DS90C031
DS90C031 LVDS Quad CMOS Differential Line Driver
Literature Number: SNLS095A
DS90C031
LVDS Quad CMOS Differential Line Driver
General Description
The DS90C031 is a quad CMOS differential line driver de-
signed for applications requiring ultra low power dissipation
and high data rates. The device is designed to support data
rates in excess of 155.5 Mbps (77.7 MHz) utilizing Low Volt-
age Differential Signaling (LVDS) technology.
The DS90C031 accepts TTL/CMOS input levels and trans-
lates them to low voltage (350 mV) differential output sig-
nals. In addition the driver supports a TRI-STATE®function
that may be used to disable the output stage, disabling the
load current, and thus dropping the device to an ultra low idle
power state of 11 mW typical.
The DS90C031 and companion line receiver (DS90C032)
provide a new alternative to high power psuedo-ECLdevices
for high speed point-to-point interface applications.
Features
n>155.5 Mbps (77.7 MHz) switching rates
n±350 mV differential signaling
nUltra low power dissipation
n400 ps maximum differential skew (5V, 25˚C)
n3.5 ns maximum propagation delay
nIndustrial operating temperature range
nMilitary operating temperature range option
nAvailable in surface mount packaging (SOIC) and (LCC)
nPin compatible with DS26C31, MB571 (PECL) and
41LG (PECL)
nCompatible with IEEE 1596.3 SCI LVDS standard
nConforms to ANSI/TIA/EIA-644 LVDS standard
nAvailable to Standard Microcircuit Drawing (SMD)
5962-95833
Connection Diagrams
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Dual-In-Line
DS011946-1
Order Number DS90C031TM
See NS Package Number M16A
LCC Package
DS011946-33
Order Number DS90C031E-QML
See NS Package Number E20A
For Complete Military Specifications,
refer to appropriate SMD or MDS.
June 1998
DS90C031 LVDS Quad CMOS Differential Line Driver
© 2000 National Semiconductor Corporation DS011946 www.national.com
Functional Diagram
DRIVER
Enables Input Outputs
EN EN* D
IN
D
OUT+
D
OUT−
LHXZZ
All other combinations L L H
of ENABLE inputs H H L
DS011946-2
DS90C031
www.national.com 2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +6V
Input Voltage (D
IN
) −0.3V to (V
CC
+ 0.3V)
Enable Input Voltage (EN, EN*) −0.3V to (V
CC
+ 0.3V)
Output Voltage (D
OUT+
,D
OUT−
) −0.3V to (V
CC
+ 0.3V)
Short Circuit Duration
(D
OUT+
,D
OUT−
) Continuous
Maximum Package Power Dissipation @+25˚C
M Package 1068 mW
E Package 1900 mW
Derate M Package 8.5 mW/˚C above +25˚C
Derate E Package 12.8 mW/˚C above +25˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature Range
Soldering (4 sec.) +260˚C
Maximum Junction Temperature
(DS90C031T) +150˚C
Maximum Junction Temperature
(DS90C031E) +175˚C
ESD Rating (Note 7)
(HBM, 1.5 k, 100 pF) 3,500V
(EIAJ, 0 , 200 pF) 250V
Recommended Operating
Conditions
Min Typ Max Units
Supply Voltage (V
CC
) +4.5 +5.0 +5.5 V
Operating Free Air Temperature (T
A
)
DS90C031T −40 +25 +85 ˚C
DS90C031E −55 +25 +125 ˚C
Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 3)
Symbol Parameter Conditions Pin Min Typ Max Units
V
OD1
Differential Output Voltage R
L
= 100(
Figure 1
)D
OUT−
,
D
OUT+
250 345 450 mV
V
OD1
Change in Magnitude of V
OD1
for Complementary Output
States
4 35 |mV|
V
OS
Offset Voltage 1.125 1.25 1.375 V
V
OS
Change in Magnitude of V
OS
for
Complementary Output States 5 25 |mV|
V
OH
Output Voltage High R
L
= 1001.41 1.60 V
