PIC16C505 PIC16C505 Rev. A Silicon/Data Sheet Errata The PIC16C505 parts you have received conform functionally to the Device Data Sheet (DS40192C), except for the anomalies described below. All of the issues listed here will be addressed in future revisions of the PIC16C505 silicon. 1. Module: Voltage Frequency Graphs Use the following graphs for the respective graphs in the Electrical Specification Section. FIGURE 1: PIC16LC505 VOLTAGE-FREQUENCY GRAPH, -40C TA 0C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.7 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. (c) 2007 Microchip Technology Inc. DS80060D-page 1 PIC16C505 PIC16LC505 VOLTAGE-FREQUENCY GRAPH, 0C TA +70C FIGURE 2: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. DS80060D-page 2 (c) 2007 Microchip Technology Inc. PIC16C505 FIGURE 3: PIC16LC505 VOLTAGE-FREQUENCY GRAPH, +70C TA +125C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. (c) 2007 Microchip Technology Inc. DS80060D-page 3 PIC16C505 Clarifications/Corrections to the Data Sheet: In the Device Data Sheet (DS40192C), the following clarifications and corrections should be noted. 1. Module: Special Function Register Corrections to the Special Function Register (SFR) Summary are shown in Table 4-1. TABLE 4-1: Address SPECIAL FUNCTION REGISTER (SFR) SUMMARY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 0 Value on All Other Resets(2) 100x xxxx 10uu uuuu 04h FSR Legend: Shaded cells not used by PORT Registers, read as `0', - = unimplemented, read as `0', x = unknown, u = unchanged, q = depends on condition. If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0. Other (non-power-up) Resets include external Reset through MCLR, Watchdog Timer and wake-up on pin change Reset. Note 1: 2: DS80060D-page 4 Indirect Data Memory Address Pointer Bit 1 Value on Power-On Reset (c) 2007 Microchip Technology Inc. PIC16C505 2. Module: DC Characteristics Corrections for the DC Characteristics, Sections 10.1, 10.2 and 10.3 are shown. 10.1 DC CHARACTERISTICS: PIC16C505-04 (Commercial, Industrial, Extended) PIC16C505-20(Commercial, Industrial, Extended) Standard Operating Conditions (unless otherwise specified) 0C TA +70C (commercial) Operating Temperature DC CHARACTERISTICS POWER SUPPLY PINS -40C TA +85C (industrial) -40C TA +125C (extended) Parm. No. Characteristic Supply Current(3) D010 Sym Min Typ(1) Max Units IDD -- 0.8 1.4 mA -- 0.6 1.0 mA -- 3 7 mA -- 4 12 mA -- 4.5 16 mA 19 27 A 0.25 0.4 3 5 4 5.5 8 14 A A A A -- Power-Down Current (5) D020 Note 1: 2: 3: 4: 5: 6: IPD -- -- -- -- Conditions FOSC = 4MHz, VDD = 5.5V, WDT disabled, XT mode (Note 4) FOSC = 4MHz, VDD = 3.0V, WDT disabled, XT mode (Note 4) FOSC = 10MHz, VDD = 3.0V, WDT disabled, HS mode (Note 6) FOSC = 20MHz, VDD = 4.5V, WDT disabled, HS mode FOSC = 20MHz, VDD = 5.5V, WDT disabled, HS mode FOSC = 32kHz, VDD = 3.0V, WDT disabled, LP mode (Note 6) VDD = 3.0V (Note 6) VDD = 4.5V (Note 6) VDD = 5.5V, Industrial VDD = 5.5V, Extended Temp. Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in Sleep mode. Does not include current through REXT. The current through the resistor can be estimated by the formula: IR = VDD/2REXT (mA) with REXT in kOhm. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS. Commercial temperature range only. (c) 2007 Microchip Technology Inc. DS80060D-page 5 PIC16C505 10.2 DC CHARACTERISTICS: Standard Operating Conditions (unless otherwise specified) DC CHARACTERISTICS POWER SUPPLY PINS Parm. No. Characteristic Supply Current(3) D010 PIC16LC505-04 (Commercial, Industrial) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Sym Min Typ(1) Max Units IDD -- 0.8 1.4 mA -- 0.4 0.8 mA -- 15 23 A -- -- -- 0.25 0.25 3 3 4 8 A A A Conditions FOSC = 4MHz, VDD = 5.5V, WDT disabled, XT mode (Note 4) FOSC = 4MHz, VDD = 2.5V, WDT disabled, XT mode (Note 4) FOSC = 32kHz, VDD = 2.5V, WDT disabled, LP mode (Note 6) D020 Power-Down Current (5) Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. c) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. d) For standby current measurements, the conditions are the same, except that the device is in Sleep mode. Does not include current through REXT. The current through the resistor can be estimated by the formula: IR = VDD/2REXT (mA) with REXT in kOhm. