TO -2 20F NXPS20H100CX Dual power Schottky diode Rev. 2 -- 24 May 2012 Product data sheet 1. Product profile 1.1 General description Dual common cathode power Schottky diode designed for high frequency switched mode power supplies in a SOT186A (TO-220F) "full pack" plastic package. 1.2 Features and benefits High junction temperature capability Negligible switching losses Isolated package Optimised design to give low VF and high Tj(max) Low leakage current 1.3 Applications DC to DC converters OR-ing diode Freewheeling diode Switched mode power supply rectifier 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VRRM repetitive peak reverse voltage IF(AV) average forward current IO(AV) average output current Tj junction temperature Conditions Min Typ Max Unit - - 100 V square-wave pulse; = 0.5 ; Th 147 C; per diode; see Figure 1; see Figure 2; see Figure 3 - - 10 A square-wave pulse; = 0.5 ; Th 128 C; both diodes conducting - - 20 A - - 175 C IF = 10 A; Tj = 25 C; see Figure 6 - - 0.77 V IF = 10 A; Tj = 125 C; see Figure 6 - 0.59 0.64 V VR = 100 V; Tj = 25 C; see Figure 7 - 2 4.5 A VR = 100 V; Tj = 125 C; see Figure 7 - 1 6 mA Static characteristics VF IR forward voltage reverse current NXPS20H100CX NXP Semiconductors Dual power Schottky diode 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 A1 anode 1 2 K cathode 3 A2 anode 2 mb n.c. mb; isolated Simplified outline Graphic symbol mb A1 A2 K sym125 1 2 3 SOT186A (TO-220F) 3. Ordering information Table 3. Ordering information Type number Package NXPS20H100CX Name Description Version TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 "full pack" SOT186A 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit VRRM repetitive peak reverse voltage - 100 V IF(AV) average forward current square-wave pulse; = 0.5 ; Th 147 C; per diode; see Figure 1; see Figure 2; see Figure 3 - 10 A IO(AV) average output current square-wave pulse; = 0.5 ; Th 128 C; both diodes conducting - 20 A IFSM non-repetitive peak forward current sine-wave pulse; tp = 10 ms; Tj(init) = 25 C; see Figure 4 - 250 A Tstg storage temperature -65 175 C Tj junction temperature - 175 C NXPS20H100CX Product data sheet Conditions All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 2 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode 003aaj311 10 Ptot (W) Ptot (W) 8 1.9 2.2 2.8 6 0.2 4.0 4 0.1 4 2 2 Fig 1. a = 1.57 6 0.5 0 003aaj312 8 =1 0 4 8 12 IF(AV) (A) Forward power dissipation as a function of average forward current; square waveform; per diode; maximum values 003aaj314 12 0 16 Fig 2. 0 2 4 6 8 10 IF(AV) (A) Forward power dissipation as a function of average forward current; sinusoidal waveform; per diode; maximum values 003aaj315 104 147 C IFSM (A) IF(AV) (A) 8 103 4 102 P tp 0 -50 Fig 3. 0 50 100 150 200 Th (C) Average forward current as a function of heatsink temperature; per diode; maximum values NXPS20H100CX Product data sheet 10 10-5 Fig 4. 10-4 10-3 tp (s) t 10-2 Non-repetitive peak forward current as a function of pulse width; square waveform; per diode; maximum values All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 3 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Rth(j-h) thermal resistance from junction to with heatsink compound; per diode; heatsink see Figure 5 with heatsink compound; both diodes conducting Rth(j-a) thermal resistance from junction to in free air ambient Min Typ Max Unit - - 4 K/W - - 3.2 K/W - 55 - K/W 003aaj317 10 Zth(j-h) (K/W) 1 10-1 P = 10-2 tp 10-3 10-6 Fig 5. 10-5 10-4 10-3 10-2 10-1 tp T t T 1 10 tp (s) Transient thermal impedance from junction to heatsink as a function of pulse width; per diode 6. Isolation characteristics Table 6. Isolation characteristics Symbol Parameter Conditions Min Typ Max Unit Visol(RMS) RMS isolation voltage 50 Hz < f < 60 Hz; sinusoidal waveform ; RH 65 %; clean and dust free; from all terminals to external heatsink - - 2500 V Cisol isolation capacitance from cathode to external heatsink ; f = 1 MHz - 10 - pF NXPS20H100CX Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 4 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode 7. