Nov- 08
KBP204G ........ KBP207G
2.0 Amp. Glass Passivated Bridge Rectifiers
Maximum Ratings and Electrical Characteristics at 25 ºC
V
RRM
Maximum Recurrent Peak Reverse Voltage (V)
Maximum RMS Voltage (V)
I
FSM
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC Method)
V
DC
Maximum DC Blocking Voltage (V)
60 A
V
RMS
T
j
Operating Temperature Range -55 to +150 °C
Current
2.0 A
Voltage
400 V to 1000 V
Typical Thermal Resistance Per Leg
(Note)
I
F(AV)
Maximum Average Forward Rectified
Current @ Tc = 50 °C 2.0 A
25 °C/W
Rth (j-a)
T
stg
Storage Temperature Range -55 to +150 °C
Electrical Characteristics at Tamb = 25 °C
1.2 V
V
F
Maximum Instantaneous Forward Voltage
@ = 3.14 A
I
R
Maximum DC Reverse Current @ TA = 25 °C
at Rated DC Blocking Voltage @ TA =125°C
10.0 µA
500 µA
400
400
280
600
600
420
800
800
560
1000
1000
700
KBP
204G
KBP
205G
KBP
206G
KBP
207G
MECHANICAL DATA
Case: Molded plastic body.
Small size, simple installation
Leads solderable per MIL-STD-202, Method 208
Mounting position: Any
Dimensions in mm.
KBP
Ideal for printed circuit board
Glass passivated chip junction
Reliable low cost
construction technique results in
inexpensive product
High surge current capability
High temperature soldering guaranteed:
260 °C / 10 seconds / 9.5mm, lead lengths.
I2t
Rating for fusing (t<8.3 ms) 15 A2sec
Rth (j-l) 8.0 °C/W
SPACING
.460(11.68)
.420(10.6)
.160(4.1)
.140(3.6)
.050(1.27)
.5
MIN
(12.7)
AC
.035(0.9)
.028(0.7)
.600(15.24)
.560(14.22)
.153(3.9)
.146(3.7)
Notes: Thermal Resistance from Junction to Ambient and from Junction to Lead Mounted on P.C.B.
With 0.4" x 0.4" (10 x 10mm) Copper Pads.