V
OL
Output Voltage Low 0.90 1.07 V
V
IH
Input Voltage High D
IN
,
EN,
EN*
2.0 V
CC
V
V
IL
Input Voltage Low GND 0.8 V
I
I
Input Current V
IN
=V
CC
, GND, 2.5V or 0.4V −10 ±1 +10 µA
V
CL
Input Clamp Voltage I
CL
= −18 mA −1.5 −0.8 V
I
OS
Output Short Circuit Current V
OUT
= 0V (Note 8) D
OUT−
,
D
OUT+
−3.5 −5.0 mA
I
OZ
Output TRI-STATE Current EN = 0.8V and EN* = 2.0V,
V
OUT
=0VorV
CC
−10 ±1 +10 µA
I
CC
No Load Supply Current
Drivers Enabled D
IN
=V
CC
or GND DS90C031T V
CC
1.7 3.0 mA
D
IN
= 2.5V or 0.4V 4.0 6.5 mA
I
CCL
Loaded Supply Current
Drivers Enabled R
L
= 100All Channels
V
IN
=V
CC
or GND
(all inputs)
DS90C031T 15.4 21.0 mA
DS90C031E 15.4 25.0 mA
I
CCZ
No Load Supply Current
Drivers Disabled D
IN
=V
CC
or GND
EN = GND, EN* = V
CC
DS90C031T 2.2 4.0 mA
DS90C031E 2.2 10.0 mA
Switching Characteristics
V
CC
= +5.0V, T
A
= +25˚C DS90C031T. (Notes 3, 4, 6, 9)
Symbol Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay High to Low R
L
= 100,C
L
=5pF
(
Figure 2
and
Figure 3
)1.0 2.0 3.0 ns
t
PLHD
Differential Propagation Delay Low to High 1.0 2.1 3.0 ns
t
SKD
Differential Skew |t
PHLD
–t
PLHD
| 0 80 400 ps
t
SK1
Channel-to-Channel Skew (Note 4) 0 300 600 ps
DS90C031
www.national.com3
Switching Characteristics (Continued)
V
CC
= +5.0V, T
A
= +25˚C DS90C031T. (Notes 3, 4, 6, 9)
Symbol Parameter Conditions Min Typ Max Units
t
TLH
Rise Time 0.35 1.5 ns
t
THL
Fall Time 0.35 1.5 ns
t
PHZ
Disable Time High to Z R
L
= 100,
C
L
=5pF
(
Figure 4
and
Figure 5
)
2.5 10 ns
t
PLZ
Disable Time Low to Z 2.5 10 ns
t
PZH
Enable Time Z to High 2.5 10 ns
t
PZL
Enable Time Z to Low 2.5 10 ns
Switching Characteristics
V
CC
= +5.0V ±10%, T
A
= −40˚C to +85˚C DS90C031T. (Notes 3, 4, 5, 6, 9)
Symbol Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay High to Low R
L
= 100,C
L
=5pF
(
Figure 2
and
Figure 3
)0.5 2.0 3.5 ns
t
PLHD
Differential Propagation Delay Low to High 0.5 2.1 3.5 ns
t
SKD
Differential Skew |t
PHLD
–t
PLHD
| 0 80 900 ps
t
SK1
Channel-to-Channel Skew (Note 4) 0 0.3 1.0 ns
t
SK2
Chip to Chip Skew (Note 5) 3.0 ns
t
TLH
Rise Time 0.35 2.0 ns
t
THL
Fall Time 0.35 2.0 ns
t
PHZ
Disable Time High to Z R
L
= 100,
C
L
=5pF
(
Figure 4
and
Figure 5
)
2.5 15 ns
t
PLZ
Disable Time Low to Z 2.5 15 ns
t
PZH
Enable Time Z to High 2.5 15 ns
t
PZL
Enable Time Z to Low 2.5 15 ns
Switching Characteristics
V
CC
= +5.0V ±10%, T
A
= −55˚C to +125˚C DS90C031E. (Notes 3, 4, 5, 6, 9, 10)
Symbol Parameter Conditions Min Typ Max Units
t
PHLD
Differential Propagation Delay High to Low R
L
= 100,C
L
=20pF
(
Figure 3
)
C
L
Connected between
each Output and GND
0.5 2.0 5.0 ns
t
PLHD
Differential Propagation Delay Low to High 0.5 2.1 5.0 ns
t
SKD
Differential Skew |t
PHLD
–t
PLHD
| 0 0.08 3.0 ns
t
SK1
Channel-to-Channel Skew (Note 4) 0 0.3 3.0 ns
t
SK2
Chip to Chip Skew (Note 5) 4.5 ns
t
PHZ
Disable Time High to Z R
L
= 100,
C
L
=5pF
(
Figure 4
and
Figure 5
)
2.5 20 ns
t
PLZ
Disable Time Low to Z 2.5 20 ns
t
PZH
Enable Time Z to High 2.5 20 ns
t
PZL
Enable Time Z to Low 2.5 20 ns
Parameter Measurement Information
DS011946-3
FIGURE 1. Driver V
OD
and V
OS
Test Circuit
DS90C031
www.national.com 4
Parameter Measurement Information (Continued)
DS011946-4
FIGURE 2. Driver Propagation Delay and Transition Time Test Circuit
DS011946-5
FIGURE 3. Driver Propagation Delay and Transition Time Waveforms
DS011946-6
