Anti-Sulfurated Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
R
2
J
3
S
4
0
5
6
6
F
7
1
8
0
9
0
10
2
11
V
12
Thick Film
Chip Resistors
Product Code Size, Power Rating
Type: inches
S02 : 0402
S03 : 0603
S06 : 0805
S08 : 1206
S14 : 1210
S12 : 1812
S1D : 2010
S1T : 2512
0.063 W
0.1 W
0.125 W
0.25 W
0.25 W
0.5 W
0.5 W
1W
Power R.
Resistance Tolerance
Code
F
J
0
Tolerance
±1%
±5%
Jumper
The first two or three digits are significant figures of resistance
and the third or 4th one denotes number of zeros following.
Jumper is expressed by R00.
Example: 100210 k
Resistance Value
Packaging Methods
Code Packaging Type
Punched Carrier Taping
2mmpitch
Punched Carrier Taping
4mmpitch
Embossed Carrier Taping
4mmpitch
ERJS02
ERJS03
ERJS06
ERJS08
ERJS14
ERJS12
ERJS1D
ERJS1T
X
V
U
Anti-Sulfurated Thick Film Chip Resistors
0402, 0603, 0805, 1206, 1210,
1812, 2010, 2512
Type: ERJ S02, S03, S06, S08, S14
S12, S1D, S1T
Features
Special construction to avoid open failure due to the presence of sulfur
High reliability
Metal glaze thick fi lm resistive element and three layers of electrodes
Suitable for both refl ow and fl ow soldering
Reference Standard
IEC 60115-8, JIS C5201-8
Explanation of Part Numbers
Mar. 2008
Anti-Sulfurated Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
a
b
t
W
L
–40 –20 0 20 40 60 80 100 120 140 160
0180–60
70 °C
Ambient Temperature (°C)
20
40
60
80
100
Rated Load (%)
–55 °C
155 °C
Construction Dimensions in mm (not to scale)
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the fi gure below.
<For Jumper>
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ҂ Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ҂ Power Rating or max. Overload Voltage listed
above whichever less.
Type
(inches)
Rated Current
(A)
Maximum Overload Current
(A)
ERJS02
(0402) 12
ERJS03
(0603)
ERJS06
(0805)
24
ERJS08
(1206)
ERJS14
(1210)
ERJS12
(1812)
ERJS1D
(2012)
ERJS1T
(2512)
Ratings
<For Resistor>
Type
(inches)
PowerRating
at 70 °C
(W)
Limiting Element
Voltage (Maximum
RCWV)
(1) (V)
Maximum Over-
load Voltage
(2)
(V)
Resistance
Tolerance
(%)
Resistance
Range
()
T.C.R.
[
҂
10-6C
(ppm/°C)]
Category Temperature
Range (Operating
Temperature Range)
(°C)
ERJS02
(0402) 0.063 50 100 ±1 10 to 1 M (E24, E96) ±200 -55 to +155
±5 1 to 3.3 M (E24)
ERJS03
(0603) 0.1 50 100 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155
±5 1 to 10 M (E24)
ERJS06
(0805) 0.125 150 200 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155
±5 1 to 10 M (E24)
ERJS08
(1206) 0.25 200 400 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155
±5 1 to 10 M (E24)
ERJS14
(1210) 0.25 200 400 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155
±5 1 to 10 M (E24)
ERJS12
(1812) 0.5 200 400 ±1 10 to 1 M (E24, E96) ±100 - 55 to +155
±5 1 to 10 M (E24)
ERJS1D
(2010) 0.5 200 400 ±1 10 to 1 M (E24, E96) ±10 0 - 55 to +155
±5 1 to 10 M (E24)
ERJS1T
(2512) 1.0 200 400 ±1 10 to 1 M (E24, E96) ±10 0 - 55 to +155
±5 1 to 10 M (E24)
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWa b t
ERJS02(0402)
1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.10 0.35±0.05 0.8
ERJS03(0603)
1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2
ERJS06(0805)
2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4
ERJS08(1206)
3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10
ERJS14(1210)
3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16
ERJS12(1812)
4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27
ERJS1D(2010)
5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27
ERJS1T(2512)
6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45
Thick fi lm
resistive element
Electrode (Inner)
Electrode (Outer)