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit IF = 8 A; Tj = 25 C; see Figure 6 - - 0.71 V IF = 10 A; Tj = 25 C; see Figure 6 - - 0.77 V IF = 16 A; Tj = 25 C; see Figure 6 - - 0.81 V IF = 20 A; Tj = 25 C; see Figure 6 - - 0.88 V IF = 8 A; Tj = 125 C; see Figure 6 - 0.56 0.58 V IF = 10 A; Tj = 125 C; see Figure 6 - 0.59 0.64 V IF = 16 A; Tj = 125 C; see Figure 6 - 0.65 0.68 V IF = 20 A; Tj = 125 C; see Figure 6 - 0.67 0.73 V VR = 100 V; Tj = 25 C; see Figure 7 - 2 4.5 A VR = 100 V; Tj = 125 C; see Figure 7 - 1 6 mA f = 1 MHz; VR = 10 V; Tj = 25 C; see Figure 8 - 250 - pF Static characteristics forward voltage VF reverse current IR Dynamic characteristics diode capacitance Cd 003aaj319 20 003aaj318 104 IR (uA) 103 IF (A) 16 (4) (3) (2) 102 12 (1) (2) 10 (3) 8 1 4 0 Fig 6. (1) 10-1 0 0.2 0.4 0.6 0.8 VF (V) 10-2 1 Forward current as a function of forward voltage; per diode NXPS20H100CX Product data sheet Fig 7. 0 20 40 60 80 VR (V) 100 Reverse leakage current as a function of reverse voltage; per diode; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 5 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode 003aaj349 1000 C (pF) 100 Fig 8. 1 10 VR (V) 100 Junction capacitance as a function of applied reverse voltage; per diode; typical values NXPS20H100CX Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 6 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode 8. Package outline Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 'full pack' SOT186A E A A1 P q D1 mounting base T D j L2 L1 K Q b1 L b2 1 2 3 b c w M e e1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) UNIT A A1 b b1 b2 c D D1 E e e1 j K mm 4.6 4.0 2.9 2.5 0.9 0.7 1.1 0.9 1.4 1.0 0.7 0.4 15.8 15.2 6.5 6.3 10.3 9.7 2.54 5.08 2.7 1.7 0.6 0.4 L L1 14.4 3.30 13.5 2.79 L2 max. P Q q 3 3.2 3.0 2.6 2.3 3.0 2.6 (2) T 2.5 w 0.4 Notes 1. Terminal dimensions within this zone are uncontrolled. 2. Both recesses are 2.5 x 0.8 max. depth OUTLINE VERSION SOT186A Fig 9. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-04-09 06-02-14 3-lead TO-220F Package outline SOT186A (TO-220F) NXPS20H100CX Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 7 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode 9. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes NXPS20H100CX v.2 20120524 Product data sheet - NXPS20H100CX v.1 - - Modifications: NXPS20H100CX v.1 NXPS20H100CX Product data sheet * * Status changed from preliminary to product. Various changes to content. 20120420 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 8 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode 10. Legal information 10.1 Data sheet status Document status[1] [2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 10.2 Definitions Preview -- The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 9 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published athttp://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G reenChip,HiPerSmart,HITAG,IC-bus logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE Ultralight,MoReUse,QLPAK,Silicon Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia andUCODE -- are trademarks of NXP B.V. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the HD Radio andHD Radio logo -- are trademarks of iBiquity Digital Corporation. 11. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com NXPS20H100CX Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 -- 24 May 2012 (c) NXP B.V. 2012. All rights reserved. 10 of 11 NXPS20H100CX NXP Semiconductors Dual power Schottky diode 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Isolation characteristics . . . . . . . . . . . . . . . . . . .4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Contact information. . . . . . . . . . . . . . . . . . . . . .10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 May 2012 Document identifier: NXPS20H100CX Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: NXP: NXPS20H100CX,127