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS. Commercial temperature range only. 2: 3: 4: 5: 6: DS80060D-page 6 IPD VDD = 2.5V (Note 6) VDD = 3.0V (Note 6) VDD = 5.5V Industrial (c) 2007 Microchip Technology Inc. PIC16C505 10.3 DC CHARACTERISTICS: DC CHARACTERISTICS Param No. D040 D040A Characteristic Input High Voltage I/O ports with TTL buffer PIC16C505-04 (Commercial, Industrial, Extended) PIC16C505-20(Commercial, Industrial, Extended) PIC16LC505-04 (Commercial, Industrial)) Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Sym Min Typ Max Units -- -- -- VDD VDD V V Conditions VIH 2.0 0.25VDD+ 0.8V 4.5 VDD 5.5V Otherwise Input Leakage Current (Notes 2, 3) IIL D061 RB3/MCLR (Note 5) 8 130 250 A Vss VPIN VDD D061A RB3/MCLR (Note 6) -- -- +5 A Vss VPIN VDD D070 RB weak pull-up current (Note 4) IPUR 179 250 333 A VDD = 5V, VPIN = VSS Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C505 be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as coming out of the pin. 4: Does not include RB3. For RB3 see parameters D0061 and D0061A. 5: This specification applies to RB3/MCLR configured as external MCLR and RB3/MCLR configured as input with internal pull-up enabled. 6: This specification applies to RB3/MCLR configured as external MCLR and RB3/MCLR configured as input with pull-up disabled. The leakage current of the MCLR circuit is higher than the standard I/O logic. (c) 2007 Microchip Technology Inc. DS80060D-page 7 PIC16C505 3. Module: PORTB Pull-up Register Ranges Corrections for the PORTB pull-up resistor ranges are shown in Table 10-1. TABLE 10-1: PULL-UP RESISTOR RANGES - PIC16C505 VDD (Volts) Temperature (C) Min 2.5 -40 25 85 125 -40 25 85 125 38K 42K 42K 50K 15K 18K 19K 22K Typ Max Units 42K 48K 49K 55K 17K 20K 22K 24K 63K 63K 63K 63K 20K 23K 25K 28K 80K 100K 110K 120K 60K 65K 80K 90K 850K 1150K 1300K 1500K 600K 750K 900K 990K RB0/RB1/RB4 5.5 RB3(1) 2.5 -40 65K 25 80K 85 85K 125 100K 5.5 -40 50K 25 60K 85 65K 125 75K * These parameters are characterized but not tested. Note 1: The weak pull-up resistor and associated current for the RB3/MCLR pin is nonlinear when the respective pin voltage is less than VDD - 1.0V. See parameter D061 for RB3/MCLR pin current specifications. DS80060D-page 8 (c) 2007 Microchip Technology Inc. PIC16C505 4. Module: Reset (CLKIN/CLKOUT) For the section titled "Reset", additional information is provided on OSC1/CLKIN and OSC2/CLKOUT pin states during a MCLR. Reset When MCLR is asserted, the state of the OSC1/CLKIN and CLKOUT/OSC2 pins are as follows: CLKIN/CLKOUT PIN STATES WHEN MCLR ASSERTED Oscillator Mode OSC1/CLKIN Pin OSC2/ CLKOUT Pin EXTRC, CLKOUT on OSC1 pin is OSC2 tri-stated and driven by external circuit OSC2 pin is driven low EXTRC, OSC2 is I/O OSC1 pin is tri-stated and driven by external circuit OSC2 pin is tri-state input INTRC, CLKOUT on OSC2 OSC1 pin is tri-state input OSC2 pin is driven low INTRC, OSC2 is I/O OSC1 pin is tri-state input OSC2 pin is tri-state input (c) 2007 Microchip Technology Inc. DS80060D-page 9 PIC16C505 5. Module: Packaging (TSSOP) Update data sheet to include TSSOP as follows: Pin Diagram: PDIP, SOIC, TSSOP, Ceramic Side Brazed 1 14 2 13 3 4 5 6 7 PIC16C505 VDD RB5/OSC1/CLKIN RB4/OSC2/CLKOUT RB3/MCLR/VPP RC5/T0CKI RC4 RC3 12 11 10 9 8 VSS RB0 RB1 RB2 RC0 RC1 RC2 PIC16C505 Product Identification System Examples PART NO. -XX X /XX XXX Pattern: Special Requirements Package: SL P JW = 150 mil SOIC = 300 mil PDIP = 300 mil Windowed Ceramic Side Brazed Temperature Range: I E = 0C to +70C = -40C to +85C = -40C to +125C Frequency Range: 04 20 = 4 MHz (XT, INTRC, EXTRC OSC) = 20 MHz (HS OSC) Device PIC16C505 PIC16LC505 PIC16C505T (Tape & reel for SOIC only) PIC16LC505T (Tape & reel for SOIC only) ST 10.3 = Thin Shrink Small Outline (TSSOP) a) PIC16C505-04/P Commercial Temp., PDIP Package, 4 MHz, normal VDD limits b) PIC16C505-04I/SL Industrial Temp., SOIC package, 4 MHz, normal VDD limits c) PIC16C505-04I/P Industrial Temp., PDIP package, 4 MHz, normal VDD limits Package Marking Information 14-Lead TSSOP XXXXXXXX YYWW NNN DS80060D-page 10 Example C505/ST 0610 017 (c) 2007 Microchip Technology Inc. PIC16C505 APPENDIX A: REVISION HISTORY Revision D (5/2007) Updates throughout document. (c) 2007 Microchip Technology Inc. DS80060D-page 11 PIC16C505 NOTES: DS80060D-page 12 (c) 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2007 Microchip Technology Inc. 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