Electrode
(Between)
Alumina substrate
Protective coating
–0.05
–0.15
–0.20
Mar. 2008
Anti-Sulfurated Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor
c
a
b
φB
W
T
φA
φC
TTA
P0
P2
P1
P1
φD0
B
F
W
E
φD1(Only Emboss)
(2 mm pitch)
Carrier Tape
Packaging Methods (Taping)
Standard Quantity
Type
(inches)
Dimensions (mm)
abc
ERJS02(0402)
0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERJS03(0603)
0.7 to 0.9 2 to 2.2 0.8 to 1
ERJS06(0805)
1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJS08(1206)
2 to 2.4 4.4 to 5 1.2 to 1.8
ERJS14(1210)
2 to 2.4 4.4 to 5 1.8 to 2.8
ERJS12(1812)
3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
ERJS1D(2010)
3.6 to 4 6.2 to 7 1.8 to 2.8
ERJS1T(2512)
5 to 5.4 7.6 to 8.6 2.3 to 3.5
Punched Carrier Embossed Carrier
(Unit : mm)
Type Kind of Taping Pitch (P1) Quantity
ERJS02
Punched Carrier Taping
2 mm 10000 pcs./reel
ERJS03
4 mm 5000 pcs./reel
ERJS06
ERJS08
ERJS14
Embossed Carrier Taping
ERJS12
ERJS1D
ERJS1T 4000 pcs./reel
Taping Reel
Type A B W F E P1P2P0φD0TφD1
ERJS02 0.70±0.05 1.20±0.05
8.00±0.20
3.50±0.05
1.75±0.10
2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.52±0.05
ERJS03 1.10±0.10 1.90±0.10
4.00±0.10
0.70±0.05
ERJS06 1.65±0.15 2.50±0.20 0.84±0.05
ERJS08 2.00±0.15 3.60±0.20
1.00±0.10
ERJS14 2.80±0.20 3.50±0.20 8.00±0.30
1.0+0.10
ERJS12 3.50±0.20 4.80±0.20
12.00±0.30 5.50±0.20
ERJS1D 2.80±0.20 5.30±0.20
1.5 min.
ERJS1T 3.60±0.20 6.90±0.20
−0
Type φAφBφCW T
ERJS02
180.0–3.0 60 min. 13.0±1.0
9.0±1.0 11.4 ±1.0
ERJS03
ERJS06
ERJS08
ERJS14
ERJS12
ERJS1D 13.0±1.0 15.4±2.0
ERJS1T
(Unit : mm)
+0
−0
Recommended Land Pattern
In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Feb. 2006
Anti-Sulfurated Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Preheating
Peak
Heating
Temperature
Time
Recommended Soldering Conditions
Recommendations and precautions are described below.
Recommended soldering conditions for refl ow
Recommended soldering conditions for fl ow
For soldering For lead-free soldering
Temperature Time Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245±5 °C 20 s to 30 s max. 260 °C max. 10 s
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Anti-Sulfurated Thick Film Chip Resistors
(here af ter called the resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avo id exc e ss ive be n d ing of printed circuit boards in order to protect the resistors from abnormal stress.
Feb. 2006
– ER3 –
Safety Precautions
(Common precautions for Fixed Resistors)
When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement
on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without
prior notice.
Do not use the products beyond the specifi cations described in this catalog.
This catalog explains the quality and performance of the products as individual components. Before use, check and
evaluate their operations when installed in your products.
Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating applianc es,
combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
These products are designed and manufactured for general and standard use in general electronic
equipment (e.g. AV equipment, home electric appliances, offi ce equipment, information and communication
equipment)
These products are not intended for use in the following special conditions. Before using the products, carefully check
the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, NH3, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. S e alin g o r c oating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C
and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, NH3, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006