Notes:
(1) Measured at 1.0MHz and applied reverse voltage of 4.0 VDC
(2) Thermal resistance from junction to ambient on P.C. Board Mounted
Characteristic Symbols DF005 DF01 DF02 DF04 DF06 DF08 DF10 Units
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 Volts
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts
Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 Volts
Maximum average forward rectified current
at TA=40 I(AV) 1.0 Amp
Peak forward surge current
8.3mS single half sine-wave superimposed
on rated load
IFSM 50.0 Amps
Maximum forward voltage at
forward current perelement 1.0A VF1.1 Volts
I2t-rating for fusion (t<8.3mS) I2t10.0A
2
S
Maximum DC reverse current TA=25
at rated DC blocking voltage TA=125 IR
10.0
500.0 A
Typical junction capacitance (Note 1) CJ25.0 F
Typical thermal resistance (Note 2) R JA 40.0 /W
Operating temperature range TJ-55 to +125
Storage temperature range TSTG -55 to +150
Features
Mechanical Data
DF005 THRU DF10
GLASS PASSIVATED CHIP SINGLE-PHASE BRIDGE RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 1.0 Ampere
Ideal for printed circuit board
Glass passivated chip junction
High temperature soldering guaranteed:
260 /10 seconds at 5 lbs tension
Terminals: Plated leads, solderable per
MIL-STD-202, method 208
Case: Molded with UL-94Class V-0 recognized
flame retartant epoxy
Polarity: Polarity symbol marked on body
Mounting Position: Any
Maximum Ratings and Electrical Characteristics
1
Single-phase, half-wave, 60Hz, resistive or inductive load.
Ratings at 25 unless otherwise stated.
For capacitive load, Derate current by 20%.
RATINGS AND CHARACTERISTIC CURVES