FIGURE 4. Driver TRI-STATE Delay Test Circuit
DS90C031
www.national.com5
Parameter Measurement Information (Continued)
Typical Application
Applications Information
LVDS drivers and receivers are intended to be primarily used
in an uncomplicated point-to-point configuration as is shown
in
Figure 6
. This configuration provides a clean signaling en-
vironment for the quick edge rates of the drivers. The re-
ceiver is connected to the driver through a balanced media
which may be a standard twisted pair cable, a parallel pair
cable, or simply PCB traces. Typically, the characteristic im-
pedance of the media is in the range of 100. A termination
resistor of 100should be selected to match the media, and
is located as close to the receiver input pins as possible. The
termination resistor converts the current sourced by the
driver into a voltage that is detected by the receiver. Other
configurations are possible such as a multi-receiver configu-
ration, but the effects of a mid-stream connector(s), cable
stub(s), and other impedance discontinuities as well as
ground shifting, noise margin limits, and total termination
loading must be taken into account.
The DS90C031 differential line driver is a balanced current
source design. A current mode driver, generally speaking
has a high output impedance and supplies a constant cur-
rent for a range of loads (a voltage mode driver on the other
hand supplies a constant voltage for a range of loads). Cur-
rent is switched through the load in one direction to produce
a logic state and in the other direction to produce the other
logic state. The typical output current is mere 3.4 mA, a mini-
mum of 2.5 mA, and a maximum of 4.5 mA. The current
mode requires (as discussed above) that a resistive termi-
nation be employed to terminate the signal and to complete
the loop as shown in
Figure 6
. AC or unterminated configu-
rations are not allowed. The 3.4 mAloop current will develop
a differential voltage of 340 mV across the 100termination
resistor which the receiver detects with a 240 mV minimum
differential noise margin neglecting resistive line losses
(driven signal minus receiver threshold (340 mV 100 mV =
240 mV)). The signal is centered around +1.2V (Driver Off-
set, V
OS
) with respect to ground as shown in
Figure 7
. Note
that the steady-state voltage (V
SS
) peak-to-peak swing is
twice the differential voltage (V
OD
) and is typically 680 mV.
The current mode driver provides substantial benefits over
voltage mode drivers, such as an RS-422 driver. Its quies-
cent current remains relatively flat versus switching fre-
quency. Whereas the RS-422 voltage mode driver increases
exponentially in most case between 20 MHz–50 MHz. This
is due to the overlap current that flows between the rails of
the device when the internal gates switch. Whereas the cur-
rent mode driver switches a fixed current between its output
without any substantial overlap current. This is similar to
some ECL and PECL devices, but without the heavy static
I
CC
requirements of the ECL/PECL designs. LVDS requires
80% less current than similar PECL devices. AC specifica-
tions for the driver are a tenfold improvement over other ex-
isting RS-422 drivers.
The TRI-STATE function allows the driver outputs to be dis-
abled, thus obtaining an even lower power state when the
transmission of data is not required.
DS011946-7
FIGURE 5. Driver TRI-STATE Delay Waveform
DS011946-8
FIGURE 6. Point-to-Point Application
DS90C031
www.national.com 6
Applications Information (Continued)
The footprint of the DS90C031 is the same as the industry
standard 26LS31 Quad Differential (RS-422) Driver.
Pin Descriptions
Pin No. Name Description
(SOIC)
1, 7,
9, 15 D
IN
Driver input pin, TTL/CMOS
compatible
2, 6,
10, 14 D
OUT+
Non-inverting driver output pin,
LVDS levels
3, 5,
11, 13 D
OUT−
Inverting driver output pin,
LVDS levels
4 EN Active high enable pin, OR-ed
with EN*
12 EN* Active low enable pin, OR-ed
with EN
Pin No. Name Description
(SOIC)
16 V
CC
Power supply pin, +5V ±10%
8 GND Ground pin
Ordering Information
Operating Package Type/ Order Number
Temperature Number
−40˚C to +85˚C SOP/M16A DS90C031TM
−55˚C to +125˚C LCC/E20A DS90C031E-QML
DS90C031E-QML (NSID)
5962-95833 (SMD)
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: VOD1 and
VOD1.
Note 3: All typicals are given for: VCC = +5.0V, TA= +25˚C.
Note 4: Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event
on the inputs.
Note 5: Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
Note 6: Generator waveform for all tests unless otherwise specified:f=1MHz, ZO=50,t
r6 ns, and tf6 ns.
Note 7: ESD Ratings:
HBM (1.5 k, 100 pF) 3,500V
EIAJ (0, 200 pF) 250V
Note 8: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
Note 9: CLincludes probe and jig capacitance.
Note 10: Guaranteed by characterization data (DS90C031E).
DS011946-9
FIGURE 7. Driver Output Levels
DS90C031
www.national.com7
Typical Performance Characteristics
Power Supply Current
vs Power Supply Voltage
DS011946-10
Power Supply Current
vs Temperature
DS011946-11
Power Supply Current
vs Power Supply Voltage
DS011946-12
Power Supply Current
vs Temperature
DS011946-13
Output TRI-STATE Current
vs Power Supply Voltage
DS011946-14
Output Short Circuit Current
vs Power Supply Voltage
DS011946-15
DS90C031
www.national.com 8
Typical Performance Characteristics (Continued)
Differential Output Voltage
vs Power Supply Voltage
DS011946-16
Differential Output Voltage
vs Ambient Temperature
DS011946-17
Output Voltage High vs
Power Supply Voltage
DS011946-18
Output Voltage High vs
Ambient Temperature
DS011946-19
Output Voltage Low vs
Power Supply Voltage
DS011946-20
Output Voltage Low vs
Ambient Temperature
DS011946-21
DS90C031
www.national.com9
Typical Performance Characteristics (Continued)
Offset Voltage vs
Power Supply Voltage
DS011946-22
Offset Voltage vs
Ambient Temperature
DS011946-23
Power Supply Current
vs Frequency
DS011946-24
Power Supply Current
vs Frequency
DS011946-25
Differential Output Voltage
vs Load Resistor
DS011946-26
Differential Propagation Delay
vs Power Supply Voltage
DS011946-27
DS90C031
www.national.com 10
Typical Performance Characteristics (Continued)
Differential Propagation Delay
vs Ambient Temperature
DS011946-28
Differential Skew vs
Power Supply Voltage
DS011946-29
Differential Skew vs
Ambient Temperature
DS011946-30
Differential Transition Time
vs Power Supply Voltage
DS011946-31
Differential Transition Time
vs Ambient Temperature
DS011946-32
DS90C031
www.national.com11
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Ceramic Leadless Chip Carrier, Type C
Order Number DS90C031E-QML
NS Package Number E20A
16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS90C031TM
NS Package Number M16A
DS90C031
www.national.com 12
Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: support@nsc.com
National Semiconductor
Europe Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: ap.support@nsc.com
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
www.national.com
DS90C031 LVDS Quad CMOS Differential Line Driver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated