mA) On-Resistance (:) 60 Form-B Typical Load Current vs. Load Voltage (IF=8mA) -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 80 100 -40 -20 0 20 40 60 80 Temperature (C) 100 120 Form-B Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) 420 415 410 405 400 395 390 385 380 -40 -20 0 20 40 60 Temperature (C) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 6 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LCC110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LCC110 / LCC110S / LCC110P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles LCC110 LCC110S LCC110P 250C 250C 260C 30 seconds 30 seconds 30 seconds 1 3 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R07 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LCC110 Mechanical Dimensions LCC110 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 3.302 0.051 (0.130 0.002) 0.457 0.076 (0.018 0.003) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) LCC110S 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) LCC110P 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 0.127 (0.370 0.005) Pin 1 9.652 0.381 (0.380 0.015) 7.620 0.254 (0.300 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 0.127 (0.025 0.005) 0.203 0.013 (0.008 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 0.025 (0.085 0.001) 0.457 0.076 (0.018 0.003) 0.864 0.120 (0.034 0.004) 8 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION LCC110 LCC110STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 LCC110PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 9 Specification: DS-LCC110-R07 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 8/10